TWM644234U - A liquid rinse apparatus for removing residual liquid - Google Patents

Abstract

The present invention relates to a liquid rinse apparatus for removing residual liquid, which comprises a liquid tank, a liquid rinse device tank, and at least one rear water tank. The liquid tank, the liquid rinse device tank, and the at least one rear water tank are arranged along a process line. The liquid rinse device tank has two brackets and multiple nozzles. The two brackets are set vertically, and a board passing space is formed between the two brackets. The nozzles are respectively mounted on the two brackets, are arranged up and down, and are capable of spraying liquid toward the board passing space. By adjusting the tank configurations and adding the liquid rinse device tank after the liquid tank, the board to be processed can be rinsed by the nozzles of the liquid rinse device tank spraying liquid from both sides of the board after soaking the chemical liquid, so the residual chemical liquid in the through holes or blind holes of the board can be completely removed.

Description

Fluid punching to remove residual liquid equipment

The invention relates to a plate body processing device, especially a fluid punching and residual liquid removal device that can completely remove the liquid medicine remaining in the through hole or blind hole on a plate body with a through hole or blind hole after processing.

In some processes, the board body (such as semi-finished products used for various types of circuit boards) needs to be cleaned with chemical solution after drilling through holes or blind holes, and then coated with copper, and the board must be cleaned before copper coating. Residual liquid medicine is removed, otherwise it will lead to low bonding force between copper oxide and plate body.

In terms of geometric structure, if through-holes or blind holes are drilled on the board, the subsequent wet process will easily leave the liquid in the through-holes or the bottom of the blind holes, resulting in difficult flushing. One of the reasons is that the surface tension of the bath solution is 30 dyne/cm, while the surface tension of water washing is 73 dyne/cm, which is caused by poor wettability; another reason is caused by the geometric structure.

For example, please refer to FIG. 8 , in the slot configuration of the wet process in the prior art, the plate body first passes through the front-stage processing device 91, then soaks in the chemical solution tank 92, and then passes through the first water washing device 93 and the second water washing device in sequence. 94, it directly enters the transfer station device 95 for the next process. However, if the board has a process of drilling through holes or drilling blind holes, such a slot configuration will easily cause the chemical solution to remain in the through holes or the bottom of the blind holes, causing various wet process problems. For example, the retention of the acidic tin-palladium colloidal bath solution in the through-hole of the copper wire leads to the ICD of the copper-silicon type in the deep through-hole, and the copper-silicon debonding of the build-up deep blind hole, etc.

Therefore, how to overcome the problems of poor wettability and geometric structure restrictions of through holes or blind holes in the slot configuration of the wet process in the prior art, and completely remove the residue remaining in the through holes or blind holes of the board. Liquid medicine, in order to improve the bonding strength of copper and the plate body, has become a topic in this field.

In view of the aforementioned shortcomings and deficiencies of the prior art, this creation provides a fluid punching device for removing residual liquid, which changes the slot configuration, adds a fluid punching device slot, and directly flushes the through hole or blind hole of the plate body with fluid , so that the liquid medicine remaining in the through hole or blind hole of the board can be completely removed, and then the subsequent water washing and transfer station are carried out to enter the next process.

In order to achieve the above creative purpose, the technical means used in this creation is to design a fluid punching to remove residual liquid equipment, which includes: A liquid medicine tank, a fluid punching device tank, and at least one post-rinsing tank; the chemical liquid tank, the fluid punching device tank, and the at least one post-washing tank are arranged in sequence along a process line; The liquid medicine tank can hold liquid medicine; The Fluid Punch Set Tank contains Two erecting parts, which are set upright, and a space for board body passage is formed between the two erecting parts; A plurality of nozzles, which are respectively arranged on the two erecting parts, arranged up and down, and capable of spraying fluid toward the passage space of the plate body; The at least one post-wash tank can hold water.

The advantage of this creation is that by changing the slot configuration, a fluid punching device slot is added behind the liquid medicine tank, so that the plate to be processed can be sprayed with fluid by the nozzle of the fluid punching device slot after soaking the liquid medicine Through-holes or blind-holes are flushed from both sides of the board in a unique way, which can overcome the problems of poor wettability and the geometrical structure restrictions of through-holes or blind holes, and can completely remove the through-holes remaining on the board. liquid in holes or blind holes.

