TWM655923U - Vacuum drying equipment that adjusts the air guide direction - Google Patents
Vacuum drying equipment that adjusts the air guide direction Download PDFInfo
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- 238000001291 vacuum drying Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000011521 glass Substances 0.000 claims abstract description 44
- JTCFNJXQEFODHE-UHFFFAOYSA-N [Ca].[Ti] Chemical compound [Ca].[Ti] JTCFNJXQEFODHE-UHFFFAOYSA-N 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 3
- 238000011109 contamination Methods 0.000 description 5
- 240000004050 Pentaglottis sempervirens Species 0.000 description 2
- 235000004522 Pentaglottis sempervirens Nutrition 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
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Abstract
一種調整氣導方向的真空乾燥設備,其包括:一真空腔體,該真空腔體設有一容置槽、複數抽氣口及一下側,該等抽氣口設置於該真空腔體之下側連通該容置槽;一玻璃基板底座,該玻璃基板底座設置於該真空腔體之容置槽;一基板薄膜,該基板薄膜設置於該玻璃基板底座上;一氣導調整板,該氣導調整板兩側設有支架,該氣導調整板透過該等支架設置於該玻璃基板底座上;一真空抽氣泵浦,該真空抽氣泵浦與該真空腔體之該等抽氣口相連接。藉由該等抽氣孔及該等孔洞進行排列設置,使抽氣氣流由該基板薄膜往該氣導調整板方向抽氣,且往該氣導調整板周遭之該等抽氣口抽出,使本創作達到氣流均勻分布的效果,即可避免該基板薄膜其表面被溶劑二次汙染的情況發生。A vacuum drying device for adjusting the air conduction direction comprises: a vacuum chamber, the vacuum chamber is provided with a containing groove, a plurality of exhaust ports and a lower side, the exhaust ports are arranged on the lower side of the vacuum chamber and connected to the containing groove; a glass substrate base, the glass substrate base is arranged in the containing groove of the vacuum chamber; a substrate film, the substrate film is arranged on the glass substrate base; an air conduction adjustment plate, the air conduction adjustment plate is provided with brackets on both sides, the air conduction adjustment plate is arranged on the glass substrate base through the brackets; a vacuum exhaust pump, the vacuum exhaust pump is connected to the exhaust ports of the vacuum chamber. By arranging the exhaust holes and the holes, the exhaust airflow is drawn from the substrate film toward the air conduction adjustment plate and then out to the exhaust ports around the air conduction adjustment plate, so that the invention can achieve the effect of uniform airflow distribution, thereby preventing the surface of the substrate film from being secondary contaminated by the solvent.
Description
本創作係關於一種真空乾燥設備,特別係關於一種調整氣導方向的真空乾燥設備。This invention relates to a vacuum drying device, and in particular to a vacuum drying device capable of adjusting the air conduction direction.
一般而言,真空乾燥係將待加工物件放置於一腔體之中,並透過抽真空方式使該待加工物件處於負壓的狀態,讓該待加工物件凝固乾燥的一種方式,該待加工物件中所含的水分在負壓的情況下,因為真空度的提升進而使水分獲得足夠的動能脫離該待加工物件之表面。Generally speaking, vacuum drying is a method of placing the object to be processed in a chamber and putting the object to be processed in a negative pressure state by vacuuming, so that the object to be processed solidifies and dries. Under negative pressure, the moisture contained in the object to be processed obtains sufficient kinetic energy to leave the surface of the object to be processed due to the increase in vacuum degree.
請配合參閱圖1,圖1係為習知真空乾燥設備之剖面示意圖,其設有一真空抽氣泵浦A1、一真空腔體A2,該真空腔體A2內設有一玻璃底板A3,且該玻璃底板A3上設有一玻璃基板A31,該等玻璃基板A31上含有大量溶劑,該真空腔體A2一端設有一抽氣口A21,該真空抽氣泵浦A1透過一閥門A11與該抽氣口A21相連接,該真空腔體A2設有一真空計A22藉此偵測該真空腔體A2內之真空程度。Please refer to FIG. 1, which is a cross-sectional schematic diagram of a conventional vacuum drying device, which is provided with a vacuum pump A1 and a vacuum chamber A2. A glass bottom plate A3 is provided in the vacuum chamber A2, and a glass substrate A31 is provided on the glass bottom plate A3. The glass substrate A31 contains a large amount of solvent. An exhaust port A21 is provided at one end of the vacuum chamber A2. The vacuum pump A1 is connected to the exhaust port A21 through a valve A11. The vacuum chamber A2 is provided with a vacuum gauge A22 to detect the vacuum level in the vacuum chamber A2.
