TWM637790U - Winding-type capacitor package structure - Google Patents

Winding-type capacitor package structure Download PDF

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Publication number
TWM637790U
TWM637790U TW111212266U TW111212266U TWM637790U TW M637790 U TWM637790 U TW M637790U TW 111212266 U TW111212266 U TW 111212266U TW 111212266 U TW111212266 U TW 111212266U TW M637790 U TWM637790 U TW M637790U
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pin
protection layer
exposed portion
conductive
conductive pin
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TW111212266U
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Chinese (zh)
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林傑
蘇忠瑞
陸正浩
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鈺邦科技股份有限公司
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Priority to TW111212266U priority Critical patent/TWM637790U/en
Publication of TWM637790U publication Critical patent/TWM637790U/en

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Abstract

本創作提供一種捲繞型電容器封裝結構,其包括捲繞式組件、導電組件、封裝組件、底部座板以及接腳保護組件。導電組件包括第一導電接腳以及第二導電接腳。捲繞式組件被包覆在封裝組件的內部。底部座板設置在封裝組件的底端。接腳保護組件包括被配置以用於覆蓋第一導電接腳的一部分的一第一接腳保護層以及被配置以用於覆蓋第二導電接腳的一部分的一第二接腳保護層。第一導電接腳包括裸露在封裝組件外部的一第一裸露部,並且第二導電接腳包括裸露在封裝組件外部的一第二裸露部。第一接腳保護層以及第二接腳保護層分別設置在第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部上,以用於分別保護第一裸露部以及第二裸露部。The present invention provides a wrapping capacitor package structure, which includes a wrapping component, a conductive component, a package component, a bottom seat plate and a pin protection component. The conductive component includes a first conductive pin and a second conductive pin. The wound component is wrapped inside the packaged component. The bottom seat plate is arranged at the bottom end of the package assembly. The pin protection assembly includes a first pin protection layer configured to cover a portion of the first conductive pin and a second pin protection layer configured to cover a portion of the second conductive pin. The first conductive pin includes a first exposed portion exposed outside the package component, and the second conductive pin includes a second exposed portion exposed outside the package component. The first pin protection layer and the second pin protection layer are respectively disposed on the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin for respectively protecting the first exposed portion and the second exposed portion. 2. The bare part.

Description

捲繞型電容器封裝結構Winding Capacitor Package Structure

本創作涉及一種電容器封裝結構,特別是涉及一種捲繞型電容器封裝結構。The invention relates to a capacitor packaging structure, in particular to a winding type capacitor packaging structure.

電容器已廣泛被使用於消費性家電用品、電腦主機板、電源供應器、通訊產品以及汽車等的基本元件,其主要的作用包括濾波、旁路、整流、耦合、去耦、轉相等等,是電子產品中不可缺少的元件之一。然而,現有技術的捲繞型電容器仍然具有可改善空間。特別的是,當電容器的導電接腳需要進行彎折時,導電接腳很容易在彎折處出現斷裂或者裂痕的情況。Capacitors have been widely used in basic components such as consumer appliances, computer motherboards, power supplies, communication products, and automobiles. Their main functions include filtering, bypassing, rectification, coupling, decoupling, phase inversion, etc. One of the indispensable components in electronic products. However, the wound capacitors in the prior art still have room for improvement. In particular, when the conductive pins of the capacitor need to be bent, the conductive pins are likely to be broken or cracked at the bent places.

本創作所欲解決之問題在於,針對現有技術的不足提供一種捲繞型電容器封裝結構。The problem to be solved by this invention is to provide a package structure of wound capacitors for the deficiencies of the prior art.

為了解決上述的問題,本創作所採用的其中一技術手段是提供一種捲繞型電容器封裝結構,其包括一捲繞式組件、一導電組件、一封裝組件、一底部座板以及一接腳保護組件。捲繞式組件包括一捲繞式正極導電箔片、一捲繞式負極導電箔片以及兩個捲繞式隔離片。導電組件包括電性接觸捲繞式正極導電箔片的一第一導電接腳以及電性接觸捲繞式負極導電箔片的一第二導電接腳。捲繞式組件被包覆在封裝組件的內部。底部座板設置在封裝組件的底端,以用於承載封裝組件。接腳保護組件包括被配置以用於覆蓋第一導電接腳的一部分的一第一接腳保護層以及被配置以用於覆蓋第二導電接腳的一部分的一第二接腳保護層。其中,兩個捲繞式隔離片的其中之一設置在捲繞式正極導電箔片與捲繞式負極導電箔片之間,並且捲繞式正極導電箔片與捲繞式負極導電箔片兩者其中之一設置在兩個捲繞式隔離片之間;其中,第一導電接腳包括被容置在封裝組件內部的一第一內埋部以及裸露在封裝組件外部的一第一裸露部,並且第二導電接腳包括被容置在封裝組件內部的一第二內埋部以及裸露在封裝組件外部的一第二裸露部;其中,第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部穿過底部座板而裸露在外,並且第一接腳保護層以及第二接腳保護層分別設置在第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部上。In order to solve the above-mentioned problems, one of the technical means adopted in this creation is to provide a winding type capacitor packaging structure, which includes a winding type component, a conductive component, a packaging component, a bottom seat plate and a pin protection components. The winding assembly includes a winding positive electrode conductive foil, a winding negative electrode conductive foil and two winding separators. The conductive component includes a first conductive pin electrically contacting the wound positive electrode conductive foil and a second conductive pin electrically contacted the wound negative electrode conductive foil. The wound component is wrapped inside the packaged component. The bottom seat plate is arranged at the bottom of the package component for carrying the package component. The pin protection assembly includes a first pin protection layer configured to cover a portion of the first conductive pin and a second pin protection layer configured to cover a portion of the second conductive pin. Wherein, one of the two wound-type separators is arranged between the wound-type positive electrode conductive foil and the wound-type negative electrode conductive foil, and the wound-type positive electrode conductive foil and the wound-type negative electrode conductive foil are both One of them is disposed between two wound spacers; wherein, the first conductive pin includes a first embedded part accommodated inside the package component and a first exposed part exposed outside the package component , and the second conductive pin includes a second embedded part accommodated inside the package component and a second exposed part exposed outside the package component; wherein, the first exposed part of the first conductive pin and the second The second exposed portion of the conductive pin is exposed through the bottom seat plate, and the first pin protection layer and the second pin protection layer are respectively arranged on the first exposed portion of the first conductive pin and the second conductive pin on the second exposed part.

