TWM643729U - Circuit structure for multiple antenna radio unit, base station, and satellite communications - Google Patents

Abstract

A circuit structure for multiple antenna radio units (RUs), base stations (BSs), and satellite communications is provided. Different from the current main technology using the circuit structure of a single printed circuit board (PCB), the circuit structure in this present disclosure consists of multiple PCBs, and the required modules of the active antenna such as the antennas and RF components; the digital circuit such as the fronthaul interface module, digital processing module of communications, beamforming module, and baseband digital circuit module; and the power module in the RU, BS, and satellite communications are allocated into the multiple PCBs. By elaborately allocating those modules into the multiple PCBs, they are able to coordinate for achieving the required functionality, and the overall performance can be optimized. The circuit structure can also be used in Massive MIMO (Multiple-Input Multiple-Output) BSs such that the corresponding transmit power can be reduced as a green technology.

Description

Circuit architecture for multi-antenna radio frequency units, base stations, and satellite communications

The present invention relates to a radio frequency unit, a base station, and a circuit structure for satellite communication in a wireless communication system.

In a wireless communication system with multiple antennas, there are two types of antennas: active antennas and passive antennas according to their antenna structures. The traditional fourth generation (4th Generation, 4G) mobile communication base station (Base Station, BS) mainly uses a passive antenna, which is characterized by separating the radio frequency (Radio Frequency, RF) component from the antenna, wherein the radio frequency component is placed in the remote radio head (Remote Radio Head, RRH), and the antenna is placed outside the remote radio head and connected to the remote radio head through a cable (Cable). Different from the passive antenna structure, the active antenna integrates the radio frequency element and the antenna, which can avoid or reduce the cable loss (Cable Loss), and is more suitable for wireless communication systems with a large number of antennas. Due to the advantages of active antennas and the increase in the number of antennas, the 5th Generation (5G) mobile communication base stations often use active antennas. For example, radio frequency components and antennas can be integrated into the radio unit (RU) of the base station.

In the active antenna system, the existing technology uses a single-chip printed circuit board (Printed Circuit Board, PCB) as the mainstream architecture, by using a single-chip multilayer (Multilayer) The printed circuit board architecture integrates antennas, radio frequency components, and baseband digital circuits into one printed circuit board. For example, U.S. Patent Publications No. US9,391,370B2, No. US10,201,073B2, and No. US10,290,920B2 all use similar multi-layer printed circuit board structures to integrate antennas, radio frequency components, and baseband digital circuits into a single printed circuit board. However, in the active antenna system applications with a large number of antennas such as radio frequency units, base stations, and satellite communications, the use of single-chip multi-layer printed circuit boards is the mainstream of the prior art, but has the following disadvantages. First of all, because the antenna, radio frequency components, and digital circuits are all integrated into a single printed circuit board, the heat dissipation area is limited by the area of the single printed circuit board, so it is easy to cause low heat dissipation efficiency and difficult heat dissipation. Secondly, since the antenna, radio frequency components, and digital circuits are all integrated into a single printed circuit board, the distance between each component is relatively close, which is prone to generate noise and interference problems such as Electromagnetic Interference (EMI)/Electromagnetic Compatibility (EMC). Furthermore, since a single-chip printed circuit board is used, if the printed circuit board or internal components are aged or damaged, the entire system may fail to operate, resulting in a shorter service life and lower stability; and due to its highly integrated characteristics, it is difficult to repair, replace and update some damaged components. In addition, since the multi-layer printed circuit board uses a three-dimensional structure to arrange components, its production is complicated, making its production cost quite high; and due to its complicated production, the yield rate of mass production is also low.

Based on the above, the existing technology still has shortcomings such as poor heat dissipation, high noise and interference, short life, low stability, difficult maintenance, high cost, and low mass production yield, which still needs to be improved.

In order to solve the shortcomings of the above-mentioned prior art, different from single-chip printed circuit boards, this disclosure The content shown uses a multi-chip printed circuit board structure to distribute radio frequency units, base stations, and active antennas such as antennas and radio frequency components required in satellite communication systems; digital circuits such as fronthaul interface (Fronthaul Interface) modules, communication digital signal processing modules, beamforming (Beamforming) modules, baseband (Baseband) digital circuit modules; and power supply (Power) modules are distributed to multiple printed circuit boards. It can work together to achieve the required functions and optimize its overall performance.

One aspect of the disclosure provides a circuit structure for a radio frequency unit, including a plurality of printed circuit boards, and data and/or signals can be transmitted between each printed circuit board through any digital interface and/or analog interface; at least one of the printed circuit boards includes an antenna module; at least another printed circuit board includes a fronthaul interface module. In addition to the antenna module, the printed circuit board including the antenna module may also include a radio frequency front-end module (FEM). In addition to the fronthaul interface module, the printed circuit board including the fronthaul interface module may also include a radio frequency module, a communication digital signal processing module, and a beamforming module. In addition to the printed circuit board including the antenna module and the printed circuit board including the fronthaul interface module, there may also be another printed circuit board including the power module.

Another aspect of the disclosure provides a circuit structure for a radio frequency unit, including a plurality of printed circuit boards, and data and/or signals can be transmitted between each printed circuit board through any digital interface and/or analog interface; at least one of the printed circuit boards includes an antenna module; at least another printed circuit board includes a fronthaul interface module. In addition to the antenna module, the printed circuit board including the antenna module may also include a radio frequency front-end module and a radio frequency module. In addition to the fronthaul interface module, the printed circuit board including the fronthaul interface module may also include a communication digital signal processing module and a beamforming module. In addition to the printed circuit board containing the antenna module and In addition to the printed circuit board including the fronthaul interface module, there may also be another printed circuit board including the power module.

Another aspect of the disclosure provides a circuit structure for a radio frequency unit, including a plurality of printed circuit boards, and data and/or signals can be transmitted between each printed circuit board through any digital interface and/or analog interface; wherein at least one printed circuit board includes an antenna module; at least another printed circuit board includes a power module. In addition to the antenna module, the printed circuit board including the antenna module may also include a radio frequency front-end module, a radio frequency module, a communication digital signal processing module, and a beamforming module.

Another aspect of the disclosure provides a circuit structure for base station and satellite communication, including a plurality of printed circuit boards, and data and/or signals can be transmitted between each printed circuit board through any digital interface and/or analog interface; at least one of the printed circuit boards includes an antenna module; at least another printed circuit board includes a baseband digital circuit module. In addition to the antenna module, the printed circuit board including the antenna module may also include a radio frequency front-end module. In addition to the baseband digital circuit module, the printed circuit board including the baseband digital circuit module may also include a radio frequency module and a beamforming module. In addition to the printed circuit board including the antenna module and the printed circuit board including the baseband digital circuit module, there may also be another printed circuit board including the power module.

