TWM642473U - Circuit board with identifiable electrical check point - Google Patents
Circuit board with identifiable electrical check point Download PDFInfo
- Publication number
- TWM642473U TWM642473U TW112201041U TW112201041U TWM642473U TW M642473 U TWM642473 U TW M642473U TW 112201041 U TW112201041 U TW 112201041U TW 112201041 U TW112201041 U TW 112201041U TW M642473 U TWM642473 U TW M642473U
- Authority
- TW
- Taiwan
- Prior art keywords
- detection points
- several
- test
- circuit board
- identification
- Prior art date
Links
Images
Landscapes
- Indicating And Signalling Devices For Elevators (AREA)
Abstract
一種具有可識別電性檢測點之電路板,用以解決習知電路板之電性檢測點辨識困難而無法快速確認缺陷位置的問題。係包含:一線路部,具有數條導電線路,該數條導電線路電性連接數個電子元件;及一測試部,具有數個檢測點及數條測試線,該數個檢測點係一對一電性連接該數條測試線,各該測試線電性連接該線路部中的各該電子元件,每N個檢測點設置一辨識檢測點,N為大於三的整數,各該辨識檢測點的圖案形狀不同於其他檢測點。A circuit board with identifiable electrical detection points is used to solve the problem that the identification of electrical detection points of conventional circuit boards is difficult and the defect position cannot be quickly confirmed. The system includes: a line section with several conductive lines electrically connected to several electronic components; and a test section with several detection points and several test lines, and the several detection points are a pair of One is electrically connected to the plurality of test lines, and each of the test lines is electrically connected to each of the electronic components in the circuit part, and an identification detection point is set for every N detection points, N is an integer greater than three, each of the identification detection points The shape of the pattern is different from other detection points.
Description
本創作係關於一種電子元件安裝基板,尤其是一種電性測試後能夠快速找到缺陷位置的具有可識別電性檢測點之電路板。The invention relates to a substrate for mounting electronic components, especially a circuit board with identifiable electrical detection points that can quickly find defect positions after electrical testing.
習知的電路板用於承載多個電子元件,且習知的電路板透過數條導電線路電性連接該多個電子元件,例如:電阻、電容、晶片等,為了測試安裝在電路板上的電子元件是否符合規格,及確認有無短路或斷路的焊接瑕疵,會利用探針接觸每一個電子元件電性連接的導電線路以測量電性特徵是否正確,但是,習知的電路板上安裝大量的電子元件,需要耗費人力及長時間逐一測量每一個電子元件。The known circuit board is used to carry multiple electronic components, and the conventional circuit board is electrically connected to the multiple electronic components through several conductive lines, such as resistors, capacitors, chips, etc., in order to test the components mounted on the circuit board Whether the electronic components meet the specifications, and to confirm whether there are short circuit or open circuit soldering defects, probes will be used to touch the conductive lines electrically connected to each electronic component to measure whether the electrical characteristics are correct. However, a large number of Electronic components require manpower and a long time to measure each electronic component one by one.
一種自動化測試機台係可以替代人力檢測上述習知的電路板,該測試機台利用具有多隻探針的針床(Bed of Nails)治具,同時接觸電路板線路上的多個電子元件的焊接點,係可以一次確認該多個電子元件的電性特徵,在測試過程中,該測試機台係透過程式控制該針床在電路板上依序移動至定位再下壓接觸線路,係可以快速檢測完一片電路板上的所有的電子元件。An automated testing machine system can replace the human inspection of the above-mentioned known circuit boards. The testing machine uses a Bed of Nails (Bed of Nails) jig with multiple probes to simultaneously contact multiple electronic components on the circuit board circuit. Soldering points can confirm the electrical characteristics of the multiple electronic components at one time. During the test process, the test machine controls the needle bed to move to the position on the circuit board in sequence through the program and then presses down the contact line. Quickly inspect all electronic components on a circuit board.
