TWM637912U - Piezoelectric vibration module and planar piezoelectric element - Google Patents

Abstract

A piezoelectric vibration module includes two conductive layers, two plane piezoelectric elements and a packaging material. The two conductive layers face each other and are spaced apart. The two plane piezoelectric elements face each other and are arranged between the two conductive layers, wherein a separation gap exists between the two planar piezoelectric elements. The packaging material is arranged between the two conductive layers, covers the two plane piezoelectric elements, and fills the separation gap. A planar piezoelectric element comprises a piezoelectric material layer, two conductive adhesive layers and a surface treatment layer, wherein the two conductive adhesive layers are respectively arranged on two surfaces of the piezoelectric material layer, and the surface treatment layer covers the peripheral side of the piezoelectric material layer, the peripheral wall and the exposed surface of the conductive adhesive layer. The piezoelectric vibration module has the advantage of realizing high frequency and wide frequency transmission of sound waves.

Description

Piezoelectric vibration module and planar piezoelectric element

This creation is about the structure of a vibration module, especially about the structure of a piezoelectric vibration module and the structure of a planar piezoelectric element.

With the development trend of thinner and lighter electronic products, speakers are gradually becoming thinner, and the demand for planar speakers is rapidly increasing along with the electronic product market. How to ensure the sound quality of music, and how to be thin enough to be built into electronic products has become the focus of technological development of new speaker products. In addition to the appeal of thinness, broadband is also the follow-up development of piezoelectric speaker technology. Among them, under the condition of broadband demand, the audio response of the speaker has a wide range, and the sound pressure of each frequency must be maintained at a sufficiently similar state to avoid excessive fluctuations in high and low frequencies. Therefore, providing a piezoelectric planar speaker (that is, a piezoelectric vibration module) with a wide frequency range and bandwidth is really pursued by the former industry.

The invention provides a piezoelectric vibration module and a planar piezoelectric element, wherein the piezoelectric vibration module has the advantage of realizing high-frequency and wide-band transmission of sound waves.

The piezoelectric vibration module provided by this creation includes two conductive layers, two planar piezoelectric elements and packaging materials. The two conductive layers face each other and are arranged at intervals; the two planar piezoelectric elements face each other and are arranged between the two conductive layers, wherein there is a piezoelectric material separation gap between the two planar piezoelectric elements; the packaging material is arranged between the two conductive layers The space covers the two planar piezoelectric elements and fills the separation gap of the piezoelectric material.

In an embodiment of the present invention, the pitch of the separation gap of the piezoelectric material is less than 20 microns.

In an embodiment of the present invention, the above-mentioned two planar piezoelectric elements are respectively in direct contact with the two conductive layers.

In an embodiment of the present invention, there is a bonding gap between at least one of the two planar piezoelectric elements and at least one of the two adjacent conductive layers, and the encapsulation material further fills the bonding gap.

In an embodiment of the present invention, the piezoelectric vibration module further includes a non-conductive adhesive layer, and there is an adhesive gap between at least one of the two planar piezoelectric elements and at least one of the adjacent two conductive layers, and the non-conductive adhesive layer Set in the bonding gap, the non-conductive bonding layer is silicone rubber, acrylic glue or epoxy resin.

In an embodiment of the present invention, the piezoelectric vibration module further includes a conductive adhesive layer, and there is an adhesive gap between at least one of the two planar piezoelectric elements and at least one of the adjacent two conductive layers, and the conductive adhesive layer is disposed on Then gap.

In an embodiment of the present invention, the pitch of the aforesaid bonding gaps is less than 20 microns.

In an embodiment of the present invention, the above two conductive layers are selected from one or a combination of conductive metal, conductive metal oxide material, conductive glue and conductive polymer material.

In an embodiment of the present invention, the above two conductive layers are electrically connected to the positive contact and the negative contact of the audio output device respectively.

The piezoelectric vibration module provided by this creation includes a support layer, a first conductive layer, a second conductive layer, a third conductive layer, a first planar piezoelectric element, a second planar piezoelectric element, a first packaging material, a second Two packaging materials, and a conductive connection structure. The first conductive layer is arranged on the support layer; the second conductive layer and the first conductive layer are facing each other and arranged at intervals; the first planar piezoelectric element is arranged between the first conductive layer and the second conductive layer; the first packaging material It is at least disposed between the first conductive layer and the second conductive layer, and covers at least the peripheral side of the first planar piezoelectric element; the third conductive layer is disposed on the support layer, and there is a groove between the first conductive layer and the first conductive layer ; The second planar piezoelectric element is arranged on the third conductive layer; the second packaging material is at least arranged on the third conductive layer and at least covers the peripheral side of the second planar piezoelectric element, and the second packaging material is further arranged on the grooved A part covers part of the third conductive layer; the conductive connection structure is arranged on the support layer and filled in the other part of the slot, and the conductive connection structure is electrically connected to the first conductive layer and the second planar piezoelectric element.

In an embodiment of the present creation, the above-mentioned conductive connection structure includes a longitudinal portion, a first transverse portion and a second transverse portion, the longitudinal portion is provided along one side of the second packaging material by a slot, and the first transverse portion is formed by a longitudinal The portion adjacent to the bottom end extends laterally to electrically connect to the first conductive layer, and the second lateral portion extends laterally from the top end of the longitudinal portion and electrically connects to the second planar piezoelectric element.

In an embodiment of the present invention, the piezoelectric vibration module further includes a fourth conductive layer, which is disposed on the other side of the second planar piezoelectric element away from the third conductive layer, so that the fourth conductive layer and the third conductive layer They face each other and are arranged at intervals, and the second encapsulation material is arranged between the third conductive layer and the fourth conductive layer.