Another aspect of the disclosure provides a circuit structure for base station and satellite communication, including a plurality of printed circuit boards, and data and/or signals can be transmitted between each printed circuit board through any digital interface and/or analog interface; at least one of the printed circuit boards includes an antenna module; at least another printed circuit board includes a baseband digital circuit module. In addition to the antenna module, the printed circuit board containing the antenna module can also include the RF front-end module and the radio frequency frequency module. In addition to the baseband digital circuit module, the printed circuit board including the baseband digital circuit module may also include a beamforming module. In addition to the printed circuit board including the antenna module and the printed circuit board including the baseband digital circuit module, there may also be another printed circuit board including the power module.

Another aspect of the disclosure provides a circuit structure for base station and satellite communication, including a plurality of printed circuit boards, and data and/or signals can be transmitted between each printed circuit board through any digital interface and/or analog interface; wherein at least one printed circuit board includes an antenna module; at least another printed circuit board includes a power module. In addition to the antenna module, the printed circuit board including the antenna module may also include a radio frequency front-end module, a radio frequency module, a beam forming module, and a baseband digital circuit module.

According to the above, the radio frequency unit, base station, and satellite communication circuit structure of this disclosure use multiple printed circuit boards. By arranging each module on the multiple printed circuit boards, in addition to achieving the functions that the original system should have, it can also optimize the overall performance of the system and provide new functions as follows. First of all, due to the use of multiple printed circuit boards, compared with a single printed circuit board, the heat dissipation area is larger, so the heat dissipation effect is better. Secondly, since circuit components can be placed on multiple printed circuit boards, components that are likely to cause electromagnetic interference and electromagnetic compatibility problems can be placed on different printed circuit boards to make the distance between them longer and reduce noise and interference. Moreover, since a multi-chip PCB architecture is used, its stability and lifespan are likely to be better than those of a single-chip PCB architecture. For example, in the application of a radio frequency unit with multiple antennas, especially when the number of antennas is large, even if the PCBs of some antenna branches or their internal components are damaged, although the performance may be reduced, the overall system still has a chance to operate normally, which can prolong the service life. Furthermore, when some internal components of the printed circuit board are damaged, only the damaged printed circuit board and its components need to be replaced. Only components are needed instead of replacing the whole system, so it is easy to repair. Furthermore, since the manufacturing complexity of the multi-chip printed circuit board structure is relatively low, the overall circuit cost can be reduced, and the yield rate of mass production can be improved. In addition, the circuit structure disclosed in the disclosure is particularly suitable for wireless communication systems with a large number of antennas, such as Massive Multiple-Input Multiple-Output (Massive MIMO) base stations. Under the condition of the same data transmission rate, the large MIMO antenna base station can effectively reduce the transmit power (Transmit Power) of user equipment (UE) such as mobile phone (Cell Phone) and base station as the number of antennas increases, and the reduced transmit power is proportional to the number of antennas, that is to say, the more the number of antennas, the more the reduced transmit power. Therefore, the power consumption (Power Consumption) of mobile phones and base stations can be reduced, and the green technology effect of energy saving and carbon reduction can be achieved.

To sum up the above, in addition to achieving the proper functions, the circuit structure disclosed in this disclosure can also optimize the overall performance and provide additional functions, including better heat dissipation, reduced noise and interference, longer service life, easy maintenance and update, suitable for mass production and low circuit cost, and has the effect of energy saving and carbon reduction. Among them, due to good heat dissipation efficiency, it is more suitable for base stations and satellite communication systems that require high heat dissipation; low noise and interference can improve the stability and performance of base stations and satellite communication systems; longer service life, easy maintenance and update are more suitable for use in base stations and satellite communication systems. Especially in the application of base stations, telecom operators usually require base stations to have a long service life, such as a lifespan of more than 10 years. Therefore, with the update of international communication standards, their internal circuits may need to be modified or updated; suitable for mass production and low circuit cost, as well as energy-saving and carbon-reducing functions, will help the construction and deployment of a large number of fifth-generation (5G) and even sixth-generation (6G) mobile communication base stations in the future.

10: Wireless communication base station with radio frequency unit

11a to 11c, 44, 54, 63, 72: front-end interface

100a to 100c: radio frequency unit

120,220,320: support frame

130: Distribution unit

20: Wireless communication base station

200a to 200c: base stations

30: Satellite communication ground station

300: ground station

41,81: bidirectional analog interface

42,43,52,53,62,71,82,83,92,93,101: one-way analog interface

400,500,600,700: RF unit circuit architecture

410,420,430,510,520,530,610,620,710,720,810,820,830,910,920, 930, 1010, 1020: printed circuit boards

411,511,611,711,811,911,1011: antenna module

412,512,612,712,812,912,1012: RF front-end modules

421,513,613,713,821,913,1013: RF modules

422,521,621,714: communication digital signal processing modules

423,522,622,715,822,921,1014: beamforming modules

424,523,623,716: fronthaul interface modules

431,531,624,721,831,931,1021: power module

51,61,91: bi-directional digital interface

800,900,1000: base station and satellite communication circuit structure

In order to make the content and embodiments of this disclosure more obvious and understandable, the description of the accompanying drawings is as follows:

[FIG. 1] shows a schematic diagram of a wireless communication base station with a radio frequency unit.

[FIG. 2] shows a schematic diagram of a wireless communication base station.

[Fig. 3] shows a schematic diagram of a satellite communication ground station.

[ FIG. 4 ] is a schematic diagram illustrating a circuit structure of a radio frequency unit according to an embodiment of the present disclosure.

[ FIG. 5 ] is a schematic diagram illustrating a circuit structure of a radio frequency unit according to another embodiment of the present disclosure.

[ FIG. 6 ] is a schematic diagram illustrating a circuit structure of a radio frequency unit according to another embodiment of the present disclosure.

[ FIG. 7 ] is a schematic diagram illustrating a circuit structure of a radio frequency unit according to another embodiment of the present disclosure.

[ FIG. 8 ] is a schematic diagram illustrating a base station and satellite communication circuit structure according to another embodiment of the present disclosure.

[ FIG. 9 ] is a schematic diagram illustrating a base station and satellite communication circuit structure according to another embodiment of the present disclosure.

