TWM648990U - Laser welding apparatus capable of adjusting welding target - Google Patents
Laser welding apparatus capable of adjusting welding target Download PDFInfo
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Abstract
本創作的可調整焊接目標的焊接設備包括一工作台、一拾取頭及一焊接裝置。工作台用以承載一電路基板。電路基板包括間隔排列的多個像素。拾取頭設置於工作台,且可相對工作台移動,並用以轉置多個光電元件至電路基板的相對位置。焊接裝置設置於工作台,且包括一雷射源、一光調變器及一處理器。雷射源用以產生一主雷射光束。光調變器連接處理器,以調變主雷射光束。處理器依據一產品圖案控制光調變器在一目標範圍內投射多焊接光束至電路基板,以焊接多個像素的焊接位置及多個光電元件。產品圖案包括對應電路基板的多個像素的焊接位置。The welding equipment with adjustable welding target of this invention includes a workbench, a pick-up head and a welding device. The workbench is used to carry a circuit substrate. The circuit substrate includes a plurality of pixels arranged at intervals. The pickup head is disposed on the workbench and can move relative to the workbench, and is used to transfer the plurality of photoelectric components to relative positions on the circuit substrate. The welding device is installed on the workbench and includes a laser source, a light modulator and a processor. The laser source is used to generate a main laser beam. The light modulator is connected to the processor to modulate the main laser beam. The processor controls the light modulator to project multiple welding beams to the circuit substrate within a target range according to a product pattern to weld the welding positions of multiple pixels and multiple optoelectronic components. The product pattern includes welding positions corresponding to multiple pixels of the circuit substrate.
Description
本創作與焊接設備有關,特別是指一種可調整焊接目標的雷射焊接設備。This creation is related to welding equipment, specifically a laser welding equipment with an adjustable welding target.
微型光電元件組成像素的顯示器在生產過程中需要重複拾取、轉置及焊接等步驟來實現巨量或批量轉移,在這個生產過程中每一次重複的作業都需要耗費一段時間,而造成生產效率不佳。Displays with pixels composed of micro optoelectronic components need to repeat steps such as picking up, transposing and welding during the production process to achieve huge or batch transfers. In this production process, each repeated operation takes a period of time, resulting in low production efficiency. good.
其中,目前在巨量或批量轉移後的雷射焊接技術只能定焦且一次焊接一個。定焦表示雷射焦點固定,因此,在焊接時只能透過平台不斷地移動顯示器的電路基板(產品),來讓被焊接的像素位在雷射焦點位置。再者,當電路基板更換後,還需要人員需要經過多重的設定才能完成更換後電路基板的像素配置,而不利於量產。Among them, the current laser welding technology after mass or batch transfer can only be fixed-focus and welded one at a time. Fixed focus means that the laser focus is fixed. Therefore, during welding, the circuit board (product) of the display can only be continuously moved through the platform to position the pixels to be welded at the laser focus position. Furthermore, when the circuit substrate is replaced, personnel still need to go through multiple settings to complete the pixel configuration of the replaced circuit substrate, which is not conducive to mass production.
此外,對於需要修補的電路基板,其需要修補的像素位置是較散亂的,因此,目前的雷射焊接也只能一個一個修補,而不能單次對多個位置進行修補,這樣也會耗費較多的修補時間。In addition, for the circuit substrate that needs to be repaired, the pixel positions that need to be repaired are relatively scattered. Therefore, the current laser welding can only repair one by one, and cannot repair multiple positions at a time, which will also consume a lot of time. More patching time.
有鑑於上述缺失,本創作的可調整焊接目標的雷射焊接設備可以按照電路基板的像素配置關係來調整來進行焊接作業。此外,在修補作業時,雷射焊接設備可按照像素的位置分布調整焊接光束的投射位置,以進行單次多點的修補作業。In view of the above deficiencies, the laser welding equipment with adjustable welding target of this invention can be adjusted according to the pixel configuration relationship of the circuit substrate to perform welding operations. In addition, during repair operations, the laser welding equipment can adjust the projection position of the welding beam according to the position distribution of the pixels to perform a single multi-point repair operation.
