TWM655926U - Optical fingerprint imaging device - Google Patents
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- TWM655926U TWM655926U TW113200445U TW113200445U TWM655926U TW M655926 U TWM655926 U TW M655926U TW 113200445 U TW113200445 U TW 113200445U TW 113200445 U TW113200445 U TW 113200445U TW M655926 U TWM655926 U TW M655926U
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Abstract
Description
本新型創作是有關於一種感測裝置,且特別是有關於一種光學指紋取像裝置。The present invention relates to a sensing device, and in particular to an optical fingerprint capturing device.
在現今,生物辨識裝置與我們的日常生活息息相關,它取代了密碼輸入的繁瑣過程以及容易被遺忘的不便利性,在安防、機密保護、現金支付等領域提供了更好的安全性以及便利性。Nowadays, biometric devices are closely related to our daily lives. They replace the cumbersome process of password input and the inconvenience of being easily forgotten, and provide better security and convenience in the fields of security, confidentiality protection, cash payment, etc.
過往的指紋辨識模組多為使用塑膠外殼,僅為符合產品外觀以及安裝至更大模組內的嵌合需求,導致指紋辨識模組本身的可靠性與強度不足。此外,若為了具備觸控功能,還需要另外設置可導電的零組件,其會使製造工藝較為複雜。In the past, fingerprint recognition modules were mostly made of plastic shells, which only met the product appearance and the requirements of being installed in a larger module, resulting in insufficient reliability and strength of the fingerprint recognition module itself. In addition, in order to have a touch function, it is necessary to set up additional conductive components, which will make the manufacturing process more complicated.
本新型創作提供一種光學指紋取像裝置,可提升結構強度以及優化封裝對位性,並能美化外觀。The novel invention provides an optical fingerprint acquisition device, which can enhance structural strength, optimize packaging alignment, and beautify appearance.
本新型創作提供一種光學指紋取像裝置,包括基板、感光模組、至少一發光元件、中空殼體、發光元件以及透光壓板。基板沿參考平面延伸。感光模組配置於基板。至少一發光元件配置於基板。中空殼體配置於基板以圍繞感光模組以及至少一發光元件。中空殼體包括外壁部以及由外壁部朝內且沿平行於參考平面的方向延伸的第一嵌合部。第一嵌合部包括第一嵌合面。透光壓板配置於第一嵌合面,其中中空殼體的外壁部圍繞透光壓板以及基板,第一嵌合部圍繞通光區,透光壓板的面積大於通光區的面積。The novel creation provides an optical fingerprint capturing device, including a substrate, a photosensitive module, at least one light-emitting element, a hollow shell, the light-emitting element and a light-transmitting pressure plate. The substrate extends along a reference plane. The photosensitive module is arranged on the substrate. At least one light-emitting element is arranged on the substrate. The hollow shell is arranged on the substrate to surround the photosensitive module and the at least one light-emitting element. The hollow shell includes an outer wall portion and a first engaging portion extending inward from the outer wall portion and in a direction parallel to the reference plane. The first engaging portion includes a first engaging surface. The light-transmitting pressure plate is arranged on the first engaging surface, wherein the outer wall portion of the hollow shell surrounds the light-transmitting pressure plate and the substrate, the first engaging portion surrounds the light-transmitting area, and the area of the light-transmitting pressure plate is larger than the area of the light-transmitting area.
在本新型創作的一實施例中,上述的外壁部包括頂面。透光壓板包括指壓表面,且頂面至參考平面的最短距離大於指壓表面至參考平面的最短距離。In one embodiment of the present invention, the outer wall portion includes a top surface, the light-transmitting pressure plate includes a finger-pressing surface, and the shortest distance from the top surface to the reference plane is greater than the shortest distance from the finger-pressing surface to the reference plane.
在本新型創作的一實施例中,上述的第一嵌合部還包括第二嵌合面,基板配置於第二嵌合面。In an embodiment of the present invention, the first engaging portion further includes a second engaging surface, and the substrate is disposed on the second engaging surface.
在本新型創作的一實施例中,上述的外壁部包括底面,基板包括外側表面,且底面至參考平面的最短距離大於外側表面至參考平面的最短距離。In one embodiment of the present novel creation, the outer wall portion includes a bottom surface, the substrate includes an outer surface, and the shortest distance from the bottom surface to the reference plane is greater than the shortest distance from the outer surface to the reference plane.
