TWM677243U - Transmission cable - Google Patents

Abstract

The transmission cable includes a wire set and a first connector arranged at a first end of the wire set. The first connector includes a first circuit board having a connection pad set, and an active chip arranged on the first circuit board. A first power port of the active chip is electrically connected to a VCONN connection pad of the connection pad set. The wire set includes a first signal transmission unit. The first signal transmission unit has a first signal transmission wire and a first drain wire. The first signal transmission wire is electrically connected to a first signal transmission pad of the connection pad set. The first drain wire is electrically connected to the VCONN connection pad.

Description

Transmission cable

This work relates to a transmission cable; in particular, to a transmission cable optimized for voltage drop across both ends of the transmission cable.

With advancements in technology, the functional differences between various transmission cables are significant. Even cables using the same connector can exhibit vastly different functionalities due to configurations or the choice of chips. Take USB Type-C cables as an example: they can be configured to provide different power outputs (e.g., 3-5 amps or 5-20 volts), support video transmission, or offer different transmission speeds. Because a single USB Type-C cable may have different capability configurations, an active chip (E-marker) is required to record various capability attributes of the transmission cable, such as power transmission capabilities, data transmission capabilities, video transmission capabilities, and identification codes.

The power supply for the active chip of the transmission cable may originate from a device at one end of the transmission cable. For example, referring to Figure 1, which shows the connection configuration of the active chip P11 in a conventional transmission cable P1, the conventional transmission cable P1 may include a first connector P10, a second connector P30 disposed at both ends, and a wire assembly P20 connecting the first connector P10 and the second connector P30. The active chip P11 of the conventional transmission cable P1 may be configured in one or both connectors P10 and P20, and powered through connectors P10 and P20. Specifically, the active chip P11 may have two power/voltage connection (VCONN) ports, VCONN1 and VCONN2, which are connected to the VCONN terminals of the first connector P10 and the second connector P20, respectively. When the conventional transmission cable is connected to the first device P2 and the second device P3, the first device P2 and the second device P3 can determine the data flow (e.g., downlink (DFP), uplink (UFP), or dual-purpose data (DRD)) or power supply mode through the configure control (CC) port of the active chip P11. Then, an agreement is made for the first device or the second device to power the active chip.

In practical applications, the cable assemblies are easily constrained by their physical limitations. The electrical impedance of the cable assemblies leads to energy loss, and voltage drops occur at the two ends of the cable (e.g., between the VBUS or VCONN terminals of a power bus), causing signal level deviation or inaccuracy, resulting in malfunction or failure. For example, if the power supply to the active chip becomes unstable due to excessive voltage drop, the active chip will fail and cannot achieve its intended function. These problems become even more pronounced in long-distance transmission.

To address voltage drops or signal loss caused by the electrical impedance of the cable bundle, the traditional approach is to increase the wire diameter within the bundle. However, this adjustment may increase the rigidity of the transmission cable bundle, leading to problems such as difficulty in bending, making cable setup more challenging for users/installers. It should be noted that voltage drop issues are not limited to long-distance transmission. For short-distance applications, using smaller cross-sectional area cable bundles can achieve advantages such as reduced cost and increased flexibility.

Therefore, how to reduce signal and/or energy attenuation caused by the impedance of transmission cables without increasing the wire diameter of the transmission cables, or with the desire to reduce the wire diameter of transmission cables, will be a major challenge in the field of transmission cable research and development.

One of the purposes of this invention is to reduce the voltage drop at both ends of the transmission line in order to avoid failure of the active chip or loss of function of the transmission line due to voltage drop.

This invention provides a transmission cable. The transmission cable includes a cable assembly and a first connector disposed at a first end of the cable assembly. The first connector includes a first connector circuit board having a cable assembly connection pad assembly and an active chip disposed on the first connector circuit board. A first power supply port of the active chip is electrically connected to a VCONN connection pad of the cable assembly connection pad assembly. The cable assembly includes a first signal transmission unit. The first signal transmission unit has a first signal transmission line and a first drain line. The first signal transmission line is electrically connected to the first signal transmission pad of the cable assembly connection pad assembly. The first drain line is electrically connected to the VCONN connection pad.

