TWM650917U - Case of portable electronic device - Google Patents
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- TWM650917U TWM650917U TW112211397U TW112211397U TWM650917U TW M650917 U TWM650917 U TW M650917U TW 112211397 U TW112211397 U TW 112211397U TW 112211397 U TW112211397 U TW 112211397U TW M650917 U TWM650917 U TW M650917U
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- casing
- bonding layer
- portable electronic
- electronic device
- shell
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- 229910052729 chemical element Inorganic materials 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 16
- 230000002093 peripheral effect Effects 0.000 claims description 24
- 238000007789 sealing Methods 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
一種可攜式電子裝置的機殼,包含一殼件、一結合層,及一功能件。殼件包括一接合面。結合層形成於接合面,結合層含有一化學元素的材料。功能件通過於結合層結合於殼件,功能件由含有該化學元素的材料所製成。藉此,使得機殼的製造速度快並能大量生產製造,以及功能件能通過結合層穩固地固定在殼件的接合面上。 A casing of a portable electronic device includes a shell component, a combination layer, and a functional component. The shell includes a joint surface. The bonding layer is formed on the bonding surface, and the bonding layer contains a material of a chemical element. The functional part is combined with the shell through the bonding layer, and the functional part is made of a material containing the chemical element. In this way, the manufacturing speed of the casing is fast and can be mass-produced, and the functional parts can be firmly fixed on the joint surface of the casing through the bonding layer.
Description
本新型是有關於一種可攜式電子裝置的機殼,特別是指一種通過結合層將功能件結合於殼件的可攜式電子裝置的機殼。 The present invention relates to a casing of a portable electronic device, in particular to a casing of a portable electronic device that combines functional components with the casing through a binding layer.
現有可攜式電子裝置是通過一機殼與一面板共同夾持住一密封墊圈,使密封墊圈以接觸方式抵壓於機殼及面板而達到防水或防塵的功效。由於密封墊圈並未固定在機殼或面板上,因此,密封墊圈很容易在機殼與面板的組裝或拆卸的過程中脫落。此外,密封墊圈也容易受到人為組裝不確實的影響而無法緊密接觸於機殼或面板,進而導致防水或防塵的效果不佳。 Existing portable electronic devices use a casing and a panel to jointly hold a sealing gasket, so that the sealing gasket is pressed against the casing and the panel in a contact manner to achieve waterproof or dustproof effects. Since the sealing gasket is not fixed on the casing or the panel, the sealing gasket can easily fall off during the assembly or disassembly of the casing and the panel. In addition, the sealing gasket is also susceptible to inaccurate human assembly and cannot be in close contact with the chassis or panel, resulting in poor waterproof or dustproof effects.
現有可攜式電子裝置為了達到防撞的效果,會將一緩衝墊套在機殼的一外周面。然而,前述套設的方式容易受到人為組裝不確實的影響而導致可攜式電子裝置落摔時緩衝墊由機殼上脫落,進而造成機殼受損。另一種方式是通過一外殼罩住機殼及四個緩衝墊,進而將該等緩衝墊分別固定在機殼的四個角落,以防止緩衝墊脫落。然而,前述方式增添了外殼的使用成本,並且會造成可攜式電子裝置的厚度變厚。 In order to achieve the anti-collision effect of existing portable electronic devices, a buffer pad is placed on an outer peripheral surface of the casing. However, the above-mentioned setting method is easily affected by artificial assembly inaccuracies, which may cause the cushion pad to fall off the casing when the portable electronic device is dropped, thereby causing damage to the casing. Another method is to cover the casing and four cushion pads with a shell, and then fix the cushion pads at the four corners of the casing respectively to prevent the cushion pads from falling off. However, the above-mentioned method increases the use cost of the casing and causes the thickness of the portable electronic device to become thicker.
因此,本新型之其中一目的,即在提供一種能夠克服先前技術的至少一個缺點的可攜式電子裝置的機殼。 Therefore, one of the objects of the present invention is to provide a casing for a portable electronic device that can overcome at least one disadvantage of the prior art.
