TWM645959U - Carrier and computer device - Google Patents

Abstract

A carrier for different form factors for insertion in a slot of a computing device is disclosed. The different form factors have different thicknesses defined by the E1.S specification. The carrier includes a base holding a first type of form factor. A bezel is configurable for insertion in a slot for a device of the first type of form factor. The bezel has an attachment surface. The base is attachable to the attachment surface of the bezel. A second type of form factor is also attachable to the attachment surface of the bezel. A cover encloses the first type of form factor when joined to the base. The base and cover are discarded when the second type of form factor is attached to the bezel. The attached bezel and second type of form factor may also be inserted in the slot.

Description

Carriers and computer devices

The present disclosure generally relates to a carrier for high-capacity electronic components that can be inserted into a modular slot in a server. More specifically, features of the present disclosure relate to a carrier that can be used in different size E1.S form factors.

Electronic devices, such as servers, include many electronic components powered by a common power supply. Typically, servers are designed for a specific function, such as storing large amounts of data or processing. Server design starts with a chassis that includes power components and a general-purpose controller, such as a baseboard management controller. Current large server designs include slots for server sleds that house processors, memory, power supplies, and network interfaces. Such sliding components in turn include expansion slots that accept expansion device cards that can be inserted to perform additional server functions, such as storage or processing. For example, a storage server slider may include slots for additional solid state drive (SSD) device cards, while a processing server may include slots for more device cards with processing units.

As mentioned previously, storage server sliders may include solid-state drive (SSD)-based expansion cards to increase storage capacity. The current generation of SSD cards is based on memory chip carriers that comply with the M.2 form factor (such as M.2 22110). Therefore, the carrier is specifically designed to accommodate components designed based on the M.2 form factor. For example, the M.2 22110 mechanical specification has a top-side component area of about 22 mm by 110 mm, with a gold finger connector on one end.

Next-generation memory cards generally tend to have larger form factors to accommodate the greater storage capabilities of SSD devices. In 2018, the Storage Networking Industry Association (SNIA) released a new storage device specification (SFF-TA-1006), the Enterprise and Data Center 1U Short Device Form Factor (E1.S). This specification defines the mechanical properties of a 1U short form factor device of varying thicknesses that can be mounted vertically in a standard 1U rack-mounted host system. The application environment of the 1U short form factor is a cabinet or enclosure connected to one or more additional form factors. 1U refers to 1 standard unit of an IT equipment rack and an IT enclosure that fits in the space. Unit appearance specifications apply to an enclosure that will fit in this given space. This form factor is mainly used in data center servers and storage systems that require high capacity and performance with high scalability in 1U. These form factor devices are electrically connected to a server or storage system via a card edge connector.

The E1.S specification describes many different appearance specifications with varying thicknesses. For example, the appearance specifications defined in the E1.S standard include five appearance specifications with different thicknesses. The 1U short form factor is available in various thicknesses, depending on maximum power rating. Defined mounting holes and component placement areas allow mechanical attachments to accommodate different enclosure chassis, such as rails and latches. Figure 1 shows the four E1.S appearance specifications limited by the specification. Figure 1 shows the 5.9 mm thick 1U short form factor 110, the 8.01 mm thick 1U short form factor 120 with an optional heat sink, and the 9.5 mm thick 1U short form factor 140 with an optional symmetrical enclosure , and the 15mm thick 1U short form factor 150, with an optional asymmetrical housing. The other form factor is 25 mm and has the same shape as the short form factor 150.

Form factor 110 includes a printed circuit board 112 with an edge connector 114 . A housing 116 is attached to the printed circuit board 112 . Each corner of the housing 116 includes cutouts 118 that allow access to mounting holes in the printed circuit board 112 . Form factor 120 includes a printed circuit board 122 with edge connectors 124 . A housing 126 is attached to the printed circuit board 122 . Each corner of the support housing 126 includes cutouts 128 that allow access to mounting holes in the printed circuit board 122 . A heat sink 130 is mounted on the housing 126 to dissipate heat generated by components on the printed circuit board 122.