惟,隨著電子產品微型化、輕量化及高性能化的發展趨勢,電路板上的電子元件的體積縮小,且導電線路的分佈密度增加及線寬細化,當探針直接接觸電子元件與線路的焊接點時,可能損傷線路的導電性或破壞焊接結構,甚至壓壞電子元件;又,探針接觸測試的點位隨著電子元件的安裝位置散佈在電路板各處且數量龐大,當自動化測試機台測量到異常的電性數值時,雖然測試機台可以記錄是哪一根探針接觸到缺陷部位,但是,無法立即判斷是電路板上的哪一個電子元件或焊接位置發生異常,導致測試作業人員必須依據探針編號及測試機台的紀錄,尋找對應至電路板上的測試位置,以進一步確認缺陷的模式及發生原因。因此,上述習知電路板的測試過程複雜且耗時,還會增加電路板及電子元件受損的機率。However, with the development trend of miniaturization, light weight and high performance of electronic products, the volume of electronic components on the circuit board is reduced, and the distribution density of conductive lines is increased and the line width is thinned. When the probe directly contacts the electronic components and When the soldering point of the circuit is damaged, the conductivity of the circuit may be damaged or the welding structure may be damaged, and even the electronic component may be crushed; in addition, the points of the probe contact test are scattered all over the circuit board along with the installation position of the electronic component, and the number is huge. When the automated test machine measures abnormal electrical values, although the test machine can record which probe is in contact with the defect, it cannot immediately determine which electronic component or soldering position on the circuit board is abnormal. As a result, test operators must search for the test position corresponding to the circuit board based on the probe number and the record of the test machine, so as to further confirm the mode and cause of the defect. Therefore, the testing process of the above-mentioned conventional circuit board is complicated and time-consuming, and also increases the probability of damage to the circuit board and electronic components.
有鑑於此,習知的電路板的電性測試確實仍有加以改善之必要。In view of this, it is necessary to improve the conventional electrical testing of circuit boards.
為解決上述問題,本創作的目的是提供一種具有可識別電性檢測點之電路板,係可以快速辨識檢測點的編號順序。In order to solve the above problems, the purpose of this creation is to provide a circuit board with identifiable electrical detection points, which can quickly identify the numbering sequence of the detection points.
本創作的次一目的是提供一種具有可識別電性檢測點之電路板,係可以避免測試過程破壞電路板迴路或壓毀電子元件。The second purpose of this creation is to provide a circuit board with identifiable electrical testing points, which can prevent the circuit board circuit from being damaged or electronic components from being crushed during the testing process.
本創作的又一目的是提供一種具有可識別電性檢測點之電路板,係可以提升測試效率。Another purpose of this invention is to provide a circuit board with identifiable electrical testing points, which can improve testing efficiency.
本創作全文所述方向性或其近似用語,例如「左」、「右」、「上」、「下」、「內」、「外」、「側面」等,主要係參考附加圖式的方向,各方向性或其近似用語僅用以輔助說明及理解本創作的各實施例,非用以限制本創作。Direction or similar terms mentioned in this work, such as "left", "right", "upper", "lower", "inner", "outer", "side", etc., mainly refer to the direction of the attached drawing , each direction or similar terms are only used to assist in explaining and understanding the various embodiments of the creation, not to limit the creation.
本創作全文所記載的元件及構件使用「一」或「一個」之量詞,僅是為了方便使用且提供本創作範圍的通常意義;於本創作中應被解讀為包括一個或至少一個,且單一的概念也包括複數的情況,除非其明顯意指其他意思。The use of the quantifiers "one" or "one" in the elements and components described throughout this creation is only for convenience and to provide the usual meaning of the scope of this creation; it should be interpreted in this creation as including one or at least one, and a single The notion of also includes the plural unless it is obvious that it means otherwise.
