TWM655442U - Power supply - Google Patents

Abstract

A power supply including a casing, a circuit board, a heat source, at least one heat dissipation sheet and a heat dissipation mud is provided. The circuit board is disposed in the casing. The circuit board includes at least one heat dissipation through hole, a first surface and a second surface opposite to each other. The heat source is disposed on the first surface and corresponds to the heat dissipation through hole. The heat dissipation sheet is connected to the second surface and covers the heat dissipation through hole, and the heat dissipation sheet contacts the chassis. The heat dissipation mud is filled in the heat dissipation through hole, and the heat dissipation mud contacts the heat source and the heat dissipation sheet.

Description

Power supply

This case relates to a supply, and in particular to a power supply.

Today's power supplies are equipped with fans to dissipate heat from the electronic components (heat sources) inside the power supply. When the temperature of the electronic components gradually increases, the power supply needs to increase the speed of the fan, which will increase the fan noise and increase the power supply's energy consumption.

The present invention provides a power supply, including a housing, a circuit board, a heat source, at least one heat sink and a heat sink. The circuit board is arranged in the housing. The circuit board includes at least one heat sink hole, a first surface and a second surface opposite to each other. The heat source is arranged on the first surface and corresponds to the heat sink hole. The heat sink is located on the second surface and covers the heat sink hole, and the heat sink contacts the housing. The heat sink fills the heat sink hole, and the heat sink contacts the heat source and the heat sink.

Based on the above, the heat source of the power supply of the present invention can be thermally coupled to the chassis through the heat dissipation mud and heat sink filled in the heat dissipation through-holes to increase the heat dissipation area of the heat source and improve the heat dissipation efficiency of the power supply.

A1, A2: Storage space

A3: Space

B: Secondary heat source

C: Cold air flow

P1: First heat dissipation path

P2: Second heat dissipation path

S1,S2,S3,S4,S5: points

X-Y-Z: Cartesian coordinates

100,100a,100b100c,100d:Power supply

110: Chassis

120,120a,120d: Circuit board

122,122a,122b,1221,1222,1223,1224: heat dissipation holes

124: First page

126: Second side

127: Line

130,130b,130c:Heat source

131: Bottom

132: Stop plate

134,134a,134b: Pins

136: Coil

137: Bottom

140,140a,140b:Heat sink

150,150a,150b: Heat dissipation mud

160: Fan

162: Air outlet

170,170b: Stopper

180,180a: Insulation parts

182,182a,182b: opening

184: U-shaped groove

190b: Auxiliary heat dissipation cover

190a: Auxiliary heat dissipation mud

191: Heat sink cover body

192: Part 1

193: Part 2

194: Fin structure

Figure 1 is a cross-sectional schematic diagram of a power supply according to an embodiment of the present invention.

FIG2 is a schematic diagram of the second side of the circuit board of FIG1.

Figure 3 is a schematic diagram of the insulating member of Figure 1.

Figure 4 is a top view of the heat source of Figure 1.

Figure 5 is a cross-sectional schematic diagram of a power supply according to an embodiment of the present invention.

FIG6 is a schematic diagram of the second side of the circuit board of FIG5.

FIG7 is a cross-sectional schematic diagram of a power supply according to an embodiment of the present invention.

FIG8 is a cross-sectional schematic diagram of a power supply according to an embodiment of the present invention.

FIG9 is a schematic diagram of a circuit board of a power supply according to an embodiment of the present invention.

FIG1 is a schematic cross-sectional view of a power supply according to an embodiment of the present invention, which only shows the relative positions of the components without limiting the actual size and thickness of the components. FIG2 is a schematic view of the second side of the circuit board of FIG1. FIG3 is a schematic view of the insulating member of FIG1. The rectangular coordinates X-Y-Z are provided here to facilitate the description of the components.

