TWM639887U - Image sensing lens and open sensing module - Google Patents

Abstract

The invention discloses an image sensing lens and an open sensing module. The open sensing module includes an image sensing chip, a support layer disposed on the image sensing chip, a filter disposed on the support layer, and a circuit carrier formed with through holes , and a bonding layer. The support layer is not in the shape of a closed ring and is formed with an internal communication port. The image sensing chip is soldered and fixed on the circuit carrier board, and at least part of the filter is penetrated through the through hole to form a communication with the inner wall of the through hole and communicate with the inner wall of the through hole. An annular gap at the mouth. The bonding layer is formed in a part of the annular gap for bonding the optical filter to the circuit carrier and forms an external communication port communicating with the annular gap to jointly form a dust-proof channel.

Description

Image sensing lens and open sensing module

The invention relates to a sensing lens, in particular to an image sensing lens and an open sensing module.

In order to realize the dust-proof function, the existing image sensing modules all adopt a support layer in the shape of a closed ring between the image sensing chip and the filter to form a closed space together. However, the support layer used in the existing image sensing module can only be in the shape of a closed ring, which greatly hinders subsequent research and development and structural improvement; for example, the image sensing chip of the existing image sensing module With the development of miniaturization, the gluing space for providing the supporting layer is also reduced simultaneously. Therefore, the author of the present invention believes that the above-mentioned defects can be improved. Naite devoted himself to research and combined with the application of scientific principles, and finally proposed a work with a reasonable structure and effectively improved the above-mentioned defects.

The inventive embodiment provides an image sensing lens and an open sensing module, which can effectively improve the possible defects of the existing image sensing modules.

The embodiment of the present invention discloses an image sensing lens, which includes: an open sensing module, including: an image sensing chip, which is configured with a sensing area on the top surface, and a sensor located outside the sensing area A joint area; a support layer, arranged in the joint area, and the support layer is not in the shape of a closed ring, but has at least one internal communication port; a filter, arranged in the support layer along a predetermined direction covering and covering the sensing area; wherein, a sensing space is formed between the filter and the sensing area; a circuit carrier is formed with a through hole; wherein, the image sensing chip is fixed on The circuit carrier board, and at least a part of the filter penetrates through the through hole, so as to form an annular gap communicating with at least one of the inner communication ports between the inner wall of the through hole and the inner wall of the through hole; A first adhesive layer is formed in part of the annular gap to adhere the optical filter to the circuit carrier, and the first adhesive layer is not in the shape of a closed ring but is formed with at least one external communication port; Wherein, at least one of the inner communication ports and at least one of the outer communication ports do not overlap with each other in the predetermined direction, so that at least one of the outer communication ports, the annular gap, and at least one of the inner communication ports The openings can jointly form a dust-proof channel connected to the sensing space; and a second adhesive layer, connecting and sealing the top surface periphery of the image sensing chip and the circuit carrier; and an optical module , including a bracket mounted on the open sensing module, and at least one lens installed in the bracket; wherein, the optical module and the image sensing chip are respectively located on the circuit carrier opposite sides of the board.

The embodiment of the present invention also discloses an open sensing module, which includes: an image sensing chip, which is configured with a sensing area on the top surface, and a bonding area located outside the sensing area; a support layer, It is arranged in the joint area, and the support layer is not in the shape of a closed ring but has at least one internal communication port; a filter is arranged on the support layer along a predetermined direction and shields the sensing area ; wherein, a sensing space is formed between the filter and the sensing area; a circuit carrier is formed with a through hole; wherein, the image sensing chip is fixed on the circuit carrier, and the At least part of the optical filter is pierced through the through hole to form an annular gap connected to at least one of the inner communication ports between the inner wall of the through hole; a first adhesive layer is formed on the Part of the annular gap is used to bond the optical filter to the circuit carrier, and the first adhesive layer is not in the shape of a closed ring but has at least one external communication port; wherein, at least one of the internal communication ports The mouth and the at least one outer communication port do not overlap with each other in the predetermined direction, so that at least one outer communication port, the annular gap, and at least one inner communication port can jointly form a connection to the a dust-proof passage in the sensing space; and a second adhesive layer connecting and sealing the top surface periphery of the image sensing chip and the circuit carrier.

