TWM656258U - Micro composite I/O computer chip module based on OSM-L standard - Google Patents

Abstract

This invention proposes a micro-multiple I/O chip (MIOC/Multiple I/O Chip) module based on the OSM-L standard, which includes: an I/O circuit carrier, the two sides of the I/O circuit carrier have a carrier first layer and a carrier second layer respectively electrically connected, the carrier first layer is provided with a highly integrated I/O line design, and the carrier second layer has an OSM-L interface defined by SGeT; a composite I/O interface module, which is electrically connected and arranged on the carrier first layer, and the composite I/O interface module is provided with an I/O interface line, an I/O processor and/or a chip on a circuit board; a plurality of electrical connectors, which are electrically connected and Set on the first layer of the carrier; a case, one side of the case is hollow, so that the case has a storage space inside, the storage space is used to set the I/O circuit carrier, the space gap between the inside of the case and the I/O circuit carrier and the composite I/O interface module is filled with thermal conductive interface material; in this way, it becomes a fully functional micro input/output (I/O) chip module, and in the future it can be combined with All-in-One Computer (AIOC), and make this microcomputer chip module system a standard commonly used by the industry.

Description

Micro-complex I/O computer chip module based on OSM-L standard

This work is about a micro-complex I/O computer chip structure, especially a chip module that integrates I/O circuits and hardware, so that it can be used with a micro-All-in-One computer chip system architecture and is a micro-complex I/O computer chip module based on the OSM-L standard.

According to the data, computer equipment has become a common equipment for modern people in work or life, including personal computers, industrial computers or other special-purpose computers. The hardware components of a computer can be divided into four major units, namely the central processing unit (CPU), memory, input/output interfaces (I/O ports) and power supply (PSU). The evolution of computers is mainly based on the central processing unit (CPU), which determines the computing power of the computer. All software and input/output interfaces (I/O) must be designed according to its capabilities to design various applications and devices. Therefore, various computer motherboard manufacturers all use the planning of the central processing unit (CPU) to carry out wiring design, memory and power integration. Therefore, it can be said that the CPU is the mainstream of computer chips and determines the future development of the information and communication technology industry/ICT (Information and Communication Technology).

As for the integration of CPU, memory and power supply, they are usually matched, that is, the changes between them are all placed and wired in a limited space, and the electromagnetic effect is balanced to avoid mutual interference. I/O devices often vary greatly due to differences in customer application fields. Wired devices rely on connectors of different sizes for transmission, and wireless devices rely on chips of different band frequencies to transmit information. Since I/O devices need to be compatible with customer application requirements and the operation of physical components such as CPU, memory, and power supply in the equipment, and after CPU, memory, and power supply/power supply lines are better integrated in current computers, I/O device systems also need to be integrated together, making the application of computer microchips feasible and becoming a standard used by the industry, thereby greatly reducing the complexity of computer system design, saving a lot of development time, and increasing the stability of computer systems. It is the ideal direction of computer chip system design at present.

Furthermore, in recent years, the industrial computer field has widely adopted system module standards such as SMARC, Qseven, COMe and PC/104 to achieve high integration and flexibility in embedded computing. In order to further promote the development of this field, the Embedded Technology Standardization Organization (SGeT) launched the open standard module (OSM/Open Standard Module) in 2020. The OSM-L standard adopts a stamp-like size of 45*45mm and is applied to embedded systems of industrial computers. In recent years, the OSM-L module has become the preferred component of many manufacturers in the field of IoT and edge computing due to its performance, cost and space efficiency. Therefore, how to effectively utilize this OSM-L module architecture and integrate it with the main components of computer equipment to form an overall computer chip integrated design, and promote its application in industrial computer systems, should be the key direction that the industry should develop and break through.

Therefore, in view of the fact that the existing computer chip system architecture has not yet had a modular I/O device system to integrate and match with it, the creator of this case immediately started to develop a solution, hoping to develop a micro-compound I/O device that is more computer chip-based, standardized and optimized in its related performance. A micro-compound I/O computer chip module based on the OSM-L standard can serve the public and promote the development of this industry. After a long period of thinking, this creation was born.

The purpose of this invention is to provide a micro-complex I/O computer chip module based on the OSM-L standard, which can provide a highly integrated circuit design, place various IO interface circuits and related micro connectors in a micro-computer chip module size space, making it a fully functional micro-computer input and output interface chip module, and forming the input and output function expansion chip (MIOC) of the All-in-One Computer (AIOC), and make these two chip modules can be combined into an ultra-microcomputer chip system, becoming a standard used by the industry, so as to reduce the complexity of future computer application design, and enjoy the advantages of shortening development time and increasing system stability.

