US10093044B2 - Imprinting apparatus and imprinting method - Google Patents
Imprinting apparatus and imprinting method Download PDFInfo
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- US10093044B2 US10093044B2 US14/946,915 US201514946915A US10093044B2 US 10093044 B2 US10093044 B2 US 10093044B2 US 201514946915 A US201514946915 A US 201514946915A US 10093044 B2 US10093044 B2 US 10093044B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5825—Measuring, controlling or regulating dimensions or shape, e.g. size, thickness
Definitions
- Embodiments described herein relate generally to an imprinting apparatus and an imprinting method.
- Imprinting lithography which is a lithography method of a semiconductor process is a technique of transferring a pattern to a transfer substrate using a template of the same magnification.
- a stress is applied to the side surface of the template in pressing the template against a resist on the transfer substrate. Accordingly, the size of a template pattern is adjusted in magnification and then the template pattern is transferred to the resist.
- a magnification response coefficient is calculated from a relational expression of the input magnification value and the magnification of the actual shot pattern.
- the input magnification value is corrected based on the magnification response coefficient and then a stress is applied to the side surface of the template.
- magnification response coefficient varies depending on templates and thus the magnification response coefficient is calculated for each template. Accordingly, a long time is required for setting conditions in imprinting.
- FIG. 1 is a diagram illustrating a configuration of an imprinting apparatus according to an embodiment
- FIGS. 2A to 2D are diagrams illustrating a process flow of an imprinting process
- FIG. 3 is a top view illustrating a configuration of a pressing unit according to the embodiment
- FIG. 4 is a diagram illustrating a configuration of a magnification correction value calculating device according to the embodiment.
- FIG. 5 is a flowchart illustrating a process flow of a magnification response coefficient calculating process according to the embodiment
- FIG. 6 is a flowchart illustrating a process flow of a magnification correction value calculating process using a magnification response coefficient according to the embodiment
- FIG. 7 is a diagram illustrating a relationship between a pressure on a template and a shot magnification of the template
- FIG. 8 is a diagram illustrating a magnification response coefficient
- FIG. 9 is diagram illustrating examples of a positional slippage component
- FIGS. 10A to 10C are diagrams illustrating Zernike terms
- FIG. 11 is a diagram illustrating calculation examples of front flatness according to the embodiment.
- FIG. 12 is a diagram illustrating calculation examples of the magnification response coefficient according to the embodiment.
- FIG. 13 is a diagram illustrating a creation example of a front relational expression according to the embodiment.
- FIG. 14 is a diagram illustrating a hardware configuration of a correction information calculating device according to the embodiment.
- an imprinting apparatus includes an adjustment unit, a suction unit, a contact processing unit, a correction information calculating device, and a control unit.
- the adjustment unit adjusts a shape and a size of a first template by an amount corresponding to a first input adjustment value in performing a first imprinting process using the first template.
- the adjustment unit adjusts a shape and a size of a second template by an amount corresponding to a second input adjustment value in performing a second imprinting process using the second template.
- the suction unit suctions and fixes a rear surface of the first template in performing the first imprinting process.
- the suction unit suctions and fixes a rear surface of the second template in performing the second imprinting process.
- the contact processing unit brings a template pattern formed on a front surface of the second template into contact with a resist placed on a substrate and fills the template pattern with the resist.
- the correction information calculating device calculates a second response coefficient corresponding to the second template as correction information out of first response coefficients based on a flatness relational expression and flatness of the second template suctioned by the suction unit.
- the first response coefficients are actual amounts of positional slippage of the first template from the first input adjustment value.
- the flatness relational expression indicates a relation between the flatness of the first template suctioned by the suction unit and the first response coefficients.
- the control unit corrects the second input adjustment value using the correction information.
- the control unit causes the adjustment unit to adjust the shape and the size of the second template with the corrected second input adjustment value.
- FIG. 1 is a diagram illustrating a configuration of an imprinting apparatus according to an embodiment.
- FIG. 1 illustrates a configuration of an imprinting apparatus 101 when viewed from the Y axis direction.
- a plane on which a wafer Wx is mounted is an XY plane and the top surface of the wafer Wx is perpendicular to the Z axis.
- the imprinting apparatus 101 is an apparatus that performs an imprinting process such as nano-imprinting lithography (NIL).
- the imprinting apparatus 101 transfers a template pattern of a template Tx as a mold substrate to a transfer substrate (semiconductor substrate) such as a wafer Wx.
- the template is a master mold formed of a plate-shaped member having a rectangular main surface and the template pattern is an embossed pattern such as a circuit pattern.
- the template pattern is formed on a mesa on the top of the template Tx.
- the imprinting apparatus 101 forms a resist pattern on the entire surface of the wafer Wx in a step & repeat manner.
- the imprinting apparatus 101 adjusts the magnification of the size of the template pattern for each template.
- the imprinting apparatus 101 calculates a relational expression of flatness affecting the front surface of the template and a magnification response coefficient (hereinafter, referred to as a front relational expression) in advance using a learning template L (not illustrated).