[ FIG. 10 ] is a schematic diagram illustrating a base station and satellite communication circuit architecture according to an embodiment of the present disclosure.

The following is a detailed description of the embodiments in conjunction with the accompanying drawings, but the provided embodiments are not intended to limit the scope covered herein. Any structure resulting from the recombination of components, resulting in Devices with equivalent functions are within the scope of this article. In addition, the drawings are for illustrative purposes only and are not drawn to original scale.

The terms "first", "second", etc. used herein do not refer to a particular order or sequence, nor are they used to limit the present invention, but are only used to distinguish between different items described.

Regarding the "multiple printed circuit board" used in this article is a multi-piece printed circuit board, which refers to at least two or more printed circuit boards, each of which can be single-sided (Single-Sided) or single-layer (Single Layer), double-sided (Double-Sided) or double-layer (Double Layer), or multi-layer (Multilayer) printed circuit boards, or any mixture of these three.

Regarding the "two-way transmission" used herein, it means: if A transmits signals or data to B in both directions, it means that A can transmit signals or data to B and/or B can transmit signals or data to A.

As used herein, "Radio Unit (RU)" refers to a system with an antenna, a radio frequency analog circuit, and a digital circuit. For example, the Open Radio Unit (O-RU) stipulated by the Open Radio Access Network (O-RAN) organization belongs to the radio frequency unit referred to herein. Other combined systems, such as open radio frequency unit (O-RU) plus open distributed unit (Open Distributed Unit, O-DU) and other combined systems, also belong to the radio frequency unit referred to herein.

The "Distributed Unit (DU)" used in this article refers to a system that is connected to a radio frequency unit through one or more interfaces and includes digital circuits related to the physical layer (Physical Layer, PHY). Open Wireless Access Network The Open Distributed Unit (O-DU) stipulated by the (O-RAN) organization belongs to the distribution unit referred to in this article. Other combinations, such as combined systems such as an open distribution unit plus an open central unit (Open Central Unit, O-CU), also belong to the distribution unit referred to herein.

The "fronthaul interface" used in this article refers to the interface connecting the radio frequency unit and the distribution unit. For example, the Fronthaul Interface stipulated by the Open Wireless Access Network Organization adopts the enhanced Common Public Radio Interface (eCPRI) protocol (Protocol), and includes the Control Plane (C-Plane), the User Plane (User Plane, U-Plane), the Synchronization Plane (Synchronization Plane, S-Plane), and the Management Plane (Management Plane). , M-Plane), which belongs to the pre-transfer interface referred to in this article.

Please refer to FIG. 1 , which shows a schematic diagram of a wireless communication base station with a radio frequency unit. The radio frequency units (RU) 100a to 100c integrate the antenna, the radio frequency analog circuit, and the digital circuit together, which can reduce or avoid the cable loss of the remote radio head (RRH). And because the radio frequency unit and the antenna are integrated, it is more suitable for active antenna architectures with a large number of antennas, such as Massive MIMO base stations, so the fifth generation (5G) mobile communication base stations can also use wireless communication base stations with radio frequency units. As shown in FIG. 1 , the wireless communication base station 10 includes radio frequency units 100a to 100c, a support frame 120, a distribution unit (DU) 130, and fronthaul interfaces 11a to 11c.

The supporting frame 120 is mainly used for supporting, and the radio frequency units 100a to 100c are installed on it, wherein each radio frequency unit 100a to 100c includes an antenna, a radio frequency analog circuit, and a digital circuit. Antennas are used to receive and transmit radio wave signals; RF analog circuits include RF front-end modules (FEM) and RF modules, which mainly perform RF analog signal processing; and digital circuits are mainly It is for low physical layer (Low Physical Layer, Low-PHY) related digital signal processing operations, including beamforming modules, communication digital signal processing modules, and fronthaul interface modules. The circuit structure of the radio frequency unit is the core of this disclosure, and details can be referred to the description of the embodiment in FIG. 4 to FIG. 7 . The radio frequency units 100a to 100c bidirectionally transmit digital data to the distribution unit 130 through the fronthaul interfaces 11a to 11c, wherein the distribution unit 130 performs the functions required by the base station including high physical layer (High Physical Layer, High-PHY), media access control (Media Access Control, MAC), and radio link control (Radio Link Control, RLC).

Please refer to FIG. 2 , which shows a schematic diagram of a wireless communication base station. Different from the wireless communication base station with the radio frequency unit shown in FIG. 1, the radio frequency unit can be separated from the distribution unit, the base stations (BS) 200a to 200c of the wireless communication base station 20 can integrate the internal modules of the distribution unit (DU) and the central unit (Central Unit, CU) in addition to the internal modules of the radio frequency unit (RU) to form an integrated base station. Among them, the distribution unit (DU) may include a baseband digital circuit with functions such as high physical layer (High-PHY), medium access control (MAC), and radio link control (RLC); and the central unit (CU) in this article refers to a system including a baseband digital circuit with functions such as Packet Data Convergence Protocol (PDCP) and Radio Resource Control (RRC). For example, the Open Central Unit (O-CU) stipulated by the Open Radio Access Network (O-RAN) organization belongs to the central unit referred to herein.

As shown in FIG. 2 , the wireless communication base station 20 includes base stations (BS) 200 a to 200 c and a supporting frame 220 . The supporting frame 220 is mainly used for supporting, and there are base stations 200a to 200c installed on it, wherein each base station 200a to 200c includes an antenna, a radio frequency analog circuit, and a digital circuit. The circuit structure of the base station is the core of this disclosure, details can refer to the embodiment in Figure 8 to Figure 10 description.

Please refer to FIG. 3 . FIG. 3 shows a schematic diagram of a satellite communication ground station. As shown in FIG. 3 , the satellite communication ground station 30 includes a ground station (Ground Station, GS) 300 and a supporting frame 320 . The supporting frame 320 is mainly used for supporting, and the ground station 300 is installed on it, wherein the ground station 300 includes an antenna, a radio frequency analog circuit, and a digital circuit. The circuit structure of the ground station is the core of this disclosure, and details can be referred to the description of the embodiment in FIG. 8 to FIG. 10 .

Please refer to FIG. 4 . FIG. 4 is a schematic diagram illustrating a circuit structure of a radio frequency unit according to an embodiment of the present disclosure. As shown in FIG. 4 , the radio frequency unit circuit structure 400 includes a first printed circuit board 410 , a second printed circuit board 420 , a third printed circuit board 430 , an analog interface 41 , an analog interface 42 , an analog interface 43 , and a fronthaul interface 44 .