Another purpose of this invention is to provide a micro-complex I/O computer chip module based on the OSM-L standard, which can integrate various input and output devices by incorporating a specific interface recognized by the industry, so as to achieve communication with all-in-one computers (AIOC) with various functions and achieve the purpose of excellent transmission and control.

Another purpose of this invention is to provide a micro-complex I/O computer chip module based on the OSM-L standard, which can effectively eliminate the heat source problem generated by the circuits of highly integrated various input and output devices through the design of heat conduction and packaging heat dissipation, thereby greatly reducing the temperature.

Another purpose of this invention is to provide a micro-complex I/O chip module for various input/output devices based on the OSM-L standard. It can provide a vibration-resistant PCB solderable module through the OSM-L standard, and has a compact appearance with a maximum pin area ratio, thereby taking into account the scalability of technology, achieving the integration requirements of high performance and miniaturization, and can promote applications in fields such as the Internet of Things, edge computing, and artificial intelligence.

The technical means adopted by this invention to achieve the above-mentioned purpose include: an I/O circuit carrier, which is a circuit carrier with a length and width of 45mm*45mm. The two sides of the I/O circuit carrier are respectively a first layer of the carrier and a second layer of the carrier for electrical connection. The first layer of the carrier is provided with a highly integrated I/O circuit design, and the second layer of the carrier is an open standard module (OSM/Open Standard Module) of the OSM-L interface; a composite I/O interface module, which is electrically connected and arranged on the first layer of the carrier, wherein the composite I/O interface module is a circuit board on which an I/O interface circuit, an I/O processor and/or a chip are arranged; a plurality of electrical connectors, which are electrically connected and arranged on the first layer of the carrier; a housing, which has a storage space for arranging the I/O circuit carrier after combining the composite I/O interface module and the connector set.

In this embodiment, the OSM-L interface of the second layer of the carrier defines 662 pins/nodes as interfaces for external connections.

In this embodiment, the OSM-L interface uses a symmetrical LGA package, and the contact technology uses LGA or BGA.

In this embodiment, the housing is provided with a plurality of connector openings, and the plurality of connector openings are used to be arranged relative to the plurality of electrical connectors, and the plurality of electrical connectors are correspondingly exposed in the plurality of connector openings.

In this embodiment, the space between the inside of the housing and the I/O circuit carrier and the composite I/O interface module is filled with a thermally conductive interface material, such as a thermal paste, a heat sink, etc.

In this embodiment, the I/O circuit carrier is electrically connected to a micro All-in-One computer chip module, and the micro All-in-One computer chip module includes a system circuit carrier, the system circuit carrier has an electrically connected carrier top layer and a carrier bottom layer, the carrier top layer is provided with an integrated circuit of a highly integrated circuit design, and the carrier bottom layer has an OSM-L interface of an open standard module (OSM/Open Standard Module) defined by SGeT, and the OSM-L interface of the system circuit carrier is electrically connected and combined with the OSM-L interface of the I/O circuit carrier.

In this embodiment, a processor system chip (SoC/System on a Chip), a memory system and a power circuit module are electrically connected on the top layer of the carrier to operate computer functions.

In this embodiment, the I/O circuit carrier is electrically connected to a system motherboard, and the system motherboard has an OSM-L interface for multiple embedded computing. The OSM-L interface of the system motherboard is electrically connected to the OSM-L interface of the I/O circuit carrier and the OSM-L interface of the system circuit carrier.

In order to enable the review committee to have a deeper understanding and knowledge of the technical features and effects achieved by this creation, we would like to provide better implementation diagrams and detailed explanations as follows:

1: Micro-complex I/O computer chip module

10: I/O circuit board

11: First layer of carrier board

12: Second layer of carrier board

13: OSM-L interface

20: Composite I/O interface module

30: Connector set

31:Electrical connector

40: Chassis

41: Storage space

42: Connector port

51: System motherboard

80: Micro All-in-One Computer Chip Module

80A: System circuit board

81: Carrier top layer

82: Carrier bottom layer

821: OSM-L interface

83: Processor system chip

84:Memory system

85: Power line module

86: Enclosure cover

861: Storage space

Figure 1 is a schematic diagram of a disassembled micro All-in-One computer chip module;

Figure 2 is a schematic diagram of the structural decomposition of this work;

Figure 3A is a schematic side view of the composition of this work;

Figure 3B is a schematic diagram of the composition from above;

Figure 4 is a schematic diagram of an application example 1 of this invention;

Figure 5 is a schematic diagram of the second application embodiment of this invention; Figure 6 is a schematic diagram of the operation of the circuit logic block of this invention.

