TWM648990U - Laser welding apparatus capable of adjusting welding target - Google Patents

Abstract

The welding equipment with adjustable welding target of this invention includes a workbench, a pick-up head and a welding device. The workbench is used to carry a circuit substrate. The circuit substrate includes a plurality of pixels arranged at intervals. The pickup head is disposed on the workbench and can move relative to the workbench, and is used to transfer the plurality of photoelectric components to relative positions on the circuit substrate. The welding device is installed on the workbench and includes a laser source, a light modulator and a processor. The laser source is used to generate a main laser beam. The light modulator is connected to the processor to modulate the main laser beam. The processor controls the light modulator to project multiple welding beams to the circuit substrate within a target range according to a product pattern to weld the welding positions of multiple pixels and multiple optoelectronic components. The product pattern includes welding positions corresponding to multiple pixels of the circuit substrate.

Description

Laser welding equipment with adjustable welding target

This creation is related to welding equipment, specifically a laser welding equipment with an adjustable welding target.

Displays with pixels composed of micro optoelectronic components need to repeat steps such as picking up, transposing and welding during the production process to achieve huge or batch transfers. In this production process, each repeated operation takes a period of time, resulting in low production efficiency. good.

Among them, the current laser welding technology after mass or batch transfer can only be fixed-focus and welded one at a time. Fixed focus means that the laser focus is fixed. Therefore, during welding, the circuit board (product) of the display can only be continuously moved through the platform to position the pixels to be welded at the laser focus position. Furthermore, when the circuit substrate is replaced, personnel still need to go through multiple settings to complete the pixel configuration of the replaced circuit substrate, which is not conducive to mass production.

In addition, for the circuit substrate that needs to be repaired, the pixel positions that need to be repaired are relatively scattered. Therefore, the current laser welding can only repair one by one, and cannot repair multiple positions at a time, which will also consume a lot of time. More patching time.

In view of the above deficiencies, the laser welding equipment with adjustable welding target of this invention can be adjusted according to the pixel configuration relationship of the circuit substrate to perform welding operations. In addition, during repair operations, the laser welding equipment can adjust the projection position of the welding beam according to the position distribution of the pixels to perform a single multi-point repair operation.

In order to achieve the above purpose, the laser welding equipment with adjustable welding target of the present invention includes a workbench, a pick-up head and a welding device. The workbench is used to carry a circuit substrate. The circuit substrate includes a plurality of pixels arranged at intervals. Each of the plurality of pixels includes a welding location. The pick-up head is arranged on the workbench, can move relative to the workbench, and has a pick-up range. The pick-up range is used to transpose a plurality of optoelectronic components to relative positions on the circuit substrate. Multiple photoelectric elements correspond to the welding positions of multiple pixels. The welding device is installed on the workbench and includes a laser source, a light modulator and a processor. The laser source is used to generate a main laser beam. The light modulator is connected to the processor and used to receive the main laser beam. The processor is used to control the light modulator to project multiple welding beams within a target range to a corresponding range of the circuit substrate according to a product pattern, so that the welding positions of the multiple pixels and the multiple optoelectronic components acted upon by the multiple welding beams are welded. The product pattern includes welding positions corresponding to multiple pixels of the circuit substrate.

In this way, the processor of the adjustable welding target laser welding equipment of this invention can plan the multiple welding beams projected by the light modulator through the product pattern to correctly act on the welding position of the target pixel to meet the needs of replacing circuit substrates and Repair work.

The detailed structure or characteristics of the laser welding equipment with adjustable welding target provided by this invention will be described in the subsequent detailed description of the implementation. However, those skilled in the art should understand that the detailed description and the specific examples listed for implementing the present invention are only suitable for illustrating the present invention and are not intended to limit the patentable scope of the present invention.

The applicant would like to first explain that in the entire description, including the embodiments introduced below and the claims in the patent application scope, terms related to directionality are based on the direction in the drawings. Secondly, in the embodiments and drawings to be introduced below, the same component numbers represent the same or similar components or structural features.