Please refer to Figures 1 to 3 at the same time. The power supply 100 includes a housing 110, a circuit board 120 disposed in the housing 110, a heat source 130, at least one heat sink 140 and a heat sink mud 150. The circuit board 120 includes at least one heat sink hole 122, a first surface 124 and a second surface 126, and the first surface 124 is opposite to the second surface 126. The heat source 130 is disposed on the first surface 124 and corresponds to the heat sink hole 122. The heat sink 140 is located on the second surface 126 and covers the heat sink hole 122. The heat sink mud 150 is filled in the heat sink hole 122, and the heat sink mud 150 contacts a bottom surface 137 of the heat source 130 and the heat sink 140. At least one heat sink 140 contacts the housing 110.

The heat source 130 of the power supply 100 can be heat-dissipated through a first heat dissipation path P1. The first heat dissipation path P1 is a path for heat energy to be transferred from the heat source 130 to the housing 110 through the heat dissipation mud 150 and the heat sink 140. In other words, the heat source 130 can be thermally coupled to the housing 110 through the heat dissipation mud 150 and the heat sink 140 filled in the heat dissipation through hole 122. In this way, the housing 110 as a whole can be used for heat dissipation of the heat source 130, and the heat dissipation area of the heat source 130 is increased to improve the heat dissipation efficiency of the power supply 100. The heat source 130 of this embodiment is, for example, a magnetic element. Specifically, the heat source 130 is a transformer, but not limited thereto. The number of the heat dissipation through hole 122 is one, but not limited thereto.

The thermal conductivity coefficients of the heat sink 140 and the heat sink mud 150 are matched to each other to reduce thermal resistance. For example, the thermal conductivity coefficient of the heat sink 140 may be between 6W/mK and 7W/mK, and the thermal conductivity coefficient of the heat sink mud 150 may be between 6W/mK and 7W/mK, but not limited thereto.

As shown in FIG. 1 , the power supply 100 further includes a fan 160, which is disposed in the housing 110 and includes an air outlet 162. The air outlet 162 faces the first surface 124 and corresponds to the heat source 130. The air outlet 162 is used to blow out a cold air flow C, so that the heat source 130 can also dissipate heat through a second heat dissipation path P2. The second heat dissipation path P2 is that the cold air flow C blown out by the fan 160 exchanges heat with the heat source 130 to form a hot air flow, and the hot air flow moves away from the heat source 130 to take away the heat energy.

It can be seen that the heat source 130 of the power supply 100 of this embodiment can dissipate heat through the first heat dissipation path P1 (heat dissipation mud 150 and heat sink 140) and the second heat dissipation path P2 (cold air flow C of the fan 160) to further improve the heat dissipation efficiency of the power supply 100 and improve the working efficiency of the power supply 100. Since the heat source 130 of the power supply 100 can dissipate heat through the first heat dissipation path P1 (heat dissipation mud 150 and heat sink 140), even if the speed of the fan 160 decreases (that is, the heat dissipation efficiency of the second heat dissipation path P2 decreases), the heat source 130 can still be cooled to the target temperature.

In other words, the power supply 100 can still maintain good heat dissipation efficiency when the speed and wattage of the fan 160 are reduced. The power supply 100 can reduce the noise of the fan 160 (power supply 100) and reduce the energy consumption of the power supply 100 by reducing the speed and wattage of the fan 160.

In addition, as shown in FIG. 1 , the power supply 100 may optionally include a stopper 170. The heat source 130 includes a plurality of pins 134 and may optionally include a plurality of stopper plates 132. These pins 134 are disposed at a bottom 131 of the heat source 130 and connected to the circuit board 120. The stopper 170 and the stopper plates 132 are used to stop the heat sink 150 to prevent the heat sink 150 from overflowing to the outside of the heat source 130 and affecting other electronic components (not shown) on the circuit board 120.