The diagrams disclosed in this work are only used for the purpose of illustrating the implementation examples, and are not used to limit the specific implementation of this work and the scope of protection. The "OSM" mentioned in this work refers to the "Open Standard Module", and "OSM-L" refers to the L size of the four different sizes of this standard module, which adopts the 45x45mm size; and the "I/O" mentioned refers to "Input/Output". This work is a micro-complex I/O computer chip module (MIOC/Multiple I/O Chip) based on the OSM-L standard, which is mainly used in conjunction with a micro-All-in-One computer chip module (AIOC) to form an ultra-micro computer chip system, making it a standard commonly used by the industry.

As shown in FIG. 1 , the micro All-in-One computer chip module 80 includes: a system circuit carrier 80A, the system circuit carrier 80A having an electrically connected carrier top layer 81 and a carrier bottom layer 82, the carrier top layer 81 having an integrated circuit with a high degree of circuit integration design, the carrier bottom layer 82 having an OSM-L interface 821 of an open standard module (OSM/Open Standard Module) defined by SGeT; the carrier top layer 81 having an electrically connected processor system chip 83 (SoC/System on a chip) Chip), memory system 84 and power line module 85 for operating computer-related functions; in addition, a cover cover 86, the bottom of which is hollow, so that the cover cover 86 has a storage space 861 inside, and the storage space 861 is used to set the system circuit carrier 80A after combining the processor system chip 83, memory system 84 and power line module 85, and make the OSM-L interface 821 (carrier bottom layer 82) of the system circuit carrier 80A exposed downward.

Please refer to Figures 2, 3A and 3B for illustrating an embodiment of a micro-complex I/O computer chip module (MIOC) based on the OSM-L standard (I/O: input/output interface). As can be seen from the figures, the micro-complex I/O computer chip module 1 of the present invention includes an I/O circuit carrier 10, a multiple I/O interface module 20 (Multiple I/O), a connector set 30 and a housing 40; wherein the I/O circuit carrier 10 is a circuit carrier with a length and width of 45mm*45mm, and the two sides of the I/O circuit carrier 10 are respectively a first carrier layer 11 and a second carrier layer 12 electrically connected, and the first carrier layer 11 is provided with a highly circuit-integrated I/O integrated circuit design layout. The second layer 12 of the I/O circuit carrier 10 has an OSM-L interface 13 of an open standard module (OSM/Open Standard Module) defined by SGeT. The OSM-L interface 13 of the second layer 12 of the carrier has an embedded computing application and defines 662 pins/nodes (pinout) as an interface for external connection. Furthermore, the OSM-L interface 13 uses a symmetrical LGA (land grid array/planar grid array package) package, and the contact technology can adopt LGA or BGA (ball grid array) The OSM-L interface 13 can be completely machined during welding, assembly and testing, and uses a pre-tinned LGA package, which can be directly welded without a connector. At the same time, the OSM-L interface 13 is a pre-defined soft and hard interface.

In this way, the space size of the I/O circuit carrier 10 and its I/O integrated circuits and OSM-L interface 13 are used to communicate with the input interface of system motherboards 51 (see Figure 4) of various sizes and shapes to achieve the purpose of I/O transmission and control, and can become an I/O chip module standard commonly used by the industry to reduce the complexity of future computer designs and enjoy the advantages of shortening development time and increasing system stability.

The composite I/O interface module 20 is electrically connected and disposed on the first carrier layer 11 of the I/O circuit carrier 10. The composite I/O interface module 20 can be provided with a related I/O processor, chip and various I/O interface circuits (not shown) on a circuit board to cooperate with the I/O interface function operation of the aforementioned micro All-in-One computer chip module 80 (AIOC).

The connector set 30 is electrically connected and disposed on the first carrier layer 11 of the I/O circuit carrier 10. The connector set 30 includes various types of multiple electrical connectors 31. The electrical connector 31 can be various micro I/O connectors, such as USB, D-SUB, HDMI, DVI, etc., but is not limited thereto. The composite I/O interface module 20 is provided with the corresponding processors or chips, circuits, etc. required for the operation of each of the connector sets 30.