Form factor 140 includes a circuit board with an edge connector 142 . The circuit board is supported by a symmetrical housing 144. Symmetric housing 144 has a flat surface with a depending tab 146 on one end. The depending tab 146 has two screw holes 148 to allow attachment to a carrier.

Form factor 150 includes a circuit board with an edge connector 152 . The circuit board is supported by a symmetrical housing 154. Symmetric housing 154 has a flat surface with a depending tab 156 on one end. The depending tab 156 has two screw holes 158 allowing attachment to the carrier. An optional asymmetrical housing 160 is provided over the symmetrical housing 154. The asymmetric housing 160 acts as a heat sink fin, allowing heat to be dissipated from the form factor 150 device.

Currently, different appearance specifications 110, 120, 140, and 150 require different types of carriers due to their different shapes and thicknesses. Since the carriers for appearance sizes 110, 120, 140, and 150 are different, no carriers are interchangeable, so each appearance size must have different carriers available. The need for different carriers makes changing appearance specifications difficult. This lack of flexibility increases the cost of replacing parts for servers and other equipment in the data center.

Therefore, a carrier that can adapt to different appearance specifications is needed. There is also a need for a carrier that can be installed in a receiving slot without the need for tools. There is also a need for a carrier that allows efficient attachment of different form factors.

An example disclosed is a carrier for attachment to different appearance specifications. The carrier includes a base for fixing a first type of appearance specification. A frame is configured to be inserted into a slot of a device of the first type of form factor. The frame has an attachment surface. The base may be attached to the attachment surface of the frame. A second type of form factor may be attached to the attachment surface. The carrier also includes a cover that encloses the first type of appearance when coupled to the substrate. When the second type of appearance specification is attached to the frame, a base and a cover are not required. The frame and the attached second type of form factor are insertable into the slot.

In another embodiment of the disclosed example carrier, the frame includes a lever having a tab that engages a hole in the slot when the lever is in a closed position, allowing the frame to be locked in the slot. In another embodiment, the frame includes a lever release button to lock the lever into the closed position. Pushing the lever release button releases the lever to rotate to an open position, moving the tab out of the hole in the slot. In another embodiment, the lever includes a stop that moves into contact with an edge of the slot to push the carrier out of the slot when the lever is in the open position. In another embodiment, the frame includes a release mechanism to secure the cover to the base. In another embodiment, the cover includes registration features that locate the first type of form factor. In another embodiment, the first type of appearance is one of an E1.S appearance with a thickness of 5.9 mm or an E1.S appearance with a thickness of 8.1 mm. In another embodiment, the electronic device is a solid state drive. In another embodiment, the second type of appearance is one of a 9.5 mm thickness E1.S appearance or a 15 mm thickness E1.S appearance. In another embodiment, the lid engages the base with a hinge, allowing the first type of form factor to be inserted into the base when the lid is rotated via the hinge.

Another disclosed example is a computer device, including a chassis and a first slot supported by the chassis. A first carrier fixes a first type of appearance specification of a first device, the first device communicates with the computer device, and the first carrier is inserted into the first slot. The first carrier includes a housing that secures the first type of form factor and a cover that is attached to the housing that encloses the first type of form factor. The first carrier includes a first frame configured to be inserted into the first slot. The first frame has an attachment surface attached to the base. A second slot is supported by the chassis. A second carrier fixes a second type of appearance specification of a second device, the second device communicates with the computer device, and the second carrier is inserted into the second slot. The second carrier includes a second frame configured to be inserted into the first slot or the second slot. The second frame is the same as the first frame. The second frame has an attachment surface that is coupled to the second type of form factor.