The first printed circuit board 410 includes an antenna module 411 and a radio frequency front-end module (FEM) 412 . The antenna module 411 includes receiving and transmitting antennas for receiving and transmitting radio wave signals. The number of antennas can be a single antenna or multiple antennas, especially suitable for antenna arrays with a large number of antennas, such as Massive MIMO with 32 antennas, 64 antennas, 128 antennas or more. The RF front-end module (FEM) 412 includes one or more Transmit/Receive (T/R) switches (Switch), power amplifiers (Power Amplifier, PA), and low noise amplifiers (Low Noise Amplifier, LNA). The generated radio frequency signal is amplified and then output to the antenna module; the low noise amplifier on the receiving circuit amplifies the signal received by the antenna module and then outputs it to the radio frequency module 421 in the second printed circuit board 420 through the analog interface 41.

The second printed circuit board 420 includes a radio frequency module 421 , a communication digital signal processing module 422 , a beamforming module 423 , and a fronthaul interface module 424 .

The radio frequency module 421 includes one or more frequency converters (Up/Down Converter), filters (Filter), amplifiers (Amplifier) and/or attenuators (Attenuator). Its main functions are frequency reduction, filtering, and signal amplification and attenuation of radio frequency analog signals. In the part of the transmission circuit, firstly, the analog signal generated by the Digital to Analog Converter (DAC) in the communication digital signal processing module 422 will be processed by the filter for filtering (Filtering), and the gain (Gain) will be adjusted through the amplifier or attenuator, and then the frequency of the signal will be raised to the carrier frequency (Carrier Frequency) of the transmission signal through the up converter (Up Converter), and output to the first printed circuit board 4 through the analog interface 41 10. The RF front-end module 412. In the part of the receiving circuit, firstly, the received signal provided by the RF front-end module 412 of the first printed circuit board 410 will be input to the down converter (Down Converter) and filter through the analog interface 41 for down-converter and filter processing, and the gain is adjusted through the amplifier or attenuator, and then the signal is output to the analog-to-digital converter (Analog to Digital Converter, ADC) in the communication digital signal processing module 422.

The communication digital signal processing module 422 includes a transmission circuit and a reception circuit. The transmission part includes Inverse Fast Fourier Transform (IFFT), Cyclic Prefix Addition (CP Addition), Crest Factor Reduction (CFR), Digital Pre-distortion (Digital Pre-distortion, DPD), Digital Upconverter (Digital Up Converter) verter, DUC), and digital to analog converter (Digital to Analog Converter, DAC). First, the frequency domain (Frequency Domain) signal will be orthogonalized through inverse fast Fourier transform (IFFT) and cyclic prefix (CP Addition) The frequency division multiplexing (Orthogonal Frequency Division Multiplexing, OFDM) modulation operation converts the frequency domain signal into a time domain (Time Domain) signal, and then limits the size of the signal within the set dynamic range through crest factor reduction (CFR), and then compensates the nonlinear distortion of the power amplifier (PA) in the RF front-end module (FEM) 412 through digital predistortion (DPD). Finally, the signal sampling frequency is increased and/or frequency shifted by a digital up-converter (DUC), and the digital signal is converted into an analog signal by a digital-to-analog converter (DAC), and then output to the radio frequency module 421 .

The communication digital signal processing module 422 includes an analog-to-digital converter (ADC), a digital down converter (Digital Down Converter, DDC), a cyclic prefix removal (Cyclic Prefix Removal, CP Removal), and a fast Fourier transform (Fourier Transform, FFT). First, the analog signal output by the radio frequency module 421 is converted into a digital signal through an analog-to-digital converter (ADC), and then the signal sampling frequency is reduced and/or frequency shifted through a digital down-converter (DDC). Finally, the demodulation operation of Orthogonal Frequency Division Multiplexing (OFDM) is performed by removing the cyclic prefix (CP Removal) and fast Fourier transform (FFT) to convert the time-domain signal into a frequency-domain signal.

The communication digital signal processing module 422 may also include the following modules: physical random access channel (Physical Random Access Channel, PRACH) processing, automatic gain control (Automatic Gain Control, AGC), OFDM Phase Compensation (OFDM Phase Compensation), antenna calibration (Antenna Calibration), and in-phase and quadrature (In-phase and Quadrature, I/Q) signal compression (Compression) and Decompression. Among them, the processing of the physical random access channel is mainly for correlation filtering (Filtering) processing of the physical random access channel; the automatic gain control is used to achieve the function of automatic gain adjustment; Compression and decompression are used to reduce the data required to be transmitted and received by the fronthaul interface.

The beamforming module 423 mainly performs uplink (Uplink) and downlink (downlink) beamforming calculations. In the uplink part, the beamforming calculation mainly converts the digital signals received by each antenna into corresponding data streams (Data Stream) of each user; in the downlink part, the beamforming calculation mainly converts the data stream to be transmitted to each user into a digital signal corresponding to each antenna.

The fronthaul interface module 424 is a transmitter and receiver of the fronthaul interface, which can transmit the data of the radio frequency unit to the distribution unit through the fronthaul interface 44 and receive the data transmitted from the distribution unit to the radio frequency unit through the fronthaul interface 44 .

As shown in FIG. 4 , between the first printed circuit board 410 and the second printed circuit board 420, data can be bidirectionally transmitted through one or a plurality of analog interfaces 41, wherein the analog interface 41 is an analog signal interface, which can be used as a bidirectional transmission interface between the radio frequency front-end module (FEM) 412 and the radio frequency module 421.

The third printed circuit board 430 includes a power supply module 431, which is a power supply circuit and can provide power to the second printed circuit board and the internal modules of the first printed circuit board through one or a plurality of analog interfaces 42 and analog interfaces 43, wherein the analog interface 42 and the analog interface 43 can be any analog interface that can transmit power, such as a power cord or a power socket.

The components or circuits of the various modules in this disclosure can be combined arbitrarily, which also falls within the scope of this disclosure. For example, the radio frequency module 421 of the second printed circuit board 420 can be a radio frequency integrated circuit (RF Integrated Circuit, RFIC) and integrate some digital circuits in the communication digital signal processing module 422, such as digital predistortion (DPD), crest factor reduction (CFR), automatic gain control (AGC), digital-to-analog converter (DAC), analog-to-digital converter (ADC), digital upconverter (DUC), and digital down-converter (DDC) and other digital circuits.