為了解決上述的問題,本創作所採用的另外一技術手段是提供一種捲繞型電容器封裝結構,其包括一捲繞式組件、一導電組件、一封裝組件、一底部座板以及一接腳保護組件。導電組件包括一第一導電接腳以及一第二導電接腳。捲繞式組件被包覆在封裝組件的內部。底部座板設置在封裝組件的底端。接腳保護組件包括被配置以用於覆蓋第一導電接腳的一部分的一第一接腳保護層以及被配置以用於覆蓋第二導電接腳的一部分的一第二接腳保護層。其中,第一導電接腳包括裸露在封裝組件外部的一第一裸露部,並且第二導電接腳包括裸露在封裝組件外部的一第二裸露部;其中,第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部穿過底部座板而裸露在外,並且第一接腳保護層以及第二接腳保護層分別設置在第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部上。In order to solve the above-mentioned problems, another technical means adopted in this creation is to provide a winding type capacitor packaging structure, which includes a winding type component, a conductive component, a packaging component, a bottom seat plate and a pin protection components. The conductive component includes a first conductive pin and a second conductive pin. The wound component is wrapped inside the packaged component. The bottom seat plate is arranged at the bottom end of the package assembly. The pin protection assembly includes a first pin protection layer configured to cover a portion of the first conductive pin and a second pin protection layer configured to cover a portion of the second conductive pin. Wherein, the first conductive pin includes a first exposed portion exposed outside the package component, and the second conductive pin includes a second exposed portion exposed outside the package component; wherein, the first exposed portion of the first conductive pin part and the second exposed part of the second conductive pin are exposed outside through the bottom seat plate, and the first pin protection layer and the second pin protection layer are respectively arranged on the first exposed part of the first conductive pin and the second exposed part on the second exposed part of the two conductive pins.

在其中一可行的或者較佳的實施例中,封裝組件包括被配置以用於收容捲繞式組件的一封裝殼體以及設置在封裝殼體的內部且與封裝殼體相互配合的一底端封閉結構,並且封裝組件被封裝殼體以及底端封閉結構所完全包覆;其中,底部座板具有一第一穿孔以及一第二穿孔,第一導電接腳以及第二導電接腳分別穿過的底部座板的第一穿孔以及第二穿孔,並且第一接腳保護層的一第一末端部以及第二接腳保護層的一第二末端部分別設置在底部座板的第一穿孔以及第二穿孔的內部。In one of the feasible or preferred embodiments, the packaging assembly includes a packaging casing configured to accommodate the roll-up assembly and a bottom end disposed inside the packaging casing and cooperating with the packaging casing The sealing structure, and the packaging component is completely covered by the packaging shell and the bottom sealing structure; wherein, the bottom seat board has a first through hole and a second through hole, and the first conductive pin and the second conductive pin pass through respectively The first through hole and the second through hole of the bottom seat plate, and a first end portion of the first pin protection layer and a second end portion of the second pin protection layer are respectively arranged on the first through hole and the second end portion of the bottom seat plate The inside of the second piercing.

在其中一可行的或者較佳的實施例中,當第一導電接腳的第一裸露部被彎折而形成一第一彎折段以及連接於第一彎折段的一第一延伸段時,第一接腳保護層被配置以用於圍繞且覆蓋第一導電接腳的第一裸露部的第一彎折段,以使得第一導電接腳的第一裸露部的第一彎折段透過第一接腳保護層的保護以避免產生斷裂或者裂痕;其中,當第二導電接腳的第二裸露部被彎折而形成一第二彎折段以及連接於第二彎折段的一第二延伸段時,第二接腳保護層被配置以用於圍繞且覆蓋第二導電接腳的第二裸露部的第二彎折段,以使得第二導電接腳的第二裸露部的第二彎折段透過第二接腳保護層的保護以避免產生斷裂或者裂痕;其中,第一接腳保護層為一第一後製噴塗層或者一第一後製塗佈層,並且第二接腳保護層為一第二後製噴塗層或者一第二後製塗佈層;其中,第一接腳保護層具有用於部分地裸露第一裸露部的第一彎折段的一第一開口,並且第二接腳保護層具有用於部分地裸露第二裸露部的第二彎折段的一第二開口。In one feasible or preferred embodiment, when the first exposed portion of the first conductive pin is bent to form a first bent section and a first extension section connected to the first bent section , the first pin protection layer is configured to surround and cover the first bent section of the first exposed portion of the first conductive pin, so that the first bent section of the first exposed portion of the first conductive pin The protection of the first pin protection layer is used to avoid breakage or cracks; wherein, when the second exposed part of the second conductive pin is bent to form a second bent section and a second bent section connected to the second bent section During the second extension section, the second pin protection layer is configured to surround and cover the second bent section of the second exposed portion of the second conductive pin, so that the second exposed portion of the second conductive pin The second bending section is protected by the second pin protection layer to avoid breakage or cracks; wherein, the first pin protection layer is a first post-production spraying layer or a first post-production coating layer, and the second The pin protection layer is a second post-production spraying layer or a second post-production coating layer; wherein, the first pin protection layer has a first bending section for partially exposing the first exposed portion. an opening, and the second pin protection layer has a second opening for partially exposing the second bent section of the second exposed portion.

在其中一可行的或者較佳的實施例中,當第一導電接腳的第一裸露部被彎折而形成一第一彎折段以及連接於第一彎折段的一第一延伸段後,第一導電接腳的第一裸露部的第一彎折段的一上端區域與一下端區域分別形成一第一上彎折表面以及一第一下彎折表面,第一接腳保護層被配置以用於覆蓋第一彎折段的第一上彎折表面以及第一下彎折表面,以使得第一導電接腳的第一裸露部的第一彎折段透過第一接腳保護層的保護以避免產生斷裂或者裂痕;其中,當第二導電接腳的第二裸露部被彎折而形成一第二彎折段以及連接於第二彎折段的一第二延伸段後,第二導電接腳的第二裸露部的第二彎折段的一上端區域與一下端區域分別形成一第二上彎折表面以及一第二下彎折表面,第二接腳保護層被配置以用於覆蓋第二彎折段的第二上彎折表面以及第二下彎折表面,以使得第二導電接腳的第二裸露部的第二彎折段透過第二接腳保護層的保護以避免產生斷裂或者裂痕;其中,第一接腳保護層為一第一後製噴塗層或者一第一後製塗佈層,並且第二接腳保護層為一第二後製噴塗層或者一第二後製塗佈層。In one feasible or preferred embodiment, when the first exposed portion of the first conductive pin is bent to form a first bent section and a first extension section connected to the first bent section An upper end region and a lower end region of the first bent section of the first exposed portion of the first conductive pin respectively form a first upper bent surface and a first lower bent surface, and the first pin protection layer is covered configured to cover the first upper bent surface and the first lower bent surface of the first bent section, so that the first bent section of the first exposed portion of the first conductive pin penetrates through the first pin protection layer protection to avoid breakage or cracks; wherein, when the second exposed portion of the second conductive pin is bent to form a second bent section and a second extended section connected to the second bent section, the first An upper end region and a lower end region of the second bent section of the second exposed portion of the two conductive pins respectively form a second upper bent surface and a second lower bent surface, and the second pin protection layer is configured to Used to cover the second upper bent surface and the second lower bent surface of the second bent section, so that the second bent section of the second exposed portion of the second conductive pin is protected by the second pin protective layer To avoid breakage or cracks; wherein, the first pin protection layer is a first post-production spray coating or a first post-production coating layer, and the second pin protection layer is a second post-production spray coating or a Second post-coating layer.