In an embodiment of the present creation, the above-mentioned conductive connection structure includes a longitudinal portion, a first transverse portion and a second transverse portion, the longitudinal portion is arranged along one side of the second packaging material and the fourth conductive layer through slots, and the second A transverse portion extends transversely from a bottom end of the longitudinal portion to be electrically connected to the first conductive layer, and a second transverse portion extends transversely from a top end of the longitudinal portion and is electrically connected to the fourth conductive layer.

In an embodiment of the present invention, the above-mentioned first planar piezoelectric element has a first bottom side and a first top side opposite to each other, and the first bottom side and the first top side are respectively connected to the first conductive layer and the second conductive layer In direct contact, the second planar piezoelectric element has a second bottom side in direct contact with the third conductive layer.

In an embodiment of the present invention, the above-mentioned first planar piezoelectric element has a first bottom side and a first top side opposite to each other, at least one of the first bottom side and the first top side is respectively connected to the first conductive layer and the first top side. There is a first bonding gap between at least one of the second conductive layers, the second planar piezoelectric element has a second bottom side, and there is a second bonding gap between the second bottom side and the third conductive layer, wherein the first package The material further fills the first bonding gap, and the second packaging material further fills the second bonding gap.

In an embodiment of the present invention, the piezoelectric vibration module further includes a first conductive bonding layer and a second conductive bonding layer, the first planar piezoelectric element has a first bottom side and a first top side opposite to each other, and the first bottom There is a first connection gap between at least one of the side and the first top side and at least one of the first conductive layer and the second conductive layer respectively, the second planar piezoelectric element has a second bottom side, and the second bottom side is connected to the second bottom side There is a second bonding gap between the third conductive layers, wherein the first conductive bonding layer is disposed in the first bonding gap, and the second conductive bonding layer is disposed in the second bonding gap.

The piezoelectric vibration module provided by this creation includes a first conductive layer, two planar piezoelectric elements, two packaging materials, a bonding layer, and a second conductive layer. The two planar piezoelectric elements are arranged side by side on the first conductive layer; the two packaging materials cover at least the peripheral sides of the two planar piezoelectric elements respectively; the bonding layer is arranged on the first conductive layer, and the two packaging materials are fixed together; The second conductive layer is disposed on the bonding layer and is electrically connected to the two planar piezoelectric elements.

In an embodiment of the present invention, the above-mentioned first conductive layer includes copper foil, and the thickness of the first conductive layer is between 5 microns and 35 microns.

In an embodiment of the present invention, the thickness of the above-mentioned planar piezoelectric element is between 50 microns and 300 microns, and the thickness of the bonding layer is between 25 microns and 200 microns.

In an embodiment of the present invention, the thickness of the above-mentioned second conductive layer is between 10 microns and 50 microns.

The planar piezoelectric element provided by this creation includes a piezoelectric material layer, two conductive adhesive layers, and a surface treatment layer. The piezoelectric material layer includes two opposite surfaces and a peripheral side, the peripheral side is located between the two surfaces and connects the two surfaces; two conductive adhesive layers are respectively arranged on the two surfaces of the piezoelectric material layer, and each conductive adhesive layer includes an exposed surface and a peripheral wall; The surface treatment layer at least covers the peripheral side of the piezoelectric material layer, the peripheral wall of the conductive adhesive layer, and the exposed surface of one of the conductive adhesive layers.

In an embodiment of the present invention, the above-mentioned surface treatment layer further covers the exposed surface of another conductive adhesive layer.

In an embodiment of the present invention, the area of the exposed surface of the above-mentioned conductive adhesive layer is equal to the area of the surface of the piezoelectric material layer.

In an embodiment of the present invention, the exposed surface area of the above-mentioned conductive adhesive layer is smaller than the surface area of the piezoelectric material layer, the conductive adhesive layer does not completely cover the surface of the piezoelectric material layer, and the surface treatment layer covers the surface that is not conductive. Part of the surface covered by the glue layer.

In this creation, the piezoelectric vibration modules have different thicknesses due to the up-and-down arrangement or left-right arrangement between the planar piezoelectric elements. Due to the different thicknesses of the piezoelectric material layers of the planar piezoelectric elements, the resonant frequency of each piezoelectric material layer is different, so that there are multiple modes between the stacked or parallel planar piezoelectric elements, that is, there are multiple resonant frequencies. By rationally designing the thickness of each piezoelectric material layer, the piezoelectric vibration module of this creation makes the resonant frequency of each piezoelectric material layer in the planar piezoelectric element close to and couples with each other, and works simultaneously in a wide frequency range, which can make it Combined frequency response does not produce discontinuous and deep The concave valley will form composite multi-mode vibration in this frequency band, which can effectively expand the working bandwidth of the piezoelectric vibration module and realize high-frequency and wide-band transmission of sound waves. In addition, the surface of the planar piezoelectric element of the invention is coated with a surface treatment layer to effectively protect the piezoelectric material layer of the planar piezoelectric element and avoid affecting the resonance frequency.

In order to make the above and other purposes, features and advantages of the invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H, 10I: piezoelectric vibration module

12, 12': conductive layer

12a, 12a': the first conductive layer

12b: Second conductive layer

12c: The third conductive layer

121: surface

14, 14': planar piezoelectric element

14a: the first planar piezoelectric element

141a: first bottom side

142a: first top side

143a: Zhou side

14b: The second planar piezoelectric element

141b: second bottom side

142b: second top side

143b: Zhou side

16, 16': packaging material

16a: the first packaging material

16b: Second packaging material

18: Piezoelectric material separation gap

20: Follow the gap

20a: First follow-up gap

20b: Second follow-up gap

22: Conductive bonding layer

22a: the first conductive bonding layer

22b: second conductive bonding layer

24: Audio output device

26: Conductive circuit

28: support layer

30: Conductive connection structure

301: Vertical part

302: first transverse part

303: second lateral part

32: slotting

34: Bonding layer

36: Through hole

38, 38': external connection part

40: Substrate structure

42: Insulation layer

44: Piezoelectric material layer

441, 441': surface

442: side view

46, 46': Conductive adhesive layer

461, 461': exposed surface

462, 462': surrounding wall

50: Planar piezoelectric element

52: Surface treatment layer

FIG. 1 is a schematic structural diagram of a piezoelectric vibration module according to a first embodiment of the invention.

