TWM642997U - Metal shielding member for chip packaging - Google Patents

Abstract

This creation is a metal shielding piece for chip packaging, which is installed on the first circuit board and the second circuit board which are adjacently arranged and filled with sealing glue. The metal shielding piece includes a grinding top plate for grinding, connected to the grinding top plate The peripheral edge is bent and extended, and the plurality of side plates and the positive opening located on the opposite side of the grinding top plate. The accommodating space with a side entrance is enclosed by the grinding top plate and the side plate. The accommodating space communicates with the front opening and the side entrance, and the first electronic component and the second electronic component are arranged in the accommodating space, and the sealing glue fills the accommodating space and seals the first electronic component and the second electronic component. In this way, the electronic components on the adjacent first and second circuit boards are shielded to avoid electromagnetic interference.

Description

Metal shields for chip packaging

The invention is related to the electromagnetic shielding structure, especially a metal shielding piece for chip packaging.

Existing electronic equipment generally includes high-frequency circuits, and the high-frequency circuits are easily affected by external noise, thereby affecting the performance of the entire circuit. Therefore, in order to protect high-frequency circuits, shielding components must be used to prevent external interference. Metal shielding is one of the common shielding components, which can effectively block the interference of external noise on high-frequency circuits, or avoid the phenomenon of electromagnetic interference (EMI) caused by spectrum radiation interference that may be emitted between product components.

Furthermore, the traditional way to protect electronic signals from interference is to use metal wire bonds to form a shielding area. However, due to the continuous development of electronic products towards miniaturization and light weight, the wiring space of component modules is becoming smaller and smaller; in addition, the wire diameter of metal wiring has reached the bottleneck, resulting in an increase in the defect rate and product productivity during metal welding. decline. In this regard, how to improve the aforementioned deficiencies is the research motivation of the author.

In view of this, the author of the present invention, aiming at the above-mentioned prior art, devoted himself to the research and cooperated with the application of theories, and tried his best to solve the above-mentioned problems, which became the goal of the author's improvement.

One purpose of the present invention is to provide a metal shield for chip packaging, so as to shield the electronic components on adjacent circuit boards, thereby avoiding electromagnetic interference.

In order to achieve the above-mentioned purpose, the present invention is a metal shield for chip packaging, which is installed on the first circuit board and the second circuit board adjacently arranged and filled with sealing glue. The metal shielding part includes a grinding top plate for grinding, a plurality of side plates connected with the peripheral edge of the grinding top plate and bent and extended, and a positive opening located on the opposite side of the grinding top plate. The grinding top plate and the side plate enclose an accommodating space with a side entrance. The accommodating space communicates with the front opening and the side entrance, and at least one first electronic component and at least one second electronic component are arranged in the accommodating space. The sealant fills the accommodating space and seals at least one first electronic component and at least one second electronic component.

Compared with the conventional one, the metal shielding part of the present invention straddles the first circuit board and the second circuit board, and is respectively provided with electronic components. In addition, the metal shielding member is formed by stamping, and includes grinding top plates and side plates that are closely connected to each other. The sealant is filled into the metal shield, and the electronic components installed in the metal shield are sealed; subsequently, the top surface of the metal shield and the sealant on the top are removed according to the packaging process, and the electronic components are still sealed in the The shielding function is carried out in the sealing glue, so as to avoid electromagnetic interference.

10: The first circuit board

11: The first electronic component

20: Second circuit board

21: Second electronic component

30: metal shield

31: Grinding the top plate

32: side panel

320: guide fillet

321: First side panel

322: second side panel

323: pin

33: Positive opening

34: side entrance

35:Accommodating space

40: Sealant

Figure 1 is a three-dimensional schematic diagram of the combination of metal shields used for chip packaging in this invention.

Figure 2 is a schematic diagram of the three-dimensional appearance of the metal shielding piece of this creation.

Fig. 3 is a cross-sectional view of the metal shield used for the chip package of the present invention injected into the sealant.

Fig. 4 and Fig. 5 are the cross-sectional views of the metal shield for the chip package of the present invention after grinding in the direction of two sides.

The detailed description and technical content of this creation are described as follows with the drawings, but the attached drawings are only for reference and illustration, and are not used to limit this creation.

Please refer to FIG. 1 and FIG. 2 , which are respectively a three-dimensional assembly schematic diagram of the metal shield used for chip packaging of the invention and a three-dimensional appearance schematic diagram of the metal shield. The present invention is a metal shield 30 for chip packaging, which is installed on the first circuit board 10 and the second circuit board 20 which are arranged adjacent to each other and filled with sealing glue 40 . The first circuit board 10 is provided with at least one first electronic component 11 , and the second circuit board 20 is provided with at least one second electronic component 21 .

The metal shield 30 straddles the adjacent first circuit board 10 and the second circuit board 20 . The metal shield 30 includes a grinding top plate 31 for grinding, a plurality of side plates 32 connected to the periphery of the grinding top plate 31 and extended by bending, and a front opening 33 located on the opposite side of the grinding top plate 31 . In this embodiment, the side plates 32 are integrally connected to the grinding top plate 31 to form a frame.