在其中一可行的或者較佳的實施例中,其中,當第一導電接腳的第一裸露部尚未被彎折而定義為一第一預備彎折段以及連接於第一預備彎折段的一第一延伸段時,第一接腳保護層被配置以用於圍繞且覆蓋第一導電接腳的第一裸露部的第一預備彎折段,以使得第一導電接腳的第一裸露部的第一預備彎折段透過第一接腳保護層而得到保護;其中,當第二導電接腳的第二裸露部尚未被彎折而定義為一第二預備彎折段以及連接於第二預備彎折段的一第二延伸段時,第二接腳保護層被配置以用於圍繞且覆蓋第二導電接腳的第二裸露部的第二預備彎折段,以使得第二導電接腳的第二裸露部的第二預備彎折段透過第二接腳保護層而得到保護;其中,第一接腳保護層為一第一後製噴塗層、一第一後製塗佈層、一第一預製貼附層或者一第一可拆卸耐熱彈性套件,並且第二接腳保護層為一第二後製噴塗層、一第二後製塗佈層、一第二預製貼附層或者一第二可拆卸耐熱彈性套件;其中,第一接腳保護層具有用於部分地裸露第一裸露部的第一預備彎折段的一第一開口,並且第二接腳保護層具有用於部分地裸露第二裸露部的第二預備彎折段的一第二開口。In one of the feasible or preferred embodiments, wherein, when the first bare part of the first conductive pin has not been bent, it is defined as a first preliminary bending section and the part connected to the first preliminary bending section For a first extension section, the first pin protection layer is configured to surround and cover the first pre-bending section of the first exposed portion of the first conductive pin, so that the first exposed portion of the first conductive pin The first preliminary bending section of the part is protected through the first pin protection layer; wherein, when the second exposed part of the second conductive pin has not been bent, it is defined as a second preliminary bending section and is connected to the first When a second extension of the two preparatory bending sections, the second pin protection layer is configured to surround and cover the second preparatory bending section of the second exposed part of the second conductive pin, so that the second conductive The second preliminary bending section of the second bare part of the pin is protected through the second pin protection layer; wherein, the first pin protection layer is a first post-production spraying layer and a first post-production coating layer , a first prefabricated attachment layer or a first detachable heat-resistant elastic sleeve, and the second pin protection layer is a second post-production spraying layer, a second post-production coating layer, and a second prefabricated adhesion layer Or a second detachable heat-resistant elastic sleeve; wherein, the first pin protection layer has a first opening for partially exposing the first pre-bending section of the first bare part, and the second pin protection layer has a A second opening of the second pre-bending section partially exposing the second exposed portion.

在其中一可行的或者較佳的實施例中,封裝組件包括被配置以用於收容捲繞式組件的一封裝殼體以及設置在封裝殼體的內部且與封裝殼體相互配合的一底端封閉結構,並且封裝組件被封裝殼體以及底端封閉結構所完全包覆;其中,底部座板具有一第一穿孔以及一第二穿孔,第一導電接腳以及第二導電接腳分別穿過的底部座板的第一穿孔以及第二穿孔,並且第一接腳保護層的一第一末端部以及第二接腳保護層的一第二末端部分別設置在底部座板的第一穿孔以及第二穿孔的內部;其中,第一接腳保護層為一第一不可拆卸耐熱彈性層或者一第一可拆卸耐熱彈性套件,並且第二接腳保護層為第二不可拆卸耐熱彈性層或者一第二可拆卸耐熱彈性套件;其中,第一接腳保護層具有用於部分地裸露第一裸露部的一第一開口,並且第二接腳保護層具有用於部分地裸露第二裸露部的一第二開口。In one of the feasible or preferred embodiments, the packaging assembly includes a packaging casing configured to accommodate the roll-up assembly and a bottom end disposed inside the packaging casing and cooperating with the packaging casing The sealing structure, and the packaging component is completely covered by the packaging shell and the bottom sealing structure; wherein, the bottom seat board has a first through hole and a second through hole, and the first conductive pin and the second conductive pin pass through respectively The first through hole and the second through hole of the bottom seat plate, and a first end portion of the first pin protection layer and a second end portion of the second pin protection layer are respectively arranged on the first through hole and the second end portion of the bottom seat plate The inside of the second perforation; wherein, the first pin protection layer is a first non-detachable heat-resistant elastic layer or a first detachable heat-resistant elastic sleeve, and the second pin protection layer is a second non-detachable heat-resistant elastic layer or a The second detachable heat-resistant elastic sleeve; wherein, the first pin protection layer has a first opening for partially exposing the first exposed part, and the second pin protection layer has a first opening for partially exposing the second exposed part A second opening.

本創作的其中一有益效果在於,本創作所提供的一種捲繞型電容器封裝結構,其能通過“接腳保護組件包括被配置以用於覆蓋第一導電接腳的一部分的一第一接腳保護層以及被配置以用於覆蓋第二導電接腳的一部分的一第二接腳保護層”以及“第一接腳保護層以及第二接腳保護層分別設置在第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部上”的技術方案,以使得第一接腳保護層以及第二接腳保護層可以分別被配置以用於分別保護第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部。One of the beneficial effects of the present invention is that the wound type capacitor packaging structure provided by the present invention can pass through "the pin protection component includes a first pin configured to cover a part of the first conductive pin The protective layer and a second pin protective layer configured to cover a part of the second conductive pin, the first pin protective layer and the second pin protective layer are respectively disposed on the second pin of the first conductive pin. An exposed portion and the second exposed portion of the second conductive pin” technical solution, so that the first pin protection layer and the second pin protection layer can be configured to protect the first conductive pin respectively The first exposed portion and the second exposed portion of the second conductive pin.

