TWM644234U - A liquid rinse apparatus for removing residual liquid - Google Patents
A liquid rinse apparatus for removing residual liquid Download PDFInfo
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- TWM644234U TWM644234U TW112203772U TW112203772U TWM644234U TW M644234 U TWM644234 U TW M644234U TW 112203772 U TW112203772 U TW 112203772U TW 112203772 U TW112203772 U TW 112203772U TW M644234 U TWM644234 U TW M644234U
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Abstract
Description
本創作係涉及一種板體加工裝置,尤指一種能在加工後具有通孔或盲孔的板體上將殘留於通孔或盲孔內的藥液完全去除的流體沖孔去除殘留液設備。The invention relates to a plate body processing device, especially a fluid punching and residual liquid removal device that can completely remove the liquid medicine remaining in the through hole or blind hole on a plate body with a through hole or blind hole after processing.
在某些製程中,板體(例如用於各類型電路板的半成品)在鑽通孔或打盲孔後需要經過藥液清洗再上化銅,而在上化銅前必須要將板體上殘留的藥液去除,否則會導致化銅與板體的結合力低。In some processes, the board body (such as semi-finished products used for various types of circuit boards) needs to be cleaned with chemical solution after drilling through holes or blind holes, and then coated with copper, and the board must be cleaned before copper coating. Residual liquid medicine is removed, otherwise it will lead to low bonding force between copper oxide and plate body.
以幾何結構而言,在板體上鑽通孔或打盲孔,後面走濕製程容易殘留藥液在鑽通孔內或盲孔底部,造成沖洗困難的現象。其原因之一是槽液表面張力為30 dyne/cm,而水洗的表面張力是73 dyne/cm,潤濕性不佳所致;而另一原因是幾何結構所造成的。In terms of geometric structure, if through-holes or blind holes are drilled on the board, the subsequent wet process will easily leave the liquid in the through-holes or the bottom of the blind holes, resulting in difficult flushing. One of the reasons is that the surface tension of the bath solution is 30 dyne/cm, while the surface tension of water washing is 73 dyne/cm, which is caused by poor wettability; another reason is caused by the geometric structure.
例如請參考圖8,在現有技術的濕製程的槽位配置中,板體會先經過前段處理裝置91,接著浸泡於藥液槽92中,而後依序通過第一水洗裝置93與第二水洗裝置94,就直接進入轉站裝置95進行下一個製程。然而,若板體有進行鑽通孔或打盲孔的程序,則這樣的槽位配置容易使藥液殘留在通孔內或盲孔底部,而造成種種濕製程的問題。例如化銅線通孔中的酸性錫鈀膠體槽液的滯留,造成深通孔的化銅式的ICD、以及增層深盲孔的化銅脫墊等等。For example, please refer to FIG. 8 , in the slot configuration of the wet process in the prior art, the plate body first passes through the front-
因此,如何克服現有技術的濕製程的槽位配置中,潤濕性不佳與通孔或盲孔的幾何結構限制的問題,而能夠完全的去除殘留於板體的通孔或盲孔內的藥液,以提升化銅與板體的結合強度,則成為此領域的一項課題。Therefore, how to overcome the problems of poor wettability and geometric structure restrictions of through holes or blind holes in the slot configuration of the wet process in the prior art, and completely remove the residue remaining in the through holes or blind holes of the board. Liquid medicine, in order to improve the bonding strength of copper and the plate body, has become a topic in this field.
有鑑於前述之現有技術的缺點及不足,本創作提供一種流體沖孔去除殘留液設備,其更改槽位配置,新增一流體沖孔裝置槽,直接以流體沖洗板體的通孔或盲孔,藉此能完全去除殘留於板體的通孔或盲孔內的藥液,再進行後續的水洗與轉站進入下一製程。In view of the aforementioned shortcomings and deficiencies of the prior art, this creation provides a fluid punching device for removing residual liquid, which changes the slot configuration, adds a fluid punching device slot, and directly flushes the through hole or blind hole of the plate body with fluid , so that the liquid medicine remaining in the through hole or blind hole of the board can be completely removed, and then the subsequent water washing and transfer station are carried out to enter the next process.