Furthermore, in the fluid punching hole removal equipment, the fluid sprayed by the nozzles is gas.

Further, in the fluid punching removal equipment for residual liquid, the nozzles include a plurality of gas nozzles and a plurality of liquid nozzles, the fluid injected by the gas nozzles is gas, and the fluid injected by the liquid nozzles is liquid ; On each of the erecting parts, the gas nozzles and the liquid nozzles are arranged alternately up and down.

Further, in the above-mentioned equipment for removing residual liquid by punching holes, the fluid sprayed by the nozzles is two fluids.

Furthermore, in the fluid punching device for removing residual liquid, the fluid sprayed by the nozzles is a high-pressure fluid with a pressure greater than 80 atmospheres.

Furthermore, in the fluid punching device for removing residual liquid, the angles at which the nozzles spray fluid toward the passage space of the plate body can be changed up and down.

Furthermore, in the fluid punching device for removing residual liquid, the nozzles spray the fluid obliquely downward.

Further, in the fluid punching device for removing residual liquid, the nozzles arranged on one of the erecting parts and the nozzles arranged on the other erecting part are arranged in a staggered position up and down.

Furthermore, the fluid punching device for removing residual liquid, wherein, the fluid punching device for removing residual liquid includes a front washing tank, which is arranged between the liquid medicine tank and the fluid punching device along the process flow line between slots.

Furthermore, the fluid punching device for removing residual liquid, wherein, the fluid punching device tank is arranged directly above the liquid medicine tank.

The technical means adopted by this creation to achieve the predetermined creation purpose are further described below in conjunction with the drawings and the preferred embodiments of this creation.

Please refer to FIG. 1 and FIG. 2 , the fluid punching device of the present invention for removing residual liquid includes a liquid medicine tank 10 , a fluid punching device tank 20 and at least one post-rinsing tank 30 . The liquid medicine tank 10 , the fluid punching device tank 20 and the post-rinsing tank 30 are sequentially arranged along a process line D1; the number of the post-washing tank 30 is preferably two, but the number is not limited thereto. In some embodiments, the equipment for removing residual liquid by fluid punching may further include a front washing tank 40 , and the front washing tank 40 is disposed between the liquid medicine tank 10 and the tank 20 of the fluid punching device along the process line D1 . In addition, in an embodiment that does not include the front washing tank 40 , the fluid punching device tank 20 may be located directly above the liquid medicine tank 10 , but it is not limited thereto.

The liquid medicine tank 10 can hold the liquid medicine for soaking a plate body B to be processed.

Please refer to FIG. 1 and FIG. 2 , the fluid punching device tank 20 includes two erecting parts 21 and a plurality of nozzles 22 . The two erecting parts 21 are arranged upright, and a board passage space 23 is formed between the two erecting parts 21 . The mounting part 21 can be a frame or a wall plate, as long as it can be used for the nozzle 22 to be set. The plate passing space 23 is used for the plate B to be processed to pass through. These nozzles 22 are respectively arranged on the two erecting parts 21, and are arranged up and down, and can spray fluid towards the plate body passage space 23, so that when the plate body B to be processed passes, the nozzles 22 can be directed towards the plate body B to be processed. The through hole or blind hole of the plate body B sprays fluid, so as to flush the residual liquid medicine. Furthermore, the angle at which the nozzle 22 sprays the fluid toward the board passage space 23 can be changed up and down, so as to respond to different thicknesses, hole diameters, and hole densities. Preferably, the nozzle 22 sprays fluid at a downward slope. Preferably, the nozzles 22 disposed on one of the erecting parts 21 and the nozzles 22 disposed on the other erecting part 21 are arranged in a staggered up and down position.

