TWM667148U - Cutting pad for easy work - Google Patents
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- TWM667148U TWM667148U TW113204095U TW113204095U TWM667148U TW M667148 U TWM667148 U TW M667148U TW 113204095 U TW113204095 U TW 113204095U TW 113204095 U TW113204095 U TW 113204095U TW M667148 U TWM667148 U TW M667148U
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Abstract
本創作提供一種便利工作之切割墊,包括一第一切割層、一磁吸層、一防穿刺層、一第二切割層及一環框,其中該第一切割層、該磁吸層、該防穿刺層及該第二切割層沿其厚度方向依序排列,該環框環圍該磁吸層的側向外周,且該環框位於該第一切割層及該防穿刺層之間,據此包覆定位該磁吸層,該第一切割層及該第二切割層分別由軟質的熱塑性樹脂構成,該防穿刺層由硬質的熱塑性樹脂構成,該環框由熱塑性樹脂構成,該磁吸層係具有磁性吸附力的磁片構成,該第一切割層、該環框、該防穿刺層及該第二切割層一體熱融壓合。The invention provides a cutting pad for convenient work, comprising a first cutting layer, a magnetic layer, an anti-puncture layer, a second cutting layer and a ring frame, wherein the first cutting layer, the magnetic layer, the anti-puncture layer and the second cutting layer are arranged in sequence along the thickness direction thereof, the ring frame surrounds the lateral periphery of the magnetic layer, and the ring frame is located between the first cutting layer and the anti-puncture layer. The magnetic attraction layer is positioned accordingly, the first cutting layer and the second cutting layer are respectively made of soft thermoplastic resin, the anti-puncture layer is made of hard thermoplastic resin, the ring frame is made of thermoplastic resin, the magnetic attraction layer is made of a magnetic sheet with magnetic adsorption force, and the first cutting layer, the ring frame, the anti-puncture layer and the second cutting layer are integrally heat-melted and pressed.
Description
本創作涉及一種切割墊,特別是指一種便利工作之切割墊。This invention relates to a cutting pad, and more particularly to a cutting pad that facilitates work.
切割墊被應用在裁縫、拼布、紙藝及模型等多種領域,使用刀具切割一物品時,將該切割墊襯墊在該物品的下方,該刀具的刃部不會接觸位在該切割墊下方的工作檯。The cutting pad is used in various fields such as sewing, patchwork, paper craft and model making. When a knife is used to cut an object, the cutting pad is placed under the object, and the blade of the knife does not contact the workbench under the cutting pad.
為避免該物品在被切割的過程中滑動,遂產生一種可配合磁鐵使用的切割墊,其主要由一表層、一金屬板及一底層依序層疊構成的層狀結構,其中該表層係軟質的熱塑性樹脂構成的薄形板體,該金屬板係鐵金屬或其他可導磁的金屬材料構成的薄形板體,該底層係熱塑性樹脂構成的薄形板體,該表層及該金屬板黏接接合,該金屬板及該底層黏接接合。In order to prevent the object from sliding during the cutting process, a cutting pad that can be used in conjunction with a magnet is developed. The cutting pad is mainly composed of a layered structure consisting of a surface layer, a metal plate and a bottom layer stacked in sequence, wherein the surface layer is a thin plate body made of soft thermoplastic resin, the metal plate is a thin plate body made of iron metal or other magnetically conductive metal materials, and the bottom layer is a thin plate body made of thermoplastic resin. The surface layer and the metal plate are bonded together, and the metal plate and the bottom layer are bonded together.
切割片狀的物品時,該物品平置在該表層的上方,將磁鐵疊置在該物品的上方,該磁鐵與該金屬板之間的磁吸作用,使得該磁鐵能夠壓制定位該物品。When cutting a sheet-shaped object, the object is placed flat on the surface, and the magnet is stacked on the object. The magnetic attraction between the magnet and the metal plate enables the magnet to press and position the object.