The embodiment of the invention further discloses an open sensing module, which includes: an image sensing chip, which is configured with a sensing area on the top surface, a bonding area outside the sensing area, and a bonding area located outside the bonding area. A plurality of welding pads outside the area; a supporting layer, arranged in the bonding area, and the supporting layer is not in the shape of a closed ring but formed with at least one internal communication port; an optical filter, arranged in a predetermined direction on the On the support layer and shielding the sensing area; wherein, a sensing space is formed between the optical filter and the sensing area; a circuit carrier is formed with a through hole, and the circuit carrier There are a plurality of bonding pads located outside the through hole; wherein, the image sensing chip is respectively soldered and fixed to the plurality of bonding pads with the plurality of bonding pads, and at least part of the optical filter is penetrated An annular gap communicating with at least one of the inner communication ports is formed between the through hole and the inner wall of the through hole; a first adhesive layer is an adhesive tape in a non-closed ring shape, and The first adhesive layer bonds the optical filter to the circuit carrier; wherein, the first adhesive layer is formed with at least one external communication port, and at least one of the internal communication ports communicates with at least one of the external The ports do not overlap with each other in the predetermined direction, so that at least one of the outer communication port, the annular gap, and at least one of the inner communication ports can jointly form a dust-proof passage leading to the sensing space; and a second adhesive layer, connecting and sealing the periphery of the top surface of the image sensing chip and the circuit carrier.

To sum up, the image sensing lens and the open sensing module disclosed in the embodiment of the invention can form the dust-proof passage so that the sensing space is no longer closed, which is beneficial to all miniaturization of the image sensor chip. Moreover, the dust-proof channel is defined by the specific position of at least one of the internal communication ports and at least one of the external communication ports (such as: at least one of the internal communication ports and at least one of the external communication ports are in the preset directions do not overlap with each other) and have a dust-proof effect, so that even if particles enter the dust-proof passage from at least one of the outer communication ports, it is difficult for them to reach the sensing space.

Furthermore, in the image sensing lens and the open sensing module disclosed in the embodiment of the invention, on the premise that the dust-proof channel is formed and has a dust-proof function, the structure of the support layer will no longer be subject to excessive Therefore, the support layer can be varied according to different requirements, and the first adhesive layer can also help the optical filter to be more stably combined with the circuit carrier.

In order to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings about this creation, but these descriptions and drawings are only used to illustrate this creation, not to make any statement on the scope of protection of this creation limit.

The following is a description of the implementation of the "image sensing lens and open sensing module" disclosed in this creation through a number of specific specific embodiments. Those skilled in the art can understand the advantages of this creation from the content disclosed in this specification with effect. This creation can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the idea of this creation. In addition, the drawings of this creation are only for simple illustration, not according to the actual size of the depiction, prior statement. The following embodiments will further describe the relevant technical content of this creation in detail, but the disclosed content is not intended to limit the protection scope of this creation.

It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[Example 1]

Please refer to Fig. 1 to Fig. 7, which are the first embodiment of this creation. As shown in FIGS. 1 and 2 , the present embodiment discloses an image sensing lens 1000 , which includes an open sensing module 100 and an optical module 200 mounted on the open sensing module 100 . It should be noted that any lens or packaging structure not belonging to image sensing is different from the image sensing lens 1000 defined in this embodiment.