Fig. 2 is a schematic structural diagram of a piezoelectric vibration module according to a second embodiment of the invention.

Fig. 3 is a schematic structural diagram of a piezoelectric vibration module according to a third embodiment of the invention.

Fig. 4 is a schematic structural diagram of a piezoelectric vibration module according to a fourth embodiment of the invention.

Fig. 5 is a schematic structural diagram of a piezoelectric vibration module according to a fifth embodiment of the invention.

FIG. 6 is a schematic structural diagram of a piezoelectric vibration module according to a sixth embodiment of the present invention.

FIG. 7 is a schematic structural diagram of a piezoelectric vibration module according to a seventh embodiment of the present invention.

FIG. 8 is a schematic structural diagram of a piezoelectric vibration module according to an eighth embodiment of the present invention.

FIG. 9 is a structural schematic diagram of a piezoelectric vibration module according to a ninth embodiment of the present invention.

FIG. 10A is a schematic structural diagram of a piezoelectric vibration module according to the tenth embodiment of the present invention.

Fig. 10B is a schematic top view of the piezoelectric vibration module according to the tenth embodiment of the present invention.

FIG. 11 is a schematic diagram of one process stage of the piezoelectric vibration module according to the tenth embodiment of the present invention.

12A to 12D are schematic diagrams of planar piezoelectric elements in different aspects of the present invention.

Fig. 1 is a structural schematic diagram of the piezoelectric vibration module of the first embodiment of the invention. As shown in Fig. 1, the piezoelectric vibration module 10 includes two conductive layers 12, 12', two planar piezoelectric elements 14, 14' and Packaging material 16. The two conductive layers 12, 12' are spaced apart from each other and facing each other; the two planar piezoelectric elements 14, 14' face each other and are arranged between the two conductive layers 12, 12', wherein there is a Piezoelectric material separation gap 18, in one embodiment, two planar piezoelectric elements 14, 14' are spaced up and down, and the pitch of piezoelectric material separation gap 18 is, for example, less than 20 microns (um), wherein the pitch is less than 15 microns Preferably, the thickness is less than 10 microns; the packaging material 16 is disposed between the two conductive layers 12, 12', covers the two planar piezoelectric elements 14, 14', and fills the separation gap 18 of the piezoelectric material.

Continuing the above description, as shown in FIG. 1, in one embodiment, one of the planar piezoelectric elements 14 (for example, the planar piezoelectric element 14 located above) directly contacts the conductive layer 12 adjacent to it, while the other planar piezoelectric element 14' (such as the planar piezoelectric element 14' located below) and its adjacent conductive layer 12' may have a bonding gap 20, and the packaging material 16 may be filled in the bonding gap 20, and the spacing of the bonding gap 20 is, for example, less than 20 microns, wherein the pitch is preferably less than 15 microns, and the most optimal is less than 10 microns. Also in an unillustrated embodiment, there may be gaps 20 between the upper and lower planar piezoelectric elements 14, 14' and the adjacent conductive layers 12, 12', and the gaps 20 are all filled. There is a part of the packaging material 16 .

Wherein, the material of the conductive layer 12, 12' can be selected from one or a combination of conductive metal, conductive metal oxide material, conductive glue, and conductive polymer material; the package material 16 is, for example, a package formed by a molding process. The molding compound, the material of the packaging material 16 is, for example, epoxy or other suitable dielectric materials. In another embodiment, other non- The conductive adhesive layer replaces the packaging material 16 filling the adhesive gap 20 , and the non-conductive adhesive layer is, for example, silicone, acrylic or epoxy resin.

Fig. 2 is a structural schematic diagram of the piezoelectric vibration module of the second embodiment of the present invention. As shown in Fig. 2, the piezoelectric vibration module 10A includes two conductive layers 12, 12', two planar piezoelectric elements 14, 14', The conductive bonding layer 22 and the packaging material 16 . The difference between the piezoelectric vibration module 10A of the second embodiment and the piezoelectric vibration module 10 of the first embodiment is mainly that the piezoelectric vibration module 10A includes a conductive bonding layer 22 disposed in the bonding gap 20, and other configurations are substantially the same. This will not be repeated here. The material of the conductive bonding layer 22 may include solder paste, conductive silver paste, or conductive tape.

Continuing the above description, as shown in FIG. 2, in one embodiment, one of the planar piezoelectric elements 14 (for example, the planar piezoelectric element 14 located above) directly contacts the conductive layer 12 adjacent to it, while the other planar piezoelectric element A conductive bonding layer 22 exists between 14' (eg, the underlying planar piezoelectric element 14') and its adjacent conductive layer 12'. In another embodiment not shown, there may be a conductive bonding layer 22 between the upper and lower planar piezoelectric elements 14 , 14 ′ and the adjacent conductive layers 12 , 12 ′.

Fig. 3 is a schematic diagram of the structure of the piezoelectric vibration module according to the third embodiment of the invention. As shown in Fig. 3, the piezoelectric vibration module 10B includes two conductive layers 12, 12', two planar piezoelectric elements 14, 14' and Packaging material 16. The difference between the piezoelectric vibration module 10B of the third embodiment and the piezoelectric vibration module 10 of the first embodiment is mainly that the two planar piezoelectric elements 14, 14' of the piezoelectric vibration module 10B are connected to the two conductive layers 12, 12' respectively. Direct contact without any bonding gap 20 (indicated in FIG. 1 and FIG. 2 ), that is, the planar piezoelectric elements 14, 14' and the conductive layers 12, 12' are bonded together through electrostatic adsorption. Other configurations are roughly the same and will not be repeated here.