In another embodiment of the disclosed example computer device, the first frame includes a lever having a tab. When the lever is in a closed position, the tab engages a hole in the first slot, allowing the first frame to Locked in the first slot. In another embodiment, the first frame includes a lever release button to lock the lever into the closed position. Pushing the lever release button releases the lever to rotate to an open position, moving the tab out of the hole in the first slot. In another embodiment, the lever includes a stop that moves into contact with an edge of the first slot to push the first carrier out of the first slot when the lever is in the open position. In another embodiment, the first frame includes a release mechanism to secure the cover to the base. In another embodiment, the cover includes registration features that locate the first type of form factor. In another embodiment, the first type of appearance is one of an E1.S appearance with a thickness of 5.9 mm or an E1.S appearance with a thickness of 8.1 mm. In another embodiment, the device is a solid state drive. In another embodiment, the second type of appearance is one of a 9.5 mm thickness E1.S appearance or a 15 mm thickness E1.S appearance. In another embodiment, the cover is hingedly engaged with the base, allowing the first type of form factor to be inserted into the base when the cover is rotated by the hinge.

The above novel content is not intended to present every embodiment or every feature of the present disclosure. Rather, the foregoing description merely provides examples of some of the novel features and characteristics described herein. The above features and advantages and other features and advantages of the present disclosure will become apparent from the following detailed description of representative embodiments and modes for carrying out the invention when taken in conjunction with the accompanying drawings and the appended claims. Additional features of the present disclosure will be apparent to those of ordinary skill in the art in view of the detailed description of various embodiments with reference to the accompanying drawings and the simplified notation provided below.

The invention can be implemented in many different forms. Representative embodiments are illustrated in the drawings and will be described in detail herein. This disclosure is an example or illustration of the principles of the disclosure and is not intended to limit the broad aspects of the disclosure to the illustrated embodiments. In this regard, for example, elements and limitations disclosed in the abstract, novel content, and embodiments sections but not explicitly stated in the patent scope shall not be incorporated into the patent scope individually or collectively by implication, inference, or otherwise. For the purposes of this embodiment, the singular includes the plural and vice versa unless expressly stated otherwise. The term "including" means "including without limitation." In addition, similar words such as "about, almost, substantially, approximately" and similar words may here mean, for example, "at", "near, nearly at", "at 3% Within 3-5% of", "within acceptable manufacturing tolerances", or any logical combination thereof. Additionally, the terms "vertical" or "horizontal" are intended to additionally include "within 3-5%" of the vertical or horizontal direction, respectively. In addition, directional terms such as "top," "bottom," "left," "right," "above," and "below" are intended to relate to the equivalent directions depicted in the reference illustration; from the reference object or component Understood in context, such as from the usual position of the object or element; or such other description.

This disclosure is directed to an example E1.S form factor carrier that can accommodate any of four E1.S form factors with different thicknesses. The form factor carrier includes a frame that allows attachment to a cover and a base to secure two different form factors. The assembled frame, base, and cover, and form factor can be inserted into a slot that allows the solid state drive device to operate in the form factor. Separate frames can be attached to the other two types of exterior specifications. The assembled frame and form factor can be inserted into a slot that allows the solid state drive device to operate in the form factor.

Figure 2A shows a perspective view of an example carrier 200. Figure 2B is an exploded view of components of the carrier 200. Figure 2C shows a side view of the carrier assembly 200. The carrier assembly 200 includes a cover 210, a base 212, and a The frame 214 surrounds a solid state drive (SSD) having an E1.S form factor, such as form factor 110. In this example, the thickness of the E1.S form factor 110 is 5.9 mm.

The cover 210 includes a cover plate 220. The cover plate 220 is rectangular and has a length sufficient to fix either one of the two thin appearance specifications 110 and 120 in Figure 1. Cover 210 includes parallel sides 222 and 224 . Cover plate 220 includes an interior surface with four pins 226 at each corner. Pins 226 mate with cutouts in corresponding form factors 110 and 120 in FIG. 1 to position the form factor relative to cover 210 . One end of sides 222 and 224 includes a protruding pin 228 that serves as a hinge relative to base 212 . Opposite ends of sides 222 and 224 are connected to corresponding perforated tabs 230 and 232 . A latch 234 is located between tabs 230 and 232.

