TWM647139U - Cooling assembly and computer device - Google Patents

Abstract

A cooling assembly for liquid cooling of a heat-generating component such as a dual in-line memory module in a computer device is disclosed. The cooling assembly includes a bracket holding a micro-pipe assembly. The micro-pipe assembly has a cold manifold, a hot manifold and a series of micro-pipes. The micro-pipes are fluidly coupled between the cold manifold and hot manifold to allow coolant flow between the cold manifold and the hot manifold. The bracket positions the micro-pipe assembly such that micro-pipes are positioned proximate to opposite sides of the heat-generating component. A coolant inlet supplies coolant to the cold manifold and a coolant outlet collecting coolant from the hot manifold.

Description

Cooling components and computer equipment

The present disclosure generally relates to a liquid cooling system. More specifically, the present disclosure relates to a cooling plate assembly capable of liquid cooling an array of heat-generating components.

Electronic components such as servers include many electronic components powered by a universal power supply. Servers generate a lot of heat due to the operation of internal electronics such as controllers, processors, and memory modules. Overheating due to inefficient removal of this heat has the potential to shut down or impede the operation of such devices. Therefore, servers are designed to rely on airflow through the interior of the server to carry away the heat generated by the electronic components. Servers often include various heat sinks attached to electronic components such as processing units. Heat sinks absorb heat from electronic components, thereby transferring the heat away from the components. The heat from the radiator must be removed from the server. The airflow used to remove this heat is typically generated by a fan system including a series of fans.

As more powerful components become available, traditional air cooling combined with fan systems is not sufficient to adequately remove the heat generated by newer generations of components. For example, as next-generation processors such as central processing units (CPUs) or graphics processing units (GPUs) increase processing speed through high power consumption, traditional radiators combined with air cooling cannot meet the requirements. Thermal conduction requirements. This problem is also increasing in other heat-generating devices, such as dual in-line memory modules (DIMMs) and solid-state devices, such as those that are usually close to the processor and meet the U.2 or M.2 standard device.

Therefore, liquid cooling mechanisms have been developed for processors and other components that require better cooling in new server designs. Due to its superior thermal performance, liquid cooling is currently the accepted solution for rapid heat dissipation in this type of design. At room temperature, the heat transfer coefficient of air is only 0.024W/mK, while the heat transfer coefficient of coolant such as water is 0.58W/mK, which is 24 times that of air. Therefore, liquid cooling is more efficient at transferring heat from a heat source such as a server to an external heat sink, which can transfer heat from the coolant. Using liquid cooling effectively removes heat from critical components.

In the design of rack-level liquid cooling systems, closed loop cooling systems and open loop cooling systems are used to promote heat exchange. Known closed cycle cooling systems use heat exchange to cool hot water heated from a heat source such as a server. The heat is then removed from the hot water in the closed cycle cooling system through an open cycle cooling system, such as a radiator near the fan wall. Both components are typically mounted in a rack. A closed loop cooling system consists of a heat source (such as a server) and a heat exchanger. Liquid flow tubes carry coolant to the heat source. The heat generated by the heat source is transferred to the coolant. The liquid flow tube transports the heated liquid away from the heat source.

A series of servers are fixed to the rack. In each server, an inlet tube delivers coolant to one or more cooling plates, each of which is attached to a heat-generating electronic component, such as a processor chip. The cooling plate has a network of internal conduits or channels that circulate coolant inside the cooling plate. Each processor in a server may have a dedicated cooling plate or share a cooling plate with another processor. The heat generated by the processor is transferred to the cooling plate, which in turn is transferred to the coolant that circulates through the cooling plate. The outlet pipe carries the heated liquid away from the cooling plate.

However, while the cooling plate can effectively cool the processor die itself, other heat-generating components near the processor, such as DIMMs, may also require enhanced cooling. Such DIMMs are typically arranged in arrays, but because known cooling plates are not designed for DIMM arrays, it is difficult to employ an efficient liquid cooling mechanism. One solution is to use multiple pipes that are connected to allow liquid to flow in a structure tuned for the cooling requirements of such a device. However, such a design is complex and makes it difficult to access the DIMM when the DIMM needs to be replaced.

