UA38420U - method of removal of chip from surface of multilayer glass - Google Patents

method of removal of chip from surface of multilayer glass

Info

Publication number
UA38420U
UA38420U UAU200810645U UAU200810645U UA38420U UA 38420 U UA38420 U UA 38420U UA U200810645 U UAU200810645 U UA U200810645U UA U200810645 U UAU200810645 U UA U200810645U UA 38420 U UA38420 U UA 38420U
Authority
UA
Ukraine
Prior art keywords
chip
multilayer glass
removal
transparent resin
glass
Prior art date
Application number
UAU200810645U
Other languages
Russian (ru)
Ukrainian (uk)
Inventor
Богдан Федорович Бородюк
Original Assignee
Богдан Федорович Бородюк
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Богдан Федорович Бородюк filed Critical Богдан Федорович Бородюк
Priority to UAU200810645U priority Critical patent/UA38420U/en
Publication of UA38420U publication Critical patent/UA38420U/en
Priority to RU2009118248/05A priority patent/RU2425752C2/en

Links

Landscapes

  • Surface Treatment Of Glass (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

A method of removal of a chip from the surface of multilayer glass includes preheating the surface of glass in the area of chipping, heating liquid transparent resin, introduction of heated liquid transparent resin into the chip, creation of pressure on the chip, cooling multilayer glass, application of thick transparent resin on the chip, polymerization of thick transparent resin.
UAU200810645U 2008-08-26 2008-08-26 method of removal of chip from surface of multilayer glass UA38420U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
UAU200810645U UA38420U (en) 2008-08-26 2008-08-26 method of removal of chip from surface of multilayer glass
RU2009118248/05A RU2425752C2 (en) 2008-08-26 2009-05-12 Elimination of cleavage from multilayer glass surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
UAU200810645U UA38420U (en) 2008-08-26 2008-08-26 method of removal of chip from surface of multilayer glass

Publications (1)

Publication Number Publication Date
UA38420U true UA38420U (en) 2009-01-12

Family

ID=44058170

Family Applications (1)

Application Number Title Priority Date Filing Date
UAU200810645U UA38420U (en) 2008-08-26 2008-08-26 method of removal of chip from surface of multilayer glass

Country Status (2)

Country Link
RU (1) RU2425752C2 (en)
UA (1) UA38420U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2750384C2 (en) * 2019-11-08 2021-06-28 Ирина Александровна Косырихина Method for strengthening protection and eliminating adverse factors of installation of an additional protective glass

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201715588D0 (en) 2017-09-26 2017-11-08 Belron Int Ltd Curing repair resin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2750384C2 (en) * 2019-11-08 2021-06-28 Ирина Александровна Косырихина Method for strengthening protection and eliminating adverse factors of installation of an additional protective glass

Also Published As

Publication number Publication date
RU2009118248A (en) 2010-11-20
RU2425752C2 (en) 2011-08-10

Similar Documents

Publication Publication Date Title
WO2008132903A1 (en) Pattern formation method and pattern formation apparatus
WO2010048237A3 (en) Ultraviolet reflector with coolant gas holes and method
EP2236575A4 (en) Method for bonding resin by vacuum ultraviolet irradiation, process for producing resin article or microchip using the method, and resin article or microchip produced by the process.
TWI348205B (en) A method of direct bonding two substrates used in electronics, optics, or optoelectronics
TW201711852A (en) Chemically-strengthened glass laminates
WO2010080010A3 (en) Norbornene polymer including photoreactive functional group that has halogen substituent, method for preparing the same, and alignment layer using the same
EP2100908A4 (en) Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition
EP2200074A4 (en) Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
WO2008105423A1 (en) Backlight system and optical sheet with adhesive
ATE500770T1 (en) DEVICE FOR BREWING A LIQUID FOOD OR DRINKING FOOD
MX2012007297A (en) Bonded substrates and methods for bonding substrates.
WO2009120548A3 (en) Multilayer articles and methods of making and using the same
EP2143551A4 (en) Process for formation of resin surface, process for production of articles having recesses different in size on the surface, such articles, process for production of gloves, and gloves
WO2005095087A3 (en) Reinforced resinous article and method of making the reinforced resinous article
EP2060611A4 (en) Ultraviolet-curable adhesive composition, ultraviolet-curable adhesive sheet and method for producing the same
TW200639204A (en) Polarizing layer with adherent protective layer
WO2008024933A3 (en) Air pressure brewer
TW201129518A (en) Method for manufacturing a display device
MX2019004819A (en) Method for producing a composite pane for a motor vehicle.
WO2010040781A3 (en) Device for impregnating a web-type material with thermally curable impregnating resin
WO2009103706A3 (en) Method of thermocleaving a polymer layer
WO2009139598A3 (en) Heat-shrinkable polyester film
GB0700824D0 (en) Laminate
TW200951513A (en) Method of manufacturing polarizing plate a
WO2008153119A1 (en) Micro-passage chip