TWM639359U - Waterproof structure of LED lamps - Google Patents
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- TWM639359U TWM639359U TW111212658U TW111212658U TWM639359U TW M639359 U TWM639359 U TW M639359U TW 111212658 U TW111212658 U TW 111212658U TW 111212658 U TW111212658 U TW 111212658U TW M639359 U TWM639359 U TW M639359U
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Abstract
本創作係提供一種LED燈具防水結構,係包括:一散熱基座,該散熱基座具有一底部及至少一承置部及一基座內置槽;一熱縮膜,該熱縮膜係包覆於該散熱基座外側;及至少一導電組件,該導電組件係設置於所述承置部上並貼附所述熱縮膜,且該導電組件相對該承置部另一側設置有至少一發光件,而該散熱基座外側係以所述熱縮膜直接包覆,而該熱縮膜可有效隔絕該散熱基座與外部之導電組件,以有效解決塗佈防水材料所形成之材料成本提高及作業複雜等問題,進而達到可節省材料成本及節省製作成本之功效。The invention provides a waterproof structure of LED lamps, which includes: a heat dissipation base, the heat dissipation base has a bottom, at least one bearing part and a built-in groove of the base; a heat shrinkable film, the heat shrinkable film is covered On the outside of the heat dissipation base; and at least one conductive component, the conductive component is arranged on the bearing part and attached with the heat shrinkable film, and the conductive component is provided with at least one on the other side of the bearing part The outer side of the heat dissipation base is directly covered with the heat shrinkable film, and the heat shrinkable film can effectively isolate the heat dissipation base from the external conductive components, so as to effectively solve the material cost formed by coating waterproof materials Problems such as improvement and complicated operations can be achieved, thereby achieving the effect of saving material costs and saving production costs.
Description
本創作係有關於一種LED燈具,尤指一種可節省材料成本及節省製作成本之LED燈具防水結構。 This creation is about an LED lamp, especially a waterproof structure of the LED lamp that can save material costs and production costs.
隨著LED(Light Emitting Diode,發光二極體)照明技術的日益發展,LED在人們日常生活中的應用也越來越廣泛,且隨著線性光源的應用,由低功率的燈具逐漸演變為功率較高之LED燈具,而對於LED光源來說,其發光功率的提升,溫度控制及散熱的需求也隨之提高,因此,為了使LED燈具使用壽命延長,且具有良好的照明效果,因此LED導電組件需要與散熱模組搭配使用,將LED所產生的高熱藉由散熱模組將熱量引導至燈具外部之環境,因此傳統的LED燈具多選用散熱模組來進行熱量之引導,並且為了讓LED燈具有更好的發光效率,因此市面上之LED燈具通常係由LED導電組件及散熱模組所組成,而該散熱模組內則配置有變壓器及驅動電源等電子元件,而該散熱基座上則需要設置有隔離措施來進行防止LED導電組件因接觸而漏電,與內部之壓器及驅動電源等電子元件進行防水,因此會在散熱基座上塗佈防水層,但防水層的使用會提高材料成本及作業上相對複雜,進而造成材料與製程之成本增加。 With the increasing development of LED (Light Emitting Diode, light-emitting diode) lighting technology, LED is more and more widely used in people's daily life, and with the application of linear light source, the low-power lamps gradually evolve into high-power Higher LED lamps, and for LED light sources, the increase in luminous power, temperature control and heat dissipation requirements also increase. Therefore, in order to prolong the service life of LED lamps and have good lighting effects, LED conductive The components need to be used in conjunction with the heat dissipation module to guide the high heat generated by the LED to the environment outside the lamp through the heat dissipation module. Therefore, traditional LED lamps often use the heat dissipation module to guide the heat, and in order to make the LED light It has better luminous efficiency, so LED lamps on the market are usually composed of LED conductive components and heat dissipation modules, and the heat dissipation module is equipped with electronic components such as transformers and drive power supplies, and the heat dissipation base is equipped with Isolation measures are required to prevent LED conductive components from leaking due to contact, and to waterproof electronic components such as internal transformers and drive power supplies. Therefore, a waterproof layer will be coated on the heat dissipation base, but the use of the waterproof layer will improve the performance of the material. The cost and operation are relatively complicated, which leads to an increase in the cost of materials and processes.
是以,要如何解決上述習用之問題與缺失,即為本創作之創作人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the problems and deficiencies of the above-mentioned common usage is the direction for the creators of this creation and related manufacturers engaged in this industry to study and improve.