Therefore, there is a need for a liquid cooling mechanism dedicated to arrays of heat-generating devices. There is also a need for an array type liquid cooling device that makes the array of heating devices easy to service. There is also a need for a mechanism that enables ready-to-assemble liquid cooling systems for arrays of heat generating devices.

According to certain aspects of the present disclosure, an example cooling assembly for cooling a heat-generating component is disclosed. The cooling assembly includes a microtube assembly having a cold manifold, a hot manifold, a first microtube, and a second microtube. The first microtube and the second microtube are fluidly coupled between the cold manifold and the hot manifold to allow coolant to flow between the cold manifold and the hot manifold. The bracket positions the microtube assembly relative to the heat-generating component such that the first microtube and the second microtube are close to corresponding sides of the heat-generating component. The coolant inlet supplies coolant to the cold manifold. The coolant outlet collects coolant from the hot manifold.

A further implementation of an example cooling assembly includes a base member mounted on the floor of a chassis. The heating components are assembled on the circuit board. The circuit board is assembled on the base plate. The bracket is attached to the base member and extends over the circuit board. In some embodiments, the heat-generating component is a dual-in line memory module (DIMM). In some embodiments, the heat-generating component is a device that complies with at least one of the E.1S, U.2, or M.2 standards. In some embodiments, the bracket is rotatably attached to the base member. When the stent is rotated in the closed position, the first microtube and the second microtube are positioned near the heating component. When the stand is rotated to the open position, the heating components are accessible. In some embodiments, the DIMM is one of multiple DIMMs inserted into multiple parallel slots proximate the processor on the circuit board. In some embodiments, the first microtube and the second microtube are included in a plurality of microtubes, each of the microtubes being fluidly coupled between the cold manifold and the hot manifold to allow cooling fluid to flow between the cold manifold and the hot manifold. Flow between manifold and hot manifold. In some embodiments, the cooling assembly includes a cover coupled to the bracket. The cover body includes vertical fins inserted parallel to the heat-generating component to urge the first microtube to contact the heat-generating component. In some embodiments, the cover is rotatably attached to the bracket. In some embodiments, the cover slides into place on the bracket via alignment features.

According to certain aspects of the present disclosure, an example computer device is disclosed. The computer device includes a circuit board and a heat-generating computer device assembled on the circuit board. The microtube assembly has a cold manifold, a hot manifold, a first microtube, and a second microtube. The first microtube and the second microtube are fluidly coupled between the cold manifold and the hot manifold to allow coolant to flow between the cold manifold and the hot manifold. The bracket positions the microtube assembly relative to the heat-generating component such that the first microtube and the second microtube are close to corresponding sides of the heat-generating component. The coolant inlet supplies coolant to the cold manifold. The coolant outlet collects coolant from the hot manifold.

A further embodiment of an example computer device includes a base member mounted on the floor of a chassis. The heating components are assembled on the circuit board. The circuit board is assembled on the base plate. The bracket is attached to the base member and extends over the circuit board. In some embodiments, the heat-generating component is a DIMM. In some embodiments, the heat-generating component is a device that complies with at least one of the E.1S, U.2, or M.2 standards. In some embodiments, the bracket is rotatably attached to the base member. When the stent is rotated in the closed position, the first microtube and the second microtube are positioned near the heating component. When the stand is rotated to the open position, the heating components are accessible. In some embodiments, the DIMM is one of multiple DIMMs inserted into multiple parallel slots proximate the processor on the circuit board. In some embodiments, the first microtube and the second microtube are included in a plurality of microtubes, each of the microtubes being fluidly coupled between the cold manifold and the hot manifold to allow cooling fluid to flow between the cold manifold and the hot manifold. Flow between manifold and hot manifold. In some embodiments, a computer device includes a cover coupled to a stand. The cover body includes vertical fins inserted parallel to the heat-generating component to urge the first microtube to contact the heat-generating component. In some embodiments, the cover is rotatably attached to the bracket. In some embodiments, the cover slides into place on the bracket via alignment features.