- the magnification response coefficient indicates a relationship between an input magnification value (magnification adjustment value) for applying a stress to a side surface of the template and the magnification of a shot pattern which is actually formed.
- the magnification response coefficient is correction information Indicating at what short magnification a pattern is actually formed on the wafer Wx with respect to the input magnification value.
- the imprinting apparatus 101 calculates the magnification response coefficient corresponding to the flatness of the template Tx based on the flatness of the template Tx and the front relational expression in performing an imprinting process.
- the imprinting apparatus 101 calculates a magnification correction value using the magnification response coefficient.
- the magnification correction value is a correction value that is used to correct the size or the shape of a shot (template pattern area) of the template Tx.
- magnification correction value is used to correct the slippage. Accordingly, when the input magnification value is equal to the magnification of the shot pattern which is actually formed, the magnification correction value is 0.
- a learning template L is used to calculate the front relational expression.
- plural learning templates L are prepared.
- the learning templates L have a variety of rear flatness which differs depending on the learning templates L.
- the imprinting apparatus 101 creates the front relational expression for each flatness of a template pattern surface using the plural learning templates L.
- the imprinting apparatus 101 creates the front relational expression corresponding to first flatness, for example, using the first learning template L and creates the front relational expression corresponding to M-th flatness using the M-th (where M is a natural number) learning template L.
- the templates Tx to be used when the imprinting apparatus 101 uses for the imprinting process are various templates T 1 to TN (where N is a natural number) for the imprinting process.
- the imprinting apparatus 101 calculates the magnification correction value using the front relational expressions corresponding to the templates Tx.
- the imprinting apparatus 101 includes a master stage 2 X, a sample stage 5 , a reference mark 6 , an alignment sensor 1 , a substrate chuck 8 , a stage base 9 , a light source 10 , and a pressing unit 31 .
- the imprinting apparatus 101 according to this embodiment further includes a correction information calculating device 20 , a control device 30 , and a flatness measuring device 35 .
- the sample stage 5 has a wafer Wx mounted thereon and moves in a plane (horizontal plane) parallel to the mounted wafer Wx.
- the sample stage 5 introduces the wafer Wx in which a resist 40 X as a transfer material is applied substantially to the entire surface (entire surface other than edges) thereof and moves below the template Tx.
- the sample stage 5 sequentially moves shot positions on the wafer Wx below the template Tx in performing an imprinting process to the wafer Wx.
- the substrate chuck 8 is disposed on the sample stage 5 .
- the substrate chuck 8 fixes the wafer Wx to a certain position on the sample stage 5 .
- the reference mark 6 is disposed on the sample stage 5 .
- the reference mark 6 is a mark used to detect the position of the sample stage 5 and is used to position the wafer Wx in loading the wafer onto the sample stage 5 .
- the master stage 2 X is disposed on the bottom surface side (the wafer Wx side) of the stage base 9 .
- the master stage 2 X fixes the template Tx to a certain position from the rear surface side (surface on which the template pattern is not formed) of the template Tx by vacuum suction or the like.
- the pressing unit 31 is disposed on the bottom surface side of the master stage 2 X.
- the pressing unit 31 is constituted by an actuator or the like and applies a stress to the side surface of the template Tx.
- the pressing unit 31 has a function of a manipulator.
- the pressing unit 31 adjusts the shape or the size of the template Tx by pressing the template Tx from the side surface side of the template Tx in four directions. Accordingly, the mesa of the template Tx is deformed. As a result, the positional slippage or the like of the template pattern formed on the template Tx is corrected.
- the stage base 9 supports the template Tx using the master stage 2 X and presses the template pattern of the template Tx onto the resist 40 X on the wafer Wx.
- the stage base 9 performs pressing of the template Tx onto the resist 40 X and separating (releasing) of the template Tx from the resist 40 X by moving vertically (in the vertical direction).
- the resist 40 X used for imprinting is a resin (phot-curable agent) having characteristics such as photo-curability.
- the alignment sensor 7 is disposed on the stage base 9 .
- the alignment sensor 7 is a sensor for detecting the position of the wafer Wx or the position of the template Tx.
- the light source 10 is a light source emitting light such as UV rays and is disposed above the stage base 9 .
- the light source 10 applies UV rays from above the transparent template Tx in a state in which the template Tx is pressed onto the resist 40 X.
- the control device 30 is connected to the elements of the imprinting apparatus 101 and controls the elements. In FIG. 1 , the control device 30 is connected to the pressing unit 31 , but connection to the other elements is not illustrated.
- the control device 30 controls the pressing unit 31 by transmitting an input magnification value (magnification adjustment value) to the pressing unit 31 .
- the pressing unit 31 presses the side surface of the template Tx with a force of a magnitude corresponding to the input magnification value.
- the control device 30 transmits the input magnification value to the pressing unit 31 without correcting the input magnification value when the master stage 2 X suctions the learning template L.
- the control device 30 also transmits the non-corrected input magnification value to the flatness measuring device 35 .