該金屬板相對於該表層及該底層,具有不同的材料特性,難以有效地直接連接,故採用黏接手段接合該表層及該金屬板,該金屬板及該底層亦採用黏接手段接合,所述的黏接手段無論選用黏著劑或雙面黏接膜達成,均容易由於空氣中的水份滲透、溫濕度變化或其他因素,使得接合強度下降,該表層及該金屬板容易彼此剝離,該金屬板及該底層亦容易彼此剝離,影響切割墊的使用壽命,該金屬板及該底層剝離後,該金屬板的扁薄狀邊緣容易割傷使用者。The metal plate has different material properties from the surface layer and the bottom layer, and it is difficult to directly connect them effectively. Therefore, the surface layer and the metal plate are bonded by bonding means, and the metal plate and the bottom layer are also bonded by bonding means. Regardless of whether the bonding means is achieved by adhesive or double-sided adhesive film, the bonding strength is easily reduced due to moisture penetration in the air, temperature and humidity changes or other factors. The surface layer and the metal plate are easily peeled off from each other, and the metal plate and the bottom layer are also easily peeled off from each other, affecting the service life of the cutting pad. After the metal plate and the bottom layer are peeled off, the flat and thin edge of the metal plate is easy to cut the user.
本創作之主要目的在於提供一種便利工作之切割墊。 為達到前述目的,本創作採用以下技術方案: The main purpose of this creation is to provide a cutting pad that is convenient for work. To achieve the above purpose, this creation adopts the following technical solutions:
一種便利工作之切割墊,包括一第一切割層、一磁吸層、一防穿刺層、一第二切割層及一環框,其中該第一切割層、該磁吸層、該防穿刺層及該第二切割層分別為片狀結構體,且該第一切割層、該磁吸層、該防穿刺層及該第二切割層沿其厚度方向依序排列,該環框係框形結構體,該環框環圍該磁吸層的側向外周,且該環框位於該第一切割層及該防穿刺層之間,據此包覆定位該磁吸層;A cutting pad for convenient work includes a first cutting layer, a magnetic layer, an anti-puncture layer, a second cutting layer and a ring frame, wherein the first cutting layer, the magnetic layer, the anti-puncture layer and the second cutting layer are respectively sheet-shaped structures, and the first cutting layer, the magnetic layer, the anti-puncture layer and the second cutting layer are arranged in sequence along the thickness direction thereof, and the ring frame is a frame-shaped structure, the ring frame surrounds the lateral periphery of the magnetic layer, and the ring frame is located between the first cutting layer and the anti-puncture layer, thereby covering and positioning the magnetic layer;
該第一切割層及該第二切割層分別由軟質的熱塑性樹脂構成,該防穿刺層由硬質的熱塑性樹脂構成,該環框由熱塑性樹脂構成,該磁吸層係具有磁性吸附力的磁片構成,該第一切割層、該環框、該防穿刺層及該第二切割層一體熱融壓合。The first cutting layer and the second cutting layer are respectively made of soft thermoplastic resin, the anti-puncture layer is made of hard thermoplastic resin, the ring frame is made of thermoplastic resin, the magnetic attraction layer is made of a magnetic sheet with magnetic attraction force, and the first cutting layer, the ring frame, the anti-puncture layer and the second cutting layer are integrally heat-melted and pressed.
該磁吸層不會任意地移動,且該磁吸層不會外露影響使用壽命或對使用安全性形成危害。The magnetic layer will not move arbitrarily, and the magnetic layer will not be exposed to affect the service life or cause harm to the safety of use.
本創作之另一目的,係更藉由一可被磁吸的導磁層置換該磁吸層,以達到利用具有磁力的磁吸物磁性吸引該導磁層,從而定位被切割的物品。Another purpose of the invention is to replace the magnetic layer with a magnetically attracted magnetic layer, so as to utilize a magnetic object with magnetic force to magnetically attract the magnetic layer, thereby positioning the object to be cut.
圖式所示係本創作便利工作之切割墊之實施例,惟此等實施例僅供說明之用,在專利申請上並不受此結構之限制。The drawings show an embodiment of the cutting pad for facilitating the work of the present invention, but these embodiments are for illustrative purposes only and are not limited to this structure in patent applications.