於是,本新型可攜式電子裝置的機殼,包含一殼件、至少一結合層,及至少一功能件。 Therefore, the casing of the new portable electronic device includes a shell, at least one bonding layer, and at least one functional component.
該殼件包括至少一接合面。該結合層形成於該接合面,該結合層含有一化學元素的材料。該功能件通過該結合層結合於該殼件,該功能件由含有該化學元素的材料所製成。 The shell includes at least one joint surface. The bonding layer is formed on the bonding surface, and the bonding layer contains a material of a chemical element. The functional part is combined with the shell through the bonding layer, and the functional part is made of a material containing the chemical element.
在一些實施態樣中,該化學元素為矽。 In some embodiments, the chemical element is silicon.
在一些實施態樣中,該結合層包含矽或是二氧化矽。 In some embodiments, the bonding layer includes silicon or silicon dioxide.
在一些實施態樣中,該功能件由矽膠所製成。 In some implementations, the functional component is made of silicone.
在一些實施態樣中,該結合層具有結合於該功能件的一改質面。 In some implementations, the bonding layer has a modified surface bonded to the functional component.
在一些實施態樣中,該接合面為呈圍繞封閉狀的一承載面,該結合層呈圍繞封閉狀,該功能件為呈圍繞封閉狀的一密封墊圈。 In some implementations, the joint surface is a bearing surface in a surrounding and closed shape, the bonding layer is in a surrounding and closed shape, and the functional component is a sealing gasket in a surrounding and closed shape.
在一些實施態樣中,該接合面為呈圍繞封閉狀的一外周面,該結合層呈圍繞封閉狀,該功能件為呈圍繞封閉狀的一緩衝墊。 In some implementations, the joint surface is an outer peripheral surface in a surrounding and closed shape, the bonding layer is in a surrounding and closed shape, and the functional component is a cushioning pad in a surrounding and closed shape.
在一些實施態樣中,該殼件包括四個彼此相間隔的接合面,每一個該接合面為一角面部,該機殼包含分別形成於該等接合面的四個結合層,及分別結合於該等結合層的四個功能件,每一個該功能件為一緩衝墊。 In some embodiments, the shell includes four joint surfaces spaced apart from each other, each of the joint surfaces is an angular surface, and the casing includes four bonding layers respectively formed on the joint surfaces, and are respectively bonded to Each of the four functional parts of the bonding layer is a cushion.
在一些實施態樣中,該接合面位於該殼件的外周面,該功能件為一緩衝墊。 In some implementations, the joint surface is located on the outer peripheral surface of the shell, and the functional component is a cushion.
在一些實施態樣中,該接合面位於該殼件的內周面,該功能件為一密封墊圈。 In some implementations, the joint surface is located on the inner peripheral surface of the shell, and the functional component is a sealing gasket.
本新型至少具有以下功效:製造速度快並能大量生產製造。此外,功能件能通過結合層穩固地固定在殼件的接合面上,使得功能件不會由殼件上脫落。 The new type has at least the following effects: fast manufacturing speed and capable of mass production. In addition, the functional component can be firmly fixed on the joint surface of the shell through the binding layer, so that the functional component will not fall off from the shell.