The base 212 has a frame member 240 that is generally rectangular in shape and has a rectangular hole 242 that allows a portion of the housing of form factors 110 and 120 to be exposed to provide heat dissipation. Frame member 240 is attached to both side panels 244 and 246 . In this example, side panels 244 and 246 are attached to frame member 240 via rivets, but side panels 244 and 246 may be integrally formed with frame member 240 . One end of the side panels 244 and 246 includes a slot 248 that mates with a pin 228 of the cover 210 to allow the cover 210 to rotate relative to the base 212 . Frame member 240 has an end tab 250 extending beyond the ends of side panels 244 and 246 . End tab 250 includes two screw holes 252 that receive screws 254 allowing attachment of base 212 to frame 214 .

Components of the frame 214 are shown in Figures 2A-2B, and exploded perspective views of the components of the frame 214 are shown in greater detail in Figures 2D-2E. The frame 214 includes a housing 260, a frame structure 262, a lever 264, a lever button assembly 266, and a base release button assembly 268. Housing 260 includes an attachment surface 270 with two screw holes 272 for attaching the base 212 shown in Figures 2A-2B or a form factor (such as form factors 140 and 150 in Figure 1 ) of any one. Housing 260 includes two parallel plates 276 and 278 sandwiching lever 264 . In this example, the housing 260 is a sheet metal component used for electromagnetic interference (EMI) shielding and electrostatic discharge (ESD) conduction. In this example, frame structure 262 is made of plastic.

Parallel plates 276 and 278 hold a pin 280 inserted through a hole in plate 278, a hole formed by an annular member 282 on one side of lever 264, and into a hole in plate 276 middle. The side of lever 264 opposite ring member 282 includes a handle 284 that allows lever 264 to be grasped and rotated about pin 280 . One end of the lever 264 includes a locking tab 286 and a detent 288 . The opposite end of lever 264 includes a tab 290. A spring 292 is inserted around pin 280 to provide a spring force to push lever 264 toward housing 260 . A pair of light guide posts 294 and 296 are inserted into respective plates 276 and 278 to transmit light emitted from light emitting diodes mounted in a device attached to the form factor of the carrier 200 .

Lever button assembly 266 includes a lever release button 300 formed from a surface of housing 302 . One end of a spring 304 contacts the surface of the housing 302 opposite the release button 300 . The other end of the spring 304 contacts an inner surface of the housing 260 . Housing 302 is attached to a tilt arm 310 that includes a pin 312 that is insertable into a hole 314 in plate 276 to allow lever button assembly 266 to pivot. Spring 304 provides elastic force to force button 300 away from housing 260 .

Figure 2G shows a side view of the frame 214 with the lever 264 in an unlocked position. Figure 2F shows a side view of frame 214 with lever 264 in a locked position. When button 300 is in a rest position, a hook 306 on housing 302 engages tab 290 on lever 264 to force lever 264 into the locked position, as shown in Figure 2F. When button 300 is pressed into housing 260, housing 302 and tilt arm 310 rotate on pin 312, causing hook 306 to move away from tab 290, thereby releasing lever 264, as shown in Figure 2G. Spring 292 pushes lever 264 away from housing 260 .

The exterior of plate 276 includes a notch 320 that secures cover release button 322. Cover release button 322 includes a pair of arms 324 that engage a frame 330 . Frame 330 is rectangular and allows arms 324 to be inserted to attach to frame 330 . A pin 326 is secured to an outer side of the frame 330 . The opposite side of the frame 330 secures a tab 332 that engages the latch 234 of the cover 210 . As will be explained, the cover release button 322 is moveable between the two sides of the notch 320 . Spring 334 is inserted around pin 326 such that the elastic force from spring 334 forces frame 330 and cover release button 322 toward the outer edge of plate 276 .