In one embodiment, the wire bundle further includes a shielding layer that at least partially covers the signal transmission unit and is electrically connected to the grounding pad of the wire bundle connection pad.

In one embodiment, the first drain line is disposed on the auxiliary VCONN connecting pad of the inline connection pad assembly and is electrically connected to the VCONN connecting pad via the conductor lines of the first connector circuit board.

In one embodiment, the auxiliary VCONN connection pad is set adjacent to the first signal transmission pad.

In one embodiment, the auxiliary VCONN connector pad is located at a corner of the first connector circuit board.

In one embodiment, the wiring harness further includes a VCONN transmission line disposed on the VCONN connector pad and electrically connected to a first power supply port of the active chip.

In one embodiment, the wire assembly further includes a power transmission unit electrically connected to a power transmission pad of the wire assembly connection pad.

In one embodiment, the wire assembly further includes a second signal transmission unit. The second signal transmission unit has a second signal transmission line electrically connected to a second signal transmission pad of the wire assembly connection pad, and a second drain line electrically connected to a power transmission pad of the wire assembly connection pad.

In one embodiment, the configuration port of the active chip is electrically connected to the configuration connection pad of the wire group connection pad assembly. The wire group also includes configuration transmission lines disposed on the configuration connection pad.

In one embodiment, the first connector further includes a plug terminal. The plug terminal has a VCONN terminal electrically coupled to a second power supply port of the active chip.

This invention provides a transmission cable. The transmission cable includes a cable assembly and a first connector disposed at a first end of the cable assembly. The first connector includes a first connector circuit board having a cable assembly connection pad assembly and an active chip disposed on the first connector circuit board. A first power supply port of the active chip is electrically connected to a VCONN connection pad of the cable assembly connection pad assembly. The cable assembly includes a first drain line electrically connected to the VCONN connection pad and a second drain line electrically connected to a power transmission pad in the cable assembly connection pad assembly.

In one embodiment, a first drain line is disposed on an auxiliary VCONN connector of the wire group connector pad assembly and is electrically connected to the VCONN connector pad via a first conductor line of the first connector circuit board. A second drain line is disposed on an auxiliary power transmission pad of the wire group connector pad assembly and is electrically connected to the power transmission pad via a second conductor line of the first connector circuit board.

In one embodiment, an auxiliary VCONN connector pad is disposed at a first corner of the first connector circuit board, and an auxiliary power transmission pad is disposed at a second corner of the first connector circuit board.

In one embodiment, the wiring harness further includes a VCONN transmission line disposed on the VCONN connector pad and electrically connected to a first power supply port of the active chip.

In one embodiment, the configuration port of the active chip is electrically connected to the configuration connection pad of the wire group connection pad assembly. The wire group also includes configuration transmission lines disposed on the configuration connection pad.

In one embodiment, the first connector further includes a plug terminal. The plug terminal has a VCONN terminal electrically coupled to a second power supply port of the active chip.

This invention provides a transmission cable. The transmission cable includes a cable assembly and a USB Type-C connector disposed at a first end of the cable assembly. The USB Type-C connector includes a connector circuit board having a cable assembly connection pad assembly. The cable assembly includes a first signal transmission unit. The first signal transmission unit has a first signal transmission line electrically connected to a first signal transmission pad of the cable assembly connection pad assembly, and a first drain line electrically connected to a power transmission pad of the cable assembly connection pad assembly.

In one embodiment, the wire assembly further includes a power transmission unit electrically connected to a power transmission pad of the wire assembly connection pad.

In one embodiment, the drain line is disposed on the auxiliary power transmission pad of the inline connection pad assembly and is electrically connected to the power transmission pad via the conductor lines of the first connector circuit board.