This specification describes some embodiments with reference to the accompanying drawings, wherein the same drawing numbers are used throughout to indicate similar or equivalent elements. The drawings are not necessarily drawn to scale and are provided merely to illustrate aspects and features of the present disclosure. This specification sets forth many specific details, relationships, and methods in order to provide a thorough understanding of certain aspects and features of the disclosure, although one of ordinary skill in the art will recognize that these aspects and features may be absent without one or more specific details. through other relationships or other methods. In some instances, well-known structures or operations have not been shown in detail for purposes of illustration. Some embodiments disclosed herein are not necessarily limited to the sequence of actions or events illustrated, as some actions may occur in a different order and/or concurrently with other actions or events. Furthermore, not all illustrated actions or events may be required to implement certain aspects and features of the present disclosure.

For the purposes of this specification, unless expressly stated otherwise, the singular includes the plural and vice versa. The word "including" means "including without limitation". In addition, similar words such as "about", "almost", "substantially", "approximately", etc. may be used in this article, for example, to mean "at" ”, “near”, “nearly at”, “within 3-5% of” or “within acceptable manufacturing tolerances” ” or any logical combination thereof. Similarly, the terms "vertical" or "horizontal" are intended to include "within 3-5%" of the vertical or horizontal direction, respectively. In addition, directional terms such as "top," "bottom," "left," "right," "above," and "below" are intended to relate to the equivalent directions depicted in the referenced drawings. The object or element is understood contextually (e.g. from its usual location) or as described herein.

The present disclosure relates to a liquid cooling assembly that includes a cooling plate bracket with a microtube assembly for implementing an array of thermal support components such as a dual in-line memory module (DIMM). Liquid cooling. Example components include brackets mounted near the DIMM. The cooling plate holder is configured to rotate to the closed position, positioning the microtubes adjacent to the DIMM. The cooling plate holder can be rotated to the open position, allowing replacement/maintenance of the heating device without moving the microtubes. One aspect of the present disclosure relates to the rotation design of the cover between the cooling plate holder and the microtube assembly. The cover features parallel fins inserted between the microtubes to promote contact between the microtubes and the DIMM to maximize liquid cooling performance. Another aspect of the present disclosure concerns a sliding design of the cover that allows the cover to be guided downward to engage the cooling plate brackets and engage the parallel fins.

FIG. 1A is a cross-sectional perspective view of a computer device 100 such as an application server. In this example, the servers can be mounted in a rack with other servers, switches, and a liquid cooling system that provides liquid coolant to the servers in the rack. The principles here can be applied to other computer components, such as storage servers, application servers, storage devices, network switches, or other computer devices. Computer device 100 includes a chassis 110 , a circuit board such as a motherboard 112 , a processor 114 and a processor 116 . In this example, processor 114 and processor 116 are each plugged into a socket. The slots allow for the attachment of cooling devices, such as heat sinks or cooling plates bolted onto the respective processors 114 and 116 to allow for air cooling or liquid cooling of the processors 114 and 116 . The chassis 110 includes a base plate 120 assembled on the motherboard 112 . The chassis 110 includes side walls 122 and 124 . Cross member 126 extends across side walls 122 and 124 and passes between processors 114 and 116 . The cross members 126 may be inserted into the side walls 122 and 124 to facilitate removal or attached to the side walls 122 and 124 by screws or the like. In this example, chassis 110 is a 1U server chassis and therefore has a height of 1U (U stands for server unit, a unit of size for a server rack). However, the principles of the present disclosure may be applied to computer devices of different heights and sizes. Chassis 110 also holds support components such as power supplies, circuit boards, device cards, processors, memory devices, and other components.

Each socket of the processor 114 and the processor 116 is mounted on the motherboard 112 close to a double data rate (DDR) DIMM. The DIMM serves as a random access memory (RAM). Corresponding processors 114 and 116 are used. Therefore, there are parallel DIMM slot arrays 130 and slot arrays 132 on the sides of the processor 114 . In this example, slot array 130 and slot array 132 each include slots for twelve DIMMs 134 . Accordingly, flanking the processor 116 are a slot array 136 and a slot array 138 that include similar slots for twelve DIMMs 134 .