Please refer to FIG. 5 . FIG. 5 is a schematic diagram illustrating a circuit structure of a radio frequency unit according to an embodiment of the present disclosure. As shown in FIG. 5 , the radio frequency unit circuit structure 500 includes a first printed circuit board 510 , a second printed circuit board 520 , a third printed circuit board 530 , a digital interface 51 , an analog interface 52 , an analog interface 53 , and a fronthaul interface 54 .

The first printed circuit board 510 includes an antenna module 511 , a radio frequency front-end module (FEM) 512 , and a radio frequency module 513 . The antenna module 511 includes receiving and transmitting antennas for receiving and transmitting radio wave signals. The number of antennas can be a single antenna or multiple antennas, especially suitable for antenna arrays with a large number of antennas, such as Massive MIMO with 32 antennas, 64 antennas, 128 antennas or more. RF front module (FEM) 512, including one or multiple transmission receiving switch (T/R SWITCH), power amplifier (PA), and Low Scholars (LNA). Among them, the transmission receiver is used as a switch between the transmission circuit and the receiving circuit. The signal is output to an antenna module after large -scale processing; the low noise amplifier on the receiving circuit will be output to the RF module 513 after the signal received by the antenna module.

In this embodiment, the radio frequency module 513 is a radio frequency integrated circuit (RFIC). In addition to including one or a plurality of radio frequency analog circuits such as Up/Down Converter (Up/Down Converter), Filter (Filter), Amplifier (Amplifier) and/or Attenuator (Attenuator), it also integrates some digital circuits, including digital predistortion (DPD), crest factor reduction (CFR), automatic gain control (AGC), digital analog converter (DAC), analog digital Digital circuits such as converters (ADC), digital upconverters (DUC), and digital downconverters (DDC).

The second printed circuit board 520 includes a communication digital signal processing module 521, a beam Forming module 522 and front-end interface module 523 .

The communication digital signal processing module 521 includes inverse fast Fourier transform (IFFT) and adding cyclic prefix (CP Addition) in the transmitting part; and fast Fourier transform (FFT) and removing cyclic prefix (CP Removal) in the receiving part. Other digital circuits such as digital predistortion (DPD), crest factor reduction (CFR), automatic gain control (AGC), digital-to-analog converter (DAC), analog-to-digital converter (ADC), digital up-converter (DUC), and digital down-converter (DDC) have been integrated into the radio frequency integrated circuit (RFIC) of the radio frequency module 513 . The communication digital signal processing module 521 may also include the following modules: physical random access channel processing, OFDM phase compensation, antenna calibration, and compression and decompression of in-phase and quadrature signals. In addition, the communication digital signal processing module 521 bidirectionally transmits digital data to the digital circuit in the radio frequency module 513 through one or a plurality of digital interfaces 51 .

The beamforming module 522 mainly performs uplink and downlink beamforming calculations. In the uplink part, the beamforming calculation mainly converts the digital signals received by each antenna into corresponding data streams of each user; in the downlink part, the beamforming calculation mainly converts the data streams to be transmitted to each user into digital signals corresponding to each antenna.

The fronthaul interface module 523 is a transmitter and receiver of the fronthaul interface, which can transmit the data of the radio frequency unit to the distribution unit through the fronthaul interface 54 and receive the data transmitted from the distribution unit to the radio frequency unit through the fronthaul interface 54 .

As shown in FIG. 5 , the first printed circuit board 510 and the second printed circuit board 520 can transmit data bidirectionally through one or more digital interfaces 51, wherein the digital interface 51 can pass through interfaces such as JESD204 (A/B/C), Low-Voltage Differential Signaling (Low-Voltage Differential Signaling, LVDS), PCIe (Peripheral Component Interconnect Express), etc. Or any other form of interface to achieve.

The third printed circuit board 530 includes a power supply module 531, which is a power supply circuit and can provide power to the second printed circuit board and the internal modules of the first printed circuit board through one or a plurality of analog interfaces 52 and analog interfaces 53, wherein the analog interface 52 and the analog interface 53 can be any analog interface that can transmit power, such as a power cord or a power socket.

Please refer to FIG. 6 . FIG. 6 is a schematic diagram illustrating a circuit structure of a radio frequency unit according to an embodiment of the present disclosure. As shown in FIG. 6 , the radio frequency unit circuit structure 600 includes a first printed circuit board 610 , a second printed circuit board 620 , a digital interface 61 , an analog interface 62 , and a fronthaul interface 63 .

The first printed circuit board 610 includes an antenna module 611 , a radio frequency front-end module (FEM) 612 , and a radio frequency module 613 . The antenna module 611 includes receiving and transmitting antennas for receiving and transmitting radio wave signals. The number of antennas can be a single antenna or multiple antennas, especially suitable for antenna arrays with a large number of antennas, such as Massive MIMO with 32 antennas, 64 antennas, 128 antennas or more. RF front module (FEM) 612, including one or multiple transmission receiving switch (T/R SWITCH), power amplifier (PA), and low noise amplifier (LNA). The transmission receiver is used as a switch between the transmission circuit and the receiving circuit. The signal is output to an antenna module after large -scale processing; the low noise amplifier on the receiving circuit will be output to the RF module 613 after the signal received by the antenna module.

In this embodiment, the radio frequency module 613 is a radio frequency integrated circuit (RFIC), which not only includes one or a plurality of frequency converters (Up/Down Converter), filter (Filter), amplifier (Amplifier) and/or attenuator (Attenuator) and other radio frequency analog circuits, but also integrates some digital circuits. The circuit includes digital pre-distortion (DPD), crest factor reduction (CFR), automatic gain control (AGC), digital-to-analog converter (DAC), analog-to-digital converter (ADC), digital up-converter (DUC), and digital down-converter (DDC) and other digital circuits.

The second printed circuit board 620 includes a communication digital signal processing module 621 , a beamforming module 622 , a fronthaul interface module 623 , and a power module 624 .

In the communication digital signal processing module 621, the transmitting part includes inverse fast Fourier transform (IFFT) and adding cyclic prefix (CP Addition); and the receiving part includes fast Fourier transform (FFT) and removing cyclic prefix (CP Removal). Other digital circuits such as digital predistortion (DPD), crest factor reduction (CFR), automatic gain control (AGC), digital-to-analog converter (DAC), analog-to-digital converter (ADC), digital up-converter (DUC), and digital down-converter (DDC) have been integrated into the radio frequency integrated circuit (RFIC) of the radio frequency module 613 . The communication digital signal processing module 621 may also include the following modules: physical random access channel processing, OFDM phase compensation, antenna calibration, and compression and decompression of in-phase and quadrature signals. In addition, the communication digital signal processing module 621 can bidirectionally transmit data to the radio frequency module 613 of the first printed circuit board through the digital interface 61 .