- the control device 30 calculates the magnification correction value using the magnification response coefficient transmitted from the correction information calculating device 20 when the master stage 2 X suctions the template Tx.
- the control device 30 corrects the input magnification value using the magnification correction value.
- the control device 30 transmits the corrected input magnification value to the pressing unit 31 when the master stage 2 X suctions the template Tx.
- the flatness measuring device 35 measures the rear flatness of the template Tx or the learning template L.
- the flatness measuring device 35 measures the rear flatness in a state in which the master stage 2 X suctions the template Tx or the learning template L.
- the flatness measuring device 35 transmits the measured rear flatness to the correction information calculating device 20 .
- the correction information calculating device 20 creates a front relational expression for each template pattern surface using the rear flatness of the learning template L.
- the correction information calculating device 20 calculates the magnification correction value based on the front relational expression and the rear flatness of the template Tx.
- the correction information calculating device 20 transmits the calculated magnification correction value to the control device 30 .
- a wafer Wy (not illustrated) is used to perform an imprinting process using the learning template L and a wafer Wx is used to perform an imprinting process using the template Tx.
- the wafer Wx onto which the resist 40 X is applied or dropped moves immediately below the template Tx.
- the template Tx is pressed onto the resist 40 X on the wafer Wx.
- the wafer Wy onto which the resist 40 X is applied or dropped moves immediately below the learning template L.
- the learning template L is pressed onto the resist 40 X on the wafer Wy.
- the imprinting apparatus 101 may press the resist 40 X or the learning template L onto the template Tx instead of pressing the template Tx or the learning template L onto the resist 40 X.
- the sample stage 5 presses the resist 40 X on the wafer Wx or the learning template L onto the template Tx or the learning template L.
- the imprinting apparatus 101 decreases a distance between the template Tx or the learning template L and the wafer Wx or Wy on which the resist 40 X is disposed so as to be a certain distance. Accordingly, the template pattern comes in contact with the resist 40 X.
- FIGS. 2A to 2D are diagrams illustrating the process flow of the imprinting process.
- FIGS. 2A to 2D illustrate cross-sectional views of the wafer Wx or the template Tx in the imprinting process.
- the resist 40 X is dropped onto the top surface of the wafer Wx by an ink jet method.
- the resist 40 X is an imprinting material such as a photo-curable resin material.
- a low-k (low-dielectric) film, an organic material, or the like is used as the resist 40 X.
- the template Tx moves to the resist 40 X as illustrated in FIG. 2B , and the template Tx is pressed onto the resist 40 X as Illustrated in FIG. 2C .
- the resist 40 X flows into the template pattern of the template Tx by a capillary phenomenon.
- the template pattern is an embossed pattern which is formed by plasma etching or the like.
- the template Tx and the resist 40 X come in contact with each other for a certain time. Accordingly, the template pattern is filled with the resist 40 X.
- UV rays from the light source 10 is applied to the resist 40 X via the template Tx in this state, the resist 40 X is cured.
- the imprinting apparatus 101 performs the imprinting process onto a second shot on the wafer Wx after performing the imprinting process onto a first shot on the wafer Wx.
- FIG. 3 is a top view illustrating the configuration of the pressing unit according to the embodiment.
- FIG. 3 is a top view of the pressing unit 31 and the template Tx when viewed from the Z axis direction.
- the template Tx has a pattern area 65 in which the template pattern is formed at the center thereof.
- the pattern area 65 is, for example, a rectangular area.
- the pattern area 65 is a front area of the template Tx.
- the template Tx is fixed to the master stage 2 X from the rear surface side.
- the area outside the pattern area 65 in the template Tx is suctioned by the master stage 2 X.
- the suction area 66 in which the template Tx is suctioned by the master stage 2 X is, for example, a ring-shaped area.
- the pressing unit 31 is disposed on the side surface side of the template Tx so as to press the side surface of the template Tx.
- the pressing unit 31 presses the side surface facing the ⁇ X direction, the side surface facing the +X direction, the side surface facing the +Y direction, and the side surface facing the ⁇ Y direction out of the side surfaces of the template Tx.
- the number of pressing units 31 pressing each side surface of the template Tx may be one or more.
- the pressing unit 31 performs the same pressing as the template Tx on the learning template L.
- FIG. 4 is a diagram illustrating the configuration of the magnification correction value calculating device according to the embodiment.
- the pressing unit 31 applies a pressure to the template Tx, but the pressing unit 31 applies a pressure to the template Tx or the learning template L.
- the correction information calculating device 20 includes an input unit 21 , a suctioned portion flatness extracting unit 22 , a spherical approximation unit 23 , a front flatness calculating unit 24 , a relational expression creating unit 25 , a correction information calculating unit 26 , and an output unit 27 .
- the pressing unit 31 presses the side surface of the template Tx or the learning template L.
- the control device 30 is connected to the pressing unit 31 and the positional slippage measuring device 37 . In FIG. 4 , the connection between the control device 30 and the positional slippage measuring device 37 is not illustrated.
- the control device 30 transmits the input magnification value to the pressing unit 31 and the positional slippage measuring device 37 .