為使能進一步瞭解本創作的特徵及技術內容,請參閱以下有關本創作的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本創作加以限制。In order to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings related to this creation. However, the provided drawings are only for reference and explanation, and are not used to limit this creation.

以下是通過特定的具體實施例來說明本創作所公開有關“捲繞型電容器封裝結構”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本創作的優點與效果。本創作可通過其他不同的具體實施例加以實行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不背離本創作的構思下進行各種修改與變更。另外,需事先聲明的是,本創作的圖式僅為簡單示意說明,並非依實際尺寸的描繪。以下的實施方式將進一步詳細說明本創作的相關技術內容,但所公開的內容並非用以限制本創作的保護範圍。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。The following is an illustration of the implementation of the "winding type capacitor packaging structure" disclosed in this creation through specific specific examples. Those skilled in the art can understand the advantages and effects of this creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the idea of this creation. In addition, it needs to be declared in advance that the diagrams of this creation are only for simple illustration, and are not drawn according to the actual size. The following embodiments will further describe the relevant technical content of this creation in detail, but the disclosed content is not intended to limit the protection scope of this creation. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

配合圖1至圖11所示,本創作提供一種捲繞型電容器封裝結構P,其包括一捲繞式組件1、一導電組件2、一封裝組件3、一底部座板4以及一接腳保護組件5。更進一步來說,導電組件2包括一第一導電接腳21以及一第二導電接腳22。捲繞式組件1被包覆在封裝組件3的內部。底部座板4設置在封裝組件3的底端。接腳保護組件5包括被配置以用於覆蓋第一導電接腳21的一部分的一第一接腳保護層51以及被配置以用於覆蓋第二導電接腳22的一部分的一第二接腳保護層52。再者,第一導電接腳21包括裸露在封裝組件3外部的一第一裸露部212,並且第二導電接腳22包括裸露在封裝組件3外部的一第二裸露部222。此外,第一導電接腳21的第一裸露部212以及第二導電接腳22的第二裸露部222穿過底部座板4而裸露在外,並且第一接腳保護層51以及第二接腳保護層52分別設置在第一導電接腳21的第一裸露部212以及第二導電接腳22的第二裸露部222上。As shown in Figures 1 to 11, the present invention provides a wrapping capacitor package P, which includes a wrapping component 1, a conductive component 2, a packaging component 3, a bottom seat plate 4 and a pin protection Component 5. Furthermore, the conductive component 2 includes a first conductive pin 21 and a second conductive pin 22 . The roll-up component 1 is wrapped inside the packaging component 3 . The bottom seat plate 4 is disposed at the bottom of the package assembly 3 . The pin protection assembly 5 includes a first pin protection layer 51 configured to cover a portion of the first conductive pin 21 and a second pin configured to cover a portion of the second conductive pin 22 protective layer 52 . Moreover, the first conductive pin 21 includes a first exposed portion 212 exposed outside the package component 3 , and the second conductive pin 22 includes a second exposed portion 222 exposed outside the package component 3 . In addition, the first exposed portion 212 of the first conductive pin 21 and the second exposed portion 222 of the second conductive pin 22 pass through the bottom seat plate 4 to be exposed, and the first pin protection layer 51 and the second pin The protective layer 52 is respectively disposed on the first exposed portion 212 of the first conductive pin 21 and the second exposed portion 222 of the second conductive pin 22 .

藉此,本創作所提供的一種捲繞型電容器封裝結構P,其能通過“接腳保護組件5包括被配置以用於覆蓋第一導電接腳21的一部分的一第一接腳保護層51以及被配置以用於覆蓋第二導電接腳22的一部分的一第二接腳保護層52”以及“第一接腳保護層51以及第二接腳保護層52分別設置在第一導電接腳21的第一裸露部212以及第二導電接腳22的第二裸露部222上”的技術方案,以使得第一接腳保護層51以及第二接腳保護層52可以分別被配置以用於分別保護第一導電接腳21的第一裸露部212以及第二導電接腳22的第二裸露部222,藉此以避免第一導電接腳21以及第二導電接腳22在進行彎折過程中發生斷裂或者裂痕的情況。Thereby, the wrapping type capacitor packaging structure P provided by the present invention can pass through “the pin protection component 5 includes a first pin protection layer 51 configured to cover a part of the first conductive pin 21 And a second pin protection layer 52" and "the first pin protection layer 51 and the second pin protection layer 52 configured to cover a part of the second conductive pin 22 are respectively arranged on the first conductive pin 21 on the first exposed portion 212 and the second exposed portion 222 of the second conductive pin 22”, so that the first pin protection layer 51 and the second pin protection layer 52 can be respectively configured for Protect the first exposed portion 212 of the first conductive pin 21 and the second exposed portion 222 of the second conductive pin 22 respectively, so as to avoid the bending process of the first conductive pin 21 and the second conductive pin 22 breaks or cracks occur.

[第一實施例][first embodiment]

參閱圖1至圖3所示,本創作第一實施例提供一種捲繞型電容器封裝結構P,其包括一捲繞式組件1、一導電組件2、一封裝組件3、一底部座板4以及一接腳保護組件5。Referring to FIGS. 1 to 3 , the first embodiment of the present invention provides a wound capacitor packaging structure P, which includes a wound component 1, a conductive component 2, a package component 3, a bottom seat plate 4 and A pin protection component 5 .

首先,如圖1所示,捲繞式組件1包括一捲繞式正極導電箔片11、一捲繞式負極導電箔片12以及兩個捲繞式隔離片13。更進一步來說,兩個捲繞式隔離片13的其中之一會設置在捲繞式正極導電箔片11與捲繞式負極導電箔片12之間,並且捲繞式正極導電箔片11與捲繞式負極導電箔片12兩者其中之一會設置在兩個捲繞式隔離片13之間(例如圖1所顯示的是捲繞式正極導電箔片11會設置在兩個捲繞式隔離片13之間)。另外,捲繞式隔離片13可為一種通過含浸方式以附著有導電高分子的隔離紙或者紙製箔片。然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。First, as shown in FIG. 1 , the wound assembly 1 includes a wound positive electrode conductive foil 11 , a wound negative electrode conductive foil 12 and two wound separators 13 . Furthermore, one of the two wound separators 13 will be arranged between the wound positive conductive foil 11 and the wound negative conductive foil 12, and the wound positive conductive foil 11 and One of the two winding negative electrode conductive foils 12 will be arranged between two winding separators 13 (for example, as shown in Figure 1, the winding positive electrode conductive foil 11 will be arranged between two winding separators 13 between spacers 13). In addition, the wound separator 13 may be a separator paper or a paper foil to which a conductive polymer is attached by impregnation. However, the above-mentioned example is only one possible embodiment and is not intended to limit the invention.

