TWM650418U - Probe card structure - Google Patents

Abstract

A probe card structure includes a printed circuit board, a plurality of probes, a stiffener and a plurality of adjustments. The printed circuit board has a first surface and a second surface opposite the first surface; the probes are arranged on the first surface and are electrically connected with the printed circuit board; the stiffener is arranged on the second surface, and the stiffener has a peripheral area extending out of an outer peripheral edge of the printed circuit board; each of adjustments is set through the peripheral area, and each of the adjustments has an bottom end facing the printed circuit board, wherein the bottom end of at least one of the adjustments is adjusted toward the printed circuit board to protrude from the peripheral area. The probe card structure is suitable for placing on a supporting seat with the stiffener, and at least one side of the stiffener with printed circuit board is biased away from the supporting seat by the bottom end of one of the adjustments protruding from the peripheral area and abutting against the supporting seat. Then the overall horizontality of the tips of the probes can be adjusted.

Description

Probe card structure

The invention relates to a probe card structure, in particular to a probe card structure with adjustable horizontality.

Testing on integrated circuits is mainly used to detect and isolate defective devices in the previous manufacturing stage; generally before the dicing (singleization) process, probe cards are used to test the integrated circuits on the wafer. Conducting electrical testing is called chip probe. Probe cards mainly include test heads. Among the types of test heads, cantilever probe test heads are widely used by allowing the probe to protrude from a device under test like a fishing rod.

As the number of devices under test (DUT) on the device under test increases, the size of the probe card needs to increase accordingly. Since the size of the probe card becomes larger and larger, it is difficult to control the level of the probe card. How to make the probe card have a horizontal adjustment mechanism is also what the industry is currently pursuing.

This invention provides a probe card structure that can adjust the level of the printed circuit board and the probe on the support base, which is helpful for electrical testing of the integrated circuit on the wafer.

The probe card structure provided by this invention includes a circuit board, a plurality of probes, a reinforcing ring and at least three adjustment members; the circuit board has a first surface and a second surface opposite each other; a plurality of probes are arranged on the first surface, and is electrically connected to the circuit board; the reinforcing ring is disposed on the second surface, and the reinforcing ring has a peripheral area, and the peripheral area extends out of the outer peripheral edge of the circuit board; at least three adjustment members are disposed in the peripheral area, and each adjustment member has a resistance The stop end faces the circuit board, wherein the stop end of at least one of the at least three adjustment members is adapted to be adjusted toward the circuit board direction to protrude beyond the peripheral area.

In one embodiment of the present invention, the reinforcing ring is suitable for being placed on the support base, with the stop end protruding from the peripheral area and abutting against the support base, so that at least one side of the reinforcing ring is directed away from the support base. offset.

In an embodiment of the present invention, the probe card structure further includes a plurality of conductive lines disposed on the first surface to electrically connect the plurality of probes and the circuit board.

In an embodiment of the present invention, the probe includes a cantilever probe.

In an embodiment of the present invention, the adjustment member is provided with a screw.

In an embodiment of the present invention, the adjusting members are evenly distributed in the peripheral area.

In an embodiment of the present invention, the reinforcing ring includes an inner ring part and an outer ring part arranged concentrically, and a plurality of reinforcing ribs connecting the inner ring part and the outer ring part.

In an embodiment of the present invention, the adjusting member is disposed through the outer ring portion.

In this invention, a plurality of adjusting members are provided in the peripheral area of the reinforcing ring of the probe card structure. With the stop ends of the adjusting members protruding from the peripheral area and abutting against the support base where the probe card structure is placed, the reinforcing ring is at least One side is offset in a direction away from the support base, so that through the offset of the reinforcing ring and the circuit board to which the plurality of probes are fixed, the overall level of the tips of the plurality of probes can be adjusted.

In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, embodiments are given below and explained in detail in conjunction with the attached drawings.