As shown in FIG. 1 , the laser welding equipment 10 with adjustable welding target of the present invention includes a workbench 11 , a pick-up head 13 , a welding device 15 and a machine vision device 17 .

The workbench 11 is used to carry a circuit substrate 30 and a wafer 50 . The circuit substrate 30 includes a supporting base material and a plurality of pixels 31 formed on the supporting base material. The supporting substrate can be glass or soft board, etc. The plurality of pixels 31 are conductive lines arranged at intervals. Each of the plurality of pixels 31 includes three welding positions 33, 35, and 37. The three welding positions 33, 35, and 37 are respectively used to weld photoelectric elements of corresponding colors (such as red, blue, and green). In other embodiments, , the number of welding positions can be less or more, less such as one, more such as three or more, to provide welding positions for repair. Wafer 50 includes a plurality of optoelectronic elements 51 .

The pick-up head 13 is disposed on the workbench 11 and can move relative to the workbench 11 and has a pick-up range 131 . The pickup range 131 is used to transpose the plurality of photoelectric components to relative positions on the circuit substrate 30 . The pick-up head 13 can pick up a specific number of optoelectronic elements 51 from the wafer 50, the number depending on the capabilities of the pick-up head 13. The picked-up photoelectric element 51 may correspond to a plurality of pixels 31 , so that the pickup head 13 transposes the photoelectric element 51 to a relative position or a target position on the circuit substrate 30 .

The welding device 15 is disposed on the workbench 11 and can move relative to the workbench 11, and is used to weld the photoelectric component 51 transposed to the circuit substrate 30 through the welding beam. The welding device 15 can be moved relative to the workbench 11 through a gantry, a slide rail or a robotic arm, so that the welding device 15 can move to the target position.

The machine vision device 17 is disposed on the workbench 11 and connected to the welding device 15, and is used to form a product pattern according to the spatial distribution of the plurality of pixels 31 of the circuit substrate 30. In other words, the product pattern includes welding positions corresponding to the plurality of pixels 31. . The welding device 15 plans a target range according to the distribution of the welding positions 33, 35, and 37 of the pixels 31 in the product pattern. The target range may include multiple pixels 31 arranged in a matrix (as shown in Figure 4) or multiple scattered pixels 31 (such as As shown in Figure 5).

In other embodiments, when the pixel distribution information of the circuit substrate 30 is known, that is, the product pattern is known, the machine vision device 17 can be omitted, and the welding device 15 can directly use the product pattern to plan the target range.

As shown in FIG. 2 , the welding device 15 includes a laser source 151 , a light modulator 153 and a processor 155 . The laser source 151 is used to generate a main laser beam. In this embodiment, the laser source 151 includes a light source unit 1511, a shaping unit 1513 and a reflector 1515. The light source unit 1511 is used to generate a laser beam. The shaping unit 1513 is used to receive the laser beam and shape it into a main laser beam. The shaping unit 1513 is, for example, a beam shaper (Beam Shapers). The reflector 1515 is used to reflect the main laser beam to the light modulator 153 . The light modulator 153 is connected to the processor 155 and is used to receive and modulate the main laser beam. The light modulator 153 is, for example, a Digital Microlens Device (DMD). The processor 155 is used to obtain the distribution of welding positions 33, 35, and 37 of the pixels 31 of the circuit substrate 30 according to the product pattern, and control the light modulator 153 to project multiple welding beams within a target range to the corresponding range of the circuit substrate 30, So that the welding position of the pixel and the photoelectric element acting on the multiple welding beams are welded. The circuit substrate 30 in FIG. 2 is used to indicate that it can receive multiple welding beams, and the interaction between the pickup head and the circuit substrate 30 and the pixels of the circuit substrate 30 in FIG. 1 are omitted.