In this embodiment, the grinding top plate 31 is a rectangular frame plate. Moreover, the grinding top plate 31 and the side plates 32 enclose an accommodating space 35 with a side entrance 34 . The accommodating space 35 communicates with the front opening 33 and the side entrance 34 .

Further, the side panels 32 include a first side panel 321 located on the opposite side of the side entrance 34 and a pair of second side panels 322 connected to the first side panel 321 . A plurality of pins 323 are formed on a side of each second side plate 322 facing the first circuit board 10 and the second circuit board 20 . In this embodiment, the pins 323 are arranged at intervals. In addition, each pin 323 is tooth-shaped.

It should be noted that at least one first electronic component 11 and at least one second electronic component 21 are disposed in the accommodating space 35 . In addition, the metal shield 30 is a component formed by stamping through a thin metal plate. In this embodiment, the metal shield 30 is arranged in a rectangular shape. In addition, the joints of the grinding top plate 31 and the side plates 32 are respectively formed with rounded corners 320 .

Accordingly, the metal shield 30 is used to electromagnetically control a plurality of electronic components (the first electronic component 11 and the second electronic component 21) disposed on different circuit boards (the first circuit board 10 and the second circuit board 20). Shielding to avoid mutual electromagnetic interference between external electromagnetic and electronic components.

In addition, it should be noted that the metal shield 30 can be combined on the first circuit board 10 and the second circuit board 20 through a reflow process. Moreover, the external hot air in the reflow process can enter the accommodating space 35 from the side inlet 34 to melt the solder for soldering, so that the metal shield 30 is soldered on the first circuit board 10 and the second circuit board 20 .

Please also refer to FIG. 3 , which is a cross-sectional view of the metal shield used for the chip package of the present invention injected into the sealant. As shown in FIG. 4 , the sealant 40 is filled in the metal shield 30 and seals at least one first electronic component 11 and at least one second electronic component 21 . In this embodiment, the sealant 40 can be injected into the accommodating space 35 from the side inlet 34 .

Referring to Fig. 4 and Fig. 5 again, it is a cross-sectional view of the metal shield used for chip packaging of the present invention after grinding. Subsequently, the aforementioned metal shield 30 for chip packaging is then polished by a grinding means to the grinding top plate 31, a part of the side plate 32 adjacent to the grinding top plate 31, and the sealant 40 at the position of the grinding top plate 31 according to the packaging process. remove. After the top plate 31 , the upper parts of the side plates 32 and a part of the sealant 40 are ground and removed, the first electronic component 11 and the second electronic component 21 are still sealed in the sealant 40 .

It should be noted that the grinding here is still based on the requirements of the packaging process, and the top plate 31 , part of the side plates 32 and subsequent grinding can be removed. In addition, the portion of the side plate 32 of the metal shield 30 on the periphery of the sealant 40 is still reserved according to the packaging process, thereby providing shielding for the first electronic component 11 and the second electronic component 21, thereby avoiding electromagnetic interference. .

The above descriptions are only preferred embodiments of this creation, and are not used to determine the patent scope of this creation. Other equivalent changes that use the patent spirit of this creation should all fall within the patent scope of this creation.

10: The first circuit board

11: The first electronic component

20: Second circuit board

21: Second electronic component

30: metal shield

31: Grinding the top plate

32: side panel

320: guide fillet

323: pin

40: Sealant

Claims (7)

A metal shield for chip packaging, installed on the adjacent first circuit board and second circuit board and filled with sealant, the metal shield includes a grinding top plate for grinding, and the peripheral edge of the grinding top plate A plurality of side plates that are bent and extended and a positive opening located on the opposite side of the grinding top plate, the grinding top plate and the side plates enclose an accommodating space with a side entrance, and the accommodating space communicates with the forward opening and the side entrance, and at least one first electronic component and at least one second electronic component are placed in the accommodating space, the sealant fills the accommodating space and seals the at least one first electronic component and the at least one A second electronic component. The metal shield for chip packaging as claimed in claim 1, wherein the grinding top plate and a part of the side plates are removed by a grinding means. The metal shield for chip packaging as described in Claim 1, wherein a lead fillet is formed at the joints of the grinding top plate and the side plates. The metal shield for chip packaging as described in claim 1, wherein the side plates include a first side plate on the opposite side of the side entrance and a pair of second side plates connected to the first side plate, each second side plate is at A plurality of pins are formed on one side facing the first circuit board and the second circuit board. The metal shield for chip packaging according to claim 4, wherein the pins are arranged at intervals. The metal shield for chip packaging as claimed in Claim 4, wherein the teeth of each pin are tooth-shaped. The metal shield for chip packaging according to claim 1, wherein the side plates are fixed on the first circuit board and the second circuit board by soldering.

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