Figure 1 is a schematic cross-sectional view of the structure of a probe card according to an embodiment of the present invention; Figure 2 is a schematic bottom view of the structure of a probe card according to an embodiment of the present invention; Figure 3 is a schematic top view of the structure of a probe card according to an embodiment of the present invention, wherein Figure 1 shows a cross-section along line AA' of the probe card structure shown in Figure 3. As shown in FIGS. 1 to 3 , the probe card structure 10 includes a circuit board 12 , a plurality of probes 16 , a reinforcing ring 14 and at least three adjusting members 20 . The circuit board 12 has an opposite first surface 121 and a second surface. 122; A plurality of probes 16 are disposed on the first surface 121 and are electrically connected to the circuit board 12. In one embodiment, the plurality of probes 16 are, for example, cantilever probes; the reinforcing ring 14 is disposed on the second surface 122 , the reinforcing ring 14 has a peripheral area 141 , and the peripheral area 141 extends out of the outer periphery of the circuit board 12 ; at least Three adjustment members 20 are disposed in the peripheral area 141 , and each adjustment member 20 has a stop end 22 facing the circuit board 12 , wherein the stop end 22 of at least one of the adjustment members 20 is adapted to be moved toward the circuit board 12 . Adjust to protrude from the peripheral area 141. In one embodiment, the adjusting member 20 is, for example, a stop screw, preferably a hexagonal stop screw.

Continuing with the above description, specifically, as shown in FIG. 2 , a plurality of probes 16 and a plurality of conductive lines 18 are provided on the first surface 121 of the circuit board 12 . The plurality of probes 16 are electrically connected via a plurality of conductive lines 18 . Connect to circuit board 12. In one embodiment, a positioning base 11 is further provided on the first surface 121. A plurality of probes 16 are disposed on the positioning base 11 and the tips of the probes 16 protrude from the positioning base 11 to facilitate contact with the wafer, and The plurality of probes 16 can be electrically connected to the plurality of conductive lines 18 through the positioning base 11 , so that the probes 16 can be electrically connected to the circuit board 12 through the conductive lines 18 . In one embodiment, the material of the positioning base 11 is, for example, ceramic. In addition, the number of the at least three adjusting members 20 is, for example, four, and they are evenly distributed in the peripheral area 141 .

Furthermore, as shown in FIG. 3 , the reinforcing ring 14 may include, for example, an inner ring part 143 and an outer ring part 142 arranged concentrically, and a plurality of reinforcing ribs 144 connecting the inner ring part 143 and the outer ring part 142 . In one embodiment, the outer ring portion 142 can serve as the peripheral area 141 of the reinforcing ring 14. When the reinforcing ring 14 is disposed on the second surface 122 of the circuit board 12, the outer ring portion 142 can extend out of the outer periphery of the circuit board 12. And the adjusting member 20 (marked in FIG. 1 ) is inserted through the outer ring portion 142 , for example. In one embodiment, a plurality of adjusting members 20 are evenly distributed through the outer ring portion 142. In Figure 3, the number of adjusting members is 4, and the separation angle θ1 of any two adjacent adjusting members 20 is 90 degrees is used as an example, but is not limited thereto. Figure 4 is a top view of a probe card structure according to another embodiment of the present invention. In the probe card structure 10A, the number of adjusting members 20 provided on the outer ring portion 142 is 3. , and the separation angle θ2 between any two adjacent adjusting members 20 is 120 degrees.

Figure 5 is a schematic diagram of the application of the probe card structure according to an embodiment of the present invention. As shown in the figure, the probe card structure 10 is placed on the support base 30 of the inspection platform for detecting the wafer (not shown in the figure). Integrated circuits are electrically tested (ie, chip probe). Before performing wafer probing, in order to ensure that the tips of the multiple probes 16 of the probe card structure 10 are maintained at the same level, the overall level of the entire probe card structure 10 relative to the support base 30 needs to be adjusted first. In one embodiment, the probe card structure 10 is placed on the support base 30 through the reinforcing ring 14, and the first surface 121 of the circuit board 12 and the probe 16 are facing downward. Multiple optical measurements can be performed first. The levelness of the tip of the probe 16. When the highest and lowest points of the tip of the probe 16 exceed the allowable range, the adjustment member 20 on the reinforcing ring 14 can be used to fine-tune the highest and lowest points of the tip of the probe 16. point position difference.

For example, on the lower side of the overall probe 16 tip, adjust the adjusting member 20 passing through the peripheral area 141 on this side toward the circuit board 12 so that the stop end 22 of the adjusting member 20 protrudes from the peripheral edge. area 141 and resists the support base 30, thereby causing one side of the adjustment member 20 to shift away from the support base 30, for example, in the direction shown by the arrow 40 in Figure 5, that is, along with the When an adjustment member 20 continues downward to protrude from the peripheral area 141 and abut against the support base 30 , the reinforcing ring 14 and one side of the circuit board 12 are deflected upward, so that the probe 16 originally located on the lower side of the horizontal position Due to the upward deflection of the circuit board 12 , the circuit board 12 can move upward, so that the overall level of the tip of the probe 16 can be adjusted.