一般而言,該抽氣口A21通常會位於該真空腔體A2中央底部,當該真空抽氣泵浦A1開始抽氣時,該閥門A11將會開啟,此時真空腔體A2中的氣體將會由沿著該玻璃基板A31周圍往該抽氣口A21移動,而該玻璃基板A31之溶劑將會進行揮發與該真空腔體A2中的氣體一同往該抽氣口A21移動並透過該真空抽氣泵浦A1抽取並排除。Generally speaking, the exhaust port A21 is usually located at the central bottom of the vacuum chamber A2. When the vacuum pump A1 starts to evacuate, the valve A11 will open. At this time, the gas in the vacuum chamber A2 will move toward the exhaust port A21 along the periphery of the glass substrate A31, and the solvent in the glass substrate A31 will evaporate and move toward the exhaust port A21 together with the gas in the vacuum chamber A2 and be extracted and discharged through the vacuum pump A1.
然而,氣流及該玻璃基板A31之溶劑揮發將會沿著該玻璃基板A31表面流向該抽氣口A21,而該玻璃基板A31四周抽氣速率會大於中央的抽氣速率,將會使該玻璃基板A31中央的溶劑會流向該玻璃基板邊緣,將會導致二次溶劑汙染的問題產生。However, the airflow and the solvent volatilization of the glass substrate A31 will flow along the surface of the glass substrate A31 toward the exhaust port A21, and the exhaust rate around the glass substrate A31 will be greater than the exhaust rate in the center, which will cause the solvent in the center of the glass substrate A31 to flow to the edge of the glass substrate, resulting in the problem of secondary solvent contamination.
是故,如何克服實務上設備整合所遇到的困難且克服抽氣產生的氣流不均勻導致該玻璃基板表面二次溶劑汙染的問題則為本案創作人所欲解決之技術困難點。Therefore, how to overcome the difficulties encountered in practical equipment integration and the problem of secondary solvent contamination on the surface of the glass substrate caused by uneven airflow generated by exhaust are the technical difficulties that the creators of this case want to solve.
有鑑於先前技術的問題,本創作之目的係為了改善抽氣的氣流不均勻導致基板表面二次溶劑汙染的情況,即可藉由本創作解決先前技術所面臨的問題。In view of the problems of the prior art, the purpose of this invention is to improve the situation where the uneven airflow during exhaust leads to secondary solvent contamination on the surface of the substrate, and the problems faced by the prior art can be solved by this invention.
一種調整氣導方向的真空乾燥設備,其包括: 一真空腔體,該真空腔體設有一容置槽、複數抽氣口、一上側及一下側,該容置槽設置於該上側及該下側之間,該等抽氣口設置於該真空腔體之下側連通該容置槽; 一玻璃基板底座,該玻璃基板底座設置於該真空腔體之容置槽且鄰近該下側; 一基板薄膜,該基板薄膜設置於該玻璃基板底座上; 一氣導調整板,該氣導調整板兩側設有支架,該氣導調整板透過該等支架設置於該玻璃基板底座上; 一真空抽氣泵浦,該真空抽氣泵浦與該真空腔體之該等抽氣口相連接。 A vacuum drying device for adjusting the air conduction direction comprises: A vacuum chamber, the vacuum chamber is provided with a containing groove, a plurality of exhaust ports, an upper side and a lower side, the containing groove is arranged between the upper side and the lower side, and the exhaust ports are arranged at the lower side of the vacuum chamber and connected to the containing groove; A glass substrate base, the glass substrate base is arranged in the containing groove of the vacuum chamber and adjacent to the lower side; A substrate film, the substrate film is arranged on the glass substrate base; An air conduction adjustment plate, the air conduction adjustment plate is provided with brackets on both sides, and the air conduction adjustment plate is arranged on the glass substrate base through the brackets; A vacuum exhaust pump, the vacuum exhaust pump is connected to the exhaust ports of the vacuum chamber.