Specifically, the number of the stopper plates 132 of this embodiment is two, and the number of the stopper members 170 is two. FIG. 1 schematically shows one stopper member 170 with a dotted line. The two stopper plates 132 of the heat source 130 are arranged at the bottom 131 of the heat source 130 and can extend along the X-axis direction. The two stopper members 170 are arranged between the bottom 131 of the heat source 130 and the circuit board 120 and can extend along the Y-axis direction. The two ends of the two stopper members 170 are connected to the two stopper plates 132. The two stopper plates 132 and the two stopper members 170 together enclose a rectangular accommodation space A1 to accommodate part of the heat sink 150. These stoppers 132 are located between the heat sink 150 and the pins 134 to prevent the heat sink 150 from contacting the pins 134. The stopper 170 is, for example, a weld-proof tape, but is not limited thereto. In an embodiment not shown, the number of the stoppers 132 of the heat source 130 is four, and the four stoppers 132 extend along the X-axis and the Y-axis respectively and are connected to each other to enclose the accommodation space A1.

FIG2 schematically indicates the distribution position of the circuit 127 with oblique lines, and schematically indicates the setting position of the heat sink 140 with dotted lines. As shown in FIG2, the shape of the heat dissipation hole 122 of the circuit board 120 is, for example, a quadrilateral, but is not limited thereto. The circuit board 120 further includes a plurality of circuits 127. The heat dissipation hole 122 avoids these circuits 127 without affecting the function of the circuit board 120. There is a safe distance between the heat dissipation hole 122 and the primary side and the secondary side (not shown) of the circuit board 120 to comply with safety regulations and avoid sparks caused by high and low voltage differences. The circuit board 120 of this embodiment is a circuit board 120 with a single-layer structure, but is not limited thereto. In an embodiment not shown, the circuit board 120 may have a multi-layer structure, and the heat dissipation through-hole 122 avoids the wiring of each layer and passes through the circuit board 120.

The area of the heat sink 140 of this embodiment is larger than the area of the heat dissipation through hole 122 and smaller than the area of the second surface 126 of the circuit board 120, but is not limited thereto. In an embodiment not shown, the area of the heat sink 140 may be equal to the area of the second surface 126 of the circuit board 120, and the heat sink 140 may completely cover the second surface 126.

As shown in FIG. 1 and FIG. 3 , the power supply 100 further includes an insulating member 180 , which is disposed between the second surface 126 of the circuit board 120 and the housing 110 . The insulating member 180 is used to separate the second surface 126 of the circuit board 120 and the housing 110 to prevent the circuit board 120 from being electrically connected to the housing 110 . The insulating member 180 is made of, for example, plastic, but is not limited thereto. The insulating member 180 is U-shaped, and the circuit board 120 can be placed in a U-shaped groove 184 . The insulating member 180 includes an opening 182 corresponding to the heat sink 140. When the circuit board 120 is placed on the insulating member 180, the heat sink 140 contacts the housing 110 through the opening 182.

FIG. 4 is a top view of the heat source of FIG. 1 . FIG. 1 and FIG. 4 use points S1, S2, S3, S4, and S5 to mark specific positions on the heat source 130. Please refer to FIG. 1 and FIG. 4 at the same time. The heat source 130 also includes a connecting line 139. Point S1 represents a position of the heat source 130 that is farther away from the heat sink 150, such as the top of the heat source 130. Point S2 represents a position of the heat source 130 that is closer to the heat sink 150, such as the bottom surface 137 of the heat source 130. Points S3, S4, and S5 are located next to the connecting line 139. The temperature of the heat source 130 (magnetic element) will affect the switching loss of the heat source 130, thereby affecting the efficiency of the power supply 100.

According to actual test results, in the known power supply that only uses a fan for heat dissipation, the temperature of point S1 is 116.3 degrees Celsius (℃); the temperature of point S2 is 115.5℃; the temperature of point S3 is 98.8℃; the temperature of point S4 is 124.8℃; and the temperature of point S5 is 90.7C. Therefore, the efficiency of the known power supply is 88.95% when the load is 20%; the efficiency is 91.03% when the load is 50%; and the efficiency is 88.83% when the load is 100%.