在本新型創作的一實施例中,上述的中空殼體還包括由外壁部朝內且沿平行於參考平面的方向延伸的第二嵌合部,分隔於第一嵌合部。第二嵌合部包括第三嵌合面,基板配置於第三嵌合面。In an embodiment of the present invention, the hollow shell further comprises a second engaging portion extending inwardly from the outer wall portion and in a direction parallel to the reference plane, separated from the first engaging portion. The second engaging portion comprises a third engaging surface, and the substrate is disposed on the third engaging surface.
在本新型創作的一實施例中,上述的至少一發光元件的數量為多個,且多個發光元件呈環狀排列並平均分佈於感光模組周圍。In an embodiment of the present invention, the number of the at least one light-emitting element is multiple, and the multiple light-emitting elements are arranged in a ring shape and evenly distributed around the photosensitive module.
在本新型創作的一實施例中,上述的光學指紋取像裝置還包括至少一遮光元件,配置於基板,且位於感光模組與至少一發光元件之間。In an embodiment of the present invention, the optical fingerprint capturing device further includes at least one light shielding element disposed on the substrate and located between the photosensitive module and at least one light emitting element.
在本新型創作的一實施例中,上述的中空殼體電性連接於基板及透光壓板的至少其中一者。In one embodiment of the present invention, the hollow shell is electrically connected to at least one of the substrate and the light-transmitting pressure plate.
在本新型創作的一實施例中,上述的中空殼體的外壁部、透光壓板及基板中的至少其中一者包括至少一氣孔結構,連通於光學指紋取像裝置的內側與外側。In an embodiment of the present invention, at least one of the outer wall of the hollow shell, the light-transmitting pressure plate and the substrate comprises at least one air hole structure connected to the inner side and the outer side of the optical fingerprint capturing device.
基於上述,在本新型創作的光學指紋取像裝置中,光學指紋取像裝置的中空殼體包括外壁部以及由外壁部朝內且沿平行於參考平面的方向延伸的第一嵌合部。其中,中空殼體的外壁部圍繞透光壓板以及基板,且第一嵌合部包括第一嵌合面,光學指紋取像裝置的透光壓板配置於第一嵌合部的第一嵌合面。因此,可使透光壓板及基板以嵌合方式組合於中空殼體。如此一來,可提升光學指紋取像裝置的結構強度以及優化封裝對位性,並能美化光學指紋取像裝置的外觀。Based on the above, in the optical fingerprint capturing device of the present invention, the hollow shell of the optical fingerprint capturing device includes an outer wall portion and a first interlocking portion extending inward from the outer wall portion and in a direction parallel to the reference plane. The outer wall portion of the hollow shell surrounds the light-transmitting pressure plate and the substrate, and the first interlocking portion includes a first interlocking surface, and the light-transmitting pressure plate of the optical fingerprint capturing device is arranged on the first interlocking surface of the first interlocking portion. Therefore, the light-transmitting pressure plate and the substrate can be combined in the hollow shell in an interlocking manner. In this way, the structural strength of the optical fingerprint capturing device can be improved, the packaging alignment can be optimized, and the appearance of the optical fingerprint capturing device can be beautified.
為讓本新型創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above features and advantages of the present invention more clearly understood, an embodiment is given below and described in detail with reference to the accompanying drawings.