在一實施例中,該真空腔體設有至少一邊緣,該等抽氣口設置於該真空腔體之下側中央或鄰近該真空腔體之下側與該邊緣之間。In one embodiment, the vacuum chamber has at least one edge, and the vacuum ports are disposed at the center of the lower side of the vacuum chamber or between the lower side of the vacuum chamber and the edge.
在一實施例中,該玻璃基板底座與該真空腔體之下側之間設有一間距。In one embodiment, a distance is provided between the glass substrate base and the lower side of the vacuum chamber.
在一實施例中,該基板薄膜可為鈣鈦礦太陽能電池玻璃基板或平面顯示器面板玻璃基板。In one embodiment, the substrate film may be a calcium-titanium solar cell glass substrate or a flat panel display glass substrate.
在一實施例中,該真空腔體一側設有一真空計。In one embodiment, a vacuum gauge is provided on one side of the vacuum chamber.
在一實施例中,該氣導調整板設有至少一抽氣孔及複數孔洞。In one embodiment, the air conduction adjustment plate is provided with at least one air extraction hole and a plurality of holes.
在一實施例中,該等孔洞具有至少一大孔徑孔洞、至少一中孔徑孔洞及至少一小孔徑孔洞。In one embodiment, the holes include at least one large-diameter hole, at least one medium-diameter hole, and at least one small-diameter hole.
在一實施例中,該等抽氣孔周圍排列複數小孔徑孔洞,該等小孔徑孔洞周圍遠離該等抽氣孔排列複數中孔徑孔洞,該等中孔徑孔洞周圍遠離該小孔徑孔洞排列複數大孔徑孔洞。In one embodiment, a plurality of small-diameter holes are arranged around the exhaust holes, a plurality of medium-diameter holes are arranged around the small-diameter holes away from the exhaust holes, and a plurality of large-diameter holes are arranged around the medium-diameter holes away from the small-diameter holes.
在一實施例中,該真空抽氣泵浦與該真空腔體之該等抽氣口之間設有至少一真空閥門。In one embodiment, at least one vacuum valve is disposed between the vacuum pump and the vacuum ports of the vacuum chamber.
在本創作中,該氣導調整板上設有該等抽氣孔、該等大孔徑孔洞、該等中孔徑孔洞及該等小孔徑孔洞,且藉由該等抽氣孔及該等孔洞進行排列設置,使抽氣氣流由該基板薄膜往該氣導調整板方向抽氣,且往該氣導調整板周遭之該等抽氣口抽出,使本創作達到氣流均勻分布的效果,即可避免該基板薄膜其表面被溶劑二次汙染的情況發生。In the present invention, the air-conducting adjustment plate is provided with the exhaust holes, the large-diameter holes, the medium-diameter holes and the small-diameter holes, and the exhaust holes and the holes are arranged so that the exhaust airflow is exhausted from the substrate film toward the air-conducting adjustment plate, and then exhausted to the exhaust ports around the air-conducting adjustment plate, so that the present invention achieves the effect of uniform airflow distribution, thereby avoiding the secondary contamination of the surface of the substrate film by the solvent.
為使本創作的上述目的、特徵和優點能夠更加明顯易懂,下面結合附圖對本創作的具體實施方式做詳細的說明。在下面的描述中闡述了很多具體細節以便於充分理解本創作。但是本創作能夠以很多不同於在此描述的其它方式來實施,本領域技術人員可以在不違背本創作內涵的情況下做類似改進,因此本創作不受下面公開的具體實施例的限制。In order to make the above-mentioned purposes, features and advantages of the present invention more clearly understandable, the specific implementation of the present invention is described in detail below in conjunction with the attached figures. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited to the specific embodiments disclosed below.
需要說明的是,當元件被稱為“固定於”或“設置於”另一個元件,它可以直接在另一個元件上或者也可以存在居中的元件。當一個元件被認為是“連接”另一個元件,它可以是直接連接到另一個元件或者可能同時存在居中元件。本創作的說明書所使用的術語“垂直的”、“水平的”、“上”、“下”、“左”、“右”以及類似的表述只是為了說明的目的,並不表示是唯一的實施方式。It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the description of this creation are for illustrative purposes only and do not represent the only implementation method.