In the power supply 100 of this embodiment that dissipates heat through the first heat dissipation path P1 (heat sink 140 and heat sink mud 150) and the second heat dissipation path P2 (fan 160), the temperature of point S1 is 91.3 degrees Celsius (℃); the temperature of point S2 is 73.2℃; the temperature of point S3 is 83.5℃; the temperature of point S4 is 99.7℃; and the temperature of point S5 is 75℃. Therefore, the power supply 100 of this embodiment has an efficiency of 89.09% when the load is 20%; the efficiency is 91.26% when the load is 50%; and the efficiency is 91.07% when the load is 100%.

It can be seen that the first heat dissipation path P1 and the second heat dissipation path P2 of this embodiment can effectively reduce the temperature of the heat source 130 and improve the overall efficiency of the power supply 100. In addition, the speed of the fan 160 can be reduced, thereby reducing the power consumption and fan noise of the power supply 100.

FIG5 is a schematic cross-sectional view of a power supply according to an embodiment of the present invention. FIG6 is a schematic view of the second side of the circuit board of FIG5. Please refer to FIG1, FIG5 and FIG6 simultaneously. The power supply 100a of this embodiment is similar to the aforementioned embodiment. The difference between the two is that the power supply 100a of this embodiment further includes a secondary heat source B. The heating power of the secondary heat source B is less than the heating power of the main heat source (i.e., the heat source 130). The number of heat dissipation through holes of the circuit board 120a is two, and the number of heat sinks is two. The secondary heat source B is disposed on the first side 124 of the circuit board 120a, and corresponds to one heat sink and one heat dissipation through hole. The heat source 130 corresponds to one heat sink and one heat dissipation through hole.

Specifically, the heat dissipation mud 150a of this embodiment is filled in the heat dissipation through hole 122a, and contacts the heat sink 140a and the heat source 130. The heat dissipation mud 150b is filled in the heat dissipation through hole 122b, and contacts the heat sink 140b and the auxiliary heat source B. The auxiliary heat source B is thermally coupled to the housing 110 through the heat dissipation mud 150b and the heat sink 140b.

As shown in FIG6 , the shapes of the two heat dissipation holes 122a and 122b are inconsistent, and the heat dissipation hole 122b is an irregular polygon. As shown in FIG5 , the number of openings of the insulating member 180a is two. The opening 182a corresponds to the heat sink 140a, and the opening 182b corresponds to the heat sink 140b. The air outlet 162 of the fan 160 also corresponds to the auxiliary heat source B, so that the cold air flow C can exchange heat with the auxiliary heat source B. In this way, the auxiliary heat source B can dissipate heat through two heat dissipation paths. The number of auxiliary heat sources B is not limited to this embodiment. In an embodiment not shown, the number of auxiliary heat sources B can be two, three, four, or more.

It can be seen that the power supply 100a can dissipate heat from multiple heat sources (heat source 130 and auxiliary heat source B) simultaneously through the heat dissipation mud 150a, 150b and the heat sink 140a, 140b, so as to further improve the heat dissipation efficiency of the power supply 100a, and further reduce the speed of the fan 160, thereby improving the working efficiency of the power supply 100a.

FIG7 is a cross-sectional schematic diagram of a power supply according to an embodiment of the present invention. Please refer to FIG1 and FIG7 simultaneously. The power supply 100b of the present embodiment is similar to the aforementioned embodiment. The difference between the two is that the heat sink 150 of the power supply 100b of the present embodiment contacts the pins 134 of the heat source 130b. The number of the stoppers 170b of the power supply 100b can be four. The four stoppers 170b surround the pins 134 to form a receiving space A2. The pins 134 are located in the receiving space A2. The power supply 100b of the present embodiment has the same effect as the aforementioned embodiment, and will not be described in detail here.

FIG8 is a schematic cross-sectional view of a power supply according to an embodiment of the present invention. Please refer to FIG1 and FIG8 simultaneously. The power supply 100c of this embodiment is similar to the aforementioned embodiment. The difference between the two is that the power supply 100c of this embodiment further includes an auxiliary heat dissipation mud 190a and an auxiliary heat dissipation cover 190b, and the heat source 130c has a coil 136.