In this embodiment, the beam shaper shapes the Gaussian distributed laser beam into a flat-top distributed main laser beam, so that the lenses of the digital micromirror device receive lasers with the same energy density. The same digital micromirror device is processed through The output signal of the sensor 155 controls or drives the micro-mirrors arranged in a matrix to deflect, so that the main laser beam generates multiple welding beams and projects them to the corresponding range of the circuit substrate 30 .

In this way, the processor 155 can dynamically adjust the number and projection position of the welding beam according to the product pattern, thereby eliminating the need to replace hardware parts.

As shown in Figure 3, the welding device 15a includes a laser source 151a, a light modulator 153a, a processor 155a and a projector 157a. The laser source 151a includes a light source unit 1511a, a stabilizer (ATT) 1513a, an expander 1515a and a reflector 1517a. The light source unit 1511a is used to generate a laser beam. The stabilizer 1513a receives the laser beam to ensure better laser stability under low energy. The beam expander 1515a receives the laser beam projected from the stabilizer 1513a, so that the laser beam conforms to the main laser beam with the spot size required by the light modulator 153a. The reflecting mirror 1517a is used to reflect the main laser beam to the light modulator 153a. The light modulator 153a is, for example, a spatial light modulator (SLM), which is an element used to receive the main laser beam and modulate the phase, amplitude, polarization, etc. of the main laser beam. The processor 155a is connected to the light modulator 153a, and is used to obtain the welding position distribution of the pixels of the circuit substrate according to the product pattern, and control the spatial light modulator.

In this embodiment, the processor 155a is used to control the light modulator 153 to project multiple welding beams within the target range to the corresponding range of the circuit substrate 30 according to the product pattern, so that the welding position and photoelectricity of the pixels acting on the multiple welding beams are Components are formed and soldered. Multiple welding beams are generated by controlling the liquid crystal deflection of the spatial light modulator through the processor to reflect multiple welding beams.

The projector 157a includes a relay 1571a and an output unit 1573a. The relay 1571a is used to receive a plurality of reflected welding beams and reliably transmit them to the output unit 1573a. The output unit 1573a is used to project a plurality of welding beams to corresponding areas of the circuit substrate 30 . The circuit substrate 30 in FIG. 3 is used to indicate that it can receive multiple welding beams, and the interaction between the pickup head and the circuit substrate 30 and the pixels of the circuit substrate 30 in FIG. 1 are omitted.

In this way, the processor 155a can control the spatial light modulator through electrical signals or optical signals according to the product pattern, thereby dynamically adjusting the quantity and projection position of the welding beam without replacing hardware parts.

The target range is related to the pickup range. In order to efficiently weld a batch of optoelectronic components, the optoelectronic components that need to be welded within the target range can be completed in a single pass, eliminating the cost of repeated picking, alignment, and transposition. time.

From the above description, it can be seen that the laser welding equipment of the present invention can dynamically or flexibly generate multiple welding beams. Next, the projection pattern of the multiple welding beams within the target range will be described.

As shown in FIG. 4 , the pickup range 131 of the pickup head 13 can pick up 2*2 photoelectric elements 51 . When placed on the circuit substrate 30 , the optoelectronic elements 51 are connected to the welding positions 33 of the four pixels 31 . The processor defines the target range A according to the product pattern of the circuit substrate 30 and the pickup range of the pickup head 13 . Therefore, the processor can control the light modulator to generate four welding beams to weld the welding position 33 and the optoelectronic component 51 together.

As shown in FIG. 5 , compared to FIG. 4 , the processor 155 can control the scattered laser beams of the light modulator to meet scattered welding requirements, such as repair. The pickup range 131 of the pickup head 13 can pick up 3*3 optoelectronic components 51. When placed on the circuit substrate 30, the optoelectronic components 51 are connected to the welding position 35 of the pixel 31. In order to clearly show the repair position in the figure, the repair position is omitted. Optoelectronic component 51 that does not require repair. This embodiment takes repair as an example. The position of the photoelectric element 51 in the figure represents the target that should be repaired. It can be found that the welding positions 35 are scattered. After knowing the target, the processor can pass through the product pattern of the circuit substrate 30 The target range A is planned so that the welding beam can correctly act on the target welding position 35. In this way, the processor controls the light modulator to generate a corresponding welding beam to weld the welding position 35 and the photoelectric element 51 together.