The fluid sprayed by the nozzles 22 may be gas. Or, these nozzles 22 may also include a plurality of gas nozzles and a plurality of liquid nozzles, the fluid ejected by the gas nozzles is gas, and the fluid ejected by the liquid nozzles is liquid; and, on each mounting part 21, the gas nozzles and the liquid nozzles Staggered up and down. In addition, the fluid sprayed by the nozzles 22 may also be two fluids (that is, inject gas and liquid at the same time), or may also be a high-pressure fluid with a pressure greater than 80 atmospheres. The above-mentioned gas may be a low-activity gas that does not chemically react with the plate body B to be processed and the chemical solution in the chemical solution tank 10 , such as nitrogen or inert gas. The liquid can be water, and the temperature of the liquid can be 20 degrees Celsius to 80 degrees Celsius, so as to improve the cleaning ability.

The post-wash tank 30 can hold water and can be used to clean the plate body B to be processed.

The following describes possible specific implementations of the device for removing residual liquid by punching holes of the present invention through different embodiments, but the actual implementations are not limited to the following embodiments.

Please refer to FIG. 3 and FIG. 4 , in the first embodiment, the fluid punching device for removing residual liquid of the present invention includes a liquid medicine tank 10A, a fluid punching device tank 20A and two post-rinsing tanks 30A. The fluid punching device tank 20A is arranged directly above the liquid medicine tank 10A. The fluid sprayed by the nozzles 22A of the fluid punching device tank 20A is gas. The plate body B to be processed is moved to the liquid medicine tank 10A by a plate-moving device (not shown in the figure, such as a mechanical arm) after passing through a pre-processing device F for soaking. After the soaking is completed, the plate-moving device will move the plate to be processed. While the plate body B is pulled out of the liquid medicine tank 10A, the plate body B to be processed is allowed to pass through the plate body passing space 23A of the fluid punching device tank 20A directly above the chemical liquid tank 10A, and the liquid punching device tank 20A The nozzles 22A blow air to remove the remaining liquid medicine. Subsequently, the plate moving device moves the plate body B to be processed to the two subsequent water washing tanks 30A for water washing, and then enters the transfer station device T for the next stage of the process.

Please refer to Fig. 5 and Fig. 6, in the second embodiment, the fluid punching removal equipment of the present invention includes a liquid medicine tank 10B, a front washing tank 40B, a fluid punching device tank 20B and two rear washing tanks 30B. The plate body B to be processed is moved to the liquid medicine tank 10B by a plate-moving device (not shown in the figure, such as a mechanical arm) after passing through a pre-processing device F for soaking. After the soaking is completed, the plate-moving device will move the plate to be processed. The plate body B is moved to the front washing tank 40B to be washed once, and then rinsed through the fluid punching device tank 20B. The nozzles 22B of the fluid punching device tank 20B include a plurality of gas nozzles 221B and a plurality of liquid nozzles 222B, the fluid injected by the gas nozzles 221B is gas, and the fluid injected by the liquid nozzles 222B is liquid; and, on each erection part 21B , the gas nozzles 221B and the liquid nozzles 222B are alternately arranged up and down. Spraying water and blowing air at the same time can avoid only blowing air to make the residual liquid medicine dry and solid on the board body B to be processed. After flushing with the fluid punching device tank 20B, the board moving device moves the board body B to be processed to the two subsequent washing tanks 30B for washing, and then enters the transfer station device T for the next stage of the process.

Please refer to Fig. 7, the slot configuration of the third embodiment is basically the same as that of the second embodiment, the difference is that in the third embodiment, the nozzles 22C are all the same, and the fluids ejected by them are all two fluids (i.e. simultaneously Jet gas and liquid), or all are high-pressure fluids with a pressure greater than 80 atmospheres.

In addition, in all embodiments, when the plate body B to be processed passes through the plate body passage space 23 of the fluid punching device groove 20, the plate moving device can apply vibration or swing to the plate body B to be processed, thereby improving Flushing effect, but not limited to.

By changing the configuration of the slots, a fluid punching device slot 20 is added behind the liquid medicine tank 10, so that the plate body B to be processed can be sprayed by the nozzle 22 of the fluid punching device slot 20 after soaking in the liquid medicine. The way is to flush the through holes or blind holes from both sides of the board surface, so as to overcome the problems of poor wettability and geometric structure restrictions of through holes or blind holes, and completely remove the through holes remaining on the board Or the liquid medicine in the blind hole.