本創作的具有可識別電性檢測點之電路板,包含:一線路部,具有數條導電線路,該數條導電線路電性連接數個電子元件;及一測試部,具有數個檢測點及數條測試線,該數個檢測點係一對一電性連接該數條測試線,各該測試線電性連接該線路部中的各該電子元件,每N個檢測點設置一辨識檢測點,N為大於三的整數,各該辨識檢測點的圖案形狀不同於其他檢測點。The circuit board with identifiable electrical detection points of the invention includes: a circuit part with several conductive circuits electrically connected to several electronic components; and a test part with several detection points and Several test lines, the several test points are electrically connected to the several test lines one by one, each of the test lines is electrically connected to each of the electronic components in the circuit part, and an identification detection point is set for every N detection points , N is an integer greater than three, and the pattern shape of each identification detection point is different from other detection points.
據此,本創作的具有可識別電性檢測點之電路板,係由數個檢測點透過數條測試線電性連接該線路部,使測試機的探針可以直接接觸各該檢測點以進行測試,係具有避免破壞電路板迴路或壓毀電子元件的功效,另外,藉由在數個檢測點之中,形成固定間隔的數個辨識檢測點,係可以輔助作業人員辨識該數個檢測點的編號順序,並快速找出發生測試異常之檢測點的位置,係具有提升測試效率及減輕人力負擔的功效。Accordingly, the circuit board with identifiable electrical detection points in this creation is composed of several detection points that are electrically connected to the circuit part through several test lines, so that the probes of the testing machine can directly contact each of the detection points for testing. The test has the effect of avoiding damage to the circuit board circuit or crushing the electronic components. In addition, by forming several identification detection points at fixed intervals among the several detection points, it can assist the operator to identify the several detection points. The sequence of numbers and quickly find out the location of the detection point where the test abnormality occurs, which has the effect of improving test efficiency and reducing the burden of manpower.
其中,該線路部及該測試部位於一基板的表面,且該線路部位於該基板的中央區域,該測試部位於該基板的上緣或下緣區域。如此,測試機之探針可以透過外圍的該測試部進行檢測,避免碰觸到中央區域的導電線路及電子元件,係具有防止破壞電路板迴路及提升產品良率的功效。Wherein, the circuit part and the test part are located on the surface of a substrate, and the circuit part is located in the central area of the substrate, and the test part is located in the upper or lower edge area of the substrate. In this way, the probes of the testing machine can be tested through the peripheral testing part, avoiding touching the conductive lines and electronic components in the central area, which has the effect of preventing damage to the circuit board circuit and improving product yield.
其中,該數個檢測點由該基板之外側邊緣往內排列,該數個辨識檢測點設置於最外側第一列的該數個檢測點之中。如此,位於第一列最密集的數個檢測點係可以透過設置該數個辨識檢測點,使測試作業人員能夠輕易計算出各該檢測點的編號位置,係具有快速尋找測試缺陷發生位置的功效。Wherein, the plurality of detection points are arranged inwardly from the outer edge of the substrate, and the plurality of identification detection points are arranged in the plurality of detection points in the outermost first column. In this way, the densest detection points located in the first column can be set to identify the detection points, so that the test operator can easily calculate the number position of each detection point, which has the effect of quickly finding the location of the test defect .
其中,各該檢測點的圖案形狀為矩形,各該辨識檢測點為矩形且具有至少一截角或圓弧角。如此,測試作業人員可以目視分辨各該檢測點與各該辨識檢測點的圖案形狀差異,係具有定位檢測點及對應缺陷位置的功效。Wherein, the pattern shape of each of the detection points is a rectangle, and each of the identification detection points is a rectangle with at least one truncated corner or arc corner. In this way, the test operator can visually distinguish the pattern shape difference between each of the inspection points and each of the identification inspection points, which has the effect of locating the inspection points and corresponding defect positions.