100:可攜式電子裝置的機殼 100:Cases of portable electronic devices
1:殼件 1: Shell parts
11:基壁 11:Base wall
12:圍繞壁 12: around the wall
121:內周面 121: Inner surface
122:外周面 122:Outer peripheral surface
123:角面部 123: Angular face
13:承載壁 13: Bearing wall
131:承載面 131: Bearing surface
2:結合層 2: Bonding layer
21:層面 21:Level
22:改質面 22: Modified surface
3:功能件 3: Functional parts
4:面板 4:Panel
S1~S4:步驟 S1~S4: steps
本新型之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是本新型可攜式電子裝置的機殼的一第一實施例的製造方法的一步驟流程圖;圖2是第一實施例的一殼件的一立體圖;圖3是第一實施例的殼件的一前視圖;圖4是沿圖3中的IV-IV線所截取的一剖視圖; 圖5是第一實施例的殼件與一結合層的一前視圖,說明結合層形成於殼件的一承載面;圖6是沿圖5中的VI-VI線所截取的一剖視圖;圖7是類似於圖6的一剖視圖,說明結合層的一層面經表面改質而轉變為一改質面;圖8是第一實施例的殼件與一功能件的一前視圖,說明功能件形成於結合層的改質面;圖9是沿圖8中的IX-IX線所截取的一剖視圖;圖10是類似於圖9的一剖視圖,說明一面板抵壓於功能件上;圖11是本新型可攜式電子裝置的機殼的一第二實施例的一不完整前視圖,說明結合層形成於殼件的一外周面;及圖12是本新型可攜式電子裝置的機殼的一第三實施例的一不完整前視圖,說明四個結合層分別形成於殼件的四個角面部,以及四個功能件分別結合於該等結合層。 Other features and functions of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Figure 1 is a step process of a manufacturing method of a casing of a portable electronic device according to a first embodiment of the present invention. Figure; Figure 2 is a perspective view of a shell of the first embodiment; Figure 3 is a front view of the shell of the first embodiment; Figure 4 is a cross-sectional view taken along line IV-IV in Figure 3; Figure 5 is a front view of the shell and a bonding layer of the first embodiment, illustrating that the bonding layer is formed on a bearing surface of the shell; Figure 6 is a cross-sectional view taken along line VI-VI in Figure 5; Figure 7 is a cross-sectional view similar to Figure 6, illustrating that one layer of the bonding layer is transformed into a modified surface through surface modification; Figure 8 is a front view of the shell and a functional component of the first embodiment, illustrating the functional component Modified surface formed on the bonding layer; Figure 9 is a cross-sectional view taken along line IX-IX in Figure 8; Figure 10 is a cross-sectional view similar to Figure 9, illustrating a panel pressed against the functional component; Figure 11 is an incomplete front view of a second embodiment of the casing of the new portable electronic device, illustrating that the bonding layer is formed on an outer peripheral surface of the casing; and Figure 12 is a casing of the new portable electronic device An incomplete front view of the third embodiment illustrates that four bonding layers are respectively formed on the four corner surfaces of the shell, and four functional components are respectively bonded to the bonding layers.
在本新型被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。 Before the present invention is described in detail, it should be noted that similar elements are represented by the same numbers in the following description.