In this example, a cooling plate (not shown) may be attached to the wafer socket holding processor 114 so that the cooling plate is in thermal contact with the wafer of processor 114 . The cooling plate receives coolant from the supply connector. Heat is carried through the coolant to the collection connector. Similarly, a liquid cooling system also circulates coolant to remove heat generated by processor 114 .

In this example, computer device 100 is typically placed in a rack. The rack-mounted liquid cooling system has a cool coolant manifold and a hot coolant manifold. In this example, the rear of chassis 110 includes the main coolant inlet connector. The main coolant inlet connector can be connected to a fluid coupler of the cold coolant manifold. The fluid couplers of the cold coolant manifold distribute the coolant to the different cooling plates in the chassis 110 . The rear of the chassis 110 also includes a main coolant outlet connector. The main coolant outlet connector can be connected to the fluid coupler of the hot coolant manifold. The fluid coupler of the hot coolant manifold collects the heated coolant. Therefore, the chassis 110 may include an internal network of fluid tubes. A network of liquid lines circulates coolant received from the main coolant inlet connector to a bank of liquid cooling devices such as cooling plates. The liquid line network also collects heated coolant from the liquid cooling unit and returns the heated coolant to the main coolant outlet connector.

Liquid cooling systems typically include a heat exchanger that receives hot coolant from a hot coolant manifold. A heat exchanger typically includes a radiator that circulates hot coolant. The fan wall provides cooling of the coolant in the radiator so that heat from the heated coolant is transferred from the radiator to the ambient air. The cooled coolant is circulated from the radiator to the cold coolant manifold and again via the pump of the coolant distribution unit.

Although processors 114 and 116 generate significant amounts of heat, other heat-generating components such as DIMMs 134 may also benefit from liquid cooling. Accordingly, each DIMM 134 on socket array 130 , socket array 132 , socket array 136 , and socket array 138 may be liquid cooled by example cooling assembly 150 . The example cooling assembly 150 may rotate from the open position shown in Figure 1A to the closed position shown in Figure 1B. For clarity, only one cooling assembly 150 is shown on the DIMM 134 for the socket array 130 . Cooling assembly 150 provides liquid cooling through parallel microtubes positioned on corresponding sides of heat-generating components such as DIMM 134, as will be described in detail below.

The cooling assembly 150 in Figures 1A and 1B includes a support base 160, a cooling plate bracket 170 and a cover 180. Coolant is supplied to the coolant inlet of the cooling plate bracket 170 through an inlet hose 182 . Coolant flows through a set of microtubes supported by cooling plate brackets 170 to absorb heat from the DIMMs 134 in the socket array 130 . The cooling assembly 150 collects the heated coolant and returns the heated coolant through the hot coolant outlet hose 184 attached to the coolant outlet of the cooling plate bracket 170 . The cooling assembly 150 allows the cooling plate bracket 170 to rotate to the closed position shown in FIG. 1B with the microtubes inserted between the individual DIMMs 134 . The microtubes are in thermal contact with the DIMM 134 through downwardly extending fins attached to the cover 180 . Thus, in this example, the inlet hose 182 and the hot coolant outlet hose 184 are corrugated stainless steel elastic hoses that allow the cooling plate bracket 170 to rotate freely between the closed and open positions. The open position may allow the user to access the DIMM 134 at any time and allow the user to remove the DIMM from the slot or insert the DIMM into a slot in the slot array 130 .

Figure 2A is a close-up perspective view of cooling assembly 150 in a deployed position over DIMMs 134 in slot array 130. Figure 2B is a perspective view of the support base 160 and the cooling plate bracket 170. Components in Figures 2A and 2B are labeled with the same reference numerals as corresponding parts in Figures 1A and 1B. Support base 160 includes crossbars 210 . The crossbar 210 is attached to two downwardly extending parallel supports 212 and 214 . The support members 212 and 214 have corresponding tabs 216 and 218 . Tabs 216 and 218 allow insertion of latches to rotatably attach supports 212 and 214 to cooling plate bracket 170 . Ends of the support member 212 and the support member 214 opposite to the crossbar 210 include flanges 222 and 224 that are perpendicular to the support member 212 and the support member 214 respectively. Each of flanges 222 and 224 may include a hole therethrough. These holes allow the support base 160 to be attached to the base plate 120 of the chassis 110 on one side of the motherboard 112 via screws or bolts. Side supports 226 and 228 are attached to supports 212 and 214 .