其中,各該辨識檢測點的圖案中心點為圓心形成一輔助圓,該輔助圓的直徑大於或等於0.1毫米,該辨識檢測點的截角或圓弧角位於該輔助圓的範圍之外。如此,該輔助圓係可以限制該辨識檢測點的圖案改變範圍,以避免該辨識檢測點的圖案不規則或面積縮減而導致探針接觸不良,係具有防止測試失敗及提升測量準確度的功效。Wherein, the pattern center point of each of the identification detection points is the center of a circle to form an auxiliary circle, the diameter of the auxiliary circle is greater than or equal to 0.1 mm, and the truncation angle or arc angle of the identification detection points is located outside the range of the auxiliary circle. In this way, the auxiliary circle system can limit the pattern change range of the identification detection point, so as to avoid poor contact of the probe caused by irregular pattern or area reduction of the identification detection point, which has the effect of preventing test failure and improving measurement accuracy.
其中,該數條測試線電性連接該數個電子元件的電極端,或該數個電子元件與數條導電線路之間的焊接點。如此,透過該數條測試線係可以測量各該電子元件是否符合規格及確認有無短路或斷路的焊接瑕疵,係具有提升測試效率及確認電路板品質的功效。Wherein, the plurality of testing wires are electrically connected to the electrode ends of the plurality of electronic components, or welding points between the plurality of electronic components and the plurality of conductive circuits. In this way, through the several test lines, it is possible to measure whether the electronic components meet the specifications and confirm whether there are short circuit or open circuit welding defects, which has the effect of improving test efficiency and confirming the quality of the circuit board.
為讓本創作之上述及其他目的、特徵及優點能更明顯易懂,下文特舉本創作之較佳實施例,並配合所附圖式作詳細說明;此外,在不同圖式中標示相同符號者視為相同,會省略其說明。In order to make the above and other purposes, features and advantages of this creation more obvious and easy to understand, the preferred embodiments of this creation are specially cited below, and explained in detail with the accompanying drawings; in addition, the same symbols are marked in different drawings are considered the same, and their descriptions will be omitted.
請參照第1圖所示,其係本創作具有可識別電性檢測點之電路板的較佳實施例,係包含一線路部1及一測試部2,該線路部1及該測試部2位於一基板S的表面,又,該線路部1位於該基板S的中央區域,而該測試部2位於該線路部1的外圍,且該測試部2較佳位於該基板S的上緣或下緣區域。Please refer to Figure 1, which is a preferred embodiment of a circuit board with identifiable electrical detection points in this invention, which includes a
該線路部1係由數條導電線路排列分布而成的區塊,各該導電線路係透過焊接電性連接至各種電子元件,使安裝於電路板的數個電子元件形成迴路,用於傳遞及處理電訊號以順利執行電子產品的功能,因此,電路板在組裝出貨之前,必須確保各該電子元件的規格正確且電性正常,並確認各該導電線路與各該電子元件之間的焊接結構完整且沒有短路、斷路等異常。The
請再參照第2圖,其係如第1圖所示之A區域中的該測試部2局部放大圖,該測試部2具有數個檢測點21及數條測試線22,該數個檢測點21係一對一電性連接該數條測試線22,再由各該測試線22電性連接該線路部1中的各該電子元件的電極端或焊接點,如此,一電性測試機台之探針係可以直接接觸各該檢測點21,並透過各該測試線22對各該電子元件進行檢測,在檢測過程中,該探針不會直接碰觸到各該電子元件及導電線路,係可以避免破壞電路板迴路或壓毀電子元件。Please refer to Fig. 2 again, which is a partially enlarged view of the