Figure 3A is a perspective view of the appearance specification 110 in Figure 1 installed in the example carrier 200. Figure 3B is an exploded perspective view of the carrier 200 and the appearance specification 110. FIG. 3C is an opposite side perspective view of the appearance specification 110 after installation in the example carrier 200 . Components similar to those in Figures 2A-2G are labeled with the same reference numbers in Figures 3A-3C. As shown in FIGS. 3A and 3C , the cover 210 and the base 212 form a shell to fix the appearance form factor 110 . The frame 214 is used to fix the carrier 200 with the appearance specification 110 in a slot of a computing device. In this example, frame 214 is attached to base 212 via screws 254 .

Base 212 secures form factor 110 . When the cover 210 is closed, the cutout 118 of the form factor 110 engages the pin 226 of the cover 210 to position the form factor 110 relative to the cover 210 . When form factor 110 is installed between cover 210 and base 212 , elastic force from spring 334 pushes cover release button 322 to lock tab 332 into latch 234 of cover 210 , thereby securing cover 210 to base 212 . As shown in Figures 3F-3H, the cover 210 can be released from the base 212 by sliding the button 322 away from the cover 210. This disengages tab 332 from latch 234 of cover 210 , allowing cover 210 to rotate on pin 228 . When cover 210 is opened, form factor 110 may be removed or inserted into base 212 . As shown in FIG. 3I , form factor 110 may be removed from base 212 once cover 210 is rotated away from base 212 .

FIG. 4A is a perspective view of the appearance specification 120 in FIG. 1 installed in the example carrier 200 . Figure 4B is an exploded perspective view of the carrier 200 and the appearance specification 120. The carrier 200 acts in a similar manner in relation to the form factor 110 shown in Figures 3D to 3F to secure the form factor 120. Accordingly, the form factor 120 can be inserted into the base 212 and the cover 210 can be rotated to the closed position by sliding the button 322 to retract the tab 332 from the latch 234 of the cover 210 . Once cover 210 is closed over base 212 , button 322 can be released, allowing tab 332 to engage latch 234 . This locks cover 210 in place and closes form factor 120 .

Figure 5A is a perspective view of the frame 214 of the carrier 200 installed on the appearance specification 140 in Figure 1 . Figure 5B is an exploded perspective view of the frame 214 and the appearance specification 140. For thicker form factors, such as form factor 140, base 212 and cover 210 are not required. Therefore, the frame 214 alone serves as a carrier for the appearance specification 140 . The depending tab 146 of the form factor 140 is placed on the attachment surface 270 of the frame 214 . Screws 254 are used to attach the depending tabs 146 of the form factor 140 to the frame 214 . The frame 214 and attached form factor 140 may thus be inserted into a slot in a computing device.

Figure 6A is a perspective view of the frame 214 of the carrier 200 installed on the appearance specification 150 in Figure 1 . Figure 6B is an exploded perspective view of the frame 214 and the appearance specification 150. Regarding the carrier 200, the form factor 150 does not require the use of the base 212 and the cover 210. The depending tab 156 of the form factor 150 is placed on the attachment surface 270 of the frame 214 . Screws 254 are used to attach the depending tabs 156 of the form factor 140 to the frame 214 . Thus, frame 214 and attached form factor 140 may be inserted into a slot in a computing device.

Figure 7 shows an example computer device 700. Computer device 700 may include a server, a storage device, a 5G component, or any other device with a slot that can accommodate a form factor based on the E1.S standard. Therefore, the slots of such devices allow the addition of solid-state drives or other components that may have the standard form factor of E1.S. In this example, computer device 700 has a chassis 710 that includes a front wall 712 having a series of slots 714 for inserting solid state drive storage devices, such as those shown in Figure 1 Those solid-state drive storage devices with appearance specifications 110, 120, 140, and 150. In this example, there may be multiple slots 714, with uniform dimensions, allowing insertion of any form factor attached to a suitable carrier, such as carrier 200 in Figures 2A-2C.

Slot 714 is defined by two walls, including one wall 720 . Figure 7 shows a cross-sectional view of slot 714 so that one wall parallel to wall 720 is not shown. Wall 720 is oriented perpendicular to a top panel 722 and a bottom panel 724 . The slot has a front open end 730 for inserting the carrier and the form factor, and a rear end 732 . The front end 730 typically includes a socket for inserting the form factor edge connector.