In one embodiment, the auxiliary power transmission pad is located at a corner of the first connector circuit board.

As described above, drain lines can be used as auxiliary power transmission lines for transmitting VCONN voltage in DC applications. Furthermore, because the drain line's function of eliminating and/or diverting interference signals applies to high-frequency applications, it can still achieve the desired effect in high-frequency applications. This reduces the voltage drop across the transmission line, thus preventing active chip failure or cable malfunction due to voltage drop.

Any reference to elements using names such as "first," "second," etc., as used herein does not generally limit the number or order of these elements. Rather, these names are used herein as a convenient way to distinguish two or more elements or instances of elements. Therefore, it should be understood that the names "first," "second," etc., in the claim do not necessarily correspond to the same names in the written description. Furthermore, it should be understood that references to first and second elements do not imply that only two elements can be used or that the first element must precede the second element. The terms "comprising," "including," "having," "containing," etc., as used herein are open-ended, meaning they include but are not limited to.

The term "coupled" is used in this article to refer to a direct or indirect electrical coupling between two structures. For example, in one example of indirect electrical coupling, one structure may be coupled to another structure via a passive element such as a resistor, capacitor, or inductor.

In this work, the terms “exemplary” and “for example” are used to mean “serving as an example, instance, or illustration.” Any implementation or aspect described herein as “exemplary” or “for example” is not necessarily to be construed as preferred or advantageous over other aspects of this work. The terms “approximately” and “roughly” used herein with respect to specified values or characteristics are intended to mean within a certain value (e.g., 10%) of the specified value or characteristic.

In a specific embodiment of this invention, a transmission cable is provided. Referring to FIG2, the transmission cable 10 includes a cable assembly 200 and a first connector 100 disposed at a first end 201 of the cable assembly 200. The first connector 100 includes a first connector circuit board 110 having a cable assembly connection pad assembly 111 and an active chip 120 disposed on the first connector circuit board 110. The first power supply port VCONN1 of the active chip 120 is electrically connected to the VCONN connection pad 111-1 of the cable assembly connection pad assembly 111. The cable assembly 200 includes a first signal transmission unit 210. The first signal transmission unit 210 has a first signal transmission line 211 and a first drain line 212. The first signal transmission line 211 is electrically connected to the first signal transmission pad 111-2 of the wire connection pad group 111. The first drain line 212 is electrically connected to the VCONN connection pad 111-1.

The transmission cable 10 can connect two devices for data transmission, charging (e.g., based on the USB PD protocol), and/or audio/video transmission. The transmission cable 10 consists of a cable assembly 200, a first connector 100 disposed at a first end 201 of the cable assembly 200, and a second connector 300 disposed at a second end 202 of the cable assembly 200. The cable assembly 200 can be mounted on the first connector circuit board 110 of the first connector 100 by means of soldering, but is not limited thereto.

The first connector 100 also includes a plug terminal 130, which can be any conventional plug, such as HDMI, DisplayPort (DP), USB (Type-C), etc., and has a corresponding outer casing. The outer casing is preferably electrically connected to a ground point, but is not limited thereto. The outer casing can serve as a protection mechanism to protect the terminals inside the plug terminal 130, or as a foolproof mechanism when the plug terminal 130 is inserted into a corresponding socket. For example, the configuration of the outer casing can be formed to correspond to the configuration of the socket to avoid problems such as inserting into the wrong socket or incorrect orientation during installation, but is not limited thereto. The electrical terminals of the plug terminal 130 can be electrically connected to the first connector circuit board 110 through conventional connection methods.

Taking the first connector circuit board 110 as an example, the first connector circuit board 110 can be a printed circuit board (PCB) or any suitable circuit carrier. The first connector circuit board 110 has a wire group connection pad group 111 and a chip connection pad group 112 (under the active chip 120 in FIG. 2). The wire group connection pad group 111 and the chip connection pad group 112 are respectively conductive sheets disposed on the surface of the first connector circuit board 110. The conductive sheets for connection can be formed on the substrate of the conductor by traditional manufacturing processes such as engraving, photolithography or etching. Various wires in the wire group 200 can be disposed on the wire group connection pad group 111 by means of soldering or the like, and the active chip 120 can also be disposed on the chip connection pad group 112 by means of surface mount soldering or pin soldering.