為達到上述的創作目的,本創作所採用的技術手段為設計一種流體沖孔去除殘留液設備,其中包含: 一藥液槽、一流體沖孔裝置槽、至少一後水洗槽;該藥液槽、該流體沖孔裝置槽及該至少一後水洗槽依序沿著一製程動線排列; 該藥液槽能承裝藥液; 該流體沖孔裝置槽包含 兩架設件,其直立設置,且該兩架設件之間形成一板體通行空間; 複數噴嘴,其分別設於該兩架設件上,且上下排列,且能朝向該板體通行空間噴射流體; 該至少一後水洗槽能承裝水。 In order to achieve the above creative purpose, the technical means used in this creation is to design a fluid punching to remove residual liquid equipment, which includes: A liquid medicine tank, a fluid punching device tank, and at least one post-rinsing tank; the chemical liquid tank, the fluid punching device tank, and the at least one post-washing tank are arranged in sequence along a process line; The liquid medicine tank can hold liquid medicine; The Fluid Punch Set Tank contains Two erecting parts, which are set upright, and a space for board body passage is formed between the two erecting parts; A plurality of nozzles, which are respectively arranged on the two erecting parts, arranged up and down, and capable of spraying fluid toward the passage space of the plate body; The at least one post-wash tank can hold water.
本創作的優點在於,藉由更改槽位配置,在藥液槽後增加流體沖孔裝置槽,使得所欲加工的板體可以在浸泡完藥液後被流體沖孔裝置槽的噴嘴以噴射流體的方式由板面的兩側進行通孔或者盲孔的沖洗,藉此可以克服潤濕性不佳與通孔或盲孔的幾何結構限制的問題,而能夠完全的去除殘留於板體的通孔或盲孔內的藥液。The advantage of this creation is that by changing the slot configuration, a fluid punching device slot is added behind the liquid medicine tank, so that the plate to be processed can be sprayed with fluid by the nozzle of the fluid punching device slot after soaking the liquid medicine Through-holes or blind-holes are flushed from both sides of the board in a unique way, which can overcome the problems of poor wettability and the geometrical structure restrictions of through-holes or blind holes, and can completely remove the through-holes remaining on the board. liquid in holes or blind holes.
進一步而言,所述之流體沖孔去除殘留液設備,其中,該等噴嘴所噴射的流體為氣體。Furthermore, in the fluid punching hole removal equipment, the fluid sprayed by the nozzles is gas.
進一步而言,所述之流體沖孔去除殘留液設備,其中,該等噴嘴包含複數氣體噴嘴及複數液體噴嘴,該等氣體噴嘴所噴射的流體為氣體,該等液體噴嘴所噴射的流體為液體;在各該架設件上,該等氣體噴嘴與該等液體噴嘴上下交錯設置。Further, in the fluid punching removal equipment for residual liquid, the nozzles include a plurality of gas nozzles and a plurality of liquid nozzles, the fluid injected by the gas nozzles is gas, and the fluid injected by the liquid nozzles is liquid ; On each of the erecting parts, the gas nozzles and the liquid nozzles are arranged alternately up and down.
進一步而言,所述之流體沖孔去除殘留液設備,其中,該等噴嘴所噴射的流體為二流體。Further, in the above-mentioned equipment for removing residual liquid by punching holes, the fluid sprayed by the nozzles is two fluids.
進一步而言,所述之流體沖孔去除殘留液設備,其中,該等噴嘴所噴射的流體為壓力大於80大氣壓力的高壓流體。Furthermore, in the fluid punching device for removing residual liquid, the fluid sprayed by the nozzles is a high-pressure fluid with a pressure greater than 80 atmospheres.
進一步而言,所述之流體沖孔去除殘留液設備,其中,該等噴嘴朝向該板體通行空間噴射流體的角度能上下改變。Furthermore, in the fluid punching device for removing residual liquid, the angles at which the nozzles spray fluid toward the passage space of the plate body can be changed up and down.