The housing 40 is designed as a U-shaped cross-section housing having a cover and four side covers. The other side of the housing 40 is hollow so that the housing 40 has a storage space 41 inside. The storage space 41 is used to set the I/O circuit carrier 10 after the combination of the composite I/O interface module 20 and the connector assembly 30, and to expose the OSM-L interface 13 of the I/O circuit carrier 10 (the second layer 12 of the carrier) downward. The housing 40 is also provided with a plurality of connector openings 42. The plurality of connector openings 42 are used to be arranged relative to the connector assembly 30, and the connector assembly 30 is exposed to the plurality of connector openings 42 correspondingly, so as to facilitate plugging and use. The space between the inside of the case 40 (the storage space 41) and the I/O circuit carrier 10 and the composite I/O interface module 20 can be filled with a thermally conductive interface material (not shown), such as a heat sink or a heat sink. The thermally conductive interface material is used as a heat conductor between the I/O circuit carrier 10, the composite I/O interface module 20 and the case 40 to balance the heat generated by all module components, parts and circuits of the micro composite I/O computer chip module 1 (MIOC), and is greatly reduced through the thermally conductive interface material and the conductive design of the case 40.

Please refer to FIG. 4, which is an application example 1 of the micro-complex I/O computer chip module of the present invention based on the OSM-L standard, which discloses a system motherboard 51 such as an industrial computer/network computer, and the system motherboard 51 has a plurality of OSM-L interfaces for embedded computing, and a plurality of micro-All-in-One computer chip modules 80 (AIOC) and the micro-complex I/O computer chip module 1 (MIOC) are arranged on the OSM-L interfaces corresponding to the system motherboard 51, that is, the micro-All-in-One computer chip module The OSM-L interface 821 of the group 80 and the OSM-L interface 13 of the micro-complex I/O computer chip module 1 are electrically connected to the corresponding OSM-L interfaces of the system motherboard 51, so that the assembly of the industrial computer/network computer can be completed simply, quickly and efficiently. In addition, the industrial computer/network computer can select different quantities of micro-All-in-One computer chip module 80 (AIOC) and micro-complex I/O computer chip module 1 (MIOC) for assembly according to needs, or to facilitate future expansion and improve its overall performance and efficacy. In this way, the micro-complex I/O computer chip module 1 (MIOC) of this invention can be matched with multiple micro-all-in-one computer chip modules 80 (AIOC), so that it can be combined in the form of a chip (Chip/IC) and conveniently promoted for application in industrial computers, Internet of Things, edge computing, artificial intelligence and computing centers of various forms of applications, and become a standard for joint development and operation among industries.

Please refer to Figure 5, which is the second application example of the micro-complex I/O computer chip module based on the OSM-L standard. As shown in the figure, the housing 40 of the micro-complex I/O computer chip module 1 is in a transparent upward state, and the second carrier layer 12 of the I/O circuit carrier 10 is upward, so that the OSM-L interface 13 is exposed, and then the micro-All-in-One computer chip module 80 is assembled, that is, the OSM-L interface 821 of the system circuit carrier 80A (carrier bottom layer 82) is electrically connected to the OSM-L interface 13, thereby completing a quick and easy assembly of a microcomputer.

Please refer to Figure 6, which is a schematic diagram of the operation of the circuit logic block of the present invention. As shown in the figure, the micro All-in-One computer chip module 80 (AIOC) is connected to the composite I/O interface module 20 (micro composite I/O computer chip module 1) through the OSM-L interface to perform related power, control and input/output (I/O) signal connections; and the composite I/O interface module 20 (micro composite I/O computer chip module 1) can connect the related power, control and input/output (I/O) signals to external devices through the connector set 30.