Referring to Figure 3, the wire connection pad assembly 111 includes a VCONN connection pad 111-1 and a first signal transmission pad 111-2. The chip connection pad assembly 112 includes a first power supply pad 112-1 that provides power to the first power supply port VCONN1 of the active chip 120. The VCONN connection pad 111-1 and the first power supply pad 112-1 are electrically connected to each other via a conductor path (path1) pre-configured in the first connector circuit board 110. When the VCONN connection pad 111-1 receives chip power (VC) from the second connector 300 via the VCONN transmission line 230, it can be supplied to the active chip 120 through the conductor path (path1).

The active chip 120 may be, for example, an electronic tag chip (E-Marker) for electronic identification or a relay chip (redriver) for signal relay processing, but is not limited thereto. The active chip 120 may be disposed at one or both ends of the transmission cable 10. In other words, the active chip 120 may be disposed only on the first connector 100 or the same or different active chips 120 may be disposed on the second connector 300.

When the active chip 120 needs to operate and requires power, it can obtain the necessary chip power (VC) through the plug terminal 130 of the first connector 100 or the second connector 300. Specifically, the first power supply port VCONN1 of the active chip 120 is electrically connected to the VCONN connector pad 111-1 and receives the chip power (VC) from the second connector 300. On the other hand, the active chip 120 can also be connected to the plug terminal 130 of the first connector 100 and receive the chip power (VC) from the plug terminal 130 of the first connector 100.

The wire assembly 200 can be formed by wrapping various types of core wires (single-core wire, coaxial wire, twisted pair wire, multi-strand wire) with an insulation layer. It should be noted that the number and type of core wires in the wire assembly 200 are not limited. Preferably, the core wires of the wire assembly 200 can be selected according to the specifications of the first connector 100 and/or the second connector 300, but are not limited thereto. It should also be noted that, as those skilled in the art will know, the wire assembly 200 can also contain other wires or layers, as will be explained below.

The first signal transmission unit 210 of the wire assembly 200 has a first signal transmission line 211 and a first drain line 212. The first signal transmission line 211 is used to transmit signals and is electrically connected to the first signal transmission pad 111-2 of the wire assembly connection pad group 111. For example, when the first signal transmission unit 210 is configured to transmit differential signals, the first signal transmission line 211 may be one strand of a twisted pair (211+/211-) for transmitting differential signals. The first drain line 212 is a bare conductor (i.e., without insulation) and is preferably wound around the first signal transmission line 211 and covered by an insulation layer 213. The exemplary function of the first drain line 212 is to exclude and/or divert interference signals from the first signal transmission unit 210. The interference signals from the first signal transmission unit 210 can be noise generated by the interaction between the first signal transmission line 211 and other wires (e.g., crosstalk noise) or noise coupled into the first signal transmission line 211 from outside the first signal transmission unit 210. The first drain line 212 is electrically connected to the VCONN connector pad 111-1 so that the first drain line 212 can be used in DC applications to transmit the chip power (VC) (e.g., DC 5V/3.3V) required to supply the active chip 120. This reduces the required wire diameter of the VCONN transmission line 230 for chip power (VC) transmission in the cable group 200, thereby reducing the voltage drop across the transmission cable 10 to the chip power (VC). In other words, compared to conventional configurations, for the same length requirement, the configuration of this invention can reduce the required wire diameter of the VCONN transmission line 230 for chip power (VC) transmission in the cable group 200, or achieve a smaller voltage drop using the same wire diameter VCONN transmission line 230. On the other hand, in high-frequency applications (e.g., signals above 1 GHz), the first drain line 212 can still perform its original function, such as excluding interference signals from the first signal transmission unit 210 from the VCONN connection pad 111-1.