As shown in FIGS. 3 and 4 , the open sensing module 100 includes an image sensing chip 1, a support layer 2 disposed on the image sensing chip 1, and a support layer 2 disposed on the support layer 2. A filter 3, a circuit carrier 4 carrying the image sensor chip 1, a first adhesive layer 5 connecting the filter 3 and the circuit carrier 4, and connecting the image sensor A second bonding layer 6 between the test chip 1 and the circuit carrier 4 is measured.

The image sensing chip 1 in this embodiment may be a complementary metal-oxide-semiconductor (Complementary Metal-Oxide-Semiconductor, CMOS) sensor or any sensor with an image capture function, which is not described herein. be restricted. Wherein, the image sensing chip 1 is configured on its top surface 10 with a sensing area 11 , a bonding area 12 outside the sensing area 11 , and a plurality of welding pads 13 outside the bonding area 12 .

In this embodiment, the bonding area 12 surrounds the sensing area 11, and a plurality of the welding pads 13 are arranged in two rows and are respectively located on the sensing area 11 (or the bonding area 12). opposite sides, but this creation is not limited thereto. For example, in other embodiments not shown in this creation, a plurality of the welding pads 13 can be arranged in a ring shape and surround the bonding area 12 according to requirements; or, a plurality of the welding pads 13 can be According to requirements, they are arranged in a U shape and surround the joint area 12 .

The support layer 2 (such as an adhesive layer) is disposed on the bonding area 12 of the image sensing chip 1 , and the support layer 2 is not in the shape of a closed ring but has at least one internal communication opening 21 formed therein. That is to say, any support layer or adhesive layer in the shape of a closed circle is different from the support layer 2 defined in this embodiment.

The filter 3 is disposed on the support layer 2 along a predetermined direction D and shields the sensing region 11; that is, the support layer 2 is clamped on the image sensing chip 1 Between the bonding area 12 and the filter 3 . It should be added that the selection of the optical filter 3 is preferably corresponding to the sensing area 11 of the image sensing chip 1 . For example, when a light passes through the optical module 200 , the filter 3 is used to allow the wavelength band of the light corresponding to the sensing area 11 to pass through.

In more detail, the filter 3 has an inner surface 31, an outer surface 32 located on the opposite side of the inner surface 31, and a ring side connected between the inner surface 31 and the outer surface 32 33. Wherein, the inner surface 31 of the optical filter 3 is arranged on the support layer 2 and is substantially parallel to the top surface 10 of the image sensing chip 1, and the optical filter 3 and the A sensing space S1 communicating with at least one of the internal communication ports 21 is formed between the sensing regions 11 .

The circuit carrier 4 is flat in this embodiment and can be a printed circuit board (printed circuit board, PCB), a flexible printed circuit board (flexible printed circuit, FPC), or a ceramic substrate, the invention is not limited here . Wherein, the circuit carrier 4 has a lower plate surface 43 and an upper plate surface 44 on the opposite side of the lower plate surface 43, the circuit carrier 4 is formed with a through hole 41, and the circuit carrier 4 ( The lower plate surface 43 ) has a plurality of bonding pads 42 located outside the through holes 41 .

In this embodiment, the plurality of bonding pads 42 are arranged in two rows and are respectively located on opposite sides of the through hole 41, and the positions of the plurality of bonding pads 42 are respectively corresponding to the plurality of welding pads 13, but this creation is not limited thereto. For example, in other embodiments not shown in this creation, the positions of the plurality of bonding pads 42 can be arranged in a ring or in accordance with requirements on the premise that they respectively correspond to the positions of the plurality of bonding pads 13 . U-shaped arrangement.

Furthermore, the image sensing chip 1 is welded and fixed to the plurality of bonding pads 42 with the plurality of bonding pads 13 respectively, and at least part of the optical filter 3 is penetrated through the through hole 41, so as to An annular gap G communicating with at least one of the inner communication ports 21 is formed between the inner wall of the through hole 41 .