In the above-mentioned first, second and third embodiments, as shown in Fig. 1, Fig. 2 and Fig. 3, the two planar piezoelectric elements 14, 14' are arranged at intervals up and down, and are separated from the two planar piezoelectric elements 14, 14 ' directly or indirectly The two conductive layers 12, 12' that are in contact with each other are connected to the positive contact and the negative contact of a sound source output device 24 respectively, so that the sound source signal (voltage signal) output by the sound source output device 24 can be transmitted to the two conductive layers 12, 12', so that the two conductive layers 12, 12' have an electric field, and the planar piezoelectric elements 14, 14' vibrate due to the reverse piezoelectric effect, so as to convert the audio signal into the vibration of the planar piezoelectric elements 14, 14'. In one embodiment, the two conductive layers 12 , 12 ′ can be electrically connected to the audio output device 24 through the conductive circuit 26 .

Fig. 4 is a schematic diagram of the structure of the piezoelectric vibration module according to the fourth embodiment of the invention. As shown in Fig. 4, the piezoelectric vibration module 10C includes a support layer 28, three conductive layers, two planar piezoelectric elements, and two packaging materials. and a conductive connection structure. In one embodiment, the three conductive layers are respectively the first conductive layer 12a, the second conductive layer 12b and the third conductive layer 12c, and the two planar piezoelectric elements are respectively the first planar piezoelectric element 14a and the second planar piezoelectric element 14b, the two packaging materials are respectively the first packaging material 16a and the second packaging material 16b. In one embodiment, the material of the support layer 28 is, for example, fiberglass epoxy laminate (FR4), glass, PET, polyimide (PI), or a combination thereof.

As shown in Figure 4, the first conductive layer 12a is arranged on the support layer 28; the second conductive layer 12b and the first conductive layer 12a face each other and are spaced up and down; the first planar piezoelectric element 14a is arranged on the first Between the conductive layer 12a and the second conductive layer 12b, in one embodiment, the first planar piezoelectric element 14a has a first bottom side 141a and a first top side 142a opposite to each other, and the first bottom side 141a and the first top side 142a are respectively in direct contact with the first conductive layer 12a and the second conductive layer 12b; the first packaging material 16a is arranged between the first conductive layer 12a and the second conductive layer 12b, and covers the circumference of the first planar piezoelectric element 14a side 143a. In one embodiment, as shown in FIG. 4, the first packaging material 16a does not completely cover the first conductive layer 12a and the second conductive layer 12b, but exposes the opposite surface 121 of the first conductive layer 12a and the second conductive layer 12b. peripheral part.

Continuing the above description, the third conductive layer 12c is disposed on the supporting layer 28, the third conductive layer 12c is arranged side by side with the first conductive layer 12a, and there is a slot 32 between the third conductive layer 12c and the first conductive layer 12a; Two planar piezoelectric elements 14b are disposed on the third conductive layer 12c. In one embodiment, the second planar piezoelectric element 14b has a second bottom side 141b and a second top side 142b opposite to each other. The second bottom side 141b is connected to the third The conductive layer 12c is in direct contact; the second encapsulation material 16b is disposed on the third conductive layer 12c and covers the peripheral side 143b of the second planar piezoelectric element 14b, and the second encapsulation material 16b is further disposed in a part of the slot 32 and covers Part of the third conductive layer 12c, in one embodiment, as shown in FIG. 4 , the second encapsulation material 16b extends to the support layer 28 and covers a side of the third conductive layer 12c adjacent to the first conductive layer 12a.

Continuing the above description, the conductive connection structure 30 is disposed on the support layer 28 and filled in another part of the slot 32 , and the conductive connection structure 30 is electrically connected to the first conductive layer 12 a and the second planar piezoelectric element 14 b. In one embodiment, as shown in FIG. 4 , the conductive connection structure 30 includes a longitudinal portion 301 , a first transverse portion 302 and a second transverse portion 303 . The longitudinal portion 301 is provided along one side of the second packaging material 16b by the slot 32; the first transverse portion 302 extends transversely from the bottom end of the longitudinal portion 301 to electrically connect the first conductive layer 12a, and the first transverse portion 302 For example, it is electrically connected to a portion of the periphery of the first conductive layer 12a that is not covered by the first encapsulation material 16a; the second transverse portion 303 extends laterally from the top of the longitudinal portion 301 and is electrically connected to the second planar piezoelectric element 14b, for example, electrically connected The second top side 142b of the second planar piezoelectric element 14b.

Wherein, the material of the conductive connection structure 30 can be the same as that of the first conductive layer 12a, the second conductive layer 12b and the third conductive layer 12c. In one embodiment, the conductive connection structure 30, the first conductive layer 12a, the second The material of the conductive layer 12b and the third conductive layer 12c can be selected from one or a combination of conductive metal, conductive metal oxide material, conductive glue and conductive polymer material.

Fig. 5 is a schematic structural view of the piezoelectric vibration module of the fifth embodiment of the present invention. As shown in Fig. 5, the piezoelectric vibration module 10D includes a support layer 28, three conductive layers (respectively the first conductive layer 12a, the second conductive layer conductive layer 12b and the third conductive layer 12c), two planar piezoelectric elements (respectively the first planar piezoelectric element 14a and the second planar piezoelectric element 14b), two packaging materials (respectively the first packaging material 16a and the second The packaging material 16 b ) and a conductive connection structure 30 . The difference between the piezoelectric vibration module 10D of the fifth embodiment and the piezoelectric vibration module 10C of the fourth embodiment is mainly that the first bottom side 141a of the first planar piezoelectric element 14a of the piezoelectric vibration module 10D is in contact with the first conductive There is a first bonding gap 20a between the layers 12a, and the first packaging material 16a is further filled into the first bonding gap 20a. The second bottom side 141b of the second planar piezoelectric element 14b of the piezoelectric vibration module 10D is connected to the third conductive gap 20a. There is a second bonding gap 20b between the layers 12c, and the second packaging material 16b further fills the second bonding gap 20b.