The wire assembly 200 may also include other types of wires. Please refer to Figure 4, which shows an example cross-sectional structure of the wire assembly 200. In one embodiment, the wire assembly 200 may also include a shielding layer 240 that at least partially covers the first signal transmission unit 210. For example, the shielding layer 240 may be a conductor such as aluminum foil or copper mesh, disposed on the outermost layer of the wire assembly 200. When the cross-section of the wire assembly 200 is annular, the outermost layer may be an insulating covering layer 250 followed by the shielding layer 240. The cross-section of the shielding layer 240 may be annular to form a cavity (A), in which the first signal transmission unit 210 and other wires in the wire assembly 200 are disposed. It should be noted that the chamber (A) shown in Figure 4 is only schematic. The size of the chamber (A) may be only slightly larger than the cross-sectional area of the first signal transmission unit 210 because the shielding layer 240 and the insulating covering layer 250 tightly cover the first signal transmission unit 210 or other wires. On the other hand, the shielding layer 240 is electrically connected to the ground terminal through the first connector circuit board 110. The shielding layer 240 can also be electrically connected to the ground terminal through the outer casing or other electrically common ground parts. The shielding layer 240 is electrically connected to the ground terminal so that the shielding layer 240 has the function of shielding the external noise of the wire assembly 200 to avoid interfering with the internal signal transmission of the wire assembly 200. Compared to the conventional configuration of electrically connecting the drain line to the ground terminal, the ground terminals at both ends of the transmission cable 10 can be effectively electrically connected through the shielding layer 240. Since the impedance of the shielding layer 240 itself is much smaller than that of other wires in the wire group 200, the drain line can be electrically connected to the VCONN connector 111-1 to transmit the chip power (VC) required by the active chip 120 without affecting (or with very little affecting) the grounding at both ends of the transmission cable 10.

In one embodiment, referring to Figure 5, the wiring harness 200 further includes a power transmission unit 260, which is electrically connected to the power supply terminal (VBUS) via a power transmission pad 111-4 of the wiring harness connection pad assembly 111 of the first connector circuit board 110. The power transmission unit 260 is, for example, a power-transmitting wire (e.g., copper wire) in the wiring harness 200. The power transmission unit 260 is electrically coupled to the power supply terminal (VBUS) through the power transmission pad 111-4 so that the power transmission unit 260 can act as the primary carrier of power transmission. The power supply terminal (VBUS) originates, for example, from the device provided by the first connector 100. In one application example, once the transmission cable 10 completes the PD protocol, the power transmission unit 260 can transmit power.

In one embodiment, the cable assembly 200 further includes a configuration transmission line 270 disposed on configuration connection pads 111-5. The configuration port (CC) of the active chip 120 is electrically connected to the configuration connection pads 111-5 of the cable assembly connection pads 111. Specifically, the device connected to the transmission cable 10 can send a request message to the active chip 120 through the configuration transmission line 270, and after receiving the request message through the configuration port (CC), the active chip 120 in the transmission cable 10 can provide relevant information about the device active chip 120 or the transmission cable 10 to facilitate subsequent transmission operations.

In one embodiment, the active chip 120 also has a second power supply port (VCONN2). Referring to FIG6, the second power supply port (VCONN2) is electrically connected to the VCONN terminal of the plug terminal 130. In this embodiment, the first power supply port VCONN1 of the active chip 120 is configured to receive chip power (VC) from a connected device at the second connector 300. The second power supply port (VCONN2) of the active chip 120 is configured to receive chip power (VC) from a connected device at the first connector 100. When the active chip 120 determines the source device of the chip power (VC) through a protocol (e.g., PD protocol), it can select either the first power supply port VCONN1 or the second power supply port (VCONN2) as the power supply for the active chip 120.