圖1為本新型創作一實施例的光學指紋取像裝置的剖面示意圖。請參考圖1。本實施例提供一種光學指紋取像裝置100,用以擷取使用者的手指進行感測,以獲得含有使用者指紋信號的影像。光學指紋取像裝置100包括基板110、感光模組120、至少一發光元件130、中空殼體140以及透光壓板150。FIG1 is a cross-sectional schematic diagram of an optical fingerprint capturing device according to an embodiment of the present invention. Please refer to FIG1. The present embodiment provides an optical fingerprint capturing
基板110例如為印刷電路板(Printed circuit board, PCB)、可撓式印刷電路板(Flexible printed circuit board, FPCB)、具有線路的玻璃載板或具有線路的陶瓷基板,但本新型創作並不限於此。基板110沿參考平面E延伸。The
感光模組120配置於基板110,與基板110電性連接。具體而言,在本實施例中,感光模組120例如包括感光元件122以及取像鏡組124。感光元件122例如為電荷耦合元件(Charge Coupled Device, CCD)、互補式金屬氧化物半導體元件(Complementary Metal-Oxide Semiconductor, CMOS)或其他適當種類的圖像感測元件,但本新型創作並不限於此。取像鏡組124包括具有屈光度的一或多個光學鏡片的組合,例如包括雙凹透鏡、雙凸透鏡、凹凸透鏡、凸凹透鏡、平凸透鏡以及平凹透鏡等非平面鏡片的各種組合,本新型創作亦不限於此。The
至少一發光元件130配置於基板110,與基板110電性連接,用以提供照明光束至使用者的手指。至少一發光元件130例如為發光二極體(light-emitting diode, LED)、雷射二極體(laser diode, LD)或垂直腔面射型雷射(vertical-cavity surface-emitting laser, VCSEL)。此外,所提供的光束可以包括可見光、非可見光或上述兩者的組合,非可見光可為紅外光,但本新型創作並不限於此。在本實施例中,至少一發光元件130的數量可設計為多個,且這些發光元件130呈環狀排列並平均分佈於感光模組120周圍,但本新型創作亦不限於此。At least one light-
在本實施例中,光學指紋取像裝置100還可包括至少一遮光元件160,配置於基板110,且位於感光模組120與至少一發光元件130之間,用以減少了雜散光斑的出現,進而可提高指紋取像的光學品質。遮光元件160例如為環狀結構,且其頂面高過於感光模組120的頂面。遮光元件160例如包括對發光元件130的發光波長為非透光的材料或塗層,但本新型創作並不限於此。In this embodiment, the optical fingerprint capturing
中空殼體140配置於基板110以圍繞感光模組120以及至少一發光元件130。中空殼體140包括外壁部142以及由外壁部142朝內且沿平行於參考平面E的方向延伸的第一嵌合部144。中空殼體140的外壁部142圍繞透光壓板150以及基板110。換句話說,透光壓板150與基板110分別以嵌合方式組合於中空殼體140的相對兩側以封裝成密封結構。舉例而言,透光壓板150與基板110可分別選用卡槽、干涉或膠合等方式進行嵌合,本新型創作並不限於此。The
透光壓板150例如為包括玻璃、聚甲基丙烯酸甲酯、聚碳酸酯、聚乙烯醇、聚對苯二甲酸乙二酯、聚烯烴或上述任意組合的透光平板,用以讓使用者以手指按壓承靠,然而本新型創作並不限制透光壓板150的種類及光學條件。詳細而言,中空殼體140的第一嵌合部144包括第一嵌合面S21,而透光壓板150配置於第一嵌合部144的第一嵌合面S21。在本實施例中,第一嵌合部144的第一嵌合面S21朝向遠離基板110的方向,但本新型創作並不限於此。換句話說,第一嵌合部144圍繞形成通光區A,且透光壓板150的面積大於通光區A的面積。因此,透光壓板150透過嵌合方式配置在中空殼體140,且連接於第一嵌合部144的第一嵌合面S21。如此一來,可提升光學指紋取像裝置100的結構強度以及優化封裝對位性,並能美化光學指紋取像裝置100的外觀。The light-transmitting
更詳細而言,中空殼體140的外壁部142包括頂面S11,透光壓板150包括指壓表面S3,且外壁部142的頂面S11至參考平面E的最短距離D1大於透光壓板150的指壓表面S3至參考平面E的最短距離D2。因此,透光壓板150嵌合配置在中空殼體140中。另一方面,第一嵌合部144還包括第二嵌合面S22,而基板110配置於第二嵌合面S22。在本實施例中,第一嵌合部144的第二嵌合面S22朝向遠離透光壓板150的方向,但本新型創作並不限於此。中空殼體140的外壁部142包括底面S12,基板110包括外側表面S4,且外壁部142的底面S12至參考平面E的最短距離D3大於基板110的外側表面S4至參考平面E的最短距離D4。因此,基板110也嵌合配置在中空殼體140中。In more detail, the
除此之外,在本實施例中,中空殼體140包括導電材料,並電性連接於基板110及透光壓板150的至少其中一者,用以提供導電特性。因此,可藉由中空殼體140或基板110的電性變化觸發功能性操作,達到額外的功能性效果(例如是藉由電性變化觸發觸控功能)。如此一來,可不需新增額外的導電組件,且進而在改善工藝的同時亦提升了光學指紋取像裝置100的實用性。In addition, in this embodiment, the
另一方面,在本實施例中,光學指紋取像裝置100的中空殼體140的外壁部142、透光壓板150及基板110中的至少其中一者,可設計包括至少一氣孔結構H,連通於光學指紋取像裝置100的內側與外側,用以在組裝透光壓板150及基板110時平衡光學指紋取像裝置100內側與外側的壓力,並且可於組裝完成後進一步封閉氣孔結構H以達到完全密封效果。On the other hand, in the present embodiment, at least one of the