再者,配合圖1至圖3所示,導電組件2包括電性接觸捲繞式正極導電箔片11的一第一導電接腳21以及電性接觸捲繞式負極導電箔片12的一第二導電接腳22,並且捲繞式組件1被包覆在封裝組件3的內部。更進一步來說,第一導電接腳21包括被容置在封裝組件3內部的一第一內埋部211以及裸露在封裝組件3外部的一第一裸露部212,並且第二導電接腳22包括被容置在封裝組件3內部的一第二內埋部221以及裸露在封裝組件3外部的一第二裸露部222。舉例來說,封裝組件3包括被配置以用於收容捲繞式組件1的一封裝殼體31(例如鋁質殼體或者也可以是任何材質的殼體)以及設置在封裝殼體31的內部且與封裝殼體31相互配合的一底端封閉結構32,並且封裝組件3可以被封裝殼體31以及底端封閉結構32所完全包覆。然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。Furthermore, as shown in FIG. 1 to FIG. 3 , the conductive component 2 includes a first conductive pin 21 electrically contacting the wound positive conductive foil 11 and a first conductive pin 21 electrically contacting the wound negative conductive foil 12. There are two conductive pins 22 , and the roll-up component 1 is wrapped inside the packaging component 3 . Furthermore, the first conductive pin 21 includes a first embedded portion 211 accommodated inside the package component 3 and a first exposed portion 212 exposed outside the package component 3 , and the second conductive pin 22 It includes a second embedded portion 221 accommodated inside the package component 3 and a second exposed portion 222 exposed outside the package component 3 . For example, the packaging assembly 3 includes a packaging casing 31 (for example, an aluminum casing or a casing made of any material) configured to accommodate the winding assembly 1 , and is disposed inside the packaging casing 31 And a bottom closing structure 32 cooperating with the packaging case 31 , and the packaging assembly 3 can be completely covered by the packaging case 31 and the bottom closing structure 32 . However, the above-mentioned example is only one possible embodiment and is not intended to limit the invention.

此外,配合圖1至圖3所示,底部座板4設置在封裝組件3的底端以用於承載封裝組件3,並且接腳保護組件5包括被配置以用於覆蓋第一導電接腳21的一部分的一第一接腳保護層51以及被配置以用於覆蓋第二導電接腳22的一部分的一第二接腳保護層52。更進一步來說,第一導電接腳21的第一裸露部212以及第二導電接腳22的第二裸露部222可以穿過底部座板4而裸露在外,並且第一接腳保護層51以及第二接腳保護層52可以分別設置在第一導電接腳21的第一裸露部212以及第二導電接腳22的第二裸露部222上。舉例來說,底部座板4具有一第一穿孔4001以及一第二穿孔4002,並且第一導電接腳21以及第二導電接腳22可以分別穿過的底部座板4的第一穿孔4001以及第二穿孔4002。然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。In addition, as shown in FIG. 1 to FIG. 3 , the bottom seat plate 4 is disposed on the bottom end of the package component 3 for carrying the package component 3 , and the pin protection component 5 includes a pin protection component configured to cover the first conductive pin 21 A part of a first pin protection layer 51 and a second pin protection layer 52 configured to cover a part of the second conductive pin 22 . Furthermore, the first exposed portion 212 of the first conductive pin 21 and the second exposed portion 222 of the second conductive pin 22 can pass through the bottom seat plate 4 to be exposed, and the first pin protection layer 51 and The second pin protection layer 52 can be respectively disposed on the first exposed portion 212 of the first conductive pin 21 and the second exposed portion 222 of the second conductive pin 22 . For example, the bottom seat plate 4 has a first through hole 4001 and a second through hole 4002, and the first conductive pin 21 and the second conductive pin 22 can pass through the first through hole 4001 and the second conductive pin 22 of the bottom seat plate 4 respectively. Second perforation 4002 . However, the above-mentioned example is only one possible embodiment and is not intended to limit the invention.

更進一步來說,如圖2所示,當第一導電接腳21的第一裸露部212尚未被彎折而定義為一第一預備彎折段212P以及連接於第一預備彎折段212P的一第一延伸段212E時,第一接腳保護層51可以被配置以用於圍繞且覆蓋第一導電接腳21的第一裸露部212的第一預備彎折段212P,藉此以使得第一導電接腳21的第一裸露部212的第一預備彎折段212P可以透過第一接腳保護層51而得到保護。再者,當第二導電接腳22的第二裸露部222尚未被彎折而定義為一第二預備彎折段222P以及連接於第二預備彎折段222P的一第二延伸段222E時,第二接腳保護層52可以被配置以用於圍繞且覆蓋第二導電接腳22的第二裸露部222的第二預備彎折段222P,藉此以使得第二導電接腳22的第二裸露部222的第二預備彎折段222P可以透過第二接腳保護層52而得到保護。舉例來說,第一接腳保護層51可以是一第一可拆卸耐熱彈性套件,並且第二接腳保護層52可以是一第二可拆卸耐熱彈性套件。也就是說,第一接腳保護層51以及第二接腳保護層52可以預先製作完成,並且第一接腳保護層51以及第二接腳保護層52可以分別透過套入第一導電接腳21以及第二導電接腳22的方式(或者是,第一導電接腳21以及第二導電接腳22分別穿過第一接腳保護層51以及第二接腳保護層52),以使得第一接腳保護層51以及第二接腳保護層52可以分別套設在第一導電接腳21第一預備彎折段212P以及第二導電接腳22的第二預備彎折段222P上。值得注意的是,第一接腳保護層51也可以是一第一預製貼附層,並且第二接腳保護層52也可以是一第二預製貼附層。也就是說,第一接腳保護層51(例如可由多個第一貼附層以組合成第一接腳保護層51)以及第二接腳保護層52(例如可由多個第二貼附層以組合成第二接腳保護層51)可以透過黏著物黏附的方式,以分別貼附在第一導電接腳21第一預備彎折段212P以及第二導電接腳22的第二預備彎折段222P上。然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。Furthermore, as shown in FIG. 2 , when the first bare portion 212 of the first conductive pin 21 has not been bent yet, it is defined as a first preparatory bending section 212P and the part connected to the first preparatory bending section 212P For a first extension section 212E, the first pin protection layer 51 can be configured to surround and cover the first pre-bending section 212P of the first exposed portion 212 of the first conductive pin 21 , so that the first The first pre-bending section 212P of the first exposed portion 212 of a conductive pin 21 can be protected through the first pin protection layer 51 . Moreover, when the second bare portion 222 of the second conductive pin 22 has not been bent yet and is defined as a second preparatory bending section 222P and a second extension section 222E connected to the second preparatory bending section 222P, The second pin protection layer 52 can be configured to surround and cover the second pre-bending section 222P of the second exposed portion 222 of the second conductive pin 22 , so that the second of the second conductive pin 22 The second pre-bending section 222P of the exposed portion 222 can be protected through the second pin protection layer 52 . For example, the first pin protection layer 51 can be a first detachable heat-resistant elastic sleeve, and the second pin protection layer 52 can be a second detachable heat-resistant elastic sleeve. That is to say, the first pin protection layer 51 and the second pin protection layer 52 can be prefabricated, and the first pin protection layer 51 and the second pin protection layer 52 can respectively be inserted into the first conductive pin 21 and the second conductive pin 22 (or, the first conductive pin 21 and the second conductive pin 22 pass through the first pin protection layer 51 and the second pin protection layer 52 respectively), so that the first The first pin protection layer 51 and the second pin protection layer 52 can be sleeved on the first pre-bending section 212P of the first conductive pin 21 and the second pre-bending section 222P of the second conductive pin 22 respectively. It should be noted that the first pin protection layer 51 can also be a first prefabricated attachment layer, and the second pin protection layer 52 can also be a second prefabricated attachment layer. That is to say, the first pin protection layer 51 (for example, can be composed of multiple first attachment layers to form the first pin protection layer 51 ) and the second pin protection layer 52 (for example, can be composed of multiple second attachment layers The second pre-bending section 212P of the first conductive pin 21 and the second pre-bending section 212P of the second conductive pin 22 are attached in such a way that the second pin protection layer 51) can be adhered through the adhesive. Section 222P. However, the above-mentioned example is only one possible embodiment and is not intended to limit the invention.