FIG. 2C is a top view of the cooling plate bracket 170 . As shown in FIGS. 2A-2C , the cooling plate bracket 170 includes a support member 230 extending from a rectangular frame 232 . Frame 232 includes side walls 234, 236, front wall 238, and rear wall 240. Side walls 234, 236, front wall 238, and rear wall 240 are sized to allow frame 232 to surround slot array 130 and corresponding inserted DIMMs 134 in FIGS. 1A and 1B. A mounting flange 242 extends from the front wall 238 into the frame 232 . A mounting flange 244 extends from the rear wall 240 into the frame 232 . Support tabs 246 extend from the exterior of front wall 238 . Support tab 246 may have a hole. This hole allows the support tab 246 to be attached to the cross member 126 on the chassis 110 via releasable screws 248 to secure the cooling assembly 150 to the DIMM 134 .

Support member 230 includes a pair of extending arms 250 and 252 positioned parallel to each other. The ends of arms 250 and 252 have latches that can be inserted into holes in tabs 216 and 218 that are rotatably attached to support base 160 to allow cooling plate bracket 170 to rotate. The cooling plate bracket 170 can therefore be rotated to a closed position over the DIMM 134 as shown in Figure 1B. As will be explained, the cooling plate holder 170 supports the microtube assembly 270 . Microtube assembly 270 includes microtubes 276 that can be inserted between individual DIMMs 134 to allow coolant circulation when cooling plate bracket 170 is rotated to the closed position. The cooling plate bracket 170 can also be rotated away from the DIMM 134 to an open position, as shown in FIG. 1A , to allow the DIMM to be removed or inserted into a slot of the slot array 130 .

Figure 2D is a perspective view of microtubule assembly 270. Figure 2E is a side view of the microtubule assembly 270 along line segment EE' in Figure 2D. Figure 2F is a transverse cross-sectional view of the microtubule assembly 270 along line segment FF' in Figure 2D. Figure 2F depicts cross-sections of some microtubules 276. As shown in Figures 2D-2F, the microtube assembly 270 is rectangular in shape and attached to the mounting flanges 242 and 244 of the frame 232. Microtube assembly 270 is housed between side walls 234 , 236 , front 238 , and rear 240 of frame 232 .

Microtube assembly 270 includes a cold manifold 272 and a hot manifold 274 . The cold manifold 272 is adjacent the rear wall 240 of the frame 232 and attached to the mounting flange 244 . Cold manifold 272 receives coolant from inlet hose 182 . Thermal manifold 274 is adjacent to front wall 238 of frame 232 and attached to mounting flange 242 . A series of microtubes 276 are fluidly coupled between cold manifold 272 and hot manifold 274 . In this example, microtubes 276 are made of a heat-absorbing material such as copper or aluminum. As shown in inset 290 in Figure 2F, each microtube 276 in this example has a rectangular cross-section, with the sides of the cross-section being approximately the height of one DIMM 134. Each microtube 276 in this example has an internal width, such as 0.6 mm, and a wall thickness, such as 0.2 mm, to allow them to be inserted between DIMMs 134 .

Cooling plate bracket 170 positions microtube assembly 270 relative to DIMM 134 . In this manner, two microtubes 276 are positioned near respective opposite sides of each DIMM 134 . Microtubes 276 allow coolant to flow from cold manifold 272 and absorb heat generated from DIMM 134 over the relatively large side surfaces of microtubes 276 that are in thermal contact with DIMM 134 . The heated coolant is collected from microtubes 276 into thermal manifold 274 and flows out through outlet hose 184 .

Cooling assembly 150 enables a relatively close arrangement in socket array 130 , socket array 132 , socket array 136 , and socket array 138 for liquid cooling of DIMMs 134 . FIG. 3A is an exploded perspective view of the cooling assembly 150 relative to the chassis 110 . Figure 3B is a top view of the chassis 110 before the cooling assembly 150 is installed. 3C is a top view of the chassis 110 with the micropipe assembly 270 inserted over the DIMMs 134 inserted into the slot array 130 .