圖2為本新型創作另一實施例的光學指紋取像裝置的剖面示意圖。請參考圖2。本實施例的光學指紋取像裝置100A類似於圖1所顯示的光學指紋取像裝置100。兩者不同之處在於,在本實施例中,中空殼體140A還包括由外壁部142朝內且沿平行於參考平面E的方向延伸的第二嵌合部146,分隔於第一嵌合部144。其中第二嵌合部146包括第三嵌合面S23,且基板110配置於第二嵌合部146的第三嵌合面S23。在本實施例中,第二嵌合部146的第三嵌合面S23朝向遠離透光壓板150的方向,但本新型創作並不限於此。如此一來,可提升光學指紋取像裝置100A的結構強度以及優化封裝對位性,並能美化光學指紋取像裝置100A的外觀。FIG2 is a cross-sectional schematic diagram of an optical fingerprint capturing device according to another embodiment of the present invention. Please refer to FIG2. The optical
圖3A至圖3D為本新型創作不同實施例的中空殼體的俯視示意圖。請參考圖1、圖3A至圖3D。在圖1的實施例中,中空殼體140的外壁部142與第一嵌合部144可設計為同心圓形,如圖3A所顯示。或者,在另一實施例中,可設計中空殼體140B的外壁部142具有內切面,如圖3B所顯示,以增加組裝透光壓板150具有定位功能。再者,在另一實施例中,可設計中空殼體140C的外壁部142具有定位槽,如圖3C所顯示,以進一步降低組裝錯誤機率。又或者,在另一實施例中,可設計中空殼體140D的外壁部142具有多個定位槽,如圖3D所顯示,以確保組裝正確。上述實際的組裝方式亦可應用於組裝基板110,本新型創作並不限於此。FIG. 3A to FIG. 3D are top views of the hollow shell of different embodiments of the present invention. Please refer to FIG. 1 and FIG. 3A to FIG. 3D. In the embodiment of FIG. 1, the
圖4A至圖4C為本新型創作不同實施例的中空殼體的俯視示意圖。請參考圖1、圖4A至圖4C。在另一實施例中,中空殼體140E的外壁部142與第一嵌合部144可設計為同心矩形,如圖4A所顯示。或者,在另一實施例中,可設計中空殼體140F的外壁部142具有定位槽,如圖4B所顯示,以進一步降低組裝錯誤機率。此外,在另一實施例中,中空殼體140G的外壁部142與第一嵌合部144還可設計為同心多邊形,如圖4C所顯示,本新型創作並不限於此。4A to 4C are schematic top views of the hollow shell of different embodiments of the present invention. Please refer to FIG. 1 and FIG. 4A to FIG. 4C. In another embodiment, the
綜上所述,在本新型創作的光學指紋取像裝置中,光學指紋取像裝置的中空殼體包括外壁部以及由外壁部朝內且沿平行於參考平面的方向延伸的第一嵌合部。其中,中空殼體的外壁部圍繞透光壓板以及基板,且第一嵌合部包括第一嵌合面,光學指紋取像裝置的透光壓板配置於第一嵌合部的第一嵌合面。因此,可使透光壓板及基板以嵌合方式組合於中空殼體。如此一來,可提升光學指紋取像裝置的結構強度以及優化封裝對位性,並能美化光學指紋取像裝置的外觀。In summary, in the optical fingerprint capturing device of the present invention, the hollow shell of the optical fingerprint capturing device includes an outer wall portion and a first interlocking portion extending inward from the outer wall portion and in a direction parallel to the reference plane. The outer wall portion of the hollow shell surrounds the light-transmitting pressure plate and the substrate, and the first interlocking portion includes a first interlocking surface, and the light-transmitting pressure plate of the optical fingerprint capturing device is arranged on the first interlocking surface of the first interlocking portion. Therefore, the light-transmitting pressure plate and the substrate can be combined in the hollow shell in an interlocking manner. In this way, the structural strength of the optical fingerprint capturing device can be enhanced, the packaging alignment can be optimized, and the appearance of the optical fingerprint capturing device can be beautified.
