US104431A - Improvement in soldering-machine - Google Patents

Improvement in soldering-machine Download PDF

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US104431A
US104431A US104431DA US104431A US 104431 A US104431 A US 104431A US 104431D A US104431D A US 104431DA US 104431 A US104431 A US 104431A
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solder
frame
pan
soldering
secured
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components

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  • My invention lrelates to an improved method of sustaining metallic vessels in and over a suitable. bath of molten-solder, by means of an arm or frame, upheld i ⁇ by or from any suitable support, soas-to exteud over the solder, and upon or ⁇ into which the body of the vessel to be dipped is placed, the object of my invention being to provide: an improved support for cans or other vessels in the process of soldering their vside or corner seams, by dipping the same in molten- Y y solder.
  • FIG. 1 of the accompanying drawings is a view, inperspective, of avsoldering apparatus embodying my invent-ion.
  • Figures 2, 3, 4, 5, and ' illustrate various modifications in the form of my supporting arm or frame, figs. 3 and 5 being, respectively, end views of the supports, shown Vin figs. 2 and 4, detached.-
  • 4 B is an adjustable upright standard, passing through a box secured to one side of the solder-pan, orto ⁇ the stand, frame, or furnace, upon which the solder-pan is supported.
  • C is a toothed wheel, secured to the solder-pan', or its supporting frame or stand, whose teeth engage with a rack formedon one .side of the upright standard, so as to elevate and depress the same by its revolution.
  • E F G are different forms of supporting frames, which maybe secured to the upper end of the vertical or upright standard B, at right angles' thereto, or nearly so, as shown in gs 2 and 4, or to other suitable supports, (see fig. 6.)
  • D represents a frame, composed of two plates, dal',
  • E represents a wire rod, secured to the end of the upright B, and so bent as to present a triangular frame, parallel, or nearly so, to the solder-pan, to ilt within the angle of the vessel to be soldered.
  • G represents a rectangular-wire frame, supported from a bracket, H, over a solder-pan beneath, so as to project in a -plaue parallel, or nearly so, to that ot the pan, with oneangle uppermost, and its lower angle and sides cut away, to allow the cornerot a rectangular vessel inserted therein to project below the same, as illustrated in the drawing.
  • the rack and the pinion may be adjusted to any desired height abovethe level ot' the molten-solder in the pan A, and a xed interval between the two be maintained as the solder lowers or is increased in depth.
  • the supporting arm or frame is adj usted to the .proper height above thesolder iu the pan, and the open end of the can or other vessel to he soldered, irst properly formed, is slipped over and upon said arm or frame, (or, it' both ends of the vessel be closed, then into the frame G, Iig. 6,) as illustrated by the ⁇ dotted lines in the several figures ot' the drawing.
  • the supporting arm or frame serves not only to steady and support the can in the solder, but also to regulate the depth ofits immersion.
  • the adjustment of the frame may be m'ade by means of a thumb-nu+,

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

i inttd (gitanas aient dtiljiitr.
EDWARD r. covELL, or'
BROOKLYN, NEW-YORK.
Lette/rs Patent No. 1Q4,431, dated J'une 21, 1870 4waterland .Tune 6, 1870.
www.
The Schedule referred to in these Letters Patent and making paxt of the s ame.
I, EDWARD T1. GovnLL, of Brooklyn, in the county Y of Kings and State of New York, have invented a new and improved Device forSupporting Vessels in a Soldering Apparatus, of which the following is a specification. V
My invention lrelates to an improved method of sustaining metallic vessels in and over a suitable. bath of molten-solder, by means of an arm or frame, upheld i `by or from any suitable support, soas-to exteud over the solder, and upon or `into which the body of the vessel to be dipped is placed, the object of my invention being to provide: an improved support for cans or other vessels in the process of soldering their vside or corner seams, by dipping the same in molten- Y y solder.
I Figure 1 of the accompanying drawings is a view, inperspective, of avsoldering apparatus embodying my invent-ion. Figures 2, 3, 4, 5, and 'illustrate various modifications in the form of my supporting arm or frame, figs. 3 and 5 being, respectively, end views of the supports, shown Vin figs. 2 and 4, detached.-
A denotes the-pan or vessel to contain the moltensolder, and which is to beplaced upon any suitable furnace. y
4 B is an adjustable upright standard, passing through a box secured to one side of the solder-pan, orto `the stand, frame, or furnace, upon which the solder-pan is supported. v
C is a toothed wheel, secured to the solder-pan', or its supporting frame or stand, whose teeth engage with a rack formedon one .side of the upright standard, so as to elevate and depress the same by its revolution. j
I) E F G are different forms of supporting frames, which maybe secured to the upper end of the vertical or upright standard B, at right angles' thereto, or nearly so, as shown in gs 2 and 4, or to other suitable supports, (see fig. 6.)
D represents a frame, composed of two plates, dal',
y secured at right angles to each other, orof a single.
plate," bent to form such an angle. It is so united to the end of the upright B as that its angle shall be uppermost, to lit-within the corner of the 'rectangular vessel M, to be soldered, as represented in the drawing.
E represents a wire rod, secured to the end of the upright B, and so bent as to present a triangular frame, parallel, or nearly so, to the solder-pan, to ilt within the angle of the vessel to be soldered.
F represents a flat plate, secured to the .upright B parallel to the solder-pan, or .nearly so, and which is equal in Ywidth to the greater, inner diagonal, or dialnet-ric width of the vessel to be supported, as illustrated in ig.'5.
G represents a rectangular-wire frame, supported from a bracket, H, over a solder-pan beneath, so as to project in a -plaue parallel, or nearly so, to that ot the pan, with oneangle uppermost, and its lower angle and sides cut away, to allow the cornerot a rectangular vessel inserted therein to project below the same, as illustrated in the drawing.
By means ot' the rack and the pinion (l, combined with the upright standard B, thefra'me, or support secured thereto, may be adjusted to any desired height abovethe level ot' the molten-solder in the pan A, anda xed interval between the two be maintained as the solder lowers or is increased in depth.
In using this improved apparatus, the supporting arm or frame is adj usted to the .proper height above thesolder iu the pan, and the open end of the can or other vessel to he soldered, irst properly formed, is slipped over and upon said arm or frame, (or, it' both ends of the vessel be closed, then into the frame G, Iig. 6,) as illustrated by the `dotted lines in the several figures ot' the drawing.
When so placed and suspended upon the support, the' lower angle or seam will just dipinto the molten- ,solder and be iilled thereby. So soon as this is accomplished the can is removed at au inclination, so as to allow the surplus oil solder to dow o and be replaced' by another. The supporting arm or frame serves not only to steady and support the can in the solder, but also to regulate the depth ofits immersion.
.Wherea bracket,vH, secured to the wall, or to a permanent support at the side of the solder-pan, is
used to uphold the supporting frame, the adjustment of the frame may be m'ade by means of a thumb-nu+,
h, working uponv a thread cntvon the end iot the supportingarm K,as illustrated in iig. 6.
,j I do not regard the merelnode of suspending or upholding the supporting frame or arm as au essential element in my invention. The frames or supl ports` D, 19,14, o1 G, may, therefore, be upheld-by v,other forms of standards `or supports than those il-
US104431D Improvement in soldering-machine Expired - Lifetime US104431A (en)

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