The above description is only a preferred embodiment of this creation, and does not impose any formal restrictions on this creation. Although this creation has been disclosed as above with a preferred embodiment, it is not used to limit this creation. Anyone in the technical field has Ordinary knowledgeable persons, without departing from the scope of this creative technical solution, may use the technical content disclosed above to make some changes or modify them into equivalent embodiments with equivalent changes. However, any content that does not deviate from this creative technical solution, according to The technical essence of the creation Any simple modification, equivalent change and modification made to the above embodiments still belong to the scope of the technical solution of the creation.

B: board body F: Pre-processing device T: transfer station device D1: Process flow 10: Medicine tank 20: Fluid punching device slot 21: Erecting parts 22: Nozzle 23: board passage space 30: Rear washing tank 40: Front washing tank 10A: Medicine solution tank 20A: Fluid punching device slot 22A: Nozzle 23A: board passage space 30A: After washing tank 10B: Medicine solution tank 20B: Fluid punching device slot 22B: Nozzle 221B: Gas nozzle 222B: liquid nozzle 30B: After washing tank 40B: Front washing tank 22C: Nozzle

Figure 1 is a schematic diagram of the basic slot configuration of this creation. Fig. 2 is the schematic diagram of the fluid punching device groove of this creation. Fig. 3 is a schematic diagram of the slot configuration of the first embodiment of the invention. Fig. 4 is a schematic diagram of the groove of the fluid punching device of the first embodiment of the present invention. FIG. 5 is a schematic diagram of the slot configuration of the second embodiment of the present invention. Fig. 6 is a schematic diagram of the tank of the fluid punching device according to the second embodiment of the present invention. Fig. 7 is a schematic diagram of the tank of the fluid punching device according to the third embodiment of the present invention. FIG. 8 is a schematic diagram of slot configuration of a wet process in the prior art.

B: board body

20: Fluid punching device slot

21: Erecting parts

22: Nozzle

23: board passage space

Claims (10)

A fluid punching device for removing residual liquid, which includes A liquid medicine tank, a fluid punching device tank, and at least one post-rinsing tank; the chemical liquid tank, the fluid punching device tank, and the at least one post-washing tank are arranged in sequence along a process line; The liquid medicine tank can hold liquid medicine; The Fluid Punch Set Tank contains Two erecting parts, which are set upright, and a space for board body passage is formed between the two erecting parts; A plurality of nozzles, which are respectively arranged on the two erecting parts, arranged up and down, and capable of spraying fluid toward the passage space of the plate body; The at least one post-wash tank can hold water. The fluid punching device for removing residual liquid according to claim 1, wherein the fluid sprayed by the nozzles is gas. The fluid punching removal equipment for residual liquid as described in Claim 1, wherein the nozzles include a plurality of gas nozzles and a plurality of liquid nozzles, the fluid injected by the gas nozzles is gas, and the fluid injected by the liquid nozzles is liquid ; On each of the erecting parts, the gas nozzles and the liquid nozzles are arranged alternately up and down. The fluid punching device for removing residual liquid according to claim 1, wherein the fluid sprayed by the nozzles is two fluids. The fluid punching device for removing residual liquid according to Claim 1, wherein the fluid sprayed by the nozzles is a high-pressure fluid with a pressure greater than 80 atmospheres. The fluid punching device for removing residual liquid according to any one of Claims 1 to 5, wherein the angles at which the nozzles spray fluid toward the passage space of the plate body can be changed up and down. The fluid punching device for removing residual liquid according to any one of claims 1 to 5, wherein the nozzles spray the fluid obliquely downward. The fluid punching device for removing residual liquid as described in any one of claims 1 to 5, wherein the nozzles arranged on one of the erection parts are above and below the nozzles arranged on the other erection part The positions are staggered. The equipment for removing residual liquid by fluid punching according to any one of claims 1 to 5, wherein the equipment for removing residual liquid by punching fluid includes A front washing tank is arranged between the liquid medicine tank and the fluid punching device tank along the process flow line. The equipment for removing residual liquid by fluid punching according to claim 2, wherein the fluid punching device tank is arranged directly above the liquid medicine tank.

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