為了達成上述目的,本創作的可調整焊接目標的雷射焊接設備包括一工作台、一拾取頭及一焊接裝置。工作台用以承載一電路基板。電路基板包括間隔排列的多個像素。多個像素的每一者包括一焊接位置。拾取頭設置於工作台,且可相對工作台移動,並具有一拾取範圍。拾取範圍用以轉置多個光電元件至電路基板的相對位置。多個光電元件對應多個像素的焊接位置。焊接裝置設置於工作台,且包括一雷射源、一光調變器及一處理器。雷射源用以產生一主雷射光束。光調變器連接處理器,且用以接收主雷射光束。處理器用以依據一產品圖案控制光調變器在一目標範圍內投射多焊接光束至電路基板的對應範圍,以使與多焊接光束作用的多個像素的焊接位置及多個光電元件形成焊接。產品圖案包括對應電路基板的多個像素的焊接位置。In order to achieve the above purpose, the laser welding equipment with adjustable welding target of the present invention includes a workbench, a pick-up head and a welding device. The workbench is used to carry a circuit substrate. The circuit substrate includes a plurality of pixels arranged at intervals. Each of the plurality of pixels includes a welding location. The pick-up head is arranged on the workbench, can move relative to the workbench, and has a pick-up range. The pick-up range is used to transpose a plurality of optoelectronic components to relative positions on the circuit substrate. Multiple photoelectric elements correspond to the welding positions of multiple pixels. The welding device is installed on the workbench and includes a laser source, a light modulator and a processor. The laser source is used to generate a main laser beam. The light modulator is connected to the processor and used to receive the main laser beam. The processor is used to control the light modulator to project multiple welding beams within a target range to a corresponding range of the circuit substrate according to a product pattern, so that the welding positions of the multiple pixels and the multiple optoelectronic components acted upon by the multiple welding beams are welded. The product pattern includes welding positions corresponding to multiple pixels of the circuit substrate.
如此,本創作的可調整焊接目標的雷射焊接設備的處理器可以透過產品圖案來規劃光調變器投射的多焊接光束,以正確地作用在目標像素的焊接位置,來滿足更換電路基板及修補作業。In this way, the processor of the adjustable welding target laser welding equipment of this invention can plan the multiple welding beams projected by the light modulator through the product pattern to correctly act on the welding position of the target pixel to meet the needs of replacing circuit substrates and Repair work.
有關本創作所提供之可調整焊接目標的雷射焊接設備的詳細構造或特點,將於後續的實施方式詳細說明中予以描述。然而,本領域技術人員應能瞭解,該詳細說明以及實施本創作所列舉的特定實施例,僅適用於說明本創作,並非用以限制本創作的申請專利範圍。The detailed structure or characteristics of the laser welding equipment with adjustable welding target provided by this invention will be described in the subsequent detailed description of the implementation. However, those skilled in the art should understand that the detailed description and the specific examples listed for implementing the present invention are only suitable for illustrating the present invention and are not intended to limit the patentable scope of the present invention.
申請人首先在此說明,於整篇說明書中,包括以下介紹的實施例以及申請專利範圍的請求項中,有關方向性的名詞皆以圖式中的方向為基準。其次,在以下將要介紹之實施例以及圖式中,相同之元件標號,代表相同或近似之元件或其結構特徵。The applicant would like to first explain that in the entire description, including the embodiments introduced below and the claims in the patent application scope, terms related to directionality are based on the direction in the drawings. Secondly, in the embodiments and drawings to be introduced below, the same component numbers represent the same or similar components or structural features.