This creation is based on the OSM-L standard micro-complex I/O computer chip module. Through the above structure, it can provide a highly integrated circuit design, placing various IO interface circuits and related micro connectors in a space of the size of a micro-computer chip module, making it a fully functional micro-computer input and output interface chip module, and forming the input and output function expansion chip (MIOC) of the All-in-One Computer (AIOC), and making these two chip module structures can be combined into an ultra-micro computer chip system, becoming a standard commonly used by the industry, so as to reduce the complexity of future computer application design, and enjoy the advantages of shortening development time and increasing system stability; at the same time, this creation can also provide It integrates various input/output devices by incorporating a specific interface recognized by the industry, so as to achieve communication with all-in-one computers (AIOC) with various functions and achieve the purpose of excellent transmission and control. Furthermore, this creation can effectively eliminate the heat source problem generated by the circuits of highly integrated various input/output devices through the design of heat conduction and package heat dissipation, thereby greatly reducing the temperature. Furthermore, this creation can provide a vibration-resistant PCB solderable module through the OSM-L standard, and has a streamlined appearance with the maximum pin area ratio, thereby taking into account the scalability of technology, achieving the integration requirements with high performance and miniaturization, and can be promoted in the fields of Internet of Things, edge computing and artificial intelligence.

Thus, the above description has been used in conjunction with the diagram to fully describe the implementation example of the micro-complex I/O computer chip module based on the OSM-L standard and its technical features and functions. However, it must be emphasized that the above detailed description is a specific description of the feasible implementation example of the present invention, but the implementation example is not used to limit the patent scope of the present invention. Any equivalent implementation or modification that does not deviate from the technical spirit of the present invention should be included in the patent scope of the present invention.

1: Micro-complex I/O computer chip module

10: I/O circuit board

11: First layer of carrier board

12: Second layer of carrier board

13: OSM-L interface

20: Composite I/O interface module

30: Connector set

31:Electrical connector

40: Chassis

41: Storage space

42: Connector port

Claims (8)

A micro-complex I/O computer chip module based on the OSM-L standard includes: an I/O circuit carrier, the I/O circuit carrier is a circuit carrier with a length and width of 45mm*45mm, the two sides of the I/O circuit carrier are respectively a first layer of the carrier and a second layer of the carrier for electrical connection, the first layer of the carrier is provided with a highly integrated I/O circuit design, the second layer of the carrier is an open standard module (OSM/Open Standard Module) of the OSM-L interface; a composite I/O interface module, which is electrically connected and arranged on the first layer of the carrier, wherein the composite I/O interface module is provided with an I/O interface circuit, an I/O processor and/or a chip on a circuit board; a plurality of electrical connectors, which are electrically connected and arranged on the first layer of the carrier; a housing, which has a housing space for arranging the I/O circuit carrier after combining the composite I/O interface module and the plurality of electrical connectors. As described in Item 1 of the patent application, the micro-complex I/O computer chip module based on the OSM-L standard, wherein the OSM-L interface on the second layer of the carrier defines 662 pins/nodes as an interface for external connection. As described in item 2 of the patent application scope, a micro-complex I/O computer chip module based on the OSM-L standard, wherein the OSM-L interface uses a symmetrical LGA package and the contact technology uses LGA or BGA. As described in item 1 of the patent application scope, the micro-combined I/O computer chip module based on the OSM-L standard, wherein the housing is provided with a plurality of connector ports, the plurality of connector ports are used to be arranged relative to the plurality of electrical connectors, and the plurality of electrical connectors are correspondingly exposed in the plurality of connector ports. As described in item 1 of the patent application scope, the micro-composite I/O computer chip module based on the OSM-L standard, wherein the space between the inside of the housing and the I/O circuit carrier and the composite I/O interface module is filled with a thermally conductive interface material. As described in item 1 of the patent application scope, the micro-composite I/O computer chip module based on the OSM-L standard, wherein the I/O circuit carrier is electrically connected to a micro-All-in-One computer chip module, and the micro-All-in-One computer chip module includes a system circuit carrier, the system circuit carrier has an electrically connected carrier top layer and a carrier bottom layer, the carrier top layer is provided with an integrated circuit with a high circuit integration design, and the carrier bottom layer has an OSM-L interface of an open standard module (OSM/Open Standard Module) defined by SGeT, and the OSM-L interface of the system circuit carrier is electrically connected to the OSM-L interface of the I/O circuit carrier. As described in item 6 of the patent application scope, the micro-complex I/O computer chip module based on the OSM-L standard, wherein the top layer of the carrier board is provided with an electrically connected processor system chip (SoC/System on a Chip), a memory system and a power line module for operating computer functions. As described in item 7 of the patent application scope, the micro-complex I/O computer chip module based on the OSM-L standard, wherein the I/O circuit carrier is electrically connected to a system motherboard, the system motherboard has a plurality of embedded computing OSM-L interfaces, and the OSM-L interface of the system motherboard is electrically connected to the OSM-L interface of the I/O circuit carrier and the OSM-L interface of the system circuit carrier.

Images