進一步而言,所述之流體沖孔去除殘留液設備,其中,該等噴嘴向下傾斜地噴射流體。Furthermore, in the fluid punching device for removing residual liquid, the nozzles spray the fluid obliquely downward.
進一步而言,所述之流體沖孔去除殘留液設備,其中,設於其中一該架設件上的該等噴嘴與設於另一該架設件上的該等噴嘴的上下位置相互交錯。Further, in the fluid punching device for removing residual liquid, the nozzles arranged on one of the erecting parts and the nozzles arranged on the other erecting part are arranged in a staggered position up and down.
進一步而言,所述之流體沖孔去除殘留液設備,其中,該流體沖孔去除殘留液設備包含一前水洗槽,其沿著該製程動線設於該藥液槽與該流體沖孔裝置槽之間。Furthermore, the fluid punching device for removing residual liquid, wherein, the fluid punching device for removing residual liquid includes a front washing tank, which is arranged between the liquid medicine tank and the fluid punching device along the process flow line between slots.
進一步而言,所述之流體沖孔去除殘留液設備,其中,該流體沖孔裝置槽設於該藥液槽的正上方。Furthermore, the fluid punching device for removing residual liquid, wherein, the fluid punching device tank is arranged directly above the liquid medicine tank.
以下配合圖式及本創作之較佳實施例,進一步闡述本創作為達成預定創作目的所採取的技術手段。The technical means adopted by this creation to achieve the predetermined creation purpose are further described below in conjunction with the drawings and the preferred embodiments of this creation.
請參考圖1及圖2,本創作之流體沖孔去除殘留液設備包含一藥液槽10、一流體沖孔裝置槽20及至少一後水洗槽30。藥液槽10、流體沖孔裝置槽20及後水洗槽30依序沿著一製程動線D1排列;其中,後水洗槽30的數量較佳為二,但其數量不以此為限。在部分實施例中,流體沖孔去除殘留液設備可以進一步包含一前水洗槽40,前水洗槽40沿著製程動線D1設於藥液槽10與流體沖孔裝置槽20之間。此外,在不包含前水洗槽40的實施例中,流體沖孔裝置槽20可以是設於藥液槽10的正上方,但不以此為限。Please refer to FIG. 1 and FIG. 2 , the fluid punching device of the present invention for removing residual liquid includes a
藥液槽10能承裝用以浸泡一所欲加工的板體B的藥液。The
請參考圖1及圖2,流體沖孔裝置槽20包含兩架設件21及複數噴嘴22。兩架設件21直立設置,且兩架設件21之間形成一板體通行空間23。架設件21可以是架體或者是壁板等元件,只要能供噴嘴22設置即可。板體通行空間23用以供所欲加工的板體B通過。該等噴嘴22分別設於兩架設件21上,且上下排列,且能朝向板體通行空間23噴射流體,藉此當所欲加工的板體B通過時,該等噴嘴22能朝向所欲加工的板體B的通孔或者盲孔噴射流體,藉以沖洗殘留的藥液。進一步而言,噴嘴22朝向板體通行空間23噴射流體的角度能上下改變,藉以因應不同厚度、孔徑與孔密度。較佳地,噴嘴22向下傾斜地噴射流體。較佳地,設於其中一架設件21上的噴嘴22與設於另一架設件21上的噴嘴22的上下位置相互交錯。Please refer to FIG. 1 and FIG. 2 , the fluid
該等噴嘴22所噴射的流體可以是氣體。或者,該等噴嘴22也可以是包含複數氣體噴嘴及複數液體噴嘴,氣體噴嘴所噴射的流體為氣體,液體噴嘴所噴射的流體為液體;並且,在各架設件21上,氣體噴嘴與液體噴嘴上下交錯設置。此外,該等噴嘴22所噴射的流體也可以是二流體(即同時噴射氣體與液體),或者也可以是壓力大於80大氣壓力的高壓流體。上述之氣體可以是不與所欲加工的板體B以及藥液槽10中的藥液起化學反應的低活性的氣體,例如氮氣或惰性氣體。而液體可以是水,且液體的溫度可以是攝氏20度至攝氏80度,藉以提高清洗能力。The fluid sprayed by the
後水洗槽30能承裝水且能用以清洗所欲加工的板體B。The
以下透過不同實施例說明本創作之流體沖孔去除殘留液設備的可能的具體實施態樣,但實際的實施態樣不以下列實施例為限。The following describes possible specific implementations of the device for removing residual liquid by punching holes of the present invention through different embodiments, but the actual implementations are not limited to the following embodiments.