Furthermore, in this embodiment, the outer surface 32 of the optical filter 3 (and part of the ring side surface 33 ) protrudes from the through hole 41 of the circuit carrier 4 , and the second Two adhesive layers 6 connect and seal the periphery of the top surface 10 of the image sensing chip 1 and the circuit carrier 4 (such as: the lower surface 43), so that moisture or particles cannot penetrate Pass through the junction of the image sensing chip 1 and the circuit carrier 4 .

The first adhesive layer 5 is formed on a part of the annular gap G (eg: the top of the annular gap G) to bond the optical filter 3 to the circuit carrier 4 . In this embodiment, the first adhesive layer 5 is formed by solidification of a material with a viscosity ranging from 1000cps to 125000cps, and the width W of the annular gap G is not greater than 2000 microns (μm), but the invention is not limited here.

Furthermore, as shown in Figure 3 and Figure 4, the first adhesive layer 5 is adhered to the inner wall of the through hole 41 and the ring side 33 of the filter 3 (such as: the ring The top of the side 33 ), and the first adhesive layer 5 preferably does not touch the inner surface 31 of the support layer 2 and the filter 3 , but the invention is not limited thereto.

For example, as shown in FIG. 5 , the first adhesive layer 5 can be further extended to the periphery of the outer surface 32 of the optical filter 3 according to requirements; that is, the first adhesive layer 5 Adhering to the inner wall of the through hole 41, the ring side 33 (such as: the top of the ring side 33) of the filter 3 and the surrounding parts of the outer surface 32 . Wherein, the surrounding portion of the outer surface 32 is orthographically projected on the top surface 10 along the predetermined direction D to form a projected area, which needs to be located outside the sensing area 11, so as to avoid influence The detection accuracy of the sensing area 11 .

As shown in FIG. 3 and FIG. 4 , the first adhesive layer 5 is not in the shape of a closed ring and is formed with at least one external communication opening 51 . Wherein, at least one of the inner communication port 21 and at least one of the outer communication ports 51 do not overlap with each other in the preset direction D, so that at least one of the outer communication port 51, the annular gap G, and at least one One of the internal communication ports 21 can jointly form a dust-proof passage C connected to the sensing space S1.

To sum up, the open sensing module 100 (or the image sensing lens 1000 ) in this embodiment can form the dust-proof channel C so that the sensing space S1 is no longer The closed shape further facilitates the miniaturization of the image sensing chip 1 . Furthermore, the dust-proof channel C is defined by the specific position of at least one of the internal communication ports 21 and at least one of the external communication ports 51 (such as: at least one of the internal communication ports 21 and at least one of the external communication ports 51 non-overlapping each other in the predetermined direction D) to have a dust-proof effect, so that even if particles enter the dust-proof channel C from at least one of the outer communication ports 51 , it is difficult for them to reach the sensing space S1.

Furthermore, on the premise that the open sensing module 100 (or the image sensing lens 1000 ) has a dust-proof function by forming the dust-proof channel C in this embodiment, the support layer 2 The structure will no longer be too limited, so that the support layer 2 can have different changes according to different needs, and the first adhesive layer 5 can also help the filter 3 to be more stable Combined with the circuit carrier board 4 .

That is to say, the number, size, and position of at least one internal communication port 21 and at least one external communication port 51 can be adjusted and varied according to requirements, so that the open sensing module 100 can be configured The dust-proof channel C that meets different requirements, for example: the dust-proof channel C can be shown in Figure 4, Figure 6A, Figure 6B, and to Figure 7, and any one of the inner communication ports 21 is connected to the adjacent outer port The distance formed between the communication ports 51 is defined as the path length of the dust-proof channel C, which is preferably 5%-95% of the perimeter of the sensing area 11 , but the invention is not limited thereto.