參閱圖1,本新型可攜式電子裝置的機殼的一第一實施例的製造方法的一步驟流程圖,包含下述步驟:步驟S1:提供殼件、 步驟S2:形成結合層於殼件的接合面、步驟S3:對結合層進行表面改質,及步驟S4:提供功能件使其經由結合層結合於殼件。 Referring to Figure 1, there is a step flow chart of a manufacturing method of a first embodiment of a casing of a new portable electronic device, including the following steps: Step S1: providing a casing; Step S2: forming a bonding layer on the bonding surface of the shell, step S3: performing surface modification on the bonding layer, and step S4: providing a functional component to be bonded to the shell via the bonding layer.
參閱圖1、圖2、圖3及圖4,在步驟S1中,提供一殼件1。殼件1包括一基壁11、一圍繞壁12,及一承載壁13。基壁11例如呈長壁形。圍繞壁12形成於基壁11外周緣且具有一內周面121,及相反於內周面121的一外周面122。外周面122呈圍繞封閉狀並具有四個彼此相間隔的角面部123。在本第一實施例中,每一個角面部123是以一弧形曲面為例,但不以此為限。每一個角面部123也可以是一L型直角面。承載壁13由圍繞壁12的內周面121向內延伸並與基壁11相間隔。承載壁13呈圍繞封閉狀並具有相反於基壁11的一承載面131。承載面131呈圍繞封閉狀且連接於內周面121。在本第一實施例中,承載壁13的承載面131為一接合面,接合面位於殼件1的內周面121。
Referring to Figures 1, 2, 3 and 4, in step S1, a
參閱圖1、圖5及圖6,在步驟S2中,形成一結合層2於殼件1的承載面131。結合層2含有一化學元素的材料。結合層2具有相反於承載面131的一層面21。由於承載面131呈圍繞封閉狀,因此,形成於承載面131的結合層2也呈圍繞封閉狀。在本第一實施例中,該化學元素是以矽(Si)為例但不以此為限。結合層2包含矽或是二氧化矽(SiO2)且通過例如物理氣相沉積(PVD)、化學氣相沉積(CVD)或塗佈法的方式鍍在殼件1的承載面131。殼件1是由可以鍍
上含有該化學元素的材料所製成,例如可由金屬材質所製成但不以此為限。
Referring to FIG. 1 , FIG. 5 and FIG. 6 , in step S2 , a
參閱圖1、圖6及圖7,在步驟S3中,對結合層2的層面21進行表面改質,使層面21轉變為一改質面22。結合層2的層面21例如可通過氧離子處理、紫外線或電漿等方式進行表面改質進而轉變為改質面22。
Referring to FIG. 1 , FIG. 6 and FIG. 7 , in step S3 , surface modification is performed on the
參閱圖1、圖8及圖9,在步驟S4中,提供一功能件3,功能件3由含有該化學元素的材料所製成。也就是說,功能件3與結合層2同樣都是由含有矽的材料所製成。將功能件3結合於結合層2的改質面22,使功能件3經由結合層2結合於殼件1。
Referring to Figures 1, 8 and 9, in step S4, a
在本第一實施例中,功能件3是例如由矽膠所製成,但不以此為限。具體而言,功能件3是由液態矽橡膠(LSR)所製成。此外,在本第一實施例中,是形成功能件3於結合層2的改質面22而使功能件3直接固定地結合於結合層2的改質面22。功能件3例如可通過熱壓貼合、射出成型或塗佈法等方式形成於結合層2的改質面22而直接結合於改質面22。當功能件3結合於結合層2的改質面22時,即完成一可攜式電子裝置的機殼100的製造。由於結合層2呈圍繞封閉狀,因此,形成於結合層2的功能件3也呈圍繞封閉狀。藉此,使得功能件3能起到作為一密封墊圈使用的功能。
In the first embodiment, the
結合層2通過例如物理氣相沉積(PVD)、化學氣相沉積
(CVD)或塗佈法的方式鍍在殼件1的承載面131上而形成薄膜的方式,使得結合層2能直接固定地結合於承載面131以提升結合的強度。由於物理氣相沉積的方式能一次性地在多達數百個的殼件1上各自鍍上結合層2,因此,製造速度快能大量生產製造並降低製造成本。此外,由於結合層2與功能件3同樣都是由含有該化學元素的材料所製成,因此,功能件3容易地結合於結合層2並且能夠穩固地固定在結合層2上,從而使得功能件3能通過結合層2穩固地結合固定於殼件1的承載面131。藉此,殼件1不需設計倒鉤或凹槽等抓料結構來提供功能件3包覆,能降低殼件1結構的設計複雜度及殼件1的製造成本。再者,藉由對結合層2進行表面改質使層面21(如圖6所示)轉變為改質面22的方式,能進一步地提升功能件3結合於結合層2的穩固性。
The
參閱圖10,當一面板4與可攜式電子裝置的機殼100的殼件1之間例如通過卡鉤與卡槽相互卡合的方式組裝固定在一起時,面板4會緊密地抵壓在功能件3上,使得功能件3起到密封的作用,以防止水或灰塵由外部環境滲透入殼件1與面板4所共同界定出的一內部空間內。由於功能件3是通過結合層2固定在承載面131上而非通過接觸方式抵壓在承載面131,因此,能有效地提升功能件3在殼件1與面板4之間的防水及防塵效果,還能避免功能件3在面板4與殼件1的組裝或拆卸的過程中由殼件1上脫落。
Referring to FIG. 10 , when a panel 4 and the
需說明的是,本第一實施例製造結合層2所用的材料是依據功能件3的材質來做選擇。也就是說,製成結合層2的材料中所含的該化學元素必需與功能件3的材質所含的該化學元素相同,如此才能使功能件3順利地結合於結合層2上。可以理解地,在本第一實施例的其他實施態樣中,製成功能件3及結合層2的材料中所含的該化學元素也可以是矽以外的化學元素,不以矽為限。
It should be noted that the material used to manufacture the
參閱圖11,本新型可攜式電子裝置的機殼的一第二實施例,其整體結構大致與第一實施例相同,不同處在於殼件1的接合面以及功能件3的功能及作用。