The beamforming module 622 mainly performs uplink and downlink beamforming calculations. In the uplink part, the beamforming calculation mainly converts the digital signals received by each antenna into corresponding data streams of each user; in the downlink part, the beamforming calculation mainly converts the data streams to be transmitted to each user into digital signals corresponding to each antenna.

The fronthaul interface module 623 is a transmitter and receiver of the fronthaul interface, which can transmit the data of the radio frequency unit to the distribution unit through the fronthaul interface 63 and receive the data transmitted from the distribution unit to the radio frequency unit through the fronthaul interface 63 .

The power supply module 624 is a power circuit and can provide power to the internal modules of the first printed circuit board through one or a plurality of analog interfaces 62, wherein the analog interface 62 can be any analog interface that can transmit power, such as a power cord or a power slot.

As shown in FIG. 6, data can be bidirectionally transmitted between the first printed circuit board 610 and the second printed circuit board 620 through one or a plurality of digital interfaces 61, wherein the digital interface 61 can be realized through interfaces such as JESD204 (A/B/C), low voltage differential signal, PCIe, or any other form of interface.

Please refer to FIG. 7 . FIG. 7 is a schematic diagram illustrating a circuit structure of a radio frequency unit according to an embodiment of the present disclosure. As shown in FIG. 7 , the radio frequency unit circuit structure 700 includes a first printed circuit board 710 , a second printed circuit board 720 , an analog interface 71 , and a fronthaul interface 72 .

The first printed circuit board 710 includes an antenna module 711 , a radio frequency front-end module (FEM) 712 , a radio frequency module 713 , a communication digital signal processing module 714 , a beamforming module 715 , and a fronthaul interface module 716 .

The antenna module 711 includes receiving and transmitting antennas for receiving and transmitting radio wave signals. The number of antennas can be a single antenna or multiple antennas, especially suitable for antenna arrays with a large number of antennas, such as Massive MIMO with 32 antennas, 64 antennas, 128 antennas or more. RF front module (FEM) 712 contains one or multiple transmission receiving switch (T/R SWITCH), power amplifier (PA), and Low Scholars (LNA). Among them, the transmission receiver is a switch between the transmission circuit and the receiving circuit; The signal is output to an antenna module after large -scale processing; the low noise amplifier on the receiving circuit will be output to the RF module 713 after the signal received by the antenna module.

In this embodiment, the radio frequency module 713 is a radio frequency integrated circuit (RFIC). In addition to including one or a plurality of radio frequency analog circuits such as Up/Down Converter (Up/Down Converter), Filter (Filter), Amplifier (Amplifier) and/or Attenuator (Attenuator), it also integrates some digital circuits, including digital predistortion (DPD), crest factor reduction (CFR), automatic gain control (AGC), digital analog converter (DAC), analog digital Digital circuits such as converters (ADC), digital upconverters (DUC), and digital downconverters (DDC).

In the communication digital signal processing module 714, the transmitting part includes inverse fast Fourier transform (IFFT) and adding cyclic prefix (CP Addition); and the receiving part includes fast Fourier transform (FFT) and removing cyclic prefix (CP Removal). Other digital circuits such as digital predistortion (DPD), crest factor reduction (CFR), automatic gain control (AGC), digital-to-analog converter (DAC), analog-to-digital converter (ADC), digital up-converter (DUC), and digital down-converter (DDC) have been integrated into the radio frequency integrated circuit (RFIC) of the radio frequency module 713. The communication digital signal processing module 714 may also include the following modules: physical random access channel processing, OFDM phase compensation, antenna calibration, and compression and decompression of in-phase and quadrature signals.

The beamforming module 715 mainly performs uplink and downlink beamforming calculations. In the uplink part, the beamforming calculation mainly converts the digital signals received by each antenna into corresponding data streams of each user; in the downlink part, the beamforming calculation mainly converts the data streams to be transmitted to each user into digital signals corresponding to each antenna.

The fronthaul interface module 716 is a transmitter and receiver of the fronthaul interface, capable of transmitting the data of the radio frequency unit to the distribution unit through the fronthaul interface 72 and receiving the data transmitted from the distribution unit to the radio frequency unit through the fronthaul interface 72 .

The second printed circuit board 720 includes a power module 721, which is a power circuit and The power supply to the internal modules of the first printed circuit board can be provided through one or more analog interfaces 71, wherein the analog interface 71 can be any analog interface capable of transmitting power, such as a power cord or a power socket.

Please refer to FIG. 8 . FIG. 8 is a schematic diagram illustrating a circuit architecture for base station and satellite communication according to an embodiment of the present disclosure. As shown in FIG. 8 , the base station and satellite communication circuit structure 800 includes a first printed circuit board 810 , a second printed circuit board 820 , a third printed circuit board 830 , an analog interface 81 , an analog interface 82 , an analog interface 83 , and a fronthaul interface 84 .

The first printed circuit board 810 includes an antenna module 811 and a radio frequency front-end module (FEM) 812 . The antenna module 811 includes receiving and transmitting antennas for receiving and transmitting radio wave signals. The number of antennas can be a single antenna or multiple antennas, especially suitable for antenna arrays with a large number of antennas, such as Massive MIMO with 32 antennas, 64 antennas, 128 antennas or more. The radio frequency front-end module (FEM) 812 includes one or a plurality of transmitting and receiving switches (T/R Switch), power amplifier (PA), and low noise amplifier (LNA). The signal received by the antenna module is amplified and then output to the radio frequency module 821 in the second printed circuit board 820 through the analog interface 81 .

The second printed circuit board 820 includes a radio frequency module 821 , a beamforming module 822 , and a baseband digital circuit module 823 .

The radio frequency module 821 includes one or more frequency converters (Up/Down Converter), filter (Filter), amplifier (Amplifier) and/or attenuator (Attenuator). That The main functions are the frequency reduction, filtering, and signal amplification and attenuation of the RF analog signal.

The beamforming module 822 mainly performs uplink and downlink beamforming calculations. In the uplink part, the beamforming calculation mainly converts the digital signals received by each antenna into corresponding data streams of each user; in the downlink part, the beamforming calculation mainly converts the data streams to be transmitted to each user into digital signals corresponding to each antenna.