爰此,為有效解決上述之問題,本創作之主要目的在於提供一種可節省材料成本及節省製作成本之LED燈具防水結構。 Therefore, in order to effectively solve the above-mentioned problems, the main purpose of this creation is to provide a waterproof structure of LED lamps that can save material costs and production costs.
為達上述目的,本創作係提供一種LED燈具防水結構,係包括:一散熱基座,該散熱基座具有一底部及與該底部相連之至少一承置部,且散熱基座於該底部與該承置部間形成有一基座內置槽;一熱縮膜,該熱縮膜係包覆於該散熱基座外側;及至少一導電組件,該導電組件係設置於所述承置部上並貼附所述熱縮膜,且該導電組件相對該承置部另一側設置有至少一發光件。 In order to achieve the above purpose, the invention provides a waterproof structure of LED lamps, which includes: a heat dissipation base, the heat dissipation base has a bottom and at least one bearing part connected to the bottom, and the heat dissipation base is connected between the bottom and the bottom. A base built-in groove is formed between the bearing parts; a heat shrinkable film is covered on the outside of the heat dissipation base; and at least one conductive component is arranged on the bearing part and The heat-shrinkable film is pasted, and at least one light-emitting element is arranged on the other side of the conductive component opposite to the receiving part.
根據本創作LED燈具防水結構之一實施例,其中所述導電組件更包括有一黏膠層,且該導電組件由該黏膠層貼附於該熱縮膜上。 According to an embodiment of the waterproof structure of the LED lamp of the present invention, the conductive component further includes an adhesive layer, and the conductive component is attached to the heat-shrinkable film by the adhesive layer.
根據本創作LED燈具防水結構之一實施例,更包括有至少一透光體,該透光體係設置於該導電組件上且罩蓋該發光件。 According to an embodiment of the waterproof structure of the LED lamp of the invention, it further includes at least one light-transmitting body, and the light-transmitting system is arranged on the conductive component and covers the light-emitting element.
根據本創作LED燈具防水結構之一實施例,其中所述導電組件係為金屬線或金屬板其中之一排列而成。 According to an embodiment of the waterproof structure of the LED lamp of the present invention, the conductive components are arranged as one of metal wires or metal plates.
根據本創作LED燈具防水結構之一實施例,其中所述導電組件係為金屬線或金屬板其中之一排列而成。 According to an embodiment of the waterproof structure of the LED lamp of the present invention, the conductive components are arranged as one of metal wires or metal plates.
根據本創作LED燈具防水結構之一實施例,其中所述散熱基座係以所述金屬編織網彎折成型。 According to an embodiment of the waterproof structure of the LED lamp in the present invention, the heat dissipation base is formed by bending the metal braided mesh.
根據本創作LED燈具防水結構之一實施例,其中所述散熱基座係以鋁擠成型。 According to an embodiment of the waterproof structure of the LED lamp of the present invention, the heat dissipation base is formed by extruding aluminum.
根據本創作LED燈具防水結構之一實施例,其中所述散熱基座係以鋁板沖壓成型。 According to an embodiment of the waterproof structure of the LED lamp of the present invention, the heat dissipation base is formed by stamping an aluminum plate.
根據本創作LED燈具防水結構之一實施例,其中所述熱縮膜係包覆於該底部與該承置部外側。 According to an embodiment of the waterproof structure of the LED lamp of the present invention, the heat-shrinkable film is covered on the bottom and the outer side of the receiving part.
根據本創作LED燈具防水結構之一實施例,其中所述散熱基座更具有一轉折部,該轉折部係形成於該底部與該承置部間。 According to an embodiment of the waterproof structure of the LED lamp of the present invention, the heat dissipation base further has a turning portion, and the turning portion is formed between the bottom and the receiving portion.
根據本創作LED燈具防水結構之一實施例,其中所述熱縮膜係包覆於該底部與該轉折部與該承置部外側。 According to an embodiment of the waterproof structure of the LED lamp of the present invention, the heat-shrinkable film is wrapped on the bottom, the turning portion, and the outside of the receiving portion.
1:LED燈具防水結構 1: Waterproof structure of LED lamps
2:散熱基座 2: cooling base
21:底部 21: Bottom
22:承置部 22: Bearing Department
23:轉折部 23: Turning Department
24:基座內置槽 24: Base built-in slot
3:熱縮膜 3: heat shrinkable film
4:導電組件 4: Conductive components
41:發光件 41: Luminous parts
42:黏膠層 42: Adhesive layer
5:透光體 5: Translucent body
第1圖係本創作LED燈具防水結構之組合剖視示意圖。 Figure 1 is a schematic cross-sectional view of the combination of the waterproof structure of the LED lamps created in this invention.