請參照第2圖所示,該數個檢測點21較佳位靠近該基板S的邊緣區域,以遠離電子元件及導電線路聚集的該基板S之中央區域,該數個檢測點21可以由該基板S之外側邊緣往內排列,其中,靠內側列的該數個檢測點21之間會穿插該測試線22而縮減該檢測點21的排列空間,因此,愈靠外側的該數個檢測點21的分布愈密集,愈靠內側的該數個檢測點21的分布愈分散,在本實施例中,一個寬度R範圍之內,最外側第一列可以有三個該檢測點21,第二、三列減少為兩個該檢測點21,第四至六列僅有一個該檢測點21。Please refer to Figure 2, the plurality of
又,在最外側第一列的該數個檢測點21之中,每N個檢測點21設置一辨識檢測點21a,N為大於三的整數,且各該辨識檢測點21a的圖案形狀不同於其他檢測點21,使測試作業人員能夠識別各該辨識檢測點21a,並透過該數個辨識檢測點21a的規律間隔排列,係可以快速計算出該數個檢測點21的編號順序,舉例而言,在本實施例中,N為六,即相鄰二該辨識檢測點21a之間排列五個檢測點21,當該電性測試機台檢測出由右至左數來第七根探針的電性異常時,測試作業人員係可以立即定位右邊第一個該辨識檢測點21a對應第六根探針,則位於其左邊第一個該檢測點21對應第七根探針,並判斷該檢測點21電連接的導線或電子元件發生缺陷。本創作舉上述實施例說明該數個檢測點21及辨識檢測點21a的排列方式,但不以此為限。Again, among the
請參照第3至6圖所示,其係如第2圖所示之該辨識檢測點21a的局部放大圖,該檢測點21及該辨識檢測點21a的圖案形狀可以是矩形,其中,該辨識檢測點21a具有至少一個截角或圓弧角,如第3圖所示,該辨識檢測點21a的左上方形成一截角;如第4圖所示,該辨識檢測點21a的左上方及右上方分別形成一截角;如第5圖所示,該辨識檢測點21a的左上方形成一截角,及右上方形成一圓弧角;如第6圖所示,該辨識檢測點21a的二截角相接。Please refer to Figures 3 to 6, which are partial enlarged views of the
又,以該辨識檢測點21a的圖案中心點為圓心畫一輔助圓C,該輔助圓C的直徑D大於或等於0.1毫米,該辨識檢測點21a的截角或圓弧角較佳位於該輔助圓C的範圍之外,係可以限制該辨識檢測點21a的圖案改變範圍,以避免該辨識檢測點21a的圖案不規則或面積縮減而導致探針接觸不良,係具有防止測試失敗及提升測量準確度的作用。Also, draw an auxiliary circle C with the center point of the pattern of the
綜上所述,本創作的具有可識別電性檢測點之電路板,係由數個檢測點透過數條測試線電性連接該線路部,使測試機的探針可以直接接觸各該檢測點以進行測試,係具有避免破壞電路板迴路或壓毀電子元件的功效,另外,藉由在數個檢測點之中,形成固定間隔的數個辨識檢測點,係可以輔助作業人員辨識該數個檢測點的編號順序,並快速找出發生測試異常之檢測點的位置,係具有提升測試效率及減輕人力負擔的功效。To sum up, the circuit board with identifiable electrical detection points in this creation is composed of several detection points that are electrically connected to the circuit part through several test lines, so that the probes of the testing machine can directly contact each of the detection points For testing, it has the effect of avoiding damage to the circuit board circuit or crushing electronic components. In addition, by forming several identification detection points at fixed intervals among the several detection points, it can assist the operator to identify the several detection points. The numbering sequence of the inspection points and quickly find out the location of the inspection point where the test abnormality occurs has the effect of improving the test efficiency and reducing the manpower burden.
雖然本創作已利用上述較佳實施例揭示,然其並非用以限定本創作,任何熟習此技藝者在不脫離本創作之精神和範圍之內,相對上述實施例進行各種更動與修改仍屬本創作所保護之技術範疇,因此本創作之保護範圍當包含後附之申請專利範圍所記載的文義及均等範圍內之所有變更。Although this creation has been disclosed by using the above-mentioned preferred embodiments, it is not intended to limit this creation. Anyone who is familiar with this technology can make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation shall include all changes within the meaning and equivalent scope recorded in the appended scope of patent application.