Bottom panel 724 includes a protrusion 740 extending from the surface adjacent rear end 732 . An opening 742 is located near the front end 730 . Front end 730 includes a lateral edge 744 defining the bottom of slot 714 .

FIG. 8A is a perspective view of an example carrier 200 that is fixedly inserted into the form factor 110 in the slot 714 of the computer device 700 in FIG. 7 . An illustration 800 shows the frame 214 in the slot 714 in detail. Figure 8B is a side view of the example carrier 200 inserted into slot 714 of computer device 700. An illustration 810 shows the frame 214 in the slot 714 in detail. Carrier 200 having form factor 110 may be pushed into slot 714 until the edge of base 212 contacts protrusion 740 behind bottom panel 724 of slot 714 . The edge connector of form factor 110 plugs into a receptacle (not shown) in slot 714 to provide power and allow data signals to be exchanged between computer device 700 and devices in form factor 110 .

As mentioned above, the lever 264 is in the locked position and is secured by the button assembly 266 in Figures 8A-8B. The locking tab 286 is therefore inserted into the opening 742 of the bottom panel 724 . Thus, the locking tab 286 , in conjunction with the contact of the base 212 and the protrusion 740 , secures the carrier 200 and form factor 110 in position in the slot 714 .

Figure 8C is a perspective view of example carrier 200 removed from slot 714 by moving lever 264 to the open position. An illustration 820 shows the frame 214 in the slot 714 in detail. 8D is a side view of example carrier 200 removed from slot 714. FIG. An illustration 830 shows the frame 214 in the slot 714 in detail. As described above, when a user wants to remove the carrier 200 and the attached form factor 110, the user pushes the lever release button 300. Lever release button 300 releases lever 264 and internal spring 292 pushes lever 264 away from frame 214 . The user can then rotate lever 264 on pin 280. This movement causes the locking tab 286 to rotate out of the opening 742 in the bottom panel 724 of the slot 714 . When the user pulls lever 264 via handle 284 , stop 288 contacts lateral edge 744 and thus provides a force to push frame 214 and attached base 212 and cover 210 out of slot 714 .

As mentioned above, if the carrier 200 is attached to the form factor 120, the operation of the lever 264 and the frame 214 functions in the same manner as described with respect to Figures 8A-8D. If the carrier 200 is attached to a thicker form factor 140 or 150, the base 212 and cover 210 are not required. Frame 214 is attached to form factor 140 or 150 . The corresponding housing of form factor 140 is then simply inserted into slot 714 and contacts protrusion 740 .

The carrier 200 allows accommodating any of the four appearance sizes 110, 120, 140, and 150 shown in Figure 1. Therefore, the carrier 200 can allow any of the four E1.S form factors to be installed in a system with slots, such as a server, a storage server, etc. Taking the E1.S appearance specification carrier as an example, users can choose the appropriate E1.S solid-state drive specification from four thicknesses of E1.S to replace another specification. Thus, the example carrier allows for flexible upgrades to computer devices such as servers.

As mentioned above, the lever 264 of the frame 214 allows the E1.S form factor module with the carrier 200 to be installed in and out of the slot without the need for tools. When the user wants to repair the E1.S form factor module installed in a computer device, the user can simply rotate the lever 264 to install or uninstall the E1.S form factor. Thus, the example carrier allows for greater convenience and less labor in servicing additional devices installed in slots of the computer device.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a, an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. In addition, the terms "including, includes", "having, has, with" or variations thereof used in the embodiments and/or patent application scope are intended to be similar to "comprising". )" is included.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. Furthermore, terms, such as those defined in commonly used dictionaries, shall be construed to have meanings consistent with their meanings in the relevant art and will not be used in an idealized or overly formal sense herein unless expressly so defined. explain.