In the embodiment where the first connector circuit board 110 is connected to the wire group 200, referring to Figures 7A and 7B, the first drain line 212 is disposed on the auxiliary VCONN connector pad 111-3 of the wire group connector pad assembly 111, and is electrically connected to the VCONN connector pad 111-1 via the conductor line (path1) of the first connector circuit board 110. In the embodiment shown in Figure 7A, the auxiliary VCONN connector pad 111-3 and the first signal transmission pad 111-2 are disposed adjacent to each other. In the embodiment shown in Figure 7B, the auxiliary VCONN connector pad 111-3 is disposed at a corner position (C1) of the first connector circuit board 110. The auxiliary VCONN connector 111-3 can reduce interference in the electrical connection between the first row of conductors 212 and the VCONN connector 111-1, and the auxiliary VCONN connector 111-3 and the VCONN connector 111-1 can be arranged close to or far apart according to different circuit requirements.

In one embodiment, the remaining drain wires in the cable assembly 200 can be selectively electrically connected to a ground terminal, a power supply terminal (VBUS), or a VCONN terminal. For example, referring to FIG8, the transmission cable 10 includes a cable assembly 200 and a first connector 100 disposed at a first end 201 of the cable assembly 200. The first connector 100 includes a first connector circuit board 110 having a cable assembly connection pad assembly 111 and an active chip 120 disposed on the first connector circuit board 110. The first power supply port VCONN1 of the active chip 120 is electrically connected to the VCONN connection pad 111-1 of the cable assembly connection pad assembly 111. The cable assembly 200 includes a first drain wire 212 electrically connected to the VCONN connection pad 111-1 and a second drain wire 222 electrically connected to the power transmission pad 111-4 in the cable assembly connection pad group 111. Specifically, the cable assembly 200 also has a second signal transmission unit 220. The second signal transmission unit 220 has a second signal transmission line 221 electrically connected to the second signal transmission pad 111-6 in the cable assembly connection pad group 111, and a second drain wire 222 electrically connected to the power transmission pad 111-4 in the cable assembly connection pad group 111. The required wire diameter of the power transmission unit 260 can be reduced synchronously by electrically connecting the second drain wire 222 to the power supply terminal (VBUS). This reduces the voltage drop across the power transmission unit 260.

In this embodiment, an example of the connection between the first connector circuit board 110 and the wire assembly 200 is shown in Figure 9. As shown in Figure 9, the first drain line 212 is disposed on the auxiliary VCONN connecting pad 111-3 of the wire assembly connecting pad group 111, and is electrically connected to the VCONN connecting pad 111-1 via the first conductor line of the first connector circuit board 110. The second drain line 222 is disposed on the auxiliary power transmission pad 111-7 of the wire assembly connecting pad group 111, and is electrically connected to the power transmission pad 111-4 via the second conductor line of the first connector circuit board 110. The auxiliary VCONN connector pad 111-3 is located at the first corner (C1) of the first connector circuit board 110, and the auxiliary power transmission pad 111-7 is located at the second corner (C2) of the first connector circuit board 110. This effectively distinguishes the auxiliary power transmission pad 111-7 used for power transmission from the auxiliary VCONN connector pad 111-3 used for transmitting VCONN power, reducing soldering difficulties.

In one embodiment, the present invention provides a transmission cable. The transmission cable includes a cable assembly and a USB Type-C connector 100 disposed at a first end of the cable assembly. The USB Type-C connector 100 includes a connector circuit board having a cable assembly connection pad assembly. The cable assembly includes a first signal transmission unit. The first signal transmission unit has a first signal transmission line electrically connected to a first signal transmission pad of the cable assembly connection pad assembly, and a first drain line electrically connected to a power transmission pad of the cable assembly connection pad assembly. By using the drain line as a power supply terminal (VBUS), the required wire diameter of the power transmission unit can be reduced simultaneously, thereby reducing the voltage drop across the power transmission unit.