Wherein, the pitch between the first bonding gap 20a and the second bonding gap 20b is, for example, less than 20 microns, wherein the pitch is preferably smaller than 15 microns, and most optimally smaller than 10 microns; in an unshown embodiment, the first There may also be a first bonding gap 20a between the first top side 142a of the planar piezoelectric element 14a and the second conductive layer 12b, and the first packaging material 16a further fills the first bonding gap 20a. Optionally, other non-conductive bonding layers can also be used to replace the first packaging material 16a/second packaging material 16b filling the first bonding gap 20a/second bonding gap 20b. The non-conductive bonding layer is, for example, silicone, acrylic glue or epoxy.

Fig. 6 is a schematic structural view of the piezoelectric vibration module of the sixth embodiment of the present invention. As shown in Fig. 6, the piezoelectric vibration module 10E includes a support layer 28, three conductive layers (respectively the first conductive layer 12a, the conductive layer 12b and the third conductive layer 12c), two planar piezoelectric elements (respectively the first planar piezoelectric element 14a and the second planar piezoelectric element 14b), two packaging materials (respectively the first packaging material 16a and the second The packaging material 16b), the conductive connection structure 30, the first conductive bonding layer 22a and the second conductive bonding layer 22b. Sixth reality The difference between the piezoelectric vibration module 10E of the embodiment and the piezoelectric vibration module 10D of the fifth embodiment is mainly that the piezoelectric vibration module 10E includes a first conductive bonding layer 22a and a second conductive bonding layer 22b, respectively disposed on the first Next to the gap 20a and the second subsequent gap 20b, other configurations are substantially the same, and will not be repeated here. The material of the conductive bonding layers 22a, 22b may include solder paste, conductive silver glue, or conductive tape.

In the above-mentioned fourth, fifth and sixth embodiments, as shown in Fig. 4, Fig. 5 and Fig. 6, the first planar piezoelectric element 14a and the second planar piezoelectric element 14b are spaced apart from the first The second conductive layer 12b that is in direct or indirect contact with the planar piezoelectric element 14a, and the third conductive layer 12c that is in direct or indirect contact with the second planar piezoelectric element 14b are electrically connected to the positive and negative contacts of the sound source output device 24. point, so that the sound source signal (voltage signal) output by the sound source output device 24 can be transmitted to the second conductive layer 12b and the third conductive layer 12c, so as to convert the sound source signal into the first planar piezoelectric element 14a and the second planar piezoelectric element 14b Vibration. In one embodiment, the second conductive layer 12b and the third conductive layer 12c can be electrically connected to the audio output device 24 through the conductive circuit 26 .

Fig. 7 is a structural schematic diagram of the piezoelectric vibration module of the seventh embodiment of the present invention. As shown in Fig. 7, the piezoelectric vibration module 10F includes a support layer 28, four conductive layers, two planar piezoelectric elements, two packaging materials and A conductive connection structure 30 . In one embodiment, the four conductive layers are respectively the first conductive layer 12a, the second conductive layer 12b, the third conductive layer 12c and the fourth conductive layer 12d, and the two planar piezoelectric elements are respectively the first planar piezoelectric element 14a and the fourth conductive layer 12d. The second planar piezoelectric element 14b and the two encapsulation materials are respectively the first encapsulation material 16a and the second encapsulation material 16b. Wherein, the structure and arrangement relationship among the first conductive layer 12 a , the first planar piezoelectric element 14 a , the second conductive layer 12 b and the first encapsulation material 16 a have been disclosed in the fourth embodiment and will not be repeated here.

Continuing the above description, the third conductive layer 12c is disposed on the support layer 28, the third conductive layer 12c is arranged side by side with the first conductive layer 12a, and there is an opening between the third conductive layer 12c and the first conductive layer 12a. groove 32; the fourth conductive layer 12d and the third conductive layer 12c face each other and are spaced up and down; the second planar piezoelectric element 14b is arranged between the third conductive layer 12c and the fourth conductive layer 12d, in one embodiment , the second planar piezoelectric element 14b has an opposite second bottom side 141b and a second top side 142b, the second bottom side 141b and the second top side 142b are respectively in direct contact with the third conductive layer 12c and the fourth conductive layer 12d; The second packaging material 16b is disposed between the third conductive layer 12c and the fourth conductive layer 12d, and covers the peripheral side surface 143b of the second planar piezoelectric element 14b, and the second packaging material 16b is further disposed in a part of the slot 32 and Cover part of the third conductive layer 12c. In one embodiment, as shown in FIG. .

Continuing the above description, the conductive connection structure 30 is disposed on the supporting layer 28 and filled in another part of the slot 32 , and the conductive connection structure 30 is electrically connected to the first conductive layer 12 a and the fourth conductive layer 12 d. In one embodiment, as shown in FIG. 7 , the conductive connection structure 30 includes a longitudinal portion 301 , a first transverse portion 302 and a second transverse portion 303 . The longitudinal portion 301 is disposed along one side of the second packaging material 16b and the fourth conductive layer 12d through the slot 32; the first transverse portion 302 extends transversely from the bottom end of the longitudinal portion 301 to electrically connect the first conductive layer 12a For example, the first transverse portion 302 is electrically connected to a portion of the periphery of the first conductive layer 12a not covered by the first packaging material 16a; the second transverse portion 303 extends laterally from the top of the vertical portion 301 and is electrically connected to the fourth conductive layer 12d.