The auxiliary heat dissipation mud 190a is coated on the surface of the coil 136, and the auxiliary heat dissipation cover 190b is connected to the heat source 130c and contacts the auxiliary heat dissipation mud 190a. The heat source 130c can further increase the heat dissipation area of the heat source 130c through the auxiliary heat dissipation mud 190a and the auxiliary heat dissipation cover 190b, thereby improving the heat dissipation efficiency of the power supply 100c. The auxiliary heat dissipation mud 190a and the heat dissipation mud 150 can be made of the same material. The material of the auxiliary heat dissipation cover 190b is, for example, aluminum, but is not limited thereto.

As shown in FIG8 , the auxiliary heat dissipation cover 190b is in an L-shape, for example, but not limited thereto. A space A3 is formed between the auxiliary heat dissipation cover 190b and the heat source 130c, and the auxiliary heat dissipation mud 190a is located in the space A3 and fills part of the space A3, but not limited thereto.

In one embodiment, the stopper 170b may be in a U-shape and surround the pin 134a away from the auxiliary heat dissipation cover 190b, and the opening of the U-shaped stopper corresponds to the pin 134b adjacent to the auxiliary heat dissipation cover 190b. The auxiliary heat dissipation mud 190a may completely fill the space A3 and contact the pin 134b adjacent to the auxiliary heat dissipation cover 190b. The auxiliary heat dissipation mud 190a may further fill the heat dissipation through hole 122 and contact the heat dissipation mud 150.

The auxiliary heat dissipation cover 190b of this embodiment includes a heat dissipation cover body 191 and a fin structure 194 connected to each other, and the heat dissipation cover body 191 is connected to the heat source 130c. The heat dissipation cover body 191 includes a first portion 192 and a second portion 193 connected by bending. The first portion 192 of the heat dissipation cover body 191 contacts the auxiliary heat dissipation mud 190a, and the fin structure 194 is connected to the second portion 193. The air outlet 162 of the fan 160 corresponds to the second portion 193 and the fin structure 194 of the heat dissipation cover body 191. The cold air flow C blown out of the air outlet 162 can exchange heat with the auxiliary heat dissipation cover 190b. The fin structure 194 is used to further increase the heat dissipation area of the auxiliary heat dissipation cover 190b (heat source 130c) to improve the heat dissipation efficiency of the power supply 100.

FIG9 is a schematic diagram of a circuit board of a power supply according to an embodiment of the present invention. Please refer to FIG2 and FIG9 simultaneously. The power supply 100d of the present embodiment is similar to the aforementioned embodiment. The difference between the two is that the number of heat dissipation through holes of the circuit board 120d of the power supply 100d of the present embodiment is four. The four heat dissipation through holes 1221, 1222, 1223, and 1224 correspond to a single heat source 130, thereby preventing the size of a single through hole from being too large and affecting the structural strength of the circuit board 120d.

The heat sink 140 covers four heat dissipation holes 1221, 1222, 1223, and 1224 at the same time. The shapes of these heat dissipation holes 1221, 1222, 1223, and 1224 are consistent, so that the heat source 130 can evenly transfer heat energy to these heat dissipation holes 1221, 1222, 1223, and 1224 through the heat dissipation mud 150. These heat dissipation holes 1221, 1222, 1223, and 1224 of this embodiment are arranged in a two-by-two array, but are not limited to this. In an embodiment not shown, the number of heat dissipation holes is, for example, six, and the heat dissipation holes can be arranged in a three-by-two array. The power supply 100d of this embodiment has the same effect as the aforementioned embodiment, and will not be repeated here.

In summary, the heat source of the power supply of the present invention can be thermally coupled to the chassis through the heat dissipation mud and heat sink filled in the heat dissipation through-holes to increase the heat dissipation area of the heat source and improve the heat dissipation efficiency of the power supply.