更進一步來說,當第一導電接腳21的第一裸露部212被彎折而形成一第一彎折段212B(由第一預備彎折段212P彎折後所得)以及連接於第一彎折段212B的一第一延伸段212E時,第一接腳保護層51可以被配置以用於圍繞且覆蓋第一導電接腳21的第一裸露部212的第一彎折段212B,藉此以使得第一導電接腳21的第一裸露部212的第一彎折段212B可以透過第一接腳保護層51的保護以避免發生斷裂或者裂痕的情況。再者,當第二導電接腳22的第二裸露部222被彎折而形成一第二彎折段222B(由第二預備彎折段222P彎折後所得)以及連接於第二彎折段222B的一第二延伸段222E時,第二接腳保護層52可以被配置以用於圍繞且覆蓋第二導電接腳22的第二裸露部222的第二彎折段222B,藉此以使得第二導電接腳22的第二裸露部222的第二彎折段222B可以透過第二接腳保護層52的保護以避免發生斷裂或者裂痕的情況。然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。Furthermore, when the first exposed portion 212 of the first conductive pin 21 is bent to form a first bent section 212B (obtained by bending the first pre-bent section 212P) and connected to the first bend When bending a first extension section 212E of the section 212B, the first pin protection layer 51 can be configured to surround and cover the first bent section 212B of the first exposed portion 212 of the first conductive pin 21, thereby In this way, the first bent section 212B of the first exposed portion 212 of the first conductive pin 21 can pass through the protection of the first pin protection layer 51 to avoid breakage or cracks. Moreover, when the second exposed portion 222 of the second conductive pin 22 is bent to form a second bent section 222B (obtained by bending the second pre-bent section 222P) and connected to the second bent section 222B, the second pin protection layer 52 can be configured to surround and cover the second bent section 222B of the second exposed portion 222 of the second conductive pin 22, so that The second bent section 222B of the second exposed portion 222 of the second conductive pin 22 can pass through the protection of the second pin protection layer 52 to avoid breakage or cracks. However, the above-mentioned example is only one possible embodiment and is not intended to limit the invention.

[第二實施例][Second embodiment]

參閱圖4與圖5所示,本創作第二實施例提供一種捲繞型電容器封裝結構P,其包括一捲繞式組件1、一導電組件2、一封裝組件3、一底部座板4以及一接腳保護組件5。由圖4與圖2比較,以及圖5與圖3的比較可知,本創作第二實施例與第一實施例最主要的差異在於:在第二實施例中,第一接腳保護層51的一第一末端部510以及第二接腳保護層52的一第二末端部520可以分別設置在底部座板4的第一穿孔4001以及第二穿孔4002的內部。也就是說,第二實施例所提供的第一接腳保護層51以及第二接腳保護層52的長度會分別大於第一實施例所提供的第一接腳保護層51以及第二接腳保護層52的長度,藉此以使得第一導電接腳21的第一裸露部212以及第二導電接腳22的第二裸露部222可以得到更大的保護區域。Referring to FIG. 4 and FIG. 5, the second embodiment of the present invention provides a wound capacitor packaging structure P, which includes a wound component 1, a conductive component 2, a package component 3, a bottom seat plate 4 and A pin protection component 5 . From the comparison of FIG. 4 with FIG. 2, and the comparison of FIG. 5 with FIG. 3, it can be seen that the main difference between the second embodiment of the present invention and the first embodiment lies in: A first end portion 510 and a second end portion 520 of the second pin protection layer 52 may be respectively disposed inside the first through hole 4001 and the second through hole 4002 of the bottom seat plate 4 . That is to say, the lengths of the first pin protection layer 51 and the second pin protection layer 52 provided by the second embodiment are respectively longer than the first pin protection layer 51 and the second pin protection layer 51 provided by the first embodiment. The length of the protection layer 52 is such that the first exposed portion 212 of the first conductive pin 21 and the second exposed portion 222 of the second conductive pin 22 can obtain a larger protection area.

值得注意的是,第一接腳保護層51的第一末端部510以及第二接腳保護層52的第二末端部520也可以透過緊配合的方式以分別定位在底部座板4的第一穿孔4001以及第二穿孔4002的內部。然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。It is worth noting that the first end portion 510 of the first pin protection layer 51 and the second end portion 520 of the second pin protection layer 52 can also be respectively positioned on the first end portion of the bottom seat plate 4 through a tight fit. The inside of the through hole 4001 and the second through hole 4002 . However, the above-mentioned example is only one possible embodiment and is not intended to limit the invention.