Wherein, the material of the conductive connection structure 30 can be the same as that of the first conductive layer 12a, the second conductive layer 12b, the third conductive layer 12c and the fourth conductive layer 12d. In one embodiment, the conductive connection structure 30, the first The material of the conductive layer 12a, the second conductive layer 12b, the third conductive layer 12c and the fourth conductive layer 12d can be selected from one or a combination of conductive metal, conductive metal oxide material, conductive glue and conductive polymer material.

Fig. 8 is a schematic structural diagram of the piezoelectric vibration module of the eighth embodiment of the present invention. As shown in Fig. 8, the difference between the piezoelectric vibration module 10G of the eighth embodiment and the piezoelectric vibration module 10F of the seventh embodiment mainly lies in There is a first bonding gap 20a between the first bottom side 141a of the first planar piezoelectric element 14a of the piezoelectric vibration module 10G and the first conductive layer 12a, and the first packaging material 16a further fills the first bonding gap 20a, There is a second bonding gap 20b between the second bottom side 141b of the second planar piezoelectric element 14b of the piezoelectric vibration module 10G and the third conductive layer 12c, and the second encapsulation material 16b further fills the second bonding gap.

Wherein, the distance between the first bonding gap 20 a and the second bonding gap 20 b is, for example, less than 20 microns, preferably less than 15 microns, most preferably less than 10 microns. In another embodiment not shown, there may also be a first bonding gap 20a between the first top side 142a of the first planar piezoelectric element 14a and the second conductive layer 12b, and the first packaging material 16a is further filled into the This first bonding gap 20a, and there may also be a second bonding gap 20b between the second top side 142b of the second planar piezoelectric element 14b and the fourth conductive layer 12d, and the second encapsulation material 16b is further filled into this second gap. Then gap 20b. Optionally, other non-conductive bonding layers can also be used to replace the first packaging material 16a/second packaging material 16b filling the first bonding gap 20a/second bonding gap 20b. The non-conductive bonding layer is, for example, silicone, acrylic glue or epoxy.

Fig. 9 is a structural schematic diagram of the piezoelectric vibration module of the ninth embodiment of the invention. As shown in Fig. 9, the difference between the piezoelectric vibration module 10H of the ninth embodiment and the piezoelectric vibration module 10G of the eighth embodiment mainly lies in The piezoelectric vibration module 10H includes a first conductive bonding layer 22 a and a second conductive bonding layer 22 b respectively disposed in the first bonding gap 20 a and the second bonding gap 20 b. Other configurations are substantially the same and will not be repeated here. The materials of the first conductive adhesive layer 22 a and the second conductive adhesive layer 22 b may include solder paste, conductive silver glue, or conductive tape.

Fig. 10A is a structural schematic diagram of the piezoelectric vibration module of the tenth embodiment of the first invention, and Fig. 10B is a schematic top view of the piezoelectric vibration module of the tenth embodiment of the first invention, as shown in Fig. 10A and Fig. 10B, the piezoelectric vibration The module 10I includes a first conductive layer 12a, two planar piezoelectric elements 14, 14', two packaging materials 16, 16', a bonding layer 34 and a second conductive layer 12b. Two planar piezoelectric elements 14, 14' are arranged side by side on the first conductive layer 12a. In one embodiment, the planar piezoelectric element 14/14' includes a piezoelectric material layer 44 and two conductive adhesive layers 46, 46'; The two encapsulation materials 16, 16' cover the peripheral sides of the two planar piezoelectric elements 14, 14' respectively. Optionally, in an embodiment not shown, the encapsulation materials 16/16' can further enclose the planar piezoelectric elements 14/14', and is filled between the planar piezoelectric element 14/14' and the first conductive layer 12a. In one embodiment, two planar piezoelectric elements covered by the packaging material 16/16' The electrical components 14/14' can be adjacent to each other or have a gap; the bonding layer 34 is disposed on the first conductive layer 12a, and fixes the two packaging materials 16, 16' together. In one embodiment, the bonding layer 34 A through hole 36 is formed thereon; the second conductive layer 12b is disposed on the bonding layer 34, and electrically connects the two planar piezoelectric elements 14, 14'.

In one embodiment, as shown in FIG. 10B , the piezoelectric vibration module 10I further includes two external connection parts 38, 38', wherein one external connection part 38 is electrically connected to the second conductive layer 12b, and the other external connection part 38 ′ is electrically connected to the first conductive layer 12a through the through hole 36 on the bonding layer 34 .

In one embodiment, the first conductive layer 12a includes copper foil, the thickness of the first conductive layer 12a is between 5 microns and 35 microns; and the thickness of the planar piezoelectric element 14/14' is between 50 microns and 300 microns Between microns, the thickness of the bonding layer 34 is between 25 microns and 200 microns, that is, the thickness of the bonding layer 34 is thinner than the thickness of the planar piezoelectric element 14/14'; the thickness of the second conductive layer 12b is between 10 microns to 50 microns. As shown in FIG. 10B, in one embodiment, the coverage area of the bonding layer 34 may be greater than or equal to the coverage area of the encapsulation material 16, 16', and the coverage area of the second conductive layer 12b is smaller than the encapsulation material 16, 16' coverage area.

FIG. 11 is a schematic diagram of one process stage of the piezoelectric vibration module according to the tenth embodiment of the present invention. As shown in FIG. 11 , a substrate structure 40 includes an insulating layer 42 and a first conductive layer 12a. In one embodiment, the insulating layer 42 is, for example, glass fiber, the first conductive layer 12a is copper foil, and the first conductive layer 12a Arranged on the upper surface of the insulating layer 42, a plurality of planar piezoelectric elements 14, 14' are arranged side by side on the first conductive layer 12a in pairs, and at least the peripheral side of each planar piezoelectric element 14/14' is encapsulated material 16/16', and the two-by-two planar piezoelectric elements 14, 14' are fixed together with the bonding layer 34; The two conductive layers 12b are electrically connected together. Wherein, the bonding layer 34 is formed with a through hole 36 . Afterwards, the piezoelectric vibration module 10I shown in FIG. 10A is formed by singulation and stripping of the insulating layer 42 .