1:線路部
2:測試部
21:檢測點
21a:辨識檢測點
22:測試線
S:基板
R:寬度
C:輔助圓
D:直徑1: Line Department
2: Testing department
21:
[第1圖] 本創作較佳實施例的平面圖。 [第2圖] 如第1圖所示的A區域放大圖。 [第3圖] 本創作較佳實施例之辨識檢測點的圖案形狀放大圖。 [第4圖] 本創作另一實施例之辨識檢測點的圖案形狀放大圖。 [第5圖] 本創作另一實施例之辨識檢測點的圖案形狀放大圖。 [第6圖] 本創作另一實施例之辨識檢測點的圖案形狀放大圖。 [Fig. 1] A plan view of a preferred embodiment of the invention. [Picture 2] An enlarged view of area A shown in Fig. 1. [Fig. 3] An enlarged view of the pattern shape of the identification and detection points of the preferred embodiment of the invention. [Fig. 4] An enlarged view of the pattern shape of the identification and detection points of another embodiment of the invention. [Fig. 5] An enlarged view of the pattern shape of the identification and detection points of another embodiment of the invention. [Fig. 6] An enlarged view of the pattern shape of the recognition detection point in another embodiment of the invention.
2:測試部 2: Testing department
21:檢測點 21: Detection point
21a:辨識檢測點 21a: Identify detection points
22:測試線 22: Test line
S:基板 S: Substrate
R:寬度 R: width
C:輔助圓 C: auxiliary circle
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112201041U TWM642473U (en) | 2023-02-06 | 2023-02-06 | Circuit board with identifiable electrical check point |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112201041U TWM642473U (en) | 2023-02-06 | 2023-02-06 | Circuit board with identifiable electrical check point |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM642473U true TWM642473U (en) | 2023-06-11 |
Family
ID=87804825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112201041U TWM642473U (en) | 2023-02-06 | 2023-02-06 | Circuit board with identifiable electrical check point |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM642473U (en) |
-
2023
- 2023-02-06 TW TW112201041U patent/TWM642473U/en unknown
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100741858B1 (en) | Monitoring pattern for detecting a defect in a seiconductor device and method for detecting a defect | |
TWI498576B (en) | Display panel and testing method thereof | |
JP2004047542A (en) | Chip quality determining method, chip quality determining program, marking mechanism using the program, and fault generation analyzing method of wafer | |
KR101534487B1 (en) | Semiconductor device and method for inspection of probe pin alignment in the semiconductor device | |
US5014003A (en) | Conductive pattern for electric test of semiconductor chips | |
WO2022166085A1 (en) | Fault isolation analysis method and computer-readable storage medium | |
JP2720688B2 (en) | Circuit board inspection method | |
JPH06168991A (en) | Inspecting method for multi-probing semiconductor | |
KR20050110304A (en) | Pad for probe sesnsing, substrate formed semiconductor device, method for test of semiconductor device and tester of semiconductor device | |
TWM642473U (en) | Circuit board with identifiable electrical check point | |
KR100897982B1 (en) | Miss align preventing pattern and method thereof between probe card niddle and pad | |
TW202414208A (en) | System for inspecting test probe board of boundary scan interconnect equipment | |
CN111952285B (en) | Array substrate mother board and method for detecting etching residues | |
CN111913072B (en) | Method for identifying waste coil plate reporting | |
CN114551267A (en) | Detection method and detection device for display panel and storage medium | |
JP4859174B2 (en) | Probe card | |
US7049527B1 (en) | Conductor-pattern testing method, and electro-optical device | |
JP5152941B2 (en) | Probe card | |
JP2004361249A (en) | Substrate inspection device | |
TWI745829B (en) | Semiconductor device and detecting method of needle mark offset | |
CN102495301B (en) | Testing device and testing method of narrow interval pin headers on PCB (printed circuit board) | |
KR0127639B1 (en) | Probing test method and apparatus | |
KR101823317B1 (en) | Appartus and method of inspecting wires of panel | |
KR100602097B1 (en) | Layout of via stacked test pattern using in manufacturing semiconductor device | |
JP3313684B2 (en) | Liquid crystal display substrate, its wiring inspection method and its wiring repair method |