From another perspective, as shown in FIGS. 6A and 6B , the outer edge of the sensing region 11 has two first edges 111 located on opposite sides and two second edges located on opposite sides. 112, and a plurality of the welding pads 13 are respectively located on the outside of the two first edges 111, the support layer 2 includes two strips 22, which can be arranged on the Between the two first edges 111 and the plurality of welding pads 13 (that is, the outer sides of the two first edges 111) or on the two second edges 112 as shown in FIG. 6B A plurality of communication ports 21 are formed accordingly. Alternatively, as shown in FIG. 7 , the two strips 22 may also each have an L-shaped configuration, and the two strips 22 are respectively located at two diagonally opposite corners of the sensing region 11 .

As shown in FIGS. 3 and 4 , the optical module 200 includes a bracket 201 installed on the open sensing module 100 and at least one lens 202 installed in the bracket 201 . Wherein, the optical module 200 and the image sensing chip 1 are respectively located on opposite sides of the circuit carrier 4; that is, the optical module 200 is fixed by the bracket 201 (such as: glued) on the upper surface 44 of the circuit carrier 4 , and the image sensing chip 1 is fixed on the lower surface 43 of the circuit carrier 4 .

In more detail, a central optical axis L of at least one lens 202 passes through the sensing region 11 of the image sensing chip 1 (such as: the center of the sensing region 11), and the optical A space S2 jointly surrounded by the module 200 and the open sensing module 100 can be connected to the sensing space S1 through the dust-proof channel C, but is isolated from the external environment. It should be noted that the number of at least one lens 202 is illustrated as one in the drawings of this embodiment, but in other embodiments not shown in this creation, the number of at least one lens 202 can be There are a plurality of them, and their central optical axes L substantially overlap each other.

In addition, although the open sensing module 100 is illustrated as collaborating with the optical module 200 in this embodiment, the present invention is not limited thereto. For example, in other embodiments not shown in this creation, the open sensing module 100 can also be used alone (eg, sold) or used in conjunction with other components according to actual needs.

[Example 2]

Please refer to Fig. 8 and Fig. 9, which is the second embodiment of this creation. Since this embodiment is similar to the first embodiment above, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the first embodiment above are roughly described as follows:

In this embodiment, the filter 3 is entirely located in the through hole 41 (that is, the outer surface 32 of the filter 3 is located in the through hole 41, and the filter The outer surface 32 of the sheet 3 is flush with or lower than the upper surface 44 of the circuit carrier 4), and the first adhesive layer 5 is adhered to the inner wall of the through hole 41 and the The ring side 33 (the top) of the filter 3.

In addition, as shown in FIG. 8, the first adhesive layer 5 can also be further extended to the periphery of the outer surface 32 of the optical filter 3 according to requirements; that is, the first adhesive layer 5 is adhered to On the inner wall of the through hole 41, and the ring side 33 of the filter 3 and the surrounding parts of the outer surface 32, and the surrounding parts of the outer surface 32 are along the predetermined Assume that the direction D is orthographically projected onto a projected area formed by the top surface 10 , which is located outside the sensing area 11 .

[Embodiment three]

Please refer to Fig. 10 and Fig. 11, which is the third embodiment of this invention. Since this embodiment is similar to the above-mentioned first and second embodiments, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned first and second embodiments are roughly described as follows:

In this embodiment, the first adhesive layer 5 is an adhesive tape in a non-closed ring shape, and the first adhesive layer 5 adheres the optical filter 3 to the circuit carrier 4 . Wherein, the outer surface 32 of the optical filter 3 and the upper surface 44 of the circuit carrier 4 are formed with a step difference H not greater than 1000 microns corresponding to the preset direction D, so as to facilitate The first adhesive layer 5 is used for bonding.

It should be noted that, in FIG. 10, the outer surface 32 of the optical filter 3 is slightly higher than the upper surface 44 of the circuit carrier 4; and in FIG. 11, the filter The outer surface 32 of the sheet 3 and the upper surface 44 of the circuit carrier 4 are coplanar, but not limited thereto. For example, in other embodiments not shown in this invention, the outer surface 32 of the optical filter 3 may also be slightly lower than the upper surface 44 of the circuit carrier 4 .