請參考圖3及圖4,在第一實施例中,本創作之流體沖孔去除殘留液設備包含一藥液槽10A、一流體沖孔裝置槽20A及兩後水洗槽30A。流體沖孔裝置槽20A設於藥液槽10A正上方。流體沖孔裝置槽20A的該等噴嘴22A所噴射的流體為氣體。所欲加工的板體B在經過一前處理裝置F後以一移板裝置(圖中未示,例如機械手臂)移動至藥液槽10A內浸泡,浸泡完成後移板裝置將所欲加工的板體B抽出藥液槽10A的同時,順勢使所欲加工的板體B通過設於藥液槽10A正上方的流體沖孔裝置槽20A的板體通行空間23A,以流體沖孔裝置槽20A的該等噴嘴22A進行吹氣將殘留的藥液去除。隨後,移板裝置將所欲加工的板體B依序移動至兩後水洗槽30A內進行水洗,接著進入轉站裝置T進行下一階段製程。Please refer to FIG. 3 and FIG. 4 , in the first embodiment, the fluid punching device for removing residual liquid of the present invention includes a
請參考圖5及圖6,在第二實施例中,本創作之流體沖孔去除殘留液設備包含一藥液槽10B、一前水洗槽40B、一流體沖孔裝置槽20B及兩後水洗槽30B。所欲加工的板體B在經過一前處理裝置F後以一移板裝置(圖中未示,例如機械手臂)移動至藥液槽10B內浸泡,浸泡完成後移板裝置將所欲加工的板體B移動至前水洗槽40B內先進行一次水洗,接著再通過流體沖孔裝置槽20B進行沖洗。流體沖孔裝置槽20B的該等噴嘴22B包含複數氣體噴嘴221B及複數液體噴嘴222B,氣體噴嘴221B所噴射的流體為氣體,液體噴嘴222B所噴射的流體為液體;並且,在各架設件21B上,氣體噴嘴221B與液體噴嘴222B上下交錯設置。同時進行噴水與吹氣,可以避免僅有吹氣使得殘留的藥液風乾乾固於所欲加工的板體B上。以流體沖孔裝置槽20B進行沖洗後,移板裝置將所欲加工的板體B依序移動至兩後水洗槽30B內進行水洗,接著進入轉站裝置T進行下一階段製程。Please refer to Fig. 5 and Fig. 6, in the second embodiment, the fluid punching removal equipment of the present invention includes a
請參考圖7,第三實施例的槽位配置基本與第二實施例相同,差別在於,在第三實施例中,該等噴嘴22C皆相同,其所噴射的流體皆為二流體(即同時噴射氣體與液體),或皆為壓力大於80大氣壓力的高壓流體。Please refer to Fig. 7, the slot configuration of the third embodiment is basically the same as that of the second embodiment, the difference is that in the third embodiment, the
此外,在所有實施例中,當所欲加工的板體B通過流體沖孔裝置槽20的板體通行空間23時,移板裝置可以對所欲加工的板體B施加震動或者擺動,藉以提高沖洗效果,但不以此為限。In addition, in all embodiments, when the plate body B to be processed passes through the plate
藉由更改槽位配置,在藥液槽10後增加流體沖孔裝置槽20,使得所欲加工的板體B可以在浸泡完藥液後被流體沖孔裝置槽20的噴嘴22以噴射流體的方式由板面的兩側進行通孔或者盲孔的沖洗,藉此可以克服潤濕性不佳與通孔或盲孔的幾何結構限制的問題,而能夠完全的去除殘留於板體的通孔或盲孔內的藥液。By changing the configuration of the slots, a fluid
以上所述僅是本創作的較佳實施例而已,並非對本創作做任何形式上的限制,雖然本創作已以較佳實施例揭露如上,然而並非用以限定本創作,任何所屬技術領域中具有通常知識者,在不脫離本創作技術方案的範圍內,當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施例,但凡是未脫離本創作技術方案的內容,依據本創作的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾,均仍屬於本創作技術方案的範圍內。The above description is only a preferred embodiment of this creation, and does not impose any formal restrictions on this creation. Although this creation has been disclosed as above with a preferred embodiment, it is not used to limit this creation. Anyone in the technical field has Ordinary knowledgeable persons, without departing from the scope of this creative technical solution, may use the technical content disclosed above to make some changes or modify them into equivalent embodiments with equivalent changes. However, any content that does not deviate from this creative technical solution, according to The technical essence of the creation Any simple modification, equivalent change and modification made to the above embodiments still belong to the scope of the technical solution of the creation.