[第三實施例][Third embodiment]

參閱圖6與圖7所示,本創作第三實施例提供一種捲繞型電容器封裝結構P,其包括一捲繞式組件1、一導電組件2、一封裝組件3、一底部座板4以及一接腳保護組件5。由圖6與圖2比較,以及圖6與圖3的比較可知,本創作第三實施例與第一實施例最主要的差異在於:在第三實施例中,如圖6所示,在第一導電接腳21以及第二導電接腳22被彎折之前,第一接腳保護層51具有用於部分地裸露第一裸露部212的第一預備彎折段212P的一第一開口5100,並且第二接腳保護層52具有用於部分地裸露第二裸露部222的第二預備彎折段222P的一第二開口5200。藉此,如圖7所示,當第一導電接腳21以及第二導電接腳22被彎折時(也就是第一接腳保護層51以及第二接腳保護層52被彎折時),第一接腳保護層51以及第二接腳保護層52在彎折處(也就是第一彎折段212B以及第二彎折段222B)比較不會產生皺摺的情況,所以第一導電接腳21以及第二導電接腳22可以更順利地進行彎折而分別形成第一彎折段212B以及第二彎折段222B。Referring to FIG. 6 and FIG. 7, the third embodiment of the present invention provides a wound capacitor packaging structure P, which includes a wound component 1, a conductive component 2, a package component 3, a bottom seat plate 4 and A pin protection component 5 . From the comparison of FIG. 6 with FIG. 2, and the comparison of FIG. Before a conductive pin 21 and a second conductive pin 22 are bent, the first pin protection layer 51 has a first opening 5100 for partially exposing the first pre-bending section 212P of the first exposed portion 212 , And the second pin protection layer 52 has a second opening 5200 for partially exposing the second pre-bending section 222P of the second exposed portion 222 . Thereby, as shown in FIG. 7 , when the first conductive pin 21 and the second conductive pin 22 are bent (that is, when the first pin protection layer 51 and the second pin protection layer 52 are bent) , the first pin protection layer 51 and the second pin protection layer 52 are relatively less prone to wrinkles at the bends (that is, the first bending section 212B and the second bending section 222B), so the first conductive The pin 21 and the second conductive pin 22 can be bent more smoothly to form the first bent section 212B and the second bent section 222B respectively.

值得注意的是,第三實施例所提供的第一接腳保護層51的第一開口5100以及第二接腳保護層52的第二開口5200也可以被應用在其它實施例中。It should be noted that the first opening 5100 of the first pin protection layer 51 and the second opening 5200 of the second pin protection layer 52 provided in the third embodiment can also be applied in other embodiments.

[第四實施例][Fourth Embodiment]

參閱圖8與圖9所示,本創作第四實施例提供一種捲繞型電容器封裝結構P,其包括一捲繞式組件1、一導電組件2、一封裝組件3、一底部座板4以及一接腳保護組件5。由圖8與圖2比較,以及圖9與圖3的比較可知,本創作第四實施例與第一實施例最主要的差異在於:在第四實施例中,如圖8所示,在第一導電接腳21以及第二導電接腳22進行彎折之前,第一接腳保護層51以及第二接腳保護層52可以透過後續加工(例如噴塗、塗佈或者任何的形成方式)以分別形成在第一導電接腳21的第一裸露部212的第一預備彎折段212P以及第二導電接腳22的第二裸露部222的第二預備彎折段222P上。藉此,第一接腳保護層51可以是透過後續加工以形成在第一導電接腳21的第一裸露部212上的一第一後製噴塗層、一第一後製塗佈層或者任何的一第一後製保護層(也就是說,第一接腳保護層51可以是一第一不可拆卸耐熱彈性層),並且第二接腳保護層52可以是透過後續加工以形成在第二導電接腳22的第二裸露部222上的一第二後製噴塗層、一第二後製塗佈層或者任何的一第二後製保護層(也就是說,第二接腳保護層52可以是一第二不可拆卸耐熱彈性層)。Referring to FIG. 8 and FIG. 9, the fourth embodiment of the present invention provides a wound capacitor packaging structure P, which includes a wound component 1, a conductive component 2, a package component 3, a bottom seat plate 4 and A pin protection component 5 . From the comparison between Fig. 8 and Fig. 2, and the comparison between Fig. 9 and Fig. 3, it can be seen that the main difference between the fourth embodiment of the present invention and the first embodiment is: in the fourth embodiment, as shown in Fig. 8, in the Before a conductive pin 21 and the second conductive pin 22 are bent, the first pin protection layer 51 and the second pin protection layer 52 can be processed (such as spraying, coating or any other forming method) to respectively It is formed on the first preliminary bending section 212P of the first exposed portion 212 of the first conductive pin 21 and the second preliminary bending section 222P of the second exposed portion 222 of the second conductive pin 22 . Thus, the first pin protection layer 51 can be a first post-spraying layer, a first post-production coating layer or any other post-processing formed on the first exposed portion 212 of the first conductive pin 21 through subsequent processing. A first rear protection layer (that is to say, the first pin protection layer 51 can be a first non-detachable heat-resistant elastic layer), and the second pin protection layer 52 can be formed on the second through subsequent processing On the second exposed portion 222 of the conductive pin 22, a second post-sprayed layer, a second post-coating layer or any second post-preservation layer (that is to say, the second pin protection layer 52 may be a second non-detachable heat-resistant elastic layer).

更進一步來說,如圖9所示,當第一導電接腳21的第一裸露部212被彎折而形成一第一彎折段212B以及連接於第一彎折段212B的一第一延伸段212E後,第一導電接腳21的第一裸露部212的第一彎折段212B的一上端區域與一下端區域可以分別形成一第一上彎折表面2121以及一第一下彎折表面2122,第一接腳保護層51可以被配置以用於覆蓋第一彎折段212B的第一上彎折表面2121以及第一下彎折表面2122,以使得第一導電接腳21的第一裸露部212的第一彎折段212B可以透過第一接腳保護層51的保護以避免產生斷裂或者裂痕。再者,當第二導電接腳22的第二裸露部222被彎折而形成一第二彎折段222B以及連接於第二彎折段222B的一第二延伸段222E後,第二導電接腳22的第二裸露部222的第二彎折段222B的一上端區域與一下端區域可以分別形成一第二上彎折表面2221以及一第二下彎折表面2222,第二接腳保護層52可以被配置以用於覆蓋第二彎折段222B的第二上彎折表面2221以及第二下彎折表面2222,以使得第二導電接腳22的第二裸露部222的第二彎折段222B可以透過第二接腳保護層52的保護以避免產生斷裂或者裂痕。Furthermore, as shown in FIG. 9, when the first exposed portion 212 of the first conductive pin 21 is bent to form a first bent section 212B and a first extension connected to the first bent section 212B After the section 212E, an upper end area and a lower end area of the first bending section 212B of the first exposed portion 212 of the first conductive pin 21 can respectively form a first upper bending surface 2121 and a first lower bending surface 2122, the first pin protection layer 51 can be configured to cover the first upper bending surface 2121 and the first lower bending surface 2122 of the first bending section 212B, so that the first conductive pin 21 The first bent section 212B of the exposed portion 212 can pass through the protection of the first pin protection layer 51 to avoid breakage or cracks. Furthermore, when the second exposed portion 222 of the second conductive pin 22 is bent to form a second bent section 222B and a second extension section 222E connected to the second bent section 222B, the second conductive contact An upper end region and a lower end region of the second bent section 222B of the second exposed portion 222 of the foot 22 can respectively form a second upper bent surface 2221 and a second lower bent surface 2222, and the second pin protection layer 52 may be configured to cover the second upper bending surface 2221 and the second lower bending surface 2222 of the second bending section 222B, so that the second bending of the second exposed portion 222 of the second conductive pin 22 The segment 222B can pass through the protection of the second pin protection layer 52 to avoid breakage or cracks.