Further, the first adhesive layer 5 is bonded to the peripheral portion of the outer surface 32 of the optical filter 3 and the upper surface 44 of the circuit carrier 4, and the outer surface 32 A projected area formed by the orthographic projection of the surrounding parts of the top surface 10 along the preset direction D is located outside the sensing area 11 .

In addition, since the first adhesive layer 5 is made of solid adhesive tape in this embodiment, the width W of the annular gap G can be changed according to design requirements, and is less limited by the first adhesive layer 5 .

[embodiment four]

Please refer to Figure 12, which is the fourth embodiment of this invention. Since this embodiment is similar to the above-mentioned embodiments 1 to 3, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned embodiments 1 to 3 are roughly described as follows:

In this embodiment, the open sensing module 100 further includes at least one electronic component 7 and a packaging layer 8 . At least one of the electronic components 7 is installed on the circuit carrier 4 (eg, the upper surface 44 ), and can be electrically coupled to the image sensor chip 1 through the circuit carrier 4 .

Furthermore, the encapsulation layer 8 is formed on the circuit carrier 4 (such as: the upper surface 44 ), so that at least one of the electronic components 7 is embedded therein, and part of the encapsulation layer 8 The inner edge is stopped by the first adhesive layer 5 . Wherein, the encapsulation layer 8 is, for example, a molding compound, and the optical module 200 is installed and fixed (eg, glued) on the encapsulation layer 8 by the bracket 201 .

[Technical effect of this creation embodiment]

To sum up, the image sensing lens and the open sensing module disclosed in the embodiment of the invention can form the dust-proof passage so that the sensing space is no longer closed, which is beneficial to all miniaturization of the image sensor chip. Moreover, the dust-proof channel is defined by the specific position of at least one of the internal communication ports and at least one of the external communication ports (such as: at least one of the internal communication ports and at least one of the external communication ports are in the preset directions do not overlap with each other) and have a dust-proof effect, so that even if particles enter the dust-proof passage from at least one of the outer communication ports, it is difficult for them to reach the sensing space.

Furthermore, in the image sensing lens and the open sensing module disclosed in the embodiment of the invention, on the premise that the dust-proof channel is formed and has a dust-proof function, the structure of the support layer will no longer be subject to excessive Therefore, the support layer can be varied according to different requirements, and the first adhesive layer can also help the optical filter to be more stably combined with the circuit carrier.

The content disclosed above is only the preferred feasible embodiment of this creation, and does not limit the patent scope of this creation, so all equivalent technical changes made by using the instructions and drawings of this creation are included in the patent scope of this creation Inside.

1000: image sensing lens 100: Open sensing module 1: Image sensor chip 10: top surface 11: Sensing area 111: First edge 112: second edge 12:Joint area 13: Welding pad 2: support layer 21: Internal communication port 22: strip 3: Filter 31: inner surface 32: Outer surface 33: ring side 4: Circuit carrier board 41: Through hole 42: Bonding Pad 43: Lower board surface 44: upper surface 5: The first bonding layer 51: external communication port 6: Second bonding layer 7: Electronic components 8: Encapsulation layer 200:Optical module 201: Bracket 202: lens G: Annular gap W: width S1: Sensing space S2: space C: Dust-proof channel D: Default direction L: Central optical axis H: step difference

FIG. 1 is a three-dimensional schematic diagram of an image sensing lens according to Embodiment 1 of the present invention.

FIG. 2 is an exploded schematic diagram of FIG. 1 .

FIG. 3 is a schematic cross-sectional view along line III-III in FIG. 1 .

FIG. 4 is a schematic top view of the open sensing module in FIG. 1 .

FIG. 5 is a schematic cross-sectional view of a variation of FIG. 3 .

FIG. 6A is a schematic top view of a variation of FIG. 4 .