第2圖係本創作LED燈具防水結構之組合剖視實施示意圖一。 Figure 2 is a schematic diagram of the combination and implementation of the waterproof structure of the LED lamps of this invention.
第3圖係本創作LED燈具防水結構之組合剖視實施示意圖二。 The 3rd picture is the combination section implementation schematic diagram 2 of the waterproof structure of the LED lamp of this creation.
第4圖係本創作LED燈具防水結構之組合剖視實施示意圖三。 Fig. 4 is the combined sectional view implementation schematic diagram of the waterproof structure of LED lamps and lanterns of this invention.
本創作之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above-mentioned purpose of this creation and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.
在以下,針對本創作有關LED燈具防水結構之構成及技術內容等,列舉各種適用的實例並配合參照隨文所附圖式而加以詳細地說明;然而,本創作當然不是限定於所列舉之該等的實施例、圖式或詳細說明內容而已。 In the following, for the composition and technical content of the waterproof structure of LED lamps in this creation, various applicable examples are listed and explained in detail with reference to the accompanying drawings; however, this creation is certainly not limited to the listed ones. etc., are merely the embodiments, drawings, or detailed descriptions.
再者,熟悉此項技術之業者亦當明瞭:所列舉之實施例與所附之圖式僅提供參考與說明之用,並非用來對本創作加以限制者;能夠基於該等記載而容易實施之修飾或變更而完成之創作,亦皆視為不脫離本創 作之精神與意旨的範圍內,當然該等創作亦均包括在本創作之申請專利範圍。 Furthermore, those who are familiar with this technology should also be clear: the enumerated embodiments and the attached drawings are only for reference and description, and are not used to limit the creation; Modifications or changes are also considered as not departing from the original creation. Within the scope of the spirit and intent of the work, of course, such creations are also included in the patent application scope of this creation.
又,以下實施例所提到的方向用語,例如:「上」、「下」、「左」、「右」、「前」、「後」等,僅是參考附加圖示的方向。因此,使用的方向用語是用來說明,而並非用來限制本創作;再者,在下列各實施例中,相同或相似的元件將採用相同或相似的元件標號。 In addition, the directional terms mentioned in the following embodiments, such as "upper", "lower", "left", "right", "front", "rear", etc., are only referring to the directions attached to the drawings. Therefore, the used directional terms are used for illustration, not for limiting the invention; moreover, in the following embodiments, the same or similar elements will use the same or similar element numbers.
首先,請參閱第1圖所示,係為本創作LED燈具防水結構之組合剖視示意圖,由圖中可清楚看出,其中所述LED燈具防水結構1係包括有一散熱基座2及一熱縮膜3及至少一導電組件4及至少一透光體5。
First of all, please refer to Figure 1, which is a combined cross-sectional schematic diagram of the waterproof structure of LED lamps created by this invention. It can be clearly seen from the figure that the
於本實施例中,該散熱基座2係以方形之散熱基座2為實施方式,且該散熱基座2係可以金屬編織網彎折成型或鋁擠成型或鋁板沖壓成型,但不因此為限,而該散熱基座2主要具有一底部21及一承置部22,且該底部21與該承置部22間形成有一轉折部23,該轉折部23係形成於該底部21兩端且往上延伸,而該承置部22係由該轉折部23之端緣往內延伸,且該散熱基座2於該底部21與該轉折部23與該承置部22間形成有一基座內置槽24,該基座內置槽24內可設置有變壓器或驅動電源或電線走線(圖中未表示)。
In this embodiment, the
其中所述熱縮膜3係包覆於該散熱基座2外側,於本實施例中,該熱縮膜3係包覆於該底部21與該轉折部23與該承置部22外側。
The heat-
其中該導電組件4係設置於所述承置部22之熱縮膜3上,且該導電組件4相對該承置部22另一側設置有至少一發光件41,並該導電組件4係可為金屬線或金屬板排列而成,也可為可撓式明基板、玻璃基板或PCB電路板,而該