A1: Storage space

C: Cold air flow

P1: First heat dissipation path

P2: Second heat dissipation path

S1,S2: point

X-Y-Z: Cartesian coordinates

100: Power supply

110: Chassis

120: Circuit board

122: Heat dissipation through hole

124: First page

126: Second side

130: Heat source

131: Bottom

132: Stop plate

134: Pin

137: Bottom

140: Heat sink

150: Heat dissipation mud

160: Fan

162: Air outlet

170: Stopper

180: Insulation parts

182: Opening

Claims (20)

A power supply includes: a housing; a circuit board disposed in the housing, the circuit board including at least one heat dissipation through hole, a first surface and a second surface opposite to each other; a heat source disposed on the first surface and corresponding to the at least one heat dissipation through hole; at least one heat sink located on the second surface and covering the at least one heat dissipation through hole, the at least one heat sink in contact with the housing; and a heat dissipation mud filled in the at least one heat dissipation through hole, the heat dissipation mud in contact with the heat source and the at least one heat sink. The power supply as described in claim 1 further includes a fan, which is disposed in the housing and includes an air outlet, the air outlet faces the first surface and corresponds to the heat source, and the air outlet is used to blow out a cold air flow. A power supply as described in claim 1, wherein the number of the at least one heat dissipation through hole is multiple, and the shapes of the heat dissipation through holes are consistent. In the power supply as described in claim 3, the heat dissipation holes are arranged in an array. A power supply as described in claim 1, wherein the number of the at least one heat dissipation through hole is multiple, and the shapes of the heat dissipation through holes are inconsistent. The power supply as described in claim 1 further includes a stopper, which is disposed between the heat source and the circuit board to stop the heat sink. The power supply as described in claim 1, wherein the heat source includes a plurality of baffles and a plurality of pins, the baffles are used to block the heat sink, the baffles are located between the heat sink and the pins, and the pins are connected to the circuit board. The power supply as described in claim 1 further includes an insulating member, which is disposed between the circuit board and the housing, and the insulating member includes at least one opening, and the at least one heat sink contacts the housing through the at least one opening. A power supply as described in claim 1, wherein the heat source includes a plurality of pins, the pins are connected to the circuit board, and the heat sink contacts the pins. A power supply as described in claim 1, wherein the heat source is a magnetic element. The power supply as described in claim 1 further includes an auxiliary heat dissipation mud and an auxiliary heat dissipation cover, the heat source has a coil, the auxiliary heat dissipation mud is applied on the coil, and the auxiliary heat dissipation cover is connected to the heat source and contacts the auxiliary heat dissipation mud. The power supply as described in claim 11, wherein the auxiliary heat dissipation cover comprises a heat dissipation cover body and a fin structure, the heat dissipation cover body is connected to the heat source and contacts the auxiliary heat dissipation mud, and the fin structure is connected to the heat dissipation cover body. The power supply as described in claim 12, wherein the heat dissipation cover body includes a first part and a second part connected by bending, the first part contacts the auxiliary heat dissipation mud, and the fin structure is connected to the second part. The power supply as described in claim 12 further includes a fan, which is disposed in the housing and includes an air outlet, the air outlet faces the first surface of the circuit board and corresponds to the fin structure. A power supply as described in claim 11, wherein the auxiliary heat dissipation mud is made of the same material as the heat dissipation mud. A power supply as described in claim 11, wherein the auxiliary heat dissipation cover is made of aluminum. A power supply as described in claim 1, wherein the thermal conductivity of each of the at least one heat sink is between 6W/mK and 7W/mK. A power supply as described in claim 1, wherein the thermal conductivity of the heat sink is between 6W/mK and 7W/mK. A power supply as described in claim 1, wherein the heat source is a transformer. The power supply as described in claim 1 further includes a secondary heat source, the number of the at least one heat dissipation through hole is two, the number of the at least one heat sink is two, the secondary heat source is arranged on the first surface of the circuit board, and corresponds to one of the two heat dissipation through holes and one of the two heat sinks, and the other of the two heat dissipation through holes and the other of the two heat sinks correspond to the heat source.

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