- the flatness measuring device 35 measures the rear flatness of the template Tx or the learning template L and transmits the measurement result to the correction information calculating device 20 .
- the positional slippage measuring device 37 is connected to the correction information calculating device 20 .
- the positional slippage measuring device 37 is a device that measures an amount of positional slippage of the resist pattern formed on the wafer Wy.
- the positional slippage measuring device 37 transmits correlation information in which an amount of positional slippage as the measurement result and the input magnification value from the control device 30 are correlated with each other to the correction Information calculating device 20 .
- the input unit 21 receives an input of the rear flatness (measurement result) from the flatness measuring device 35 and transmits the input rear flatness to the suctioned portion flatness extracting unit 22 .
- the input unit 21 receives an input of the correlation information from the positional slippage measuring device 37 and transmits the input correlation information to the relational expression creating unit 25 .
- the suctioned portion flatness extracting unit 22 extracts the flatness of the rear suctioned portion (hereinafter, referred to as suctioned portion flatness) out of the rear flatness. Specifically, the suctioned portion flatness extracting unit 22 extracts the flatness (suctioned portion flatness) of the area of the template Tx and the learning template L of which the rear surface is suctioned out of the rear flatness of the template Tx and the learning template L. The suctioned portion flatness extracting unit 22 transmits the suctioned portion flatness to the spherical approximation unit 23 .
- the spherical approximation unit 23 calculates a coefficient when the suctioned portion flatness is functionally approximated in the polar coordinate system. Specifically, the spherical approximation unit 23 calculates a Zernike coefficient by approximating the suctioned portion flatness to a Zernike series. The spherical approximation unit 23 transmits the Zernike coefficient to the front flatness calculating unit 24 .
- the front flatness calculating unit 24 calculates the flatness (hereinafter, referred to as front flatness) that affects the front surface (template pattern surface) of the template Tx or the learning template L based on the Zernike coefficient.
- the front flatness calculating unit 24 transmits the calculated front flatness to the relational expression creating unit 25 .
- the front flatness calculating unit 24 transmits the calculated front flatness to the correction information calculating unit 26 .
- the imprinting apparatus 101 performs the imprinting process using various input magnification values on the learning templates L in accordance with an instruction from the control device 30 .
- the imprinting apparatus 101 performs the imprinting process on a first learning template using first to P-th (where P is a natural number of two or greater) input magnification values.
- the imprinting apparatus 101 performs the imprinting process on a Q-th (where Q is a natural number of two or greater) learning template using the first to P-th input magnification values.
- a resist pattern is formed on the wafer Wx using the template Tx.
- a resist pattern is formed on the wafer Wy using the learning template L.
- the amounts of positional slippage of the resist patterns on the wafers Wx and Wy formed by the Imprinting process are measured by the positional slippage measuring device 37 .
- the correlation information in which the amounts of positional slippage and the input magnification values are correlated is transmitted to the relational expression creating unit 25 via the input unit 21 .
- the relational expression creating unit 25 calculates the magnification response coefficient (shot magnification response coefficient) based on the correlation information. Specifically, the relational expression creating unit 25 calculates the magnification response coefficient for each learning template L based on the correlation between the measured amounts of positional slippage and the input magnification values.
- Each learning template L has specific front flatness.
- the input magnification value corresponding to the front flatness of the learning template L is input and the imprinting process is performed. Accordingly, the input magnification value or the amount of positional slippage varies depending on the learning templates L. As a result, the front flatness and the magnification response coefficient vary depending on the learning templates L.
- the relational expression creating unit 25 creates the relational expression (front relational expression) between the front flatness and the magnification response coefficient.
- the front relational expression is stored in the relational expression creating unit 25 .
- the correction information calculating unit 26 calculates correction information (the magnification response coefficient of the template Tx) for correcting an amount of magnification adjustment of the template Tx based on the front flatness of the template Tx transmitted from the front flatness calculating unit 24 and the front relational expression transmitted from the relational expression creating unit 25 .
- the correction information calculating unit 26 transmits the calculated magnification response coefficient to the output unit 27 .
- the output unit 27 transmits the magnification response coefficient to the control device 30 .
- the control device 30 calculates the input magnification value based on the amount of positional slippage of an underlayer pattern.
- the underlayer pattern is a pattern which is positioned in performing the imprinting process using the template Tx.
- the underlayer pattern is disposed under the resist 40 X.
- the magnification of the template pattern is adjusted by an amount corresponding to the amount of positional slippage of the underlayer pattern. The magnification adjustment at this time is performed based on the input magnification value.
- the front relational expression (the relational expression between the front flatness and the magnification response coefficient) using the learning template L.
- the front flatness of the template Tx is calculated.
- a magnification correction coefficient is extracted from the front relational expression based on the front flatness of the template Tx.
- the input magnification value to the template Tx is corrected using the magnification correction coefficient.
- control device 30 calculates the magnification correction value for correcting the input magnification value using the magnification response coefficient.
- the control device 30 corrects the input magnification value using the magnification correction value in performing the imprinting process using the template Tx.