此外,術語“第一”、“第二”僅用於描述目的,而不能理解為指示或暗示相對重要性或者隱含指明所指示的技術特徵的數量。由此,限定有“第一”、“第二”的特徵可以明示或者隱含地包括至少一個該特徵。在本創作的描述中,“多個”、 “ 複數個”的含義是至少兩個,例如兩個,三個等,除非另有明確具體的限定。In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this work, the meaning of "multiple" and "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
在本創作中,除非另有明確的規定和限定,第一特徵在第二特徵“上”、“下”可以是第一特徵直接和第二特徵接觸,或第一特徵和第二特徵間接地通過中間媒介接觸。而且,第一特徵在第二特徵“之上”、“上方”和“上面”可是第一特徵在第二特徵正上方或斜上方,或僅表示第一特徵水準高度高於第二特徵。第一特徵在第二特徵“之上”、“上方”和“上面”可以是第一特徵在第二特徵正下方或斜下方,或僅表示第一特徵水平高度小於第二特徵。In this work, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first feature is directly in contact with the second feature, or that the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "above", "above" or "above" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
除非另有定義,本創作的說明書所使用的所有的技術和科學術語與屬於本創作的技術領域的技術人員通常知識的含義相同。在本創作的說明書中所使用的術語只是為了描述具體的實施方式的目的,不是旨在於限制本創作。本創作的說明書所使用的術語“及/或”包括一個或多個相關的所列項目的任意的和所有的組合。Unless otherwise defined, all technical and scientific terms used in the description of this invention have the same meaning as those commonly known to those skilled in the art to which this invention belongs. The terms used in the description of this invention are only for the purpose of describing specific implementations and are not intended to limit this invention. The term "and/or" used in the description of this invention includes any and all combinations of one or more of the related listed items.
請參閱圖2所示,係為本創作調整氣導方向的真空乾燥設備之剖面示意圖,本創作係一種調整氣導方向的真空乾燥設備,其包括:一真空腔體1、一玻璃基板底座2、一基板薄膜3、一氣導調整板4及一真空抽氣泵浦5。Please refer to FIG. 2 , which is a cross-sectional diagram of a vacuum drying device for adjusting the air conduction direction of the present invention. The present invention is a vacuum drying device for adjusting the air conduction direction, which includes: a
該真空腔體1設有一容置槽11、複數抽氣口12、一上側13、一下側14及至少一邊緣15,在一實施例中,該等抽氣口12設置於該真空腔體1之下側14並與該容置槽11進行連通,具體而言,該真空腔體1為一可封閉之空間或容器,該真空腔體1之頂部則為該上側13,而該真空腔體1之底部為該下側14,該真空腔體1介於該上側13與該下側14之間則為該容置槽11,該容置槽11橫向拓展方向上則以該等邊緣15為限制,其中,該抽氣口12設置於該容置槽11之下側14中央或該抽氣口12設置鄰近該容置槽11之下側14與該等邊緣15之間。The
其中,該真空腔體1之上側13進一步設有一真空計6,使本創作可透過該真空計6使該真空腔體1抽氣的過程,可藉由觀看該真空計6得知該真空腔體1內之氣壓的變化。A
該玻璃基板底座2設置於該真空腔體1之容置槽11之中,該玻璃基板底座2與該真空腔體1之下側14之間設有一間距,透過該玻璃基板底座2與該下側14之間的間距,避免使該玻璃基板底座2阻礙或阻塞該下側14設置之該等抽氣口12,以確保抽氣的進行。The
該基板薄膜3設置於該玻璃基板底座2上,該基板薄膜3可為鈣鈦礦戴陽能電池玻璃基板或平面顯示器面板玻璃基板,其中,該基板薄膜3之表面具有待揮發之溶劑。The
該氣導調整板4兩側設有支架41,該氣導調整板4透過該等支架41設置於該玻璃基板底座2上,該氣導調整板4設有至少一抽氣孔42及複數孔洞43,該等抽氣孔42係對稱或非對稱設置於該氣導調整板4之内緣,其中,該氣導調整板4與該玻璃基板底座2之間距離約為20mm。The air
請配合參閱圖3,圖3係為本創作之氣導調整板4俯瞰示意圖,該氣導調整板4之該等抽氣孔42周圍排列之孔洞43為複數小孔徑孔洞431,該等小孔徑孔洞431周圍遠離該等抽氣孔42之側排列複數中孔徑孔洞432,且該中孔徑孔洞432周圍遠離該小孔徑孔洞431之側排列之孔洞43為複數大孔徑孔洞433。Please refer to Figure 3, which is a bird's-eye view of the air
其中,該等大孔徑孔洞433之面積大於該等中孔徑孔洞432之面積及該等小孔徑孔洞431之面積,且該中孔徑孔洞432之面積大於該等小孔徑孔洞431之面積,在此僅為舉例本創作並不以此為限制。Among them, the area of the large-