B:板體
F:前處理裝置
T:轉站裝置
D1:製程動線
10:藥液槽
20:流體沖孔裝置槽
21:架設件
22:噴嘴
23:板體通行空間
30:後水洗槽
40:前水洗槽
10A:藥液槽
20A:流體沖孔裝置槽
22A:噴嘴
23A:板體通行空間
30A:後水洗槽
10B:藥液槽
20B:流體沖孔裝置槽
22B:噴嘴
221B:氣體噴嘴
222B:液體噴嘴
30B:後水洗槽
40B:前水洗槽
22C:噴嘴
B: board body
F: Pre-processing device
T: transfer station device
D1: Process flow
10: Medicine tank
20: Fluid punching device slot
21: Erecting parts
22: Nozzle
23: board passage space
30: Rear washing tank
40:
圖1係本創作的基本槽位配置示意圖。 圖2係本創作的流體沖孔裝置槽的示意圖。 圖3係本創作的第一實施例的槽位配置示意圖。 圖4係本創作的第一實施例的流體沖孔裝置槽的示意圖。 圖5係本創作的第二實施例的槽位配置示意圖。 圖6係本創作的第二實施例的流體沖孔裝置槽的示意圖。 圖7係本創作的第三實施例的流體沖孔裝置槽的示意圖。 圖8係現有技術的濕製程的槽位配置示意圖。 Figure 1 is a schematic diagram of the basic slot configuration of this creation. Fig. 2 is the schematic diagram of the fluid punching device groove of this creation. Fig. 3 is a schematic diagram of the slot configuration of the first embodiment of the invention. Fig. 4 is a schematic diagram of the groove of the fluid punching device of the first embodiment of the present invention. FIG. 5 is a schematic diagram of the slot configuration of the second embodiment of the present invention. Fig. 6 is a schematic diagram of the tank of the fluid punching device according to the second embodiment of the present invention. Fig. 7 is a schematic diagram of the tank of the fluid punching device according to the third embodiment of the present invention. FIG. 8 is a schematic diagram of slot configuration of a wet process in the prior art.
B:板體 B: board body
20:流體沖孔裝置槽 20: Fluid punching device slot
21:架設件 21: Erecting parts
22:噴嘴 22: Nozzle
23:板體通行空間 23: board passage space
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TW112203772U TWM644234U (en) | 2023-04-21 | 2023-04-21 | A liquid rinse apparatus for removing residual liquid |
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TW112203772U TWM644234U (en) | 2023-04-21 | 2023-04-21 | A liquid rinse apparatus for removing residual liquid |
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TWM644234U true TWM644234U (en) | 2023-07-21 |
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TW112203772U TWM644234U (en) | 2023-04-21 | 2023-04-21 | A liquid rinse apparatus for removing residual liquid |
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