Although embodiments of the present disclosure have been shown and described with respect to one or more implementations, equivalents and modifications will occur to those of ordinary skill in the art upon reading and understanding this specification and the accompanying drawings. Additionally, while specific features of the present disclosure may have been disclosed with respect to only one of several embodiments, such features may be combined with one or more of the other embodiments as may be required and advantageous for any given or particular application. other combinations of characteristics.

Although various embodiments of the present disclosure have been described above, it should be understood that they are presented by way of example only and not limitation. Various changes may be made in accordance with the embodiments disclosed herein without departing from the spirit or scope of the disclosure. Accordingly, the breadth and scope of the present disclosure should not be limited by any of the above-described embodiments. Rather, the scope of the disclosure should be defined in accordance with the following claims and their equivalents.

110: Appearance specifications

112:Printed circuit board

114:Edge Connector

116: Shell

118:Incision

120: Appearance specifications

122:Printed circuit board/circuit board

124:Edge connector

126: Shell

128:Incision

130: Radiator

140: Appearance specifications

142:Edge Connector

144:Symmetrical shell

146: Overhang tab

148:Screw hole

150: Appearance specifications

152:Edge Connector

154: Symmetrical housing/shell

156: Overhang tab

158:Screw hole

160:Asymmetric housing

200:carrier

210: cover

212:Base

214:frame

220:Cover

222:Side

224:Side

226:pin

228:pin

230,232: Perforated tab/tab

234:Latch

240:Frame components

242: Rectangular hole

244,246:Side panel

248:Slot

250: End tab

252:Screw hole

254:Screw

260: Shell

262:Frame structure

264:Leverage

266:Lever button assembly/button assembly

268: Base release button assembly

270: Attachment surface

272:Screw hole

276,278: Board

280:pin

282: Ring member

284: handle

286:Lock tab

288:stop

290: Tab

292:Spring

294,296:Light guide column

300:Lever release button/release button/button

302: Shell

304:Spring

306:hook

310:tilt arm

312:pin

314:hole

320: Notch

322: Cover release button/button

324:arm

326:Pin

330:Frame

332: Tab

334:Spring

700: Computer equipment

710:Chassis

712:Front wall

714:Slot

720: wall

722:Top panel

724: Bottom panel

730: Front open end/front end

732:Backend

740:bulge

742:Open your mouth

744: Horizontal edge

800: Illustrations

810:Illustrations

820:Illustrations

830:Illustrations

The present disclosure and its advantages will be better understood from the following description of exemplary embodiments in conjunction with the accompanying drawings: Figure 1 shows the appearance specifications of different types of solid-state drives with different thicknesses defined by the E1.S standard; Figure 2A is a top perspective view of an example carrier after assembly and an appearance specification from Figure 1; Figure 2B is an exploded perspective view of components of the carrier in Figure 2A; Figure 2C is a side view of the assembled carrier in Figure 2A. Figure 2D is an exploded perspective view of components of a frame of the carrier in Figure 2A. Figure 2E is an exploded perspective view of components of the frame of the carrier in Figure 2A. Figure 2F is a side view of the lever of the frame in a closed position; Figure 2G is a side view of the lever of the frame in an open position; Figure 3A is a perspective view of an appearance specification in Figure 1 installed in the example carrier in Figure 2A; Figure 3B is an exploded perspective view of the carrier in Figure 2A and the appearance specifications in Figure 3A; Figure 3C is a reverse perspective view of the installation of the appearance specifications in the example carrier in Figure 3A; Figure 3D shows the assembled appearance specifications and the side view of the carrier in Figure 3A; Figure 3E shows the assembled appearance specifications and a top view of the carrier in Figure 3A; Figure 3F is a perspective view of the cover of the carrier in Figure 3A in an open position; Figure 3G is a side view of the assembled appearance specification, showing the release of the cover; Figure 3H is a top view of the cover of the carrier in Figure 3A in an open position; Figure 3I shows the appearance specifications removed from the carrier in Figure 3A; Figure 4A is a perspective view of another appearance specification in Figure 1 installed in the example carrier in Figure 2A; Figure 4B is an exploded perspective view of the carrier in Figure 2A and the appearance specifications in Figure 4A; Figure 5A is a perspective view of the frame of the carrier in Figure 2A installed on another appearance specification in Figure 1; Figure 5B is an exploded perspective view of the example carrier in Figure 2A and the appearance specifications in Figure 5A; Figure 6A is a perspective view of the frame of the carrier in Figure 2A installed on another appearance specification in Figure 1; Figure 6B is an exploded perspective view of the example carrier in Figure 2A and the appearance specifications in Figure 6A; Figure 7 is a perspective view of a slot for an additional device in a computer device; Figure 8A is a perspective view of an example carrier inserted into a slot in the server of Figure 7; Figure 8B is a side view of an example carrier inserted into a slot in the server of Figure 7; Figure 8C is a perspective view of an example carrier being removed from a slot in the server of Figure 7 by moving a lever; and Figure 8D is a side view of an example carrier being removed from a slot in the server of Figure 7 by moving a lever.