該真空抽氣泵浦5與該真空腔體1之該等抽氣口12之間設有至少一真空閥門7,其中,該等抽氣口12可進行匯流後透過一真空閥門7與該真空抽氣泵浦5進行連接,或該等抽氣口12可分別設有一真空閥門7再與該真空抽氣泵浦5進行連接,藉由該真空抽氣泵浦5透過該真空閥門7與該真空腔體1之該等抽氣口12進行連接,使該真空抽氣泵浦5對該真空腔體1之容置槽11進行抽氣,使該真空腔體1之容置槽11內逐漸真空,並透過該真空閥門7避免已抽出氣體因為壓力差而進入該真空腔體1之容置槽11中。At least one
在本創作中,該氣導調整板4上設有該等抽氣孔42、該等大孔徑孔洞433、該等中孔徑孔洞432及該等小孔徑孔洞431,且藉由該等抽氣孔42及該等孔洞43進行排列設置,使抽氣氣流由該基板薄膜3往該氣導調整板4方向抽氣,且往該氣導調整板4周圍之該等抽氣孔42抽出,使本創作達到氣流均勻分布的效果,即可避免該基板薄膜3其表面被溶劑二次汙染的情況發生。In the present invention, the air-conducting
A1:真空抽氣泵浦A1: Vacuum pump
A11:閥門A11: Valve
A2:真空腔體A2: Vacuum chamber
A21:抽氣口A21: Air extraction port
A22:真空計A22: Vacuum gauge
A3:玻璃底板A3: Glass bottom plate
A31:玻璃基板A31: Glass substrate
1:真空腔體1: Vacuum chamber
11:容置槽11: Receiving groove
12:抽氣口12: Air outlet
13:上側13: Upper side
14:下側14: Lower side
15:邊緣15: Edge
2:玻璃基板底座2: Glass substrate base
3:基板薄膜3: Substrate film
4:氣導調整板4: Air guide adjustment plate
41:支架41: Bracket
42:抽氣孔42: Exhaust hole
43:孔洞43: Holes
431:小孔徑孔洞431: Small aperture hole
432:中孔徑孔洞432:Medium diameter hole
433:大孔徑孔洞433: Large aperture hole
5:真空抽氣泵浦5: Vacuum pump
6:真空計6: Vacuum gauge
7:真空閥門7: Vacuum valve
圖1係為習知真空乾燥設備之剖面示意圖。FIG. 1 is a schematic cross-sectional view of a conventional vacuum drying apparatus.
圖2係為本創作調整氣導方向的真空乾燥設備之剖面示意圖。FIG. 2 is a schematic cross-sectional view of the vacuum drying device for adjusting the air conduction direction of the present invention.
圖3係為本創作之氣導調整板俯瞰示意圖。FIG. 3 is a bird's-eye view of the air guide adjustment plate of this invention.
1:真空腔體 1: Vacuum chamber
11:容置槽 11: Storage tank
12:抽氣口 12: Exhaust port
13:上側 13: Upper side
14:下側 14: Lower side
15:邊緣 15: Edge
2:玻璃基板底座 2: Glass substrate base
3:基板薄膜 3: Substrate film
4:氣導調整板 4: Air guide adjustment plate
41:支架 41: Bracket
5:真空抽氣泵浦 5: Vacuum pump
6:真空計 6: Vacuum gauge
7:真空閥門 7: Vacuum valve
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW113200363U TWM655923U (en) | 2024-01-10 | 2024-01-10 | Vacuum drying equipment that adjusts the air guide direction |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW113200363U TWM655923U (en) | 2024-01-10 | 2024-01-10 | Vacuum drying equipment that adjusts the air guide direction |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM655923U true TWM655923U (en) | 2024-05-21 |
Family
ID=92075718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW113200363U TWM655923U (en) | 2024-01-10 | 2024-01-10 | Vacuum drying equipment that adjusts the air guide direction |
Country Status (1)
Country | Link |
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TW (1) | TWM655923U (en) |
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2024
- 2024-01-10 TW TW113200363U patent/TWM655923U/en unknown
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