如圖1至圖3所示,本創作便利工作之切割墊的實施例一,包括一第一切割層10、一磁吸層20、一防穿刺層30、一第二切割層40及一環框50,其中該第一切割層10、該磁吸層20、該防穿刺層30及該第二切割層40分別為片狀結構體,且該第一切割層10、該磁吸層20、該防穿刺層30及該第二切割層40沿其厚度方向依序排列,該環框50係框形結構體,該環框50環圍該磁吸層20的側向外周,且該環框50位於該第一切割層10及該防穿刺層30之間,據此包覆定位該磁吸層20。As shown in FIGS. 1 to 3 , the first embodiment of the cutting pad for facilitating work includes a
該第一切割層10及該第二切割層40分別由軟質的熱塑性樹脂構成,提供刀具切割進入,並吸收緩衝該刀具的切割作用,該防穿刺層30由硬質的熱塑性樹脂構成,該環框50可選擇由硬質的熱塑性樹脂或軟質的熱塑性樹脂構成,該磁吸層20係具有磁性吸附力的磁片構成,據使可導磁材料構成的被磁吸物92能夠被該磁吸層20吸附,該第一切割層10、該環框50、該防穿刺層30及該第二切割層40一體熱融壓合。The
實施例一可視需要進一步包括二表層60,其中各該表層60分別為軟質的熱塑性樹脂構成的片體,各該表層60分別與該第一切割層10及該第二切割層40在厚度方向的一側結合,據此分別構成切割墊01在厚度方向彼此相對的表面62。The first embodiment may further include two
實施例一製作時,該第一切割層10、該磁吸層20、該防穿刺層30、該第二切割層40、該環框50及各該表層60依序相疊,形成多層結構的半成品(圖未繪示),而後對該半成品施以高溫熱融壓合,使得該第一切割層10、該防穿刺層30、該第二切割層40、該環框50及各該表層60熱融接合,據此製得層狀結構的實施例一,而後,視需要對實施例一施以裁切加工,使實施例一的側向周邊形成預定的形狀及尺寸。When the first embodiment is manufactured, the
使用刀具切割紙張、布料、皮革等扁薄狀的物品94時,實施例一襯墊在該物品94的下方,並選擇其中一個該表面62朝上接觸該物品94,另一個該表面62朝下接觸施行切割作業的工作檯(圖未繪示),且該防穿刺層30位於該磁吸層20的上方,軟質的熱塑性樹脂構成的該第二切割層40,用於提供切割該物品94之該刀具的刃部進入,該刃部能夠在該物品94的厚度方向上刺穿該物品94,該第二切割層40並吸收該刀具的作用力,對該刃部進一步向著該磁吸層20的方向深入形成緩衝作用,硬質的熱塑性樹脂構成的該防穿刺層30,則對該刃部形成阻擋,該刃部無法進一步深入實施例一,避免該刃部接觸或破壞該磁吸層20。When using a knife to cut a flat and
切割該物品94時,可將一至數個不等的該被磁吸物92設置在該物品94的頂緣表面,該被磁吸物92的具體示例不受圖3所顯示的限制,該磁吸層20產生的磁力作用於該被磁吸物92,使得該被磁吸物92對該物品94形成壓制,該物品94不易滑動,提供切割作業的方便性。When cutting the
採用高溫熱融壓合手段一體成型該切割墊01,空氣中的水份無法滲透進入該切割墊01的內部,溫溼度的變化也不易造成相鄰的該磁吸層20與其相鄰的該第一切割層10及該防穿刺層30彼此剝離,復由該環框50環圍著該磁吸層20,能夠阻擋避免扁薄狀態的該磁吸層20的邊緣凸出該切割墊01的外部,從而避免該磁吸層20割傷使用者,不會對使用安全性形成危害。The
該磁吸層20的側向周緣與該環框50之間形成一環狀的間隙72,該第一切割層10及該防穿刺層30分別填入該間隙72;該間隙72在該磁吸層20與該環框50之間的寬度選擇介於0.3 mm至2 mm之間。An
該間隙72的形成,使得該磁吸層20易於組設進入該環框50的環狀內緣,後續執行高溫熱融壓合時,該第一切割層10及該防穿刺層30分別受熱而軟化填入該間隙72,該切割墊01製成後,該磁吸層20不會在該切割墊01的內部側向移動。The formation of the
如圖4所示,實施例二主要不同於實施例一之構成在於,實施例一的該磁吸層20選擇置換為一導磁層80,其中該導磁層80係可被磁吸的導磁材料構成的薄形結構體,該導磁層80選擇利用金屬板構成,據使具有磁力的磁吸物(圖未繪示)磁性吸引該導磁層80,從而使該磁吸物配合該表層60相對夾制定位被切割的該物品94。As shown in FIG4 , the main difference between the second embodiment and the first embodiment is that the
如圖5所示,實施例三主要不同於實施例一之構成在於,實施例三包括兩個該磁吸層20及兩個分別環圍各該磁吸層20的該環框50,且各該環框50彼此側向並列。As shown in FIG. 5 , the structure of the third embodiment is mainly different from that of the first embodiment in that the third embodiment includes two
實施例三基於具有兩個彼此側向並列的該磁吸層20及兩個分別環圍各該磁吸層20的該環框50,而可選擇進一步配置折疊構造(圖未繪示),且該折疊構造位於各該環框50之間,使得實施例三能夠折疊,而有利於收存及攜帶,所述的折疊構造為所屬技術領域人士所能思及的既有技術,恕不詳述該折疊構造的具體構成。The third embodiment is based on the two