While the disclosure is susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and will be described in further detail herein. It should be understood, however, that the present disclosure is not intended to be limited to the particular forms disclosed. On the contrary, the disclosure is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the disclosure as defined by the appended claims.

200:carrier

210: cover

212:Base

214:Frame

260: Shell

262:Frame structure

264:Leverage

266:Lever button assembly/button assembly

268: Base release button assembly

Claims (10)

A carrier for attachment to different form factors, including: A base, fixed with a first type of appearance specification; a frame configured to be inserted into a slot of a device of the first type of form factor, the frame having an attachment surface, wherein the base is attachable to the attachment surface of the frame, and a first Two types of form factors may be attached to the attachment surface; and A cover that, when joined to the base, encloses the first type of form factor, wherein when the second type of form factor is attached to the frame, the base and the cover are not required, and the frame and attached This second type of form factor can be inserted into this slot. The carrier of claim 1, wherein the frame includes a lever with a tab, and when the lever is in a closed position, the tab engages a hole in the slot, allowing the frame to be locked in the slot. . The carrier of claim 2, wherein the frame includes a lever release button to lock the lever into the closed position, wherein pushing the lever release button releases the lever to rotate to an open position, moving the tab to the slot outside of the hole. The carrier of claim 3, wherein the lever includes a stop movable to contact an edge of the slot to push the carrier out of the slot when the lever is in the open position. The carrier of claim 1, wherein the cover is engaged with the base by a hinge, allowing the first type of appearance specification to be inserted into the base when the cover is rotated via the hinge. A computer device including: One chassis; a first slot supported by the chassis; A first carrier that fixes a first type of appearance specification of a first device. The first device communicates with the computer device. The first carrier is inserted into the first slot. The first carrier includes: A shell to fix the appearance specifications of the first type; a cover attached to the enclosure enclosing the first type of appearance; and a first frame configured to be inserted into the first slot, the first frame having an attachment surface attached to a base; a second slot supported by the chassis; and a second carrier that fixes a second type of appearance specification of a second device, the second device communicates with the computer device, the second carrier is inserted into the second slot, the second carrier includes a second frame, Configurable to be inserted into the first slot or the second slot, the second frame is identical to the first frame, wherein the second frame has an attachment surface coupled to the second type of appearance specification. The computer device of claim 6, wherein the first frame includes a lever with a tab, and when the lever is in a closed position, the tab engages a hole in the first slot, allowing the first frame to The body is locked in this first slot. The computer device of claim 7, wherein the first frame includes a lever release button to lock the lever into the closed position, wherein pushing the lever release button releases the lever to rotate to an open position and moves the tab to the outside of the hole in the first slot. The computer device of claim 8, wherein the lever includes a stop movable to contact an edge of the first slot to push the first carrier out of the first slot when the lever is in the open position. The computer device of claim 6, wherein the cover is engaged with the base by a hinge, allowing the first type of appearance specification to be inserted into the base when the cover is rotated by the hinge.