TWM642104U - Sublimation transfer printing product for round substrate - Google Patents

Sublimation transfer printing product for round substrate Download PDF

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Publication number
TWM642104U
TWM642104U TW112201995U TW112201995U TWM642104U TW M642104 U TWM642104 U TW M642104U TW 112201995 U TW112201995 U TW 112201995U TW 112201995 U TW112201995 U TW 112201995U TW M642104 U TWM642104 U TW M642104U
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Taiwan
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substrate
transfer printing
base material
sublimation transfer
product
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TW112201995U
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Chinese (zh)
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武坤榮
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坤泰旺實業有限公司
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Priority to TW112201995U priority Critical patent/TWM642104U/en
Publication of TWM642104U publication Critical patent/TWM642104U/en

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Abstract

本創作一種圓型基材熱昇華轉印產品,包含:一基材及一轉印層,該基材為具有可撓性之長條狀體,斷面呈圓型,該基材具有一外周面,該轉印層轉印附著於該基材的外周面上,並滲透到該基材內;藉以,製作加工簡便,產業利用性及產品競爭力提升。This invention creates a round substrate sublimation transfer printing product, which includes: a substrate and a transfer layer, the substrate is a flexible strip with a circular cross-section, and the substrate has an outer circumference On the surface, the transfer printing layer is transferred and adhered to the outer peripheral surface of the base material, and penetrates into the base material; thus, the manufacturing process is simple, and the industrial applicability and product competitiveness are improved.

Description

圓型基材熱昇華轉印產品Sublimation transfer printing products for round substrates

本創作係有關於一種熱昇華轉印產品,尤指一種圓型基材熱昇華轉印產品。This creation is about a thermal sublimation transfer product, especially a circular substrate thermal sublimation transfer product.

熱昇華轉印指的是熱昇華墨水經加熱達到特定溫度後,染料會由固態昇華為氣態,當溫度下降,染料又還原成固態,這時染料可以滲入承印物的表面形成一染料層,達到轉印的目的。Dye sublimation transfer printing means that after the sublimation ink is heated to a specific temperature, the dye will sublimate from solid to gaseous state. When the temperature drops, the dye will return to solid state. At this time, the dye can penetrate into the surface of the substrate to form a dye layer to achieve transfer. purpose of printing.

目前一般熱昇華轉印設備主要係由一第一供應捲筒、一第二供應捲筒及一加熱滾筒所組成,其中該第一供應捲筒提供一成捲的承印物置放,該第二供應捲筒提供一成捲的轉印膜置放,該承印物及該轉印膜同時從捲筒拉出後,經多個導引滾輪導引平整後,該承印物與該轉印膜平整地相互貼合,進而共同通過加熱滾筒,透過該加熱滾筒加熱滾壓,使轉印膜上的染料受熱轉印於承印物上形成染料層。At present, general thermal sublimation transfer printing equipment is mainly composed of a first supply reel, a second supply reel and a heating roller, wherein the first supply reel provides a roll of substrates to place, the second supply The reel provides a roll of transfer film for placement. After the substrate and the transfer film are pulled out from the reel at the same time, after being guided and leveled by a plurality of guide rollers, the substrate and the transfer film are flat The dyes on the transfer film are thermally transferred to the substrate to form a dye layer.

惟,習知熱昇華轉印的產品受到結構設計的侷限,因而大多為平面形態,無法適用於圓型基材,導致產業利用性及產品競爭力受到諸多的限制。However, conventional dye-sublimation transfer printing products are limited by structural design, so most of them are flat and cannot be applied to round substrates, resulting in many restrictions on industrial applicability and product competitiveness.

本創作人有鑑於習知熱昇華轉印的產品具有上述缺點,是以乃思及創作的意念,經多方探討與試作樣品試驗,及多次修正改良後,遂推出本創作。In view of the above-mentioned shortcomings of known dye-sublimation transfer printing products, the author of this creation is based on his ideas and creative ideas. After many discussions, trial sample tests, and many revisions and improvements, he launched this creation.

本創作提供一種圓型基材熱昇華轉印產品,包含:一基材,為具有可撓性之長條狀體,斷面呈圓型,該基材包含一第一端面、一第二端面及一連接於該第一端面外緣與該第二端面外緣之間的外周面;及一轉印層,轉印附著於該基材的外周面上,並滲透到該基材內。This creation provides a round substrate sublimation transfer printing product, including: a substrate, which is a flexible strip with a circular cross section, and the substrate includes a first end surface and a second end surface and an outer peripheral surface connected between the outer edge of the first end surface and the outer edge of the second end surface; and a transfer printing layer, which is transferred and adhered to the outer peripheral surface of the base material and penetrates into the base material.

本創作圓型基材熱昇華轉印產品的主要目的,在於其製作加工簡便,可適用於圓型基材,產業利用性及產品競爭力提升。The main purpose of creating the sublimation transfer printing product for round substrates is that it is easy to manufacture and process, can be applied to round substrates, and enhances industrial applicability and product competitiveness.