雖然本新型創作已以實施例揭露如上,然其並非用以限定本新型創作,任何所屬技術領域中具有通常知識者,在不脫離本新型創作的精神和範圍內,當可作些許的更動與潤飾,故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the novel creation has been disclosed as above by way of embodiments, they are not intended to limit the novel creation. Any person with ordinary knowledge in the relevant technical field may make slight changes and modifications without departing from the spirit and scope of the novel creation. Therefore, the protection scope of the novel creation shall be subject to the scope defined in the attached patent application.
100,100A:光學指紋取像裝置 110:基板 120:感光模組 122:感光元件 124:取像鏡組 130:發光元件 140,140A~140G:中空殼體 142:外壁部 144:第一嵌合部 146:第二嵌合部 150:透光壓板 160:遮光元件 A:通光區 D1~D4:最短距離 E:參考平面 H:氣孔結構 S11:頂面 S12:底面 S21:第一嵌合面 S22:第二嵌合面 S23:第三嵌合面 S3:指壓表面 S4:外側表面 100,100A: Optical fingerprint imaging device 110: Substrate 120: Photosensitive module 122: Photosensitive element 124: Image pickup lens assembly 130: Light emitting element 140,140A~140G: Hollow shell 142: Outer wall 144: First interlocking part 146: Second interlocking part 150: Transparent pressure plate 160: Shading element A: Light-transmitting area D1~D4: Shortest distance E: Reference plane H: Air hole structure S11: Top surface S12: Bottom surface S21: First interlocking surface S22: Second interlocking surface S23: Third interlocking surface S3: Finger pressure surface S4: Outer surface
圖1為本新型創作一實施例的光學指紋取像裝置的剖面示意圖。 圖2為本新型創作另一實施例的光學指紋取像裝置的剖面示意圖。 圖3A至圖3D為本新型創作不同實施例的中空殼體的俯視示意圖。 圖4A至圖4C為本新型創作不同實施例的中空殼體的俯視示意圖。 FIG1 is a schematic cross-sectional view of an optical fingerprint imaging device of an embodiment of the present invention. FIG2 is a schematic cross-sectional view of an optical fingerprint imaging device of another embodiment of the present invention. FIG3A to FIG3D are schematic top views of hollow shells of different embodiments of the present invention. FIG4A to FIG4C are schematic top views of hollow shells of different embodiments of the present invention.
100:光學指紋取像裝置 100: Optical fingerprint imaging device
110:基板 110: Substrate
120:感光模組 120: Photosensitive module
122:感光元件 122: Photosensitive element
124:取像鏡組 124: Imaging lens set
130:發光元件 130: Light-emitting element
140:中空殼體 140: Hollow shell
142:外壁部 142: Outer wall
144:第一嵌合部 144: First fitting part
150:透光壓板 150: Transparent pressure plate
160:遮光元件 160: Shading element
A:通光區 A: Light-transmitting area
D1~D4:最短距離 D1~D4: Shortest distance
E:參考平面 E: Reference plane
H:氣孔結構 H: Porous structure
S11:頂面 S11: Top
S12:底面 S12: Bottom
S21:第一嵌合面 S21: First mating surface
S22:第二嵌合面 S22: Second mating surface
S3:指壓表面 S3: Finger pressure surface
S4:外側表面 S4: Outer surface
Claims (9)
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TW113200445U TWM655926U (en) | 2024-01-12 | 2024-01-12 | Optical fingerprint imaging device |
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TWM655926U true TWM655926U (en) | 2024-05-21 |
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Application Number | Title | Priority Date | Filing Date |
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