- the control device 30 transmits the corrected input magnification value to the pressing unit 31 .
- FIG. 5 is a flowchart illustrating the process flow of the magnification response coefficient calculating process according to the embodiment.
- the magnification response coefficient is calculated using the rear flatness of the learning template L.
- the flatness measuring device 35 measures the rear flatness of the learning templates L (step S 10 ).
- the flatness measuring device 35 measures the rear flatness in a state in which the master stage 2 X suctions the learning templates L.
- the flatness measuring device 35 transmits the measured rear flatness to the correction information calculating device 20 .
- the rear flatness is transmitted to the suctioned portion flatness extracting unit 22 via the input unit 21 .
- the suctioned portion flatness extracting unit 22 extracts the suctioned portion flatness which is the flatness of the rear suctioned portion out of the rear flatness (step S 20 ).
- the suctioned portion flatness extracting unit 22 extracts the suctioned portion flatness for each learning template L.
- the spherical approximation unit 23 calculates the Zernike coefficient by approximating the suctioned portion flatness to the Zernike series. Accordingly, the spherical approximation unit 23 approximates the suctioned portion flatness for each learning template L (step S 30 ).
- the front flatness calculating unit 24 calculates the front flatness which affects the template pattern surface of the template Tx based on the Zernike coefficient (step S 40 ). The front flatness calculating unit 24 calculates the front flatness for each learning template L.
- the imprinting apparatus 101 performs the imprinting process on the wafer Wy using various input magnification values for each learning template L (step S 50 ). Accordingly, a resist pattern for each input magnification value is formed on the wafer Wy by rear flatness.
- the positional slippage measuring device 37 measures the amount of positional slippage of each resist pattern formed on the wafer Wy (step S 60 ).
- the positional slippage measuring device 37 creates the correlation information in which the amounts of positional slippage and the input magnification values from the control device 30 are correlated with each other.
- the positional slippage measuring device 37 creates the correlation information by the rear flatness (for each learning template L).
- the correlation information is transmitted to the relational expression creating unit 25 via the input unit 21 .
- the relational expression creating unit 25 calculates the magnification response coefficient by the correlation information based on the correlation information. Accordingly, the relational expression creating unit 25 calculates the magnification response coefficient by the rear flatness.
- the relational expression creating unit 25 creates the relational expression which is a relational expression between the front flatness of the learning template L and the magnification response coefficient (step S 70 ).
- the relational expression creating unit 25 creates the front relational expression by the rear flatness.
- the relational expression creating unit 25 stores the front relational expression.
- FIG. 6 is a flowchart illustrating the process flow of the magnification correction value calculating process using the magnification response coefficient according to this embodiment.
- the flatness measuring device 35 measures the rear flatness of the templates Tx (step S 110 ).
- the flatness measuring device 35 measures the rear flatness in a state in which the master stage 2 X suctions the templates Tx.
- the flatness measuring device 35 transmits the measured rear flatness to the correction information calculating device 20 .
- the rear flatness is transmitted to the suctioned portion flatness extracting unit 22 via the input unit 21 .
- the suctioned portion flatness extracting unit 22 extracts the suctioned portion flatness which is the flatness of the rear suctioned portion out of the rear flatness (step S 120 ).
- the spherical approximation unit 23 calculates the Zernike coefficient by approximating the suctioned portion flatness to the Zernike series. Accordingly, the spherical approximation unit 23 approximates the suctioned portion flatness for each templates Tx (step S 130 ).
- the front flatness calculating unit 24 calculates the front flatness which affects the template pattern surface of the template Tx based on the Zernike coefficient (step S 140 ).
- the correction information calculating unit 26 calculates the magnification response coefficient (correction information) of the template Tx based on the front flatness of the template Tx and the front relational expression. Specifically, the correction information calculating unit 26 calculates the magnification correction coefficient corresponding to the front flatness of the template Tx using the front relational expression (step S 150 ). The output unit 27 transmits the magnification response coefficient to the control device 30 .
- the control device 30 calculates the input magnification value based on the amount of positional slippage of the underlayer pattern. In this way, the imprinting apparatus 101 according to this embodiment calculates the magnification correction value without setting the conditions of the magnification response coefficient of the template Tx.
- the control device 30 corrects the magnification correction value for correcting the input magnification value using the calculated magnification response coefficient (step S 160 ). In this way, the control device 30 corrects the input magnification value using the calculated magnification response coefficient. In other words, the control device 30 calculates the magnification correction value in consideration of the magnification response coefficient based on the front relational expression. The imprinting process is performed using the corrected input magnification value (step S 170 ).
- the imprinting apparatus 101 predicts the magnification response coefficient of the template Tx from the rear flatness of the template Tx.
- the imprinting apparatus 101 corrects the shot magnification using the predicted magnification response coefficient and performs the imprinting process. Since the shot magnification is corrected by the imprinting apparatus 101 , it is possible to accurately superpose the resist pattern formed by the resist 40 X on the underlayer pattern.
- FIG. 7 is a diagram illustrating a relationship between the pressure on the template and the shot magnification of the template.