以下茲配合本創作較佳實施例之圖式進一步說明如下,以期能使熟悉本創作相關技術之人士,得依本說明書之陳述據以實施。The drawings of the preferred embodiments of this creation are further described below, in order to enable those familiar with the related technologies of this creation to implement it according to the statements in this manual.

首先,請配合參閱第一圖及第二圖所示,本創作一種圓型基材熱昇華轉印產品,包含:一基材10及一轉印層20。First of all, please refer to the first and second drawings together, this invention creates a circular substrate thermal sublimation transfer product, including: a substrate 10 and a transfer layer 20 .

該基材10為具有可撓性之長條狀體,斷面呈圓型,該基材10包含一第一端面11、一第二端面12及一連接於該第一端面11外緣與該第二端面12外緣之間的外周面13,於本實施例中,該基材10係由一線芯部14以及包覆該線芯部14的一外覆層15,該線芯部14具有至少一線芯。The substrate 10 is a flexible elongated body with a circular cross-section. The substrate 10 includes a first end surface 11, a second end surface 12 and an outer edge connected to the first end surface 11 and the The outer peripheral surface 13 between the outer edges of the second end surface 12, in this embodiment, the base material 10 is composed of a core portion 14 and an outer coating 15 covering the core portion 14, the core portion 14 has At least one wire.

該轉印層20以熱昇華轉印方式轉印附著於該基材10的外周面13上,並滲透至該基材10內,於本實施例中,該轉印層20係轉印附著於該基材10的整體外周面13上,該轉印層20為文字、數字、圖案、色彩、花紋或其結合。The transfer layer 20 is transferred and attached to the outer peripheral surface 13 of the base material 10 by thermal sublimation transfer printing, and penetrates into the base material 10. In this embodiment, the transfer layer 20 is transferred and attached to the base material 10. On the entire peripheral surface 13 of the substrate 10, the transfer layer 20 is composed of characters, numbers, patterns, colors, patterns or combinations thereof.

本創作圓型基材熱昇華轉印產品,可透過如第三圖及第四圖所示之製作流程,將該基材10成捲置放於一第一供應捲筒30上,配合於一第二供應捲筒40上置放一成捲的轉印膜50,該轉印膜50經加熱輪60加熱後,與該基材10一起通過一捲圓裝置70,將該轉印膜50捲成圓型並貼合於該基材10的外周面13,使該轉印膜50上的染料受熱轉印於該基材10的外周面13上,並滲透至該基材10內。In this invention, the circular base material sublimation transfer printing product can be placed on a first supply reel 30 in rolls through the production process shown in the third and fourth figures, and matched with a A rolled transfer film 50 is placed on the second supply reel 40. After the transfer film 50 is heated by the heating wheel 60, it passes through a rolling device 70 together with the substrate 10, and the transfer film 50 is rolled. Formed into a circle and pasted on the outer peripheral surface 13 of the substrate 10 , the dye on the transfer film 50 is thermally transferred to the outer peripheral surface 13 of the substrate 10 and penetrates into the substrate 10 .

或者,可透過如第五圖及第六圖所示之製作流程,將該基材10成捲置於於一第一供應捲筒30上,配合於一第二供應捲筒40上置放一成捲的轉印膜50,該轉印膜50經加熱輪60加熱後,與該基材10一起通過一搓壓裝置80,將該轉印膜50貼合於該基材10的外周面13,使該轉印膜50上的染料受熱轉印於該基材10的外周面13上,並滲透至該基材10內。Alternatively, the base material 10 can be placed in rolls on a first supply reel 30 through the manufacturing process shown in the fifth and sixth figures, and placed on a second supply reel 40 to place a Rolled transfer film 50, after the transfer film 50 is heated by the heating wheel 60, passes through a rubbing device 80 together with the substrate 10, and the transfer film 50 is attached to the outer peripheral surface 13 of the substrate 10 , the dye on the transfer film 50 is thermally transferred onto the outer peripheral surface 13 of the substrate 10 and penetrates into the substrate 10 .

該基材10可如第七圖所示為織帶,而於該基材10的外周面13轉印附著該轉印層20後,於該基材10兩端分別組設結合一束頭90,藉以形成鞋帶、提帶等使用。The base material 10 can be a webbing as shown in the seventh figure, and after the transfer layer 20 is attached to the outer peripheral surface 13 of the base material 10, a beam head 90 is respectively assembled and combined at both ends of the base material 10, It can be used to form shoelaces, straps, etc.

另該基材10可如第八圖所示為電性導線,而於該基材10的外周面13轉印附著轉印層20後,於該基材10兩端分別結合一連接埠(接頭)100,藉以形成傳輸線、充電線等使用。In addition, the substrate 10 can be an electrical wire as shown in the eighth figure, and after the transfer layer 20 is transferred and attached to the outer peripheral surface 13 of the substrate 10, a connecting port (joint) is respectively combined at both ends of the substrate 10. ) 100, so as to form a transmission line, a charging line, etc.