如圖1所示,本創作的可調整焊接目標的雷射焊接設備10包括一工作台11、一拾取頭13、一焊接裝置15及一機器視覺裝置17。As shown in FIG. 1 , the
工作台11用以承載一電路基板30及一晶圓50。電路基板30包括支撐基材及形成在支撐基材上的多個像素31。支撐基材可以是玻璃或軟板等。多個像素31是間隔排列的導電線路。多個像素31的每一者包括三個焊接位置33、35、37,三個焊接位置33、35、37分別用以焊接對應顏色(例如紅、藍及綠)的光電元件,其他實施例中,焊接位置的數量可以較少或更多,較少例如一個,較多例如三個以上,以提供修補用的焊接位置。晶圓50包括多個光電元件51。The workbench 11 is used to carry a
拾取頭13設置於工作台11,且可相對工作台11移動,並具有一拾取範圍131。拾取範圍131用以轉置多個光電元件至電路基板30的相對位置。拾取頭13可以從晶圓50上拾取特定數量的光電元件51,數量取決於拾取頭13的能力。被拾取的光電元件51可以對應多個像素31,以讓拾取頭13將光電元件51轉置到電路基板30的相對位置或目標位置。The pick-
焊接裝置15設置於工作台11,且可相對工作台11移動,並用以透過焊接光束對轉置到電路基板30的光電元件51進行焊接。焊接裝置15相對工作台11移動可以透過龍門、滑軌或機械手臂等配置,以讓焊接裝置15移動至目標物位置。The
機器視覺裝置17設置於工作台11,且連接焊接裝置15,並用以依據該電路基板30的多個像素31的空間分布來形成一產品圖案,換言之,產品圖案包括對應多個像素31的焊接位置。焊接裝置15按照產品圖案中像素31的焊接位置33、35、37分布規劃目標範圍,目標範圍可以包括矩陣排列的多個像素31(如圖4所示)或散亂的多個像素31(如圖5所示)。The machine vision device 17 is disposed on the workbench 11 and connected to the
其他實施例中,當電路基板30的像素分布資訊是已知的,也就是已知產品圖案時,機器視覺裝置17是可以被省略,焊接裝置15可以直接使用產品圖案來規劃目標範圍。In other embodiments, when the pixel distribution information of the
如圖2所示,焊接裝置15包括一雷射源151、一光調變器153及一處理器155。雷射源151用以產生一主雷射光束,本實施例中,雷射源151包括一光源單元1511、一整形單元1513及一反射鏡1515。光源單元1511用以產生一雷射光束。整形單元1513用以接收雷射光束並整形成主雷射光束,整形單元1513例如光束整形器(Beam Shapers)。反射鏡1515用以將主雷射光束反射至光調變器153。光調變器153連接處理器155,且用以接收及調變主雷射光束,光調變器153例如數位微鏡裝置(Digital Microlens Device,DMD)。處理器155用以依據產品圖案獲得電路基板30的像素31的焊接位置33、35、37分布,且控制光調變器153在一目標範圍內投射多個焊接光束至電路基板30的對應範圍,以使與多焊接光束作用的像素的焊接位置及光電元件形成焊接。圖2中電路基板30是用以表示可以接收多焊接光束,而省略圖1中拾取頭與電路基板30的互動及電路基板30的像素。As shown in FIG. 2 , the
本實施例中,光束整形器將高斯分布的雷射光束整形為平頂分布的主雷射光束,使數位微鏡裝置的鏡片接收到相同能量密度的雷射,相同數位微鏡裝置是透過處理器155的輸出信號控制或驅動矩陣排列的微鏡片偏轉,而使主雷射光束產生多焊接光束投射至電路基板30的對應範圍。In this embodiment, the beam shaper shapes the Gaussian distributed laser beam into a flat-top distributed main laser beam, so that the lenses of the digital micromirror device receive lasers with the same energy density. The same digital micromirror device is processed through The output signal of the
如此,處理器155可依據產品圖案來動態調整焊接光束的數量及投射位置,而實現不需更換硬體零件的目的。In this way, the
如圖3所示,焊接裝置15a包括一雷射源151a、一光調變器153a、一處理器155a及一投射器157a。雷射源151a包括一光源單元1511a、一穩定器(ATT)1513a、一擴束器(expander)1515a及一反射鏡1517a。光源單元1511a用以產生一雷射光束。穩定器1513a接收雷射光束,以確保在低能量下有較好的雷射穩定度。擴束器1515a接收自穩定器1513a投射出來的雷射光束,以使雷射光束符合光調變器153a需要的光斑尺寸的主雷射光束。反射鏡1517a用以將主雷射光束反射給光調變器153a。光調變器153a例如空間光調製器(Spatial Light Modulator,SLM),用以接收主雷射光束,並可以對主雷射光束的相位、振幅、偏振等進行調製的元件。處理器155a連接光調變器153a,且用以依據產品圖案獲得電路基板的像素的焊接位置分布,並控制空間光調製器。As shown in Figure 3, the