- the template sizes when the magnifications of templates T 1 and T 2 are changed in three conditions so as to deform the mesa thereof will be described below. Degrees of deformation of the templates T 1 and T 2 are measured by the positional slippage measuring device 37 or the like.
- the template T 1 which is an example of the template Tx has a small amount of magnification adjusted with respect to the pressure by the pressing unit 31 . In other words, the template T 1 has a small degree of reaction to the input magnification value.
- the template T 2 which is an example of the template Tx has a large amount of magnification adjusted with respect to the pressure by the pressing unit 31 .
- the template T 2 has a large degree of reaction to the input magnification value.
- the pressing unit 31 when the pressing unit 31 applies a large pressure to the side surface of the template T 1 , the magnification of the template T 1 becomes slightly less than a desired size.
- the pressing unit 31 applies to an appropriate force (middle pressure) to the side surface of the template T 1 , the magnification of the template T 1 is corrected to an appropriate size.
- the pressing unit 31 applies a small pressure to the side surface of the template T 1 , the magnification of the template T 1 becomes slightly greater than a desired side. In this way, the template T 1 has a small degree of variation in magnification.
- the pressing unit 31 applies a large pressure to the side surface of the template T 2 , the magnification of the template T 2 becomes much less than a desired size.
- the pressing unit 31 applies to an appropriate force (middle pressure) to the side surface of the template T 2 , the magnification of the template T 2 is corrected to an appropriate size.
- the pressing unit 31 applies a small pressure to the side surface of the template T 2 , the magnification of the template T 2 becomes much greater than a desired side. In this way, the template T 2 has a large degree of variation in magnification.
- each of the templates Tx requires correction of the magnification corresponding to the template Tx. Accordingly, the templates Tx require correction of the input magnification value for each template Tx.
- the middle pressure for making the template T 1 in an appropriate size and the middle pressure for making the template T 2 in an appropriate size are not necessarily equal to each other.
- FIG. 8 is a diagram illustrating the magnification response coefficient.
- Correlation information 51 and 52 illustrated in FIG. 8 are derived based on the relationship between the input magnification value (magnification adjustment value) for applying a stress to the side surfaces of the templates T 1 and T 2 and the magnification of the actually-formed shot pattern.
- the correlation information 51 is correlation information of the template T 1
- the correlation information 52 is correlation information of the template T 2 .
- the slope of the correlation information 51 is the magnification response coefficient of the template T 1 and the slope of the correlation information 52 is the magnification response coefficient of the template T 2 .
- the template T 1 has a small degree of variation in magnification and a small magnification response coefficient.
- the template T 2 has a large degree of variation in magnification and a large magnification response coefficient.
- the amount of positional slippage (superposition error) between the underlayer pattern and the resist pattern 40 Y includes various components.
- the positional slippage components will be described below.
- FIG. 9 is diagram illustrating examples of the positional slippage components.
- FIG. 9 illustrates an offset component
- (b) illustrates a magnification component
- (c) illustrates a rhombic component
- (d) illustrates an eccentric magnification component
- (e) illustrates a trapezoidal component
- (f) illustrates a fan-shaped component
- (g) illustrates a C-shaped magnification component
- (h) illustrates an accordion-shaped component
- (i) illustrates a C-shaped deformation component
- (j) illustrates a stream-shaped component.
- the positional slippage between the underlayer pattern and the resist pattern 40 Y is a combination of these components. Since the positional slippage corresponds to the suctioned portion flatness, the spherical approximation unit 23 calculates the Zernike coefficient by approximating the suctioned portion flatness to the Zernike series. Zernike terms of a Zernike polynomial will be described below.
- FIGS. 10A to 10C are diagrams illustrating Zernike terms.
- the Zernike terms affecting the suctioned portion flatness out of the Zernike terms Z 1 to Z 81 of the Zernike polynomial (circular polynomial) are Z 6 illustrated in FIG. 10A , Z 7 illustrated in FIG. 10B , Z 6 illustrated in FIG. 10C , and the like.
- FIG. 11 is a diagram illustrating a calculation example of the front flatness according to the embodiment, (a) of FIG. 11 illustrates rear flatness 45 - 1 and 45 - 2 of learning templates L 1 and L 2 . (b) of FIG. 11 illustrates suctioned portion flatness 46 - 1 and 46 - 2 of the learning templates L 1 and L 2 . (c) of FIG. 11 illustrates front flatness 47 - 1 and 47 - 2 of the learning templates L 1 and L 2 .
- the suctioned portion flatness 46 - 1 and 46 - 2 illustrated in (b) of FIG. 11 are calculated using the rear flatness 45 - 1 and 45 - 2 illustrated in (a) of FIG. 11 .
- the suctioned portion flatness 46 - 1 of the learning template L 1 has the Z 9 component of the Zernike polynomial.
- the suctioned portion flatness 46 - 2 of the learning template L 2 has the Z 6 component of the Zernike polynomial.