FIG. 4 is a cross-sectional side view of an example cooling assembly 150 installed on a DIMM 134 inserted into a slot of slot array 130 . Socket array 130 is attached to motherboard 112 proximate the processor sockets. Slot array 130 includes individual DIMM slots 410 . Each slot 410 allows an individual DIMM 134 to be inserted. When the cooling plate bracket 170 is rotated to the closed position, two microtubes 276 are positioned on both sides of the DIMM 134 . In this example, microtubes 276 are close to most of the height of DIMM 134 to maximize the effect of heat transfer to microtubes 276 . The width of each microtube 276 is narrow enough to allow the microtube 276 to be inserted into the gap between each DIMM 134 .

As described above, the cover 180 is inserted over the frame 232 of the cooling plate bracket 170 . Figure 5A is a side view of an example cooling assembly 150 with a first type cover 180. FIG. 5B is a cross-sectional view of an example cooling assembly 150 with cover 180 inserted over frame 232 . The cover 180 has a rectangular top plate 510 . The top panel 510 is attached to the side walls which may be inserted above the frame 232 . The interior of the top plate 510 has parallel fins 520 spaced apart so that they can be inserted between the microtubes 276 in the gaps between the DIMMs 134 . In this manner, as shown in inset 530 , when cover 180 is installed over frame 232 , fins 520 force microtubes 276 into contact with the sides of DIMM 134 to maximize contact, and therefore the effectiveness of heat transfer. In this example, cover 180 is rotatably coupled to frame 232 of cooling plate bracket 170 . Cover 180 can rotate away from frame 232 to provide user access to DIMM 134 . Cover 180 can be rotated into position to cover frame 232 and thereby insert fins 520 between DIMMs 134 in frame 232 .

Figure 6A is a close-up perspective view of an example cooling assembly 150 with a second type cover 610. 6B is a side view of the example cooling assembly 150 with the second type cover 610 removed from the cooling plate bracket 170 . FIG. 6C is a cross-sectional view of the example cooling assembly 150 with the second type cover 610 inserted over the microtube assembly 270 . The components of the cooling assembly 150 in Figures 6A-6C are labeled with the same reference numerals as the corresponding parts in Figures 1A-4.

Similar to the cover 180 in FIGS. 5A-5B , the cover 610 includes a top plate 620 . Top panel 620 has downwardly extending side walls 622 . Side walls 622 cover frame 232 . Each side wall 622 includes two slots 624 perpendicular to the top plate 620 . The interior of top plate 620 includes downwardly extending parallel fins 630 . As shown in inset 640, fins 630 are spaced apart to be interposed between microtubes 276 and DIMM 134 to urge microtubes 276 into contact with DIMM 134. In this example, the sides of frame 232 include alignment features (eg, latches 626). Each of the latches 626 can be inserted into a corresponding slot 624 in the sidewall 622 of the cover 610 . In this manner, the cover 610 can be lowered into position on the frame 232, guided by the latches 626 in the slots 624, as shown in Figure 6A.

Although the cooling assembly 150 is described above with respect to liquid cooling of DIMM arrays, the design of the cooling assembly 150 may be used with other types of heat-generating components that have a mostly rectangular shape that fit in a socket. center and oriented perpendicular to the board. The design of the example cooling assembly 150 may be applied to such heat-generating components arranged in an array of parallel slots. These devices may include solid state drive (SSD) storage devices in E.1S, M.2 or U.2 form factors.

Figure 7A is a top view of a computer system 700 incorporating the liquid cooling principles described above for another type of heat-generating component. Figure 7B is a side view of computer system 700. Computer system 700 includes a chassis 710 . Chassis 710 holds circuit boards for electronic components, such as motherboard 712 . Similar to the motherboard 112 in Figures 1A to 1B, the motherboard 712 includes components such as a processor, a memory module, a power supply, and a network interface.