本實施例中,處理器155a用以依據產品圖案控制光調變器153在目標範圍內投射多個焊接光束至電路基板30的對應範圍,以使與多焊接光束作用的像素的焊接位置及光電元件形成焊接。多個焊接光束的產生是透過處理器控制空間光調製器的液晶偏轉,來讓反射出多個焊接光束。In this embodiment, the
投射器157a包括一繼電器(relay)1571a及輸出單元1573a,繼電器1571a用以接收反射的多個焊接光束,並確實地傳遞至輸出單元1573a。輸出單元1573a用以將多個焊接光束投射至電路基板30的對應範圍。圖3中電路基板30是用以表示可以接收多焊接光束,而省略圖1中拾取頭與電路基板30的互動及電路基板30的像素。The
如此,處理器155a可依據產品圖案並透過電信號或光信號來控制空間光調製器,而達成動態調整焊接光束的數量及投射位置,且不需更換硬體零件的目的。In this way, the
目標範圍與拾取範圍有關,為了有效率的焊接一個批量的光電元件,因此,目標範圍內的需要被焊接的光電元件可以在單次中完成,而省去重複拾取、對位、轉置所耗費的時間。The target range is related to the pickup range. In order to efficiently weld a batch of optoelectronic components, the optoelectronic components that need to be welded within the target range can be completed in a single pass, eliminating the cost of repeated picking, alignment, and transposition. time.
透過上述說明可知本創作的雷射焊接設備可以實現動態或較有彈性地產生多焊接光束,隨後說明多焊接光束在目標範圍內的投射態樣。From the above description, it can be seen that the laser welding equipment of the present invention can dynamically or flexibly generate multiple welding beams. Next, the projection pattern of the multiple welding beams within the target range will be described.
如圖4所示,拾取頭13的拾取範圍131可以拾取2*2個光電元件51,在轉置於電路基板30上時,光電元件51與四個像素31的焊接位置33連接。處理器依據電路基板30的產品圖案及拾取頭13的拾取範圍來定義目標範圍A,因此,處理器可控制光調變器產生四焊接光束來讓焊接位置33與光電元件51焊接在一起。As shown in FIG. 4 , the
如圖5所示,相較於圖4,處理器155可控制光調變器散亂排列的雷射光束,來滿足散亂的焊接需求,例如修補。拾取頭13的拾取範圍131可以拾取3*3個光電元件51,在轉置於電路基板30上時,光電元件51與像素31的焊接位置35連接,圖中為了清楚顯示修補位置,因此,省略不需修補的光電元件51。本實施例是以修補為例,圖中有光電元件51的位置代表應修補的目標,且可發現焊接位置35是散亂的,處理器在已知目標後,可透過電路基板30的產品圖案來規劃目標範圍A,以讓焊接光束能正確的作用在目標的焊接位置35,如此,處理器透過控制光調變器產生對應的焊接光束來讓焊接位置35與光電元件51焊接在一起。As shown in FIG. 5 , compared to FIG. 4 , the
本創作的可調整焊接目標的雷射焊接設備可以透過焊接裝置的處理器來處理目標基板的產品圖案、影像或照片的資訊後辨別像素的焊接位置,並以此控制光調變器將主雷射光束調製成需要的多焊接光束,來正確地作用在目標像素的焊接位置,而實現可調整目標焊接的目的。The laser welding equipment with adjustable welding target of this invention can use the processor of the welding device to process the product pattern, image or photo information of the target substrate and then identify the welding position of the pixel, and thereby control the light modulator to adjust the main laser beam. The laser beam is modulated into the required multiple welding beams to correctly act on the welding position of the target pixel, thereby achieving the purpose of adjustable target welding.