- the front flatness 47 - 1 and 47 - 2 illustrated in (c) of FIG. 11 are calculated using the suctioned portion flatness 46 - 1 and 46 - 2 illustrated in (b) of FIG. 11 .
- FIG. 12 is a diagram illustrating a calculation example of the magnification response coefficient according to the embodiment.
- the imprinting apparatus 101 performs the imprinting process on the wafer Wy with various input magnification values using the learning templates L 1 and L 2 .
- FIG. 12 illustrates the input magnification value in the imprinting process.
- the input magnification values to the learning templates L 1 and L 2 are A 1 to A 4 .
- a 1 to A 4 are, for example, as follows.
- (b) of FIG. 12 illustrates a measurement result (OL (Overlay) measured value) (adjustment result) of the amounts of positional slippage of the resist pattern formed through the imprinting process.
- the amounts of positional slippage illustrated in (b) of FIG. 12 are amounts of positional slippage (magnifications) of the resist pattern formed using the input magnification values illustrated in (a) of FIG. 12 .
- the amounts of positional slippage of the learning template L 1 are B 1 to B 4 and the amounts of positional slippage of the learning template L 2 are B 5 to B 8 .
- B 1 to B 4 correspond to A 1 to A 4 of the learning templates L 1 , respectively
- B 5 to B 8 correspond to A 1 to A 4 of the learning templates L 2 , respectively.
- B 1 to B 4 are, for example, as follows.
- B 5 to B 8 are, for example, as follows.
- FIG. 12 illustrates the magnification response coefficient.
- the magnification response coefficient illustrated in (c) of FIG. 12 are calculated using the input magnification values illustrated in (a) of FIG. 12 and the amounts of positional slippage illustrated in (b) of FIG. 12 .
- the horizontal axis of the graph illustrated in (c) of FIG. 12 represents the input magnification value (ppm) illustrated in (a) of FIG. 12 .
- the vertical axis of the graph illustrated in (c) of FIG. 12 represents the amount of positional slippage (ppm) illustrated in (b) of FIG. 12 .
- FIG. 13 is a diagram illustrating a creation example of the front relational expression according to the embodiment.
- the front relational expression is a relational expression between the front flatness and the magnification response coefficient.
- the front relational expression of the learning template having the Z 9 component of the Zernike polynomial and the front relational expression of the learning template having the Z 6 component of the Zernike polynomial will be described with reference to FIG. 13 .
- the relational expression creating unit 25 calculates the front flatness and the magnification response coefficient for each learning template of plural learning templates having the Z 9 component of the Zernike polynomial.
- the relational expression creating unit 25 calculates, for example, a correlation 81 A between front flatness 61 A and a magnification response coefficient 71 A for a first learning template.
- the relational expression creating unit 25 calculates, for example, a correlation 82 A between front flatness 62 A and a magnification response coefficient 72 A for a second learning template.
- the relational expression creating unit 25 calculates, for example, a correlation 83 A between front flatness 63 A and a magnification response coefficient 73 A for a third learning template.
- the relational expression creating unit 25 calculates the front relational expression 85 A based on the correlations 81 A to 83 A.
- the horizontal axis represents the magnification correction value and the vertical axis represents the front flatness.
- the front relational expression 85 A corresponds to the Z 9 component of the Zernike polynomial.
- the front relational expression 85 A is, for example, a front relational expression in the X direction or the Y direction.
- the relational expression creating unit 25 creates the front relational expression in the X direction and the front relational expression in the Y direction based on the correlations 81 A to 83 A.
- the relational expression creating unit 25 calculates the front flatness and the magnification response coefficient for each learning template of plural learning templates having the Z 6 component of the Zernike polynomial.
- the relational expression creating unit 25 calculates, for example, a correlation 81 B between front flatness 61 B and a magnification response coefficient 71 B for a fourth learning template.
- the relational expression creating unit 25 calculates, for example, a correlation 82 B between front flatness 62 B and a magnification response coefficient 72 B for a fifth learning template.
- the relational expression creating unit 25 calculates, for example, a correlation 83 B between front flatness 63 B and a magnification response coefficient 73 B for a sixth learning template.
- the relational expression creating unit 25 calculates the front relational expression 85 B based on the correlations 81 B to 83 B.
- the horizontal axis represents the magnification correction value and the vertical axis represents the front flatness.
- the front relational expression 85 B corresponds to the Z 6 component of the Zernike polynomial.
- the front relational expression 85 B is, for example, a front relational expression in the X direction or the Y direction.
- the relational expression creating unit 25 creates the front relational expression in the X direction and the front relational expression in the Y direction based on the correlations 81 B to 83 B.
- FIG. 14 is a diagram illustrating the hardware configuration of the correction information calculating device.
- the correction information calculating device 20 includes a central processing unit (CPU) 91 , read only memory (ROM) 92 , random access memory (RAM) 93 , a display unit 94 , and an input unit 95 .
- the CPU 91 , the ROM 92 , the RAM 93 , the display unit 94 , and the input unit 95 are connected to each other via a bus line.
- the CPU 91 calculates the magnification response coefficient using a correction information calculating program 97 which is a computer program.