In the above-mentioned piezoelectric vibration modules of different types of embodiments, the planar piezoelectric element includes a piezoelectric material layer 44 (marked in FIG. 10A ) and two conductive adhesive layers 46, 46' (marked in FIG. 10A ). Adhesive layers 46, 46' are respectively disposed on both surfaces of the piezoelectric material layer 44. In one embodiment, the piezoelectric material layer 44 is preferably a piezoelectric composite material, such as a two-phase composite of piezoelectric ceramics and polymers. Piezoelectric composite materials, the piezoelectric material layer 44 can also be traditional piezoelectric materials such as piezoelectric ceramics or piezoelectric single crystals.

According to the above-mentioned piezoelectric vibration modules of different types of embodiments, this creation has different thicknesses based on the arrangement of the planar piezoelectric elements up and down or side by side, and the piezoelectric material layers of each planar piezoelectric element also have different thicknesses. s Choice. Since the thickness of each piezoelectric material layer is different, the resonant frequency of each piezoelectric material layer is different, so that there are multiple modes between stacked or parallel planar piezoelectric elements, that is, there are multiple resonant frequencies. By rationally designing the thickness of each piezoelectric material layer, the piezoelectric vibration module of this creation makes the resonant frequency of each piezoelectric material layer in the planar piezoelectric element close to and couples with each other, and works simultaneously in a wide frequency range, which can make it Combined frequency response without discontinuities and deep notches In this frequency band, complex multi-mode vibration will be formed, which can effectively expand the working bandwidth of the piezoelectric vibration module and realize high-frequency and wide-band transmission of sound waves.

FIG. 12A to FIG. 12D are schematic diagrams of different aspects of planar piezoelectric elements of the present invention, and these different aspects of planar piezoelectric elements can be optionally used to replace the planar piezoelectric elements shown in the above-mentioned embodiments. As shown in FIGS. 12A to 12D , the planar piezoelectric element 50 includes a piezoelectric material layer 44 , two conductive adhesive layers 46 , 46 ′ and a surface treatment layer 52 . The piezoelectric material layer 44 includes two opposite surfaces 441, 441' and a peripheral side 442, the peripheral side 442 is located between the two surfaces 441, 441' and connects the two surfaces 441, 441'; The two surfaces 441, 441' of the electrical material layer 44, each conductive adhesive layer 46/46' includes an exposed surface 461/461' and a surrounding wall 462/462', in one embodiment, as shown in Figure 12A and Figure 12B, The area of the exposed surface 461/461' of the conductive adhesive layer 46/46' is equal to the area of the surface 441/441' of the piezoelectric material layer 44. In another embodiment, as shown in Figure 12C and Figure 12D, the conductive adhesive The area of the exposed surface 461/461' of the layer 46/46' is smaller than the area of the surface 441/441' of the piezoelectric material layer 44, that is, the two conductive adhesive layers 46, 46' do not completely cover the two surfaces 441, 441' respectively.

Following the above description, the surface treatment layer 52 at least covers the peripheral side 442 of the piezoelectric material layer 44 , the peripheral walls 462 , 462 ′ of the conductive adhesive layers 46 , 46 ′, and the exposed surface 461 of one of the conductive adhesive layers 46 . As shown in Figure 12B, the surface treatment layer 52 covers the peripheral side 442 of the piezoelectric material layer 44, and the peripheral wall 462 and exposed surface 461 of the upper conductive adhesive layer 46; as shown in Figure 12D, since the conductive adhesive layer 46 does not completely cover the pressure The surface 441 of the electrical material layer 44 , therefore the surface treatment layer 52 covers the part of the surface 441 not covered by the conductive adhesive layer 46 . As shown in FIG. 12A, the surface treatment layer 52 further covers the peripheral wall 462' and the exposed surface 461 of the lower conductive adhesive layer 46', that is, the entire planar piezoelectric element 50 is coated with the surface treatment layer 52; correspondingly, as shown in FIG. As shown in 12C, the surface treatment layer 52 covers the periphery of the conductive adhesive layer 46' below. In addition to the wall 462 ′ and the exposed surface 461 ′, it also covers a part of the surface 441 ′ of the piezoelectric material layer 44 not covered by the underlying conductive adhesive layer 46 ′.

Wherein, the material of the surface treatment layer 52 can be an organic coating or an inorganic coating, the organic coating is, for example, parylene or resin, etc., and the inorganic coating is, for example, an oxide (SiO, SiN, SiON, ...) , diamond-like carbon (DLC) or SiC, etc. In addition, the thickness of the surface treatment layer is less than 10 microns, preferably less than 1 micron, less than 5 microns.

In the planar piezoelectric element of this creative embodiment, the coating of the surface treatment layer can effectively protect the piezoelectric material layer when the planar piezoelectric element is subsequently covered with an encapsulation material, avoiding damage to the piezoelectric material layer and affecting the resonance frequency .

Although this creation has been disclosed above with the embodiment, it is not intended to limit this creation. Those with ordinary knowledge in the technical field of this creation can make some changes and modifications without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation should be defined by the scope of the attached patent application.