In this example, one edge of motherboard 712 includes a series of slots 720 that allow heat-generating components to be inserted. In this example, the heat-generating component is a rectangular E.1S form factor storage device 722 . The storage devices 722 are inserted into corresponding slots 720 respectively. Storage device 722 provides permanent storage of data for computer system 700 .

An example liquid cooling assembly 750 may be inserted over multiple sets of heat-generating storage devices 722 . In this example, the example liquid cooling assembly 750 allows four storage devices 722 to be cooled. Liquid cooling assembly 750 includes a cold manifold 752 and a hot manifold 754 . As with cooling assembly 150 in FIGS. 1A-1B , the connector supplies coolant to cold manifold 752 . Hot coolant collects from the connector coupled to the hot manifold 754 . A series of microtubes 760 allow coolant to flow between cold manifold 752 and hot manifold 754 . The microtube 760 has a rectangular cross-section, and the sides of the cross-section overlap most of the sides of the storage device 722 . Therefore, each storage device 722 has microtubes 760 on each side. The heat generated from the storage device 722 is thus transferred to the coolant flowing through the microtubes 760 .

Although implementations of the present disclosure have been illustrated and described with respect to one or more embodiments, equivalent changes and modifications will occur or become known to those of ordinary skill in the art upon reading and understanding this specification and the accompanying drawings. . Furthermore, while a particular feature of the present invention may be disclosed with respect to only one of several embodiments, such feature may be combined with one or more other features of other embodiments, as may be desirable for any given or particular application. Desirable and beneficial.

100:Computer device 110:Chassis 112: Motherboard 114: Processor 116: Processor 120: Base plate 122:Side wall 124:Side wall 126:Horizontal member 130:Slot array 132:Slot array 134:Dual in-line memory module/DIMM 136:Slot array 138:Slot array 150:Cooling component 160:Support base 170:Cooling plate bracket 180: Cover 182:Inlet hose 184:Exit hose 210:Bar 212:Support 214:Support 216: tab 218: tab 222:Flange 224:Flange 226: Side support 228: Side support 230:Supporting members 232:Frame 234:Side wall 236:Side wall 238:Front wall 240:Rear wall 242: Assembly flange 244: Assembly flange 246:Support tab 248:Screw 250:arm 252:arm 270:Microtubule components 272:Cold manifold 274:Hot manifold 276:Microtubules 290:Illustrations 410:Slot 510:top plate 520:Fins 530:Illustrations 610: Cover 620:top plate 622:Side wall 624:Slot 626:Latch 630:Fins 640:Illustrations 700:Computer system 710:Chassis 712: Motherboard 720:Slot 722:Storage device 750: Liquid Cooling Components 752:Cold manifold 754:Hot manifold 760: Microtubules E-E': line segment F-F': line segment

The present disclosure and its advantages and drawings will be better understood from the following description of representative embodiments and with reference to the accompanying drawings. These drawings depict only representative embodiments and therefore should not be construed as limiting the scope of certain embodiments or the claims. Figure 1A is a perspective view of a computer system with an example liquid cooling system for cooling an array of heat-generating devices in accordance with certain aspects of the present disclosure. Figure 1B is a perspective view of the computer device of Figure 1A with the example liquid cooling system in a deployed position in accordance with certain aspects of the present disclosure. Figure 2A is a close-up perspective view of a cooling plate bracket of the example cooling assembly of Figure 1A in a deployed position in accordance with certain aspects of the present disclosure. Figure 2B is an isolated close-up perspective view of an example cooling assembly in accordance with certain aspects of the present disclosure; Figure 2C is a top view of a cooling plate bracket of the example cooling assembly of Figure 1A in accordance with certain aspects of the present disclosure. Figure 2D is a perspective view of a microtube assembly of a cooling plate holder in accordance with certain aspects of the present disclosure. Figure 2E is a side view of a microtube assembly of a cooling plate rack in accordance with certain aspects of the present disclosure. Figure 2F is a cross-sectional view of a microtube assembly of a cooling plate rack in accordance with certain aspects of the present disclosure. Figure 3A is an exploded perspective view of the microtube assembly relative to the chassis of the computer device of Figure 1A in accordance with certain aspects of the present disclosure. Figure 3B is a top view of a chassis before a microtube assembly is installed in accordance with certain aspects of the present disclosure. Figure 3C is a top view of a chassis of a computer device having micropipe assemblies mounted on a set of array devices in accordance with certain aspects of the present disclosure. Figure 4 is a cross-sectional view of the example cooling system of Figure 1A installed on an array of memory modules in an array of slots, in accordance with certain aspects of the present disclosure. Figure 5A is a side view of an example cooling assembly with a first type cover in an open position in accordance with certain aspects of the present disclosure. Figure 5B is a cross-sectional view of an example cooling assembly with a first type cover in accordance with certain aspects of the present disclosure. Figure 6A is a close-up perspective view of an example cooling assembly with a second type cover in accordance with certain aspects of the present disclosure. Figure 6B is a side view of an example cooling assembly with a second type cover in accordance with certain aspects of the present disclosure. Figure 6C is a cross-sectional view of an example cooling assembly with a second type cover in accordance with certain aspects of the present disclosure. Figure 7A is a top view of a computer device with an alternative example cooling assembly for cooling another type of heat-generating device array in accordance with certain aspects of the present disclosure. Figure 7B is a side view of a computer device with an alternative example cooling assembly for cooling another type of heat-generating device array in accordance with certain aspects of the present disclosure.