The laser welding equipment with adjustable welding target of this invention can use the processor of the welding device to process the product pattern, image or photo information of the target substrate and then identify the welding position of the pixel, and thereby control the light modulator to adjust the main laser beam. The laser beam is modulated into the required multiple welding beams to correctly act on the welding position of the target pixel, thereby achieving the purpose of adjustable target welding.

Finally, the structural elements disclosed in the foregoing embodiments of this invention are only examples and are not intended to limit the scope of this invention. Substitutions or changes of other equivalent elements should also be covered by the patentable scope of this invention. .

10:Laser welding equipment

11:Workbench

13: Pickup head

131: Pickup range

15:Welding device

151:Laser source

1511:Light source unit

1513: Shaping unit

1515:Reflector

153:Light modulator

155:Processor

17:Machine vision device

30:Circuit substrate

31:pixel

33,35,37: welding position

50:wafer

51: Optoelectronic components

15a:Welding device

151a:Laser source

1511a:Light source unit

1513a: Stabilizer

1515a: Beam expander

1517a: Reflector

153a: Optical modulator

155a: Processor

157a: Projector

1571a:Relay

1573a: Output unit

Figure 1 is a schematic diagram of the composition of the laser welding equipment with adjustable welding targets of this invention. FIG. 2 is a schematic diagram of the composition of the welding device 15 in FIG. 1 and an embodiment of the welding beam projected on the circuit substrate. FIG. 3 is a schematic diagram of another embodiment of the composition of the welding device 15 in FIG. 1 and the projection of the welding beam on the circuit substrate. FIG. 4 is a schematic diagram of the pick-up head in FIG. 1 transposing the optoelectronic component for welding on the circuit substrate. FIG. 5 is another schematic diagram of the pick-up head in FIG. 1 transposing the optoelectronic component for welding on the circuit substrate.

10:Laser welding equipment

11:Workbench

13: Pickup head

131: Pickup range

15:Welding device

17:Machine vision device

30:Circuit substrate

31:pixel

33,35,37: welding position

50:wafer

51: Optoelectronic components

Claims (5)

A laser welding equipment with adjustable welding target, including: A workbench for carrying a circuit substrate, the circuit substrate including a plurality of pixels arranged at intervals, each of the plurality of pixels including a soldering position; A pick-up head is disposed on the workbench and can move relative to the workbench, and has a pick-up range. The pick-up range is used to transpose a plurality of optoelectronic components to relative positions of the circuit substrate. The multiple optoelectronic components correspond to the Welding locations for multiple pixels; and A welding device is installed on the workbench and includes a laser source, an optical modulator and a processor. The laser source is used to generate a main laser beam. The optical modulator is connected to the processor, And used to receive the main laser beam, the processor is used to control the light modulator to project multiple welding beams within a target range to the corresponding range of the circuit substrate according to a product pattern, so that the multiple welding beams act on The welding positions of the plurality of pixels and the plurality of photoelectric elements are welded, and the product pattern includes welding positions corresponding to the plurality of pixels of the circuit substrate. The laser welding equipment with adjustable welding target as described in claim 1, wherein the processor obtains the welding position distribution of the plurality of pixels through the product pattern. The laser welding equipment with adjustable welding target as described in claim 1, wherein the target range is related to the pickup range of the pickup head. The laser welding equipment with adjustable welding target as described in claim 1 or 2 also includes a machine vision device, which is disposed on the workbench and connected to the processor, and is used to form a pattern based on multiple pixels of the circuit substrate. The product pattern. The laser welding equipment with adjustable welding target as claimed in claim 1, wherein the light modulator includes a spatial light modulator or a digital micromirror device.

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