The baseband digital circuit module 823 herein and in this embodiment refers to a digital circuit related to communication baseband calculations. For example, in base station applications, the base frequency digital circuit module 823 may include the digital circuit of the communication digital signal processing module in the radio frequency unit (RU), and may also include the base frequency digital circuit of the distribution unit (DU) and/or the central unit (CU); in the satellite communication application, the base frequency digital circuit module 823 is a communication base frequency operation digital circuit related to satellite communication, for example, it may include digital circuits for operations such as modulation (Modulation) and demodulation (Demodulation).

As shown in FIG. 8 , the first printed circuit board 810 and the second printed circuit board 820 transmit data bidirectionally through one or a plurality of analog interfaces 81, wherein the analog interface 81 is an interface for analog signals and can be used as a bidirectional transmission interface between the radio frequency front-end module (FEM) 812 and the radio frequency module 821.

The third printed circuit board 830 includes a power supply module 831, which is a power circuit and can provide power to the second printed circuit board and the internal modules of the first printed circuit board through one or a plurality of analog interfaces 82 and 83, wherein the analog interface 82 and the analog interface 83 can be any analog interface that can transmit power, such as a power cord or a power socket.

Please refer to FIG. 9 . FIG. 9 is a schematic diagram illustrating a circuit architecture for base station and satellite communication according to an embodiment of the present disclosure. As shown in Figure 9, the base station and satellite communication circuit The architecture 900 includes a first printed circuit board 910 , a second printed circuit board 920 , a third printed circuit board 930 , a digital interface 91 , an analog interface 92 , and an analog interface 93 .

The first printed circuit board 910 includes an antenna module 911 , a radio frequency front-end module (FEM) 912 , and a radio frequency module 913 . The antenna module 911 includes receiving and transmitting antennas for receiving and transmitting radio wave signals. The number of antennas can be a single antenna or multiple antennas, especially suitable for antenna arrays with a large number of antennas, such as Massive MIMO with 32 antennas, 64 antennas, 128 antennas or more. RF front module (FEM) 912, including one or multiple transmission receiving switch (T/R SWITCH), power amplifier (PA), and Low Scholars (LNA). Among them, the transmission receiver is a switch between the transmission circuit and the receiving circuit. The signal is output to the antenna module after large processing; the low noise amplifier on the receiving circuit will be output to the RF module 913 after the signal received by the antenna module.

In this embodiment, the radio frequency module 913 is a radio frequency integrated circuit (RFIC). In addition to including one or a plurality of radio frequency analog circuits such as Up/Down Converter (Up/Down Converter), Filter (Filter), Amplifier (Amplifier) and/or Attenuator (Attenuator), some digital circuits can also be integrated, including digital predistortion (DPD), crest factor reduction (CFR), automatic gain control (AGC), digital analog converter (DAC), analog digital Digital circuits such as digital converter (ADC), digital up-converter (DUC), and digital down-converter (DDC).

The second printed circuit board 920 includes a beamforming module 921 and a fundamental frequency digital circuit module 922 .

The beamforming module 921 is mainly used for uplink and downlink beamforming calculations. In the uplink part, the beamforming calculation is mainly to convert the digital signals received by each antenna In the downlink part, the beamforming operation mainly converts the data stream to be transmitted to each user into a digital signal corresponding to each antenna.

The baseband digital circuit module 922 herein and in this embodiment refers to a digital circuit related to communication baseband calculations. For example, in base station applications, the baseband digital circuit module 922 can include the digital circuit of the communication digital signal processing module in the radio frequency unit (RU), and can also include the baseband digital circuit of the distributed unit (DU) and/or central unit (CU); in the satellite communication application, the baseband digital circuit module 922 is a communication baseband operation digital circuit related to satellite communication, for example, it can include digital circuits for operations such as modulation (Modulation) and demodulation (Demodulation).

As shown in FIG. 9, data is bidirectionally transmitted between the first printed circuit board 910 and the second printed circuit board 920 through one or a plurality of digital interfaces 91, wherein the digital interfaces 91 can be realized through interfaces such as JESD204 (A/B/C), low-voltage differential signaling, PCIe, or other interfaces.

The third printed circuit board 930 includes a power supply module 931, which is a power supply circuit and can provide power to the second printed circuit board and the internal modules of the first printed circuit board through one or a plurality of analog interfaces 92 and 93, wherein the analog interface 92 and the analog interface 93 can be any analog interface that can transmit power, such as a power cord or a power slot.

Please refer to FIG. 10 . FIG. 10 is a schematic diagram illustrating a circuit architecture for base station and satellite communication according to an embodiment of the present disclosure. As shown in FIG. 10 , the base station and satellite communication circuit structure 1000 includes a first printed circuit board 1010 , a second printed circuit board 1020 , and an analog interface 101 .

The first printed circuit board 1010 includes an antenna module 1011 , a radio frequency front-end module (FEM) 1012 , a radio frequency module 1013 , a beamforming module 1014 , and a baseband digital circuit module 1015 .

The antenna module 1011 includes receiving and transmitting antennas for receiving and transmitting radio wave signals. The number of antennas can be a single antenna or multiple antennas, especially suitable for antenna arrays with a large number of antennas, such as Massive MIMO with 32 antennas, 64 antennas, 128 antennas or more. The radio frequency front-end module (FEM) 1012 includes one or more transmit and receive switches (T/R Switch), power amplifier (PA), and low noise amplifier (LNA). 13.

In this embodiment, the radio frequency module 1013 is a radio frequency integrated circuit (RFIC). In addition to including one or a plurality of radio frequency analog circuits such as Up/Down Converter (Up/Down Converter), Filter (Filter), Amplifier (Amplifier) and/or Attenuator (Attenuator), some digital circuits can also be integrated, including digital predistortion (DPD), crest factor reduction (CFR), automatic gain control (AGC), digital-to-analog converter (DAC), analog Digital circuits such as digital converter (ADC), digital up-converter (DUC), and digital down-converter (DDC).

The beamforming module 1014 mainly performs uplink and downlink beamforming calculations. In the uplink part, the beamforming calculation mainly converts the digital signals received by each antenna into corresponding data streams of each user; in the downlink part, the beamforming calculation mainly converts the data streams to be transmitted to each user into digital signals corresponding to each antenna.

The baseband digital circuit module 1015 refers to the digital circuit related to communication baseband calculation in this article and this embodiment. For example, in the base station application, the base frequency digital circuit module 1015 may include the digital circuit of the communication digital signal processing module in the radio frequency unit (RU), and may also include the distribution unit (DU) and/or the base frequency digital circuit of the central unit (CU); in the satellite communication application, the base frequency digital circuit module 1015 is a communication base frequency calculation digital circuit related to satellite communication, such as a digital circuit that can include operations such as modulation (Modulation) and demodulation (Demodulation).