Among them, after correction, taking the horizontal coordinate line position 0 as the reference line, the allowable range from the highest point to the lowest point of the level of the probe 16 is ±0.3 mil. If the lowest point of the tip of the probe 16 is -0.3 mil and the highest point of the tip of the probe 16 is +0.6 mil, fine adjustment can be made through the adjustment piece 20 on the reinforcing ring 14 so that the highest point of the tip of the probe 16 and The gap at the lowest point is reduced. For example, by shifting one side of the adjusting member 20 away from the support base 30 , the adjusted lowest point of the tip of the probe 16 is -0.1 mil, and the highest point of the tip of the probe 16 is +0.3. mil, so that the highest point and the lowest point of the tip of probe 16 fall within the allowable range. In this way, the overall level of the probe 16 can be adjusted.

Based on the above, the probe card structure of an embodiment of the present invention is provided with a plurality of adjusting members through the peripheral area of the reinforcing ring to adjust the level of the probe card structure. Among them, by the stop end of at least one adjusting member protruding from the peripheral area and abutting against the support base, the side to which the adjusting member is fixed is deflected in a direction away from the support base, and is fixed together with the reinforcing ring. The offset of a circuit board with multiple probes allows the overall leveling of the probe tips to be adjusted. In this way, as the number of devices under test (DUT) on the device under test (such as a wafer) increases, and the structural size of the probe card needs to increase accordingly, the levelness of the probe can still be obtained. adjustment to facilitate wafer probing.

Although the present invention has been disclosed as above in the form of embodiments, they are not intended to limit the invention. Those with ordinary knowledge in the technical field to which this invention belongs may make slight changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of protection of this invention shall be determined by the appended patent application scope.

10, 10A: Probe card structure 11: Positioning the base body 12:Circuit board 121: First surface 122: Second surface 14: Reinforcement ring 141:Peripheral area 142: Outer ring part 143:Inner ring part 144: Reinforced ribs 16:Probe 18: Conductive lines 20:Adjustment parts 22:stop end 30: Support base 40:Arrow θ1, θ2: separation angle

Figure 1 is a schematic cross-sectional view of the structure of a probe card according to an embodiment of the present invention. Figure 2 is a schematic bottom view of the structure of a probe card according to an embodiment of the present invention. Figure 3 is a schematic top view of the structure of a probe card according to an embodiment of the present invention. Figure 4 is a schematic top view of the structure of a probe card according to another embodiment of the present invention. Figure 5 is a schematic diagram of the application of the probe card structure according to an embodiment of the present invention.

10:Probe card structure

12:Circuit board

121: First surface

122: Second surface

14: Reinforcement ring

141:Peripheral area

16:Probe

20:Adjustment parts

22:stop end

Claims (8)

A probe card structure containing: A circuit board having a first surface and a second surface opposite to each other; A plurality of probes are provided on the first surface and are electrically connected to the circuit board; A reinforcing ring is provided on the second surface, and the reinforcing ring has a peripheral area that extends out of an outer peripheral edge of the circuit board; and At least three adjustment members are disposed through the peripheral area, and each of the at least three adjustment members has a stop end facing the circuit board, wherein the stop end of at least one of the at least three adjustment members is adapted to be moved toward the circuit board. The direction of the circuit board is adjusted to protrude from the peripheral area. The probe card structure as claimed in claim 1, wherein the reinforcing ring is adapted to be placed on a support base, with the stop end protruding from the peripheral area and abutting against the support base, so that the reinforcing ring is At least one side is offset away from the support base. The probe card structure of claim 1 further includes a plurality of conductive lines disposed on the first surface to electrically connect the probes and the circuit board. The probe card structure as claimed in claim 1, wherein the probes include cantilever probes. The probe card structure as claimed in claim 1, wherein the at least three adjustment members are secured with screws. The probe card structure as claimed in claim 1, wherein the at least three adjustment members are evenly distributed in the peripheral area. The probe card structure of claim 1, wherein the reinforcing ring includes an inner ring part and an outer ring part arranged concentrically, and a plurality of reinforcing ribs connecting the inner ring part and the outer ring part. The probe card structure as claimed in claim 7, wherein the at least three adjustment members are penetrated through the outer ring part.

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