圖6及圖7分別顯示基於實施例三變化而得的實施例四及實施例五,實施例四及實施例五分別包括四個該磁吸層20及對應各該磁吸層20的四個該環框50,實施例四及實施例五主要不同在於數個該磁吸層20的配置形態不同。FIG. 6 and FIG. 7 respectively show the fourth and fifth embodiments based on the variation of the third embodiment. The fourth and fifth embodiments respectively include four
實施例三至實施例五的各該磁吸層20,可分別選擇置換為實施例二揭示的該導磁層80,據此構成本創作的多個置換實施選擇。The
01:切割墊 10:第一切割層 20:磁吸層 30:防穿刺層 40:第二切割層 50:環框 60:表層 62:表面 72:間隙 80:導磁層 92:被磁吸物 94:物品01: cutting pad 10: first cutting layer 20: magnetic layer 30: anti-puncture layer 40: second cutting layer 50: ring frame 60: surface layer 62: surface 72: gap 80: magnetic layer 92: magnetically attracted object 94: object
圖1係本創作實施例一之立體分解圖。 圖2係本創作實施例一之剖視示意圖。 圖3係本創作實施例一之使用狀態的俯視圖。 圖4係本創作實施例二之立體分解圖。 圖5係本創作實施例三之俯視示意圖。 圖6係本創作實施例四之俯視示意圖。 圖7係本創作實施例五之俯視示意圖。 Figure 1 is a three-dimensional exploded view of the first embodiment of the present invention. Figure 2 is a cross-sectional schematic diagram of the first embodiment of the present invention. Figure 3 is a top view of the first embodiment of the present invention in use. Figure 4 is a three-dimensional exploded view of the second embodiment of the present invention. Figure 5 is a top view schematic diagram of the third embodiment of the present invention. Figure 6 is a top view schematic diagram of the fourth embodiment of the present invention. Figure 7 is a top view schematic diagram of the fifth embodiment of the present invention.
01:切割墊 01: Cutting pad
10:第一切割層 10: First cutting layer
20:磁吸層 20: Magnetic layer
30:防穿刺層 30: Anti-puncture layer
40:第二切割層 40: Second cutting layer
50:環框 50: Ring frame
60:表層 60: Surface layer
62:表面 62: Surface
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113204095U TWM667148U (en) | 2024-04-24 | 2024-04-24 | Cutting pad for easy work |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113204095U TWM667148U (en) | 2024-04-24 | 2024-04-24 | Cutting pad for easy work |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM667148U true TWM667148U (en) | 2025-03-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| TW113204095U TWM667148U (en) | 2024-04-24 | 2024-04-24 | Cutting pad for easy work |
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| TW (1) | TWM667148U (en) |
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2024
- 2024-04-24 TW TW113204095U patent/TWM667148U/en unknown
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