The second printed circuit board 1020 includes a power supply module 1021, which is a power circuit and can provide power to the internal modules of the first printed circuit board through one or a plurality of analog interfaces 101, wherein the analog interface 101 can be any analog interface capable of transmitting power, such as a power cord or a power socket.

41: Two-way analog interface

42,43: One-way analog interface

44: Front pass interface

400: RF unit circuit architecture

410, 420, 430: printed circuit boards

411:Antenna module

412:RF front-end module

421: RF module

422:Communication digital signal processing module

423: Beamforming Module

424:Fronthaul interface module

431: Power module

Claims (12)

A circuit structure for a radio frequency unit, including a plurality of printed circuit boards, data and/or signals can be transmitted between the printed circuit boards through any form and any number of one-way or two-way digital interfaces and/or analog interfaces; at least one of the printed circuit boards includes an antenna module; at least another printed circuit board includes a fronthaul interface module. According to the circuit structure of claim 1, one of the printed circuit boards containing the antenna module includes not only the antenna module, but also a radio frequency front-end module; the other printed circuit board containing the fronthaul interface module includes not only the fronthaul interface module, but also a radio frequency module, a communication digital signal processing module, and a beamforming module, wherein the radio frequency front-end module includes one or a plurality of transmit and receive switches, power amplifiers, and low noise amplifiers; wherein the radio frequency module includes one or a plurality of upconverters, downconverters, filters , and amplifiers and/or attenuators; wherein the communication digital signal processing module includes at least one or a combination of more of the following: inverse fast Fourier transform, adding cyclic prefix, crest factor reduction, digital predistortion, digital up-converter, digital-to-analog converter, analog-to-digital converter, digital down-converter, cyclic prefix removal, fast Fourier transform, physical random access channel processing, automatic gain control, orthogonal frequency division multiplexing phase compensation, antenna correction, and compression and decompression of in-phase and quadrature signals. According to the circuit structure of claim 1, one of the printed circuit boards containing the antenna module includes not only the antenna module, but also a radio frequency front-end module and a radio frequency module; the other printed circuit board containing the front-haul interface module also includes a communication digital signal processing module and a beamforming module in addition to the front-haul interface module, wherein the radio frequency front-end module includes one or a plurality of transmitting and receiving switches, power amplifiers, and low noise amplifiers; wherein the radio frequency module includes one or more upconverters, downconverters, filters, And amplifiers and/or attenuators; wherein the communication digital signal processing module includes at least one of or a combination of more of the following: inverse fast Fourier transform, adding cyclic prefix, crest factor reduction, digital pre-distortion, digital up-converter, digital-to-analog converter, analog-to-digital converter, digital down-converter, cyclic prefix removal, fast Fourier transform, physical random access channel processing, automatic gain control, orthogonal frequency division multiplexing phase compensation, antenna correction, and compression and decompression of in-phase and quadrature signals. According to the circuit structure of claim 1, in addition to at least one printed circuit board including the antenna module and another printed circuit board including the fronthaul interface module, there is at least another printed circuit board including the power module. A circuit structure for a radio frequency unit, including a plurality of printed circuit boards, data and/or signals can be transmitted between the printed circuit boards through any form and any number of one-way or two-way digital interfaces and/or analog interfaces; at least one of the printed circuit boards includes an antenna module; at least another printed circuit board includes a power module. According to the circuit structure of claim 5, in addition to the antenna module, one of the printed circuit boards containing the antenna module also includes a radio frequency front-end module, a radio frequency module, a communication digital signal processing module, and a beamforming module, wherein the radio frequency front-end module includes one or a plurality of transmitting and receiving switches, power amplifiers, and low noise amplifiers; wherein the radio frequency module includes one or a plurality of up-converters, down-converters, filters, and amplifiers and/or attenuators; wherein the communication digital signal processing module includes at least one or more of the following combinations : Inverse Fast Fourier Transform, Adding Cyclic Prefix, Crest Factor Reduction, Digital Predistortion, Digital Upconverter, Digital-to-Analog Converter, Analog-to-Digital Converter, Digital Downconverter, Removal of Cyclic Prefix, Fast Fourier Transform, Physical Random Access Channel Processing, Automatic Gain Control, OFDM Phase Compensation, Antenna Correction, and Compression and Decompression of In-phase and Quadrature Signals. A circuit structure for base stations and satellite communications, including a plurality of printed circuit boards, data and/or signals can be transmitted between the printed circuit boards through any form and any number of one-way or two-way digital interfaces and/or analog interfaces; at least one of the printed circuit boards includes an antenna module; at least another printed circuit board includes a baseband digital circuit module. According to the circuit structure of claim 7, one of the printed circuit boards containing the antenna module includes not only the antenna module but also a radio frequency front-end module; the other printed circuit board containing the base frequency digital circuit module also includes a radio frequency module and a beamforming module in addition to the base frequency digital circuit module, wherein the radio frequency front end module includes one or a plurality of transmit and receive switches, power amplifiers, and low noise amplifiers; wherein the radio frequency module includes one or a plurality of upconverters, downconverters, filters, and amplifiers and/or attenuators device. According to the circuit structure of claim 7, one of the printed circuit boards containing the antenna module also includes a radio frequency front-end module and a radio frequency module in addition to the antenna module; the other printed circuit board containing the base frequency digital circuit module includes a beamforming module in addition to the base frequency digital circuit module, wherein the radio frequency front end module includes one or a plurality of transmit and receive switches, power amplifiers, and low noise amplifiers; wherein the radio frequency module includes one or a plurality of upconverters, downconverters, filters, and amplifiers and/or attenuators device. According to the circuit structure of claim 7, in addition to at least one printed circuit board including the antenna module and another printed circuit board including the baseband digital circuit module, there is at least another printed circuit board including the power module. A circuit structure for base stations and satellite communications, including a plurality of printed circuit boards, data and/or signals can be transmitted between the printed circuit boards through any form and any number of one-way or two-way any digital interface and/or analog interface; at least one of the printed circuit boards contains an antenna module; at least another printed circuit board contains a power supply module. According to the circuit structure of claim 11, in addition to the antenna module, the printed circuit board containing the antenna module also includes a radio frequency front-end module, a radio frequency module, a beamforming module, and a fundamental frequency digital circuit module, wherein the radio frequency front-end module includes one or a plurality of transmission and reception switches, power amplifiers, and low noise amplifiers; wherein the radio frequency module includes one or a plurality of upconverters, downconverters, filters, and amplifiers and/or attenuators.

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