最後,本創作於前揭實施例中所揭露的構成元件,僅為舉例說明,並非用以限制本創作之範圍,其他等效元件的替代或變化,亦應為本創作之申請專利範圍所涵蓋。Finally, the structural elements disclosed in the foregoing embodiments of this invention are only examples and are not intended to limit the scope of this invention. Substitutions or changes of other equivalent elements should also be covered by the patentable scope of this invention. .
10:雷射焊接設備10:Laser welding equipment
11:工作台11:Workbench
13:拾取頭13: Pickup head
131:拾取範圍131: Pickup range
15:焊接裝置15:Welding device
151:雷射源151:Laser source
1511:光源單元1511:Light source unit
1513:整形單元1513: Shaping unit
1515:反射鏡1515:Reflector
153:光調變器153:Light modulator
155:處理器155:Processor
17:機器視覺裝置17:Machine vision device
30:電路基板30:Circuit substrate
31:像素31:pixel
33,35,37:焊接位置33,35,37: welding position
50:晶圓50:wafer
51:光電元件51: Optoelectronic components
15a:焊接裝置15a:Welding device
151a:雷射源151a:Laser source
1511a:光源單元1511a:Light source unit
1513a:穩定器1513a: Stabilizer
1515a:擴束器1515a: Beam expander
1517a:反射鏡1517a: Reflector
153a:光調變器153a: Optical modulator
155a:處理器155a: Processor
157a:投射器157a: Projector
1571a:繼電器1571a:Relay
1573a:輸出單元1573a: Output unit
圖1是本創作的可調整焊接目標的雷射焊接設備的組成示意圖。
圖2是圖1中焊接裝置15的組成及焊接光束投射在電路基板的實施例的示意圖。
圖3是圖1中焊接裝置15的組成及焊接光束投射在電路基板的另一實施例的示意圖。
圖4是圖1中拾取頭轉置光電元件在電路基板上進行焊接的示意圖。
圖5是圖1中拾取頭轉置光電元件在電路基板上進行焊接的另一示意圖。
Figure 1 is a schematic diagram of the composition of the laser welding equipment with adjustable welding targets of this invention.
FIG. 2 is a schematic diagram of the composition of the
10:雷射焊接設備 10:Laser welding equipment
11:工作台 11:Workbench
13:拾取頭 13: Pickup head
131:拾取範圍 131: Pickup range
15:焊接裝置 15:Welding device
17:機器視覺裝置 17:Machine vision device
30:電路基板 30:Circuit substrate
31:像素 31:pixel
33,35,37:焊接位置 33,35,37: welding position
50:晶圓 50:wafer
51:光電元件 51: Optoelectronic components
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112208344U TWM648990U (en) | 2023-08-08 | 2023-08-08 | Laser welding apparatus capable of adjusting welding target |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112208344U TWM648990U (en) | 2023-08-08 | 2023-08-08 | Laser welding apparatus capable of adjusting welding target |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM648990U true TWM648990U (en) | 2023-12-01 |
Family
ID=90040222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112208344U TWM648990U (en) | 2023-08-08 | 2023-08-08 | Laser welding apparatus capable of adjusting welding target |
Country Status (1)
Country | Link |
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TW (1) | TWM648990U (en) |
-
2023
- 2023-08-08 TW TW112208344U patent/TWM648990U/en unknown
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