FIG. 6B is a schematic top view of another variation of FIG. 4 .

FIG. 7 is a schematic top view of another variation of FIG. 4 .

FIG. 8 is a schematic cross-sectional view of an image sensing lens according to Embodiment 2 of the present invention.

FIG. 9 is another schematic cross-sectional view of the image sensing lens according to Embodiment 2 of the present invention.

FIG. 10 is a schematic cross-sectional view of an image sensing lens according to Embodiment 3 of the present invention.

FIG. 11 is another schematic cross-sectional view of the image sensing lens according to Embodiment 3 of the present invention.

FIG. 12 is a schematic cross-sectional view of an image sensing lens according to Embodiment 4 of the present invention.

1000: image sensing lens

100: Open sensing module

1: Image sensor chip

10: top surface

11: Sensing area

12:Joint area

13: Welding pad

2: support layer

21: Internal communication port

3: Filter

31: inner surface

32: Outer surface

33: ring side

4: Circuit carrier board

41: Through hole

42: Bonding Pad

43: Lower board surface

44: upper surface

5: The first bonding layer

51: external communication port

6: Second bonding layer

200:Optical module

201: bracket

202: lens

G: Annular gap

W: width

S1: Sensing space

S2: space

C: Dust-proof channel

D: Default direction

L: Central optical axis

Claims (10)