As described above, the drain line can be used as an auxiliary power transmission line for transmitting the VCONN voltage in DC applications. Furthermore, because the drain line's function of eliminating and/or diverting interference signals applies to high-frequency applications, it can still achieve the desired effect in high-frequency applications. This reduces the voltage drop across the transmission line, thereby preventing the active chip 120 from malfunctioning or the transmission cable 10 from losing its function due to voltage drop.

The prior description of this invention is provided to enable those skilled in the art to make or practice it. Various modifications to this invention will be apparent to those skilled in the art, and the general principles defined herein can be applied to other variations without departing from the spirit or scope of this invention. Therefore, this invention is not intended to be limited to the examples described herein, but rather to conform to the widest scope consistent with the principles and novel features of the invention herein.

P1: Traditional transmission cable P2: First device P3: Second device P10: First connector P11: Active chip P20: Cable assembly P30: Second connector 10: Transmission cable 100: First connector/USB Type-C connector 110: First connector circuit board; 111: Wire group connection pad assembly; 111-1: VCONN connection pad; 111-2: First signal transmission pad; 111-3: Auxiliary VCONN connection pad; 111-4: Power transmission pad; 111-5: Configuration connection pad; 111-6: Second signal transmission pad; 111-7: Auxiliary power transmission pad; 112: Chip connection pad assembly; 112-1: First power supply pad; 120: Active chip; 130: Plug end; 200: Wire group; 201: First end; 202: Second end; 210: First signal transmission unit; 211+. 211-: First signal transmission line; 212: First drain line; 213: Insulation layer; 220: Second signal transmission unit; 221: Second signal transmission line; 222: Second drain line; 230: VCONN transmission line; 240: Shielding layer; 250: Insulation sheath; 260: Power transmission unit; 270: Configuration transmission line; 300: Second connector.

The accompanying drawings are provided to help illustrate various aspects of this work. To simplify and highlight the content depicted in the drawings, familiar structures or components may be shown in a simplified schematic or omitted. For example, the number of components may be singular or plural. These drawings are provided solely for illustrative purposes and not for limitation.

Figure 1 is a circuit diagram of the known transmission cable and active chip configuration.

Figure 2 is a schematic diagram of the transmission cable in one embodiment of this invention.

Figure 3 is a schematic diagram of the circuit board of the active chip and the connector circuit board in one embodiment of this invention.

Figure 4 is a cross-sectional schematic diagram of the line group in one embodiment of this invention.

Figure 5 is a schematic diagram of the circuit board of the active chip and the connector circuit board in one embodiment of this invention.

Figure 6 is a schematic diagram of the circuit board of the active chip and the connector circuit board in one embodiment of this invention.

Figures 7A and 7B are schematic diagrams of the connector circuit board configuration in one embodiment of this invention.

Figure 8 is a schematic diagram of the transmission cable in one embodiment of this invention.

Figure 9 is a schematic diagram of the connector circuit board configuration in one embodiment of this invention.

10: Transmission cables

100: First Connector / USB Type-C Connector

110: First connector circuit board

111: Cable Connection Pads

111-1: VCONN Connector Gasket

111-2: First Signal Transmission Pad

111-3: Auxiliary VCONN Connector Gasket

112: Chip Connector Pads

120: Active chip

130: Plug end

200: Line group

201: First End

202: Second End

210: First Signal Transmission Unit

211+, 211-: First signal transmission line

212: First row of streamlines

213: The Insulation Layer

230: VCONN cable

300: Second Connector

Claims (20)