發光件41係焊接於該導電組件4上,又該導電組件4更包括有一黏膠層42,且該導電組件4由該黏膠層42貼附於該熱縮膜3上。
Wherein the
其中該透光體5係設置於該導電組件4上且罩蓋該發光件41,而該透光體5係可為透鏡或透光塑膠,該透鏡係罩蓋所述發光件41,而該透光塑膠所形成之長度與寬度係對應與散熱基座2且罩蓋所述發光件41。
Wherein the light-transmitting
藉此,所述散熱基座2外側係以所述熱縮膜3直接包覆,而該熱縮膜3可有效隔絕該散熱基座2與外部之導電組件4,以有效解決塗佈防水材料所形成之材料成本提高及作業複雜等問題,進而達到可節省材料成本及節省製作成本之功效。
Thereby, the outside of the
再請參閱第2圖所示,係為本創作LED燈具防水結構之組合剖視實施示意圖一,於本實施例中,該散熱基座2係以三角形之散熱基座2為實施方式,且該散熱基座2係可以金屬編織網彎折成型或鋁擠成型或鋁板沖壓成型,但不因此為限,而該散熱基座2主要具有所述底部21及兩處之承置部22,該承置部22形成於該底部21兩端且往上及往內延伸,且該散熱基座2於該底部21與該承置部22間形成有基座內置槽24,該基座內置槽24內可設置有變壓器或驅動電源或電線走線(圖中未表示),而該熱縮膜3係包覆於該底部21與該承置部22外側,另該各承置部22上分別設置有一組導電組件4,該導電組件4一側具有所述發光件41,另一側具有所述黏膠層42貼附所述熱縮膜3,且兩承置部22間形成有夾角之角度,使該LED燈具防水結構1產生之光線具有廣角之效果,而該透光體5係設置於該導電組件4上且罩蓋該發光件41,藉此,所述散熱基座2外側係以所述熱縮膜3直接包覆,而該熱縮膜3可有效隔絕該散熱基座2與外部之導電組件
4,以有效解決塗佈防水材料所形成之材料成本提高及作業複雜等問題,進而達到可節省材料成本及節省製作成本之功效。
Please refer to Figure 2 again, which is a combined cross-sectional implementation schematic diagram of the LED lamp waterproof structure of this creation. In this embodiment, the
再請參閱第3圖及第4圖所示,係為本創作LED燈具防水結構之組合剖視實施示意圖二及三,於本實施例中,該散熱基座2係以多邊形之散熱基座2為實施方式,且該散熱基座2係可以金屬編織網彎折成型或鋁擠成型或鋁板沖壓成型,但不因此為限,而該散熱基座2主要具有所述底部21及兩處之轉折部23及兩處之承置部22,該轉折部23係形成於該底部21兩端且往上延伸,而該承置部22係由該轉折部23之端緣往內延伸,且該散熱基座2於該底部21與該轉折部23與該承置部22間形成有基座內置槽24,該基座內置槽24內可設置有變壓器或驅動電源或電線走線(圖中未表示),而該熱縮膜3係包覆於該底部21與該轉折部23與該承置部22外側,另該各承置部22上分別設置有一組導電組件4,該導電組件4一側具有所述發光件41,另一側具有所述黏膠層42貼附所述熱縮膜3,且兩承置部22間形成有夾角之角度,使該LED燈具防水結構1產生之光線具有廣角之效果,而該透光體5係設置於該導電組件4上且罩蓋該發光件41,藉此,所述散熱基座2外側係以所述熱縮膜3直接包覆,而該熱縮膜3可有效隔絕該散熱基座2與外部之導電組件4,以有效解決塗佈防水材料所形成之材料成本提高及作業複雜等問題,進而達到可節省材料成本及節省製作成本之功效。
Please refer to Fig. 3 and Fig. 4 again, which are combined cross-sectional implementation schematic diagrams 2 and 3 of the LED lamp waterproof structure of this invention. In this embodiment, the
以上已將本創作做一詳細說明,惟以上所述者,僅為本創作之一較佳實施例而已,當不能限定本創作實施之範圍,即凡依本創作申請範圍所作之均等變化與修飾等,皆應仍屬本創作之專利涵蓋範圍。 The above has made a detailed description of this creation, but the above is only one of the preferred embodiments of this creation, and should not limit the scope of implementation of this creation, that is, all equal changes and modifications made according to the scope of application of this creation etc., should still be covered by the patent of this creation.
1:LED燈具防水結構 1: Waterproof structure of LED lamps
2:散熱基座 2: cooling base
21:底部 21: Bottom
22:承置部 22: Bearing Department
23:轉折部 23: Turning Department
24:基座內置槽 24: Base built-in slot
3:熱縮膜 3: heat shrinkable film
4:導電組件 4: Conductive components
41:發光件 41: Luminous parts
42:黏膠層 42: Adhesive layer
5:透光體 5: Translucent body
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TWM639359U true TWM639359U (en) | 2023-04-01 |
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TW111212658U TWM639359U (en) | 2022-11-18 | 2022-11-18 | Waterproof structure of LED lamps |
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TW (1) | TWM639359U (en) |
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2022
- 2022-11-18 TW TW111212658U patent/TWM639359U/en unknown
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