再者,如第九圖及第十圖所示,係為本創作圓型基材熱昇華轉印產品之另一實施例,該另一實施例與上述實施例的差異在於該轉印層20係轉印附著於該基材10的部分外周面13上。Furthermore, as shown in Figure 9 and Figure 10, it is another embodiment of the heat-sublimation transfer printing product of the round substrate of this invention. The difference between this other embodiment and the above embodiment is that the transfer layer 20 It is transferred and adhered to part of the outer peripheral surface 13 of the substrate 10 .

由上述具體實施例之結構,可得到下述之效益:By the structure of above-mentioned specific embodiment, can obtain following benefit:

本創作圓型基材熱昇華轉印產品,其製作加工簡便,並且可適用於圓型基材10,俾達產業利用性及產品競爭力提升。The thermal sublimation transfer printing product of the circular base material is easy to manufacture and process, and can be applied to the circular base material 10, so as to enhance the industrial applicability and product competitiveness.

10:基材 11:第一端面 12:第二端面 13:外周面 14:線芯部 15:外覆層 20:轉印層 30:第一供應捲筒 40:第二供應捲筒 50:轉印膜 60:加熱輪 70:捲圓裝置 80:搓壓裝置 90:束頭 100:連接埠 10: Substrate 11: The first end face 12: Second end face 13: Outer peripheral surface 14: core part 15: Outer cladding 20: transfer layer 30: First Supply Reel 40: Second supply reel 50: transfer film 60: heating wheel 70: rolling device 80: Rubbing device 90: bundle head 100: port

第一圖係本創作之立體圖。 第二圖係本創作之剖面圖。 第三圖係本創作之製作立體示意圖。 第四圖係本創作之製作平面示意圖。 第五圖係本創作之另一製作立體示意圖。 第六圖係本創作之另一製作平面示意圖。 第七圖係本創作之使用示意圖。 第八圖係本創作之另一使用示意圖。 第九圖係本創作另一實施例之立體圖。 第十圖係本創作另一實施例之剖面圖。 The first picture is a three-dimensional picture created by this book. The second picture is a section view of this creation. The third picture is a three-dimensional schematic diagram of the production of this creation. The fourth picture is a schematic diagram of the production plane of this creation. The fifth picture is another three-dimensional schematic diagram of this creation. The sixth picture is another production plan schematic diagram of this creation. The seventh picture is a schematic diagram of the use of this creation. The eighth picture is another schematic diagram of this creation. The ninth figure is a perspective view of another embodiment of this creation. The tenth figure is a sectional view of another embodiment of this creation.

10:基材 10: Substrate

11:第一端面 11: The first end face

12:第二端面 12: Second end face

13:外周面 13: Outer peripheral surface

14:線芯部 14: core part

15:外覆層 15: Outer cladding

20:轉印層 20: transfer layer

Claims (8)

一種圓型基材熱昇華轉印產品,包含: 一基材,為具有可撓性之長條狀體,斷面呈圓型,該基材包含一第一端面、一第二端面及一連接於該第一端面外緣與該第二端面外緣之間的外周面;及 一轉印層,轉印附著於該基材的外周面上,並滲透到該基材內。 A circular substrate heat sublimation transfer product, comprising: A base material is a flexible long strip with a circular cross-section. The base material includes a first end surface, a second end surface and an outer edge connected to the first end surface and the second end surface. the peripheral surface between the edges; and A transfer layer, which is attached to the outer peripheral surface of the base material and penetrates into the base material. 如請求項1所述之圓型基材熱昇華轉印產品,其中該基材係由一線芯部以及包覆該線芯部的一外覆層。The thermal sublimation transfer printing product for a circular base material as described in claim 1, wherein the base material is composed of a core part and an outer coating layer covering the core part. 如請求項2所述之圓型基材熱昇華轉印產品,其中該線芯部具有至少一線芯。The heat-sublimation transfer printing product for a circular base material as described in claim 2, wherein the wire core part has at least one wire core. 如請求項1所述之圓型基材熱昇華轉印產品,其中該轉印層係轉印附著於該基材的整體外周面上。The thermal sublimation transfer product for a round substrate as described in Claim 1, wherein the transfer layer is transferred and attached to the entire outer peripheral surface of the substrate. 如請求項1所述之圓型基材熱昇華轉印產品,其中該轉印層係轉印附著於該基材的部分外周面上。The heat-sublimation transfer printing product for a circular substrate as described in Claim 1, wherein the transfer printing layer is transferred and attached to a part of the outer peripheral surface of the substrate. 如請求項1、4或5所述之圓型基材熱昇華轉印產品,其中該轉印層為文字、數字、圖案、色彩、花紋或其結合。The thermal sublimation transfer printing product on a circular substrate as described in claim 1, 4 or 5, wherein the transfer printing layer is characters, numbers, patterns, colors, patterns or a combination thereof. 如請求項1所述之圓型基材熱昇華轉印產品,其中該基材為織帶。The thermal sublimation transfer printing product on a circular substrate as described in Claim 1, wherein the substrate is a webbing. 如請求項1所述之圓型基材熱昇華轉印產品,其中該基材為電性導線。The heat-sublimation transfer printing product on a circular substrate as described in claim 1, wherein the substrate is an electrical wire.
TW112201995U 2023-03-08 2023-03-08 Sublimation transfer printing product for round substrate TWM642104U (en)

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