Referring to FIG. 11 , a second embodiment of the casing of the new portable electronic device is shown. Its overall structure is roughly the same as that of the first embodiment. The difference lies in the joint surface of the
在本第二實施例中,殼件1的圍繞壁12的外周面122為一接合面,也就是說,接合面位於殼件1的外周面122。結合層2形成於殼件1的外周面122。由於外周面122呈圍繞封閉狀,因此,形成於外周面122的結合層2以及形成於結合層2的功能件3也各自呈圍繞封閉狀。藉此,功能件3能起到作為一緩衝墊使用的功能,使得可攜式電子裝置的機殼100能達到防撞效果。由於功能件3是通過結合層2固定在殼件1的外周面122上,因此,當可攜式電子裝置落摔時,功能件3能確實地固定在殼件1而不會由殼件1上脫落,進而能確實地起到緩衝保護的作用以防止殼件1受損。
In the second embodiment, the outer
參閱圖12,本新型可攜式電子裝置的機殼的一第三實施例,其整體結構大致與第二實施例相同,不同處在於殼件1的接
合面,以及殼件1的接合面、結合層2與功能件3的數量。
Referring to Figure 12, a third embodiment of the casing of the new portable electronic device is shown. Its overall structure is roughly the same as that of the second embodiment. The difference lies in the connection of the
在本第三實施例中,殼件1的外周面122的每一個角面部123為一接合面。在步驟S2(如圖1所示)中,分別形成四個結合層2於殼件1的外周面122的該等角面部123。在步驟S4(如圖1所示)中,提供四個功能件3並且將其分別結合於該等結合層2。由於每一個角面部123呈弧形,因此,形成於每一個角面部123的對應結合層2以及形成於每一個結合層2的對應功能件3也各自呈弧形。藉此,功能件3能起到作為一緩衝墊使用的功能,使得可攜式電子裝置的機殼100能達到防撞效果。由於每一個功能件3是通過對應結合層2固定在殼件1的對應角面部123上,因此,不需要額外通過一外殼罩住殼件1及該等功能件3而將該等功能件3固定在殼件1上。藉此,能省略外殼的使用成本,還能使可攜式電子裝置薄型化。
In the third embodiment, each
本第三實施例通過該等結合層2分別形成於該等角面部123,以及該等功能件3分別結合於該等結合層2的方式,與第二實施例相較下能節省結合層2及功能件3的使用量,從而能降低可攜式電子裝置的機殼100的製造成本。
In the third embodiment, the bonding layers 2 are formed on the
綜上所述,各實施例的可攜式電子裝置的機殼100,製造速度快並能大量生產製造。此外,功能件3能通過結合層2穩固地固定在殼件1的接合面上,使得功能件3不會由殼件1上脫落,故確實能達成本新型之目的。
In summary, the
惟以上所述者,僅為本新型之實施例而已,當不能以此限定本新型實施之範圍,凡是依本新型申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本新型專利涵蓋之範圍內。 However, the above are only examples of the present invention, and should not be used to limit the scope of the present invention. All simple equivalent changes and modifications made based on the patent scope of the present invention and the content of the patent specification are still within the scope of the present invention. Within the scope covered by this new patent.
100:可攜式電子裝置的機殼 100:Cases of portable electronic devices
1:殼件 1: Shell parts
13:承載壁 13: Bearing wall
131:承載面 131: Bearing surface
2:結合層 2: Bonding layer
22:改質面 22: Modified surface
3:功能件 3: Functional parts
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112211397U TWM650917U (en) | 2023-10-23 | 2023-10-23 | Case of portable electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112211397U TWM650917U (en) | 2023-10-23 | 2023-10-23 | Case of portable electronic device |
Publications (1)
Publication Number | Publication Date |
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TWM650917U true TWM650917U (en) | 2024-01-21 |
Family
ID=90456403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW112211397U TWM650917U (en) | 2023-10-23 | 2023-10-23 | Case of portable electronic device |
Country Status (1)
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TW (1) | TWM650917U (en) |
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2023
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