10: Piezoelectric vibration module

12, 12': conductive layer

14, 14': planar piezoelectric element

16: Packaging material

18: Piezoelectric material separation gap

20: Follow the gap

24: Audio output device

26: Conductive circuit

Claims (20)

A piezoelectric vibration module, comprising: two conductive layers facing each other and arranged at intervals; two planar piezoelectric elements facing each other and arranged between the two conductive layers, wherein there is a a piezoelectric material separation gap; and an encapsulation material, disposed between the two conductive layers, covering the two planar piezoelectric elements, and filling the piezoelectric material separation gap. The piezoelectric vibration module as claimed in Claim 1, wherein the spacing of the piezoelectric material separation gap is less than 20 microns. The piezoelectric vibration module according to Claim 1, wherein the two planar piezoelectric elements are respectively in direct contact with the two conductive layers. The piezoelectric vibration module as claimed in claim 1, wherein there is a bonding gap between at least one of the two planar piezoelectric elements and at least one of the adjacent two conductive layers, and the encapsulation material further fills the Then gap. The piezoelectric vibration module as described in Claim 4 further includes a non-conductive bonding layer, and there is a bonding gap between at least one of the two planar piezoelectric elements and at least one of the adjacent two conductive layers, the non-conductive The conductive bonding layer is disposed in the bonding gap, and the non-conductive bonding layer is made of silicon glue, acrylic glue or epoxy resin. The piezoelectric vibration module as described in Claim 4 further comprises a conductive bonding layer, and there is an bonding gap between at least one of the two planar piezoelectric elements and at least one of the adjacent two conductive layers, and the conductive The following layer is disposed in the following gap. The piezoelectric vibration module as claimed in claim 4, 5 or 6, wherein the pitch of the connecting gap is less than 20 microns. The piezoelectric vibration module according to claim 1, wherein the two conductive layers are selected from one or a combination of conductive metal, conductive metal oxide material, conductive glue, and conductive polymer material. The piezoelectric vibration module according to Claim 1, wherein the two conductive layers are electrically connected to a positive contact and a negative contact of a sound source output device, respectively. A piezoelectric vibration module, comprising: a supporting layer; a first conductive layer arranged on the supporting layer; a second conductive layer facing the first conductive layer and arranged at intervals; a first plane pressing An electric element is arranged between the first conductive layer and the second conductive layer; a first packaging material is at least arranged between the first conductive layer and the second conductive layer and covers at least the first plane The peripheral side of the piezoelectric element; a third conductive layer arranged on the supporting layer, and there is a slot between the first conductive layer; a second planar piezoelectric element arranged on the third conductive layer; A second encapsulation material, at least disposed on the third conductive layer and covering at least the peripheral side of the second planar piezoelectric element, the second encapsulation material is further disposed on a part of the slot and partially covers the third a conductive layer; and a conductive connection structure disposed on the support layer and filling another part of the slot, the conductive connection structure electrically connects the first conductive layer and the second planar piezoelectric element. The piezoelectric vibration module according to claim 10, wherein the conductive connection structure includes a longitudinal portion, a first transverse portion, and a second transverse portion, and the longitudinal portion is formed along the second package through the slot one side of the material, the first transverse portion extends transversely from the bottom end of the longitudinal portion to electrically connect the first conductive layer, the second transverse portion extends transversely from the top end of the longitudinal portion and electrically connects the A second planar piezoelectric element. The piezoelectric vibration module as described in Claim 10 further includes a fourth conductive layer disposed on the other side of the second planar piezoelectric element away from the third conductive layer, so that the fourth conductive layer and the The third conductive layers face each other and are arranged at intervals, and the second packaging material is arranged between the third conductive layer and the fourth conductive layer. The piezoelectric vibration module according to claim 12, wherein the conductive connection structure includes a longitudinal portion, a first transverse portion, and a second transverse portion, and the longitudinal portion is formed along the second packaging material through the slot and one side of the fourth conductive layer, the first transverse portion extends transversely from the bottom end of the longitudinal portion to electrically connect the first conductive layer, the second transverse portion extends transversely from the top end of the longitudinal portion And electrically connected to the fourth conductive layer. The piezoelectric vibration module according to claim 10 or 12, wherein the first planar piezoelectric element has a first bottom side and a first top side opposite to each other, and the first bottom side and the first top side In direct contact with the first conductive layer and the second conductive layer respectively, the second planar piezoelectric element has a second bottom side, and the second bottom side is in direct contact with the third conductive layer. The piezoelectric vibration module according to claim 10 or 12, wherein the first planar piezoelectric element has a first bottom side and a first top side opposite to each other, and the first bottom side and the first top side There is a first connection gap between at least one of them and at least one of the first conductive layer and the second conductive layer, and the second planar piezoelectric element has a second bottom side, and the second bottom side is connected to the second bottom side. There is a second bonding gap between the third conductive layers, wherein the first packaging material further fills the first bonding gap, and the second packaging material further fills the second bonding gap. The piezoelectric vibration module as described in Claim 10 or 12 further comprises a first conductive bonding layer and a second conductive bonding layer, and the first planar piezoelectric element has a first bottom side and a first bottom side opposite to each other. On the top side, there is a first bonding gap between at least one of the first bottom side and the first top side and at least one of the first conductive layer and the second conductive layer respectively, and the second planar piezoelectric The element has a second bottom side, and there is a second bonding gap between the second bottom side and the third conductive layer, wherein the first conductive bonding layer is disposed in the first bonding gap, and the second conductive bonding layer is disposed at the second subsequent gap. A piezoelectric vibration module, comprising: a first conductive layer; two planar piezoelectric elements arranged side by side on the first conductive layer; two packaging materials, respectively covering at least the peripheral sides of the two planar piezoelectric elements; A combination layer is arranged on the first conductive layer, and the two packaging materials are fixed together; and a second conductive layer is arranged on the combination layer, and is electrically connected to the two planar piezoelectric elements. The piezoelectric vibration module as claimed in claim 17, wherein the first conductive layer comprises a copper foil, and the thickness of the first conductive layer is between 5 microns and 35 microns. The piezoelectric vibration module as claimed in claim 17, wherein the thickness of each of the two planar piezoelectric elements is between 50 microns and 300 microns, and the thickness of the bonding layer is between 25 microns and 200 microns. The piezoelectric vibration module as claimed in claim 17, wherein the thickness of the second conductive layer is between 10 microns and 50 microns.

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