100:Computer device

110:Chassis

112: Motherboard

114: Processor

116: Processor

120: Base plate

122:Side wall

124:Side wall

126:Horizontal member

130:Slot array

132:Slot array

134: Dual in-line memory module

136:Slot array

138:Slot array

150:Cooling component

160:Support base

170:Cooling plate bracket

180: Cover

182:Inlet hose

184:Exit hose

Claims (10)

A cooling assembly, including: a microtube assembly having a cold manifold, a hot manifold, a plurality of first microtubes and a plurality of second microtubes, wherein the first microtubes and the second microtubes a fluid coupling between the cold manifold and the hot manifold to allow a coolant to flow between the cold manifold and the hot manifold; a bracket to position the microtube assembly relative to a heat generating component a closed position such that the first microtubes and the second microtubes are close to corresponding sides of the heating component; a coolant inlet that supplies the coolant to the cold manifold; and a coolant outlet that collects That coolant from the hot manifold. The cooling assembly of claim 1, further comprising a base member assembled on a base plate of a chassis, wherein the heating component is assembled on a circuit board, the circuit board is assembled on the base plate, and the bracket is attached over the base member and the bracket extending through the circuit board. The cooling assembly of claim 2, wherein the heat-generating component is a dual in-line memory module. The cooling assembly of claim 2, wherein the bracket is rotatably attached to the base member, the bracket is rotatable between the closed position and an open position, and the heating component is in the open position. accessible, the heating element is inaccessible in the closed position of. The cooling assembly of claim 1, further comprising a cover coupled to the bracket, the cover including a vertical fin inserted parallel to the heating component to urge the first microtubes to contact the heating component . A computer device includes: a circuit board; a heating component assembled on the circuit board; a microtube assembly having a cold manifold, a hot manifold, a plurality of first microtubes and a plurality of second microtubes , wherein the first microtubes and the second microtubes are fluidly coupled between the cold manifold and the hot manifold to allow a cooling liquid to flow between the cold manifold and the hot manifold; a bracket that positions the microtube assembly relative to the heating component such that the first microtubes and the second microtubes are close to corresponding sides of the heating component; a cooling liquid inlet that supplies the cooling to the cold manifold liquid; and a coolant outlet to collect the coolant from the thermal manifold. The computer device of claim 6, further comprising a base member mounted on a bottom plate of a chassis, the bracket is attached to the base member and the bracket extends over the circuit board. The computer device of claim 7, wherein the heating component is a dual in-line memory module. The computer device of claim 7, wherein the bracket is rotatable between a closed position and an open position, the heating component is accessible in the open position, and the heating component is accessible in the closed position. Untouchable. The computer device of claim 7, further comprising a cover coupled to the bracket, the cover including a vertical fin inserted parallel to the heating component to urge the first microtubes to contact the heating component .