An image sensing lens comprising: An open sensing module, including: An image sensing chip, which is configured with a sensing area on the top surface and a bonding area located outside the sensing area; A supporting layer is arranged in the joint area, and the supporting layer is not in the shape of a closed loop but is formed with at least one internal communication port; An optical filter is arranged on the support layer along a preset direction and shields the sensing area; wherein, a sensing space is formed between the optical filter and the sensing area; A circuit carrier formed with a through hole; wherein, the image sensing chip is fixed on the circuit carrier, and at least a part of the filter is penetrated through the through hole so as to be connected with the through hole An annular gap communicating with at least one of the inner communication ports is formed between the inner walls; A first adhesive layer is formed in part of the annular gap to adhere the optical filter to the circuit carrier, and the first adhesive layer is not in the shape of a closed ring but is formed with at least one external communication port; Wherein, at least one of the inner communication ports and at least one of the outer communication ports do not overlap with each other in the predetermined direction, so that at least one of the outer communication ports, the annular gap, and at least one of the inner communication ports The openings can jointly form a dust-proof passage leading to the sensing space; and a second adhesive layer, connecting and sealing the top surface periphery of the image sensing chip and the circuit carrier; and An optical module, including a bracket installed on the open sensing module, and at least one lens installed in the bracket; wherein, the optical module and the image sensing chip are respectively located opposite sides of the circuit carrier. The image sensing lens according to claim 1, wherein a central optical axis of at least one lens passes through the sensing area of the image sensing chip, and the optical module and the open A space surrounded by the sensing modules can be connected to the sensing space through the dust-proof passage. The image sensing lens according to claim 1, wherein the optical filter has an inner surface disposed on the supporting layer, an outer surface opposite to the inner surface, and connected to the inner surface A ring side between the outer surface; wherein, the first adhesive layer does not touch the inner surface of the support layer and the filter, and the width of the annular gap is not greater than 2000 microns (μm ); the path length of the dust-proof channel is 5% to 95% of the perimeter of the sensing area. The image sensing lens according to claim 1, wherein the optical filter has an inner surface disposed on the supporting layer, an outer surface opposite to the inner surface, and connected to the inner surface and a ring side between the outer surface; wherein, the outer surface of the filter protrudes from the through hole, and the first adhesive layer is adhered to the inner wall and the through hole the ring side of the filter. The image sensing lens according to claim 1, wherein the optical filter has an inner surface disposed on the supporting layer, an outer surface opposite to the inner surface, and connected to the inner surface A ring side between the outer surface; wherein, the outer surface of the filter is located inside the through hole, and the first adhesive layer is adhered to the inner wall and the through hole the ring side of the filter. The image sensing lens according to claim 1, wherein the optical filter has an inner surface disposed on the supporting layer, an outer surface opposite to the inner surface, and connected to the inner surface and a ring side between the outer surface; wherein, the first adhesive layer is adhered to the inner wall of the through hole, and the ring side of the filter and the surrounding parts of the outer surface , and the surrounding portion of the outer surface is orthographically projected on the top surface along the predetermined direction to form a projected area, which is located outside the sensing area. The image sensing lens according to claim 1, wherein the open sensing module further includes: At least one electronic component is mounted on the circuit carrier, and at least one of the electronic components is electrically coupled to the image sensing chip through the circuit carrier; and An encapsulation layer formed on the circuit carrier so that at least one of the electronic components is embedded therein, and part of the inner edge of the encapsulation layer is stopped by the first adhesive layer; wherein the optical The module is installed and fixed on the packaging layer by the bracket. The image sensing lens according to any one of Claims 1 to 7, wherein the image sensing chip has a plurality of soldering pads on the top surface outside the bonding area, and the circuit carrier There are a plurality of bonding pads located outside the through hole, and the image sensing chip is respectively soldered and fixed to the plurality of bonding pads by the plurality of bonding pads. An open sensing module comprising: An image sensing chip, which is configured with a sensing area on the top surface and a bonding area located outside the sensing area; A supporting layer is arranged in the joint area, and the supporting layer is not in the shape of a closed loop but is formed with at least one internal communication port; An optical filter is arranged on the support layer along a preset direction and shields the sensing area; wherein, a sensing space is formed between the optical filter and the sensing area; A circuit carrier formed with a through hole; wherein, the image sensing chip is fixed on the circuit carrier, and at least a part of the filter is penetrated through the through hole so as to be connected with the through hole An annular gap communicating with at least one of the inner communication ports is formed between the inner walls; A first adhesive layer is formed in part of the annular gap to adhere the optical filter to the circuit carrier, and the first adhesive layer is not in the shape of a closed ring but is formed with at least one external communication port; Wherein, at least one of the inner communication ports and at least one of the outer communication ports do not overlap with each other in the predetermined direction, so that at least one of the outer communication ports, the annular gap, and at least one of the inner communication ports The openings can collectively form a dust-proof passage leading to the sensing space; and A second adhesive layer connects and seals the periphery of the top surface of the image sensing chip and the circuit carrier. An open sensing module comprising: An image sensing chip, which is configured with a sensing area on the top surface, a bonding area outside the sensing area, and a plurality of welding pads outside the bonding area; A supporting layer is arranged in the joint area, and the supporting layer is not in the shape of a closed loop but is formed with at least one internal communication port; An optical filter is arranged on the support layer along a preset direction and shields the sensing area; wherein, a sensing space is formed between the optical filter and the sensing area; A circuit carrier board is formed with a through hole, and the circuit carrier board has a plurality of bonding pads located outside the through hole; wherein, the image sensing chip is respectively welded and fixed to a plurality of the welding pads. The bonding pad, and at least part of the optical filter is pierced through the through hole, so as to form an annular gap communicating with at least one of the inner communication ports between the inner wall of the through hole and the inner wall of the through hole; A first adhesive layer is an adhesive tape in the shape of a non-closed ring, and the first adhesive layer bonds the filter to the circuit carrier; wherein, the first adhesive layer is formed with at least one outer Communication port, at least one of the inner communication port and at least one of the outer communication ports do not overlap each other in the predetermined direction, so that at least one of the outer communication port, the annular gap, and at least one of the inner communication ports The communication ports can jointly form a dust-proof passage leading to the sensing space; and A second adhesive layer connects and seals the periphery of the top surface of the image sensing chip and the circuit carrier.

Images