- the correction information calculating program 97 is a computer program product including a non-transitory computer-readable recording medium including plural commands, which can be executed by a computer, for calculating the magnification response coefficient.
- the plural commands cause the computer to calculate the magnification correction value.
- the display unit 94 is a display device such as a liquid crystal monitor and displays the rear flatness, the suctioned portion flatness, the front flatness, the positional slippage, the correlation information, the front relational expression, and the magnification response coefficient as the correction information based on an instruction from the CPU 91 .
- the input unit 95 includes a mouse or a keyboard and receives instruction information (parameters and the like required for calculating the magnification response coefficient) input from the outside by a user.
- the instruction information input to the input unit 95 is transmitted to the CPU 91 .
- the correction information calculating program 97 is stored in the ROM 92 and is loaded into the RAM 93 via the bus line.
- FIG. 14 illustrates a state in which the correction information calculating program 97 is loaded into the RAM 93 .
- the CPU 91 executes the correction information calculating program 97 loaded into the RAM 93 . Specifically, in the correction information calculating device 20 , in response to an input of an instruction from the input unit 95 by the user, the CPU 91 reads the correction information calculating program 97 from the ROM 92 , develops the read correction information calculating program 97 in a program storage area in the RAM 93 , and performs various processes. The CPU 91 temporarily stores a variety of data generated in various processes in a data storage area formed in the RAM 93 .
- the correction information calculating program 97 which is executed in the correction information calculating device 20 is configured as a module including the suctioned portion flatness extracting unit 22 , the spherical approximation unit 23 , the front flatness calculating unit 24 , the relational expression creating unit 25 , and the correction information calculating unit 26 , which are loaded into a main storage device and are generated in the main storage device.
- magnification response coefficient or the magnification correction value are calculated, for example, for each layer of a wafer process. After the template Tx is corrected in magnification, the imprinting process is performed.
- an underlayer film is formed on a wafer Wx and a resist is applied to the underlayer film. Then, the imprinting process is performed in a state in which the template Tx is corrected in magnification. Thereafter, the underlayer film is etched using the resist pattern as a mask. Accordingly, an actual pattern corresponding to the resist pattern is formed on the wafer Wx.
- the magnification response coefficient calculating process, the template Tx magnification correcting process, the underlayer film forming process, the resist applying process, the template Tx magnification correcting process, the imprinting process, the etching process, and the like are repeated for each layer.
- the transfer substrate is the wafer Wx, but the transfer substrate may be a template.
- the flatness of the learning template L is measured in the state in which the master stage 2 X suctions the learning template L (first template).
- the flatness relational expression indicating the relationship between the response coefficient indicating the actual amount of positional slippage of the learning template L from the input magnification value (first input adjustment value) and the flatness of the learning template L is created.
- the flatness of the template Tx in the state in which the master stage 2 X suctions the template Tx is measured.
- the correction information calculating device 20 calculates the response coefficient (correction information) corresponding to the template Tx out of the response coefficients based on the flatness of the template Tx and the flatness relational expression.
- the control device 30 corrects the input magnification adjustment value to the template Tx using the response coefficient corresponding to the template Tx.
- the control device 30 causes the pressing unit 31 to adjust the shape and the size of the template Tx using the corrected input magnification adjustment value. Accordingly, it is possible to easily suppress the positional slippage of the pattern.
Abstract
Description
A1=X/Y=−1.0/−1.0 ppm
A2=X/Y=−2.0/−2.0 ppm
A3=X/Y=−3.0/−3.0 ppm
A4=X/Y=−4.0/−4.0 ppm
B1=X/Y=−0.9/−0.2 ppm
B2=X/Y=−1.7/−1.4 ppm
B3=X/Y=−2.7/−2.5 ppm
B4=X/Y=−3.5/−4.0 ppm
B5=X/Y=0.1/1.2 ppm
B6=X/Y=−0.3/−0.6 ppm
B7=X/Y=−2.0/−2.0 ppm
B8=X/Y=−3.7/−3.7 ppm
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US20220128901A1 (en) * | 2020-10-28 | 2022-04-28 | Canon Kabushiki Kaisha | System and Method for Shaping a Film with a Scaled Calibration Measurement Parameter |
WO2022159468A1 (en) * | 2021-01-20 | 2022-07-28 | Applied Materials, Inc. | Anti-slippery stamp landing ring |
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JP4856798B2 (en) * | 2006-10-18 | 2012-01-18 | Hoya株式会社 | Reflective mask blank manufacturing method, reflective mask manufacturing method, and semiconductor device manufacturing method |
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JP6199115B2 (en) * | 2013-08-22 | 2017-09-20 | Hoya株式会社 | Mask blank substrate manufacturing method, mask blank manufacturing method, transfer mask manufacturing method, and semiconductor device manufacturing method |
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US7703066B2 (en) * | 2004-07-27 | 2010-04-20 | Kabushiki Kaisha Toshiba | Exposure mask manufacturing method, drawing apparatus, semiconductor device manufacturing method, and mask blanks product |
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