A transmission cable includes: a first connector, comprising: a first connector circuit board having a wire group connection pad assembly; and an active chip disposed on the first connector circuit board, wherein a first power supply port of the active chip is electrically connected to a VCONN connection pad of the wire group connection pad assembly; and a wire group, wherein the first connector is disposed at a first end of the wire group, the wire group including: a first signal transmission unit having: a first signal transmission line electrically connected to a first signal transmission pad of the wire group connection pad assembly; and a first drain line electrically connected to the VCONN connection pad. The transmission cable as described in claim 1, wherein the cable assembly further includes: a shielding layer that at least partially covers the signal transmission unit and is electrically connected to a grounding pad of the cable assembly connection pad assembly. The transmission cable as described in claim 1, wherein the first drain line is disposed on an auxiliary VCONN connector of the cable assembly and is electrically connected to the VCONN connector via a conductor line of the first connector circuit board. The transmission cable as described in claim 3, wherein the auxiliary VCONN connector pad is arranged adjacent to the first signal transmission pad. The transmission cable as described in claim 3, wherein the auxiliary VCONN connector pad is located at a corner of the first connector circuit board. The transmission cable as described in claim 1, wherein the cable assembly further includes: a VCONN transmission line disposed on the VCONN connector pad and electrically connected to the first power supply port of the active chip. The transmission cable as described in claim 1, wherein the cable assembly further includes: a power transmission unit electrically connected to a power transmission pad of the cable assembly connection pad assembly. The transmission cable as described in claim 1, wherein the cable assembly further includes: a second signal transmission unit having: a second signal transmission line electrically connected to a second signal transmission pad of the cable assembly connection pad assembly; and a second drain line electrically connected to a power transmission pad of the cable assembly connection pad assembly. The transmission cable as described in claim 1, wherein a configuration port of the active chip is electrically connected to a configuration connection pad of the line assembly connection pad; and wherein the line assembly further includes a configuration transmission line disposed on the configuration connection pad. The transmission cable as described in claim 1, wherein the first connector further includes: a plug end having: a VCONN terminal electrically coupled to a second power supply port of the active chip. A transmission cable includes: a first connector, comprising: a first connector circuit board having a wire group connection pad assembly; and an active chip disposed on the first connector circuit board, wherein a first power supply port of the active chip is electrically connected to a VCONN connection pad of the wire group connection pad assembly; and a wire group, wherein the first connector is disposed at a first end of the wire group, the wire group including: a first drain line electrically connected to the VCONN connection pad; and a second drain line electrically connected to a power transmission pad in the wire group connection pad assembly. The transmission cable as described in claim 11, wherein the first drain line is disposed in an auxiliary VCONN connector of the cable group connector assembly and is electrically connected to the VCONN connector via a first conductor line of the first connector circuit board; and wherein the second drain line is disposed in an auxiliary power transmission pad of the cable group connector assembly and is electrically connected to the power transmission pad via a second conductor line of the first connector circuit board. The transmission cable as described in claim 12, wherein the auxiliary VCONN connector pad is disposed at a first corner of the first connector circuit board, and the auxiliary power transmission pad is disposed at a second corner of the first connector circuit board. The transmission cable as described in claim 11, wherein the cable assembly further includes: a VCONN transmission line disposed on the VCONN connector pad and electrically connected to the first power supply port of the active chip. The transmission cable as described in claim 11, wherein a configuration port of the active chip is electrically connected to a configuration connection pad of the line assembly connection pad; and wherein the line assembly further includes a configuration transmission line disposed on the configuration connection pad. The transmission cable as described in claim 11, wherein the first connector further includes: a plug end having: a VCONN terminal electrically coupled to a second power supply port of the active chip. A transmission cable includes: a USB Type-C connector, comprising: a connector circuit board having a wire assembly connection pad assembly; and a wire assembly, the USB Type-C connector being disposed at a first end of the wire assembly, the wire assembly including: a first signal transmission unit having: a first signal transmission line electrically connected to a first signal transmission pad of the wire assembly connection pad assembly; and a first drain line electrically connected to a power transmission pad of the wire assembly connection pad assembly. The transmission cable as described in claim 17, wherein the cable assembly further includes: a power transmission unit electrically connected to the power transmission pad of the cable assembly connection pad assembly. The transmission cable as described in claim 17, wherein the drain line is disposed on an auxiliary power transmission pad of the cable assembly and is electrically connected to the power transmission pad via a conductor line of the connector circuit board. The transmission cable as described in claim 19, wherein the auxiliary power transmission pad is located at a corner of the connector circuit board.