值得注意的是,舉例來說,在第一導電接腳21以及第二導電接腳22被彎折之前,第一接腳保護層51可以具有用於部分地裸露第一裸露部212的一第一開口(圖未示),並且第二接腳保護層52可以具有用於部分地裸露第二裸露部222的一第二開口(圖未示)。然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。It should be noted that, for example, before the first conductive pin 21 and the second conductive pin 22 are bent, the first pin protection layer 51 may have a first pin protection layer for partially exposing the first exposed portion 212. An opening (not shown), and the second pin protection layer 52 may have a second opening (not shown) for partially exposing the second exposed portion 222 . However, the above-mentioned example is only one possible embodiment and is not intended to limit the invention.

[第五實施例][Fifth Embodiment]

參閱圖10與圖11所示,本創作第五實施例提供一種捲繞型電容器封裝結構P,其包括一捲繞式組件1、一導電組件2、一封裝組件3、一底部座板4以及一接腳保護組件5。由圖10與圖2比較,以及圖11與圖3的比較可知,本創作第五實施例與第一實施例最主要的差異在於:在第五實施例中,如圖11所示,在第一導電接腳21以及第二導電接腳22進行彎折之後,第一接腳保護層51以及第二接腳保護層52可以透過後續加工(例如噴塗、塗佈或者任何的形成方式)以分別形成在第一導電接腳21的第一裸露部212的第一彎折段212B以及第二導電接腳22的第二裸露部222的第二彎折段222B上。藉此,第一接腳保護層51可以是透過後續加工以形成在第一導電接腳21的第一裸露部212上的一第一後製噴塗層、一第一後製塗佈層或者任何的一第一後製保護層(也就是說,第一接腳保護層51可以是一第一不可拆卸耐熱彈性層),並且第二接腳保護層52可以是透過後續加工以形成在第二導電接腳22的第二裸露部222上的一第二後製噴塗層、一第二後製塗佈層或者任何的一第二後製保護層(也就是說,第二接腳保護層52可以是一第二不可拆卸耐熱彈性層)。Referring to FIG. 10 and FIG. 11 , the fifth embodiment of the present invention provides a wound capacitor packaging structure P, which includes a wound component 1, a conductive component 2, a package component 3, a bottom seat plate 4 and A pin protection component 5 . From the comparison of Fig. 10 with Fig. 2, and the comparison of Fig. 11 with Fig. 3, it can be seen that the main difference between the fifth embodiment of the present invention and the first embodiment is: in the fifth embodiment, as shown in Fig. 11, the After a conductive pin 21 and a second conductive pin 22 are bent, the first pin protection layer 51 and the second pin protection layer 52 can be processed (such as spraying, coating or any other forming method) to respectively It is formed on the first bent section 212B of the first exposed portion 212 of the first conductive pin 21 and the second bent section 222B of the second exposed portion 222 of the second conductive pin 22 . Thus, the first pin protection layer 51 can be a first post-spraying layer, a first post-production coating layer or any other post-processing formed on the first exposed portion 212 of the first conductive pin 21 through subsequent processing. A first rear protection layer (that is to say, the first pin protection layer 51 can be a first non-detachable heat-resistant elastic layer), and the second pin protection layer 52 can be formed on the second through subsequent processing On the second exposed portion 222 of the conductive pin 22, a second post-sprayed layer, a second post-coating layer or any second post-preservation layer (that is to say, the second pin protection layer 52 may be a second non-detachable heat-resistant elastic layer).

更進一步來說,如圖11所示,當第一導電接腳21的第一裸露部212被彎折而形成一第一彎折段212B以及連接於第一彎折段212B的一第一延伸段212E後,第一導電接腳21的第一裸露部212的第一彎折段212B的一上端區域與一下端區域可以分別形成一第一上彎折表面2121以及一第一下彎折表面2122,第一接腳保護層51可以被配置以用於覆蓋第一彎折段212B的第一上彎折表面2121以及第一下彎折表面2122,以使得第一導電接腳21的第一裸露部212的第一彎折段212B可以透過第一接腳保護層51的保護以避免產生斷裂或者裂痕。再者,當第二導電接腳22的第二裸露部222被彎折而形成一第二彎折段222B以及連接於第二彎折段222B的一第二延伸段222E後,第二導電接腳22的第二裸露部222的第二彎折段222B的一上端區域與一下端區域可以分別形成一第二上彎折表面2221以及一第二下彎折表面2222,第二接腳保護層52可以被配置以用於覆蓋第二彎折段222B的第二上彎折表面2221以及第二下彎折表面2222,以使得第二導電接腳22的第二裸露部222的第二彎折段222B可以透過第二接腳保護層52的保護以避免產生斷裂或者裂痕。Furthermore, as shown in FIG. 11 , when the first exposed portion 212 of the first conductive pin 21 is bent to form a first bent section 212B and a first extension connected to the first bent section 212B After the section 212E, an upper end area and a lower end area of the first bending section 212B of the first exposed portion 212 of the first conductive pin 21 can respectively form a first upper bending surface 2121 and a first lower bending surface 2122, the first pin protection layer 51 can be configured to cover the first upper bending surface 2121 and the first lower bending surface 2122 of the first bending section 212B, so that the first conductive pin 21 The first bent section 212B of the exposed portion 212 can pass through the protection of the first pin protection layer 51 to avoid breakage or cracks. Furthermore, when the second exposed portion 222 of the second conductive pin 22 is bent to form a second bent section 222B and a second extension section 222E connected to the second bent section 222B, the second conductive contact An upper end region and a lower end region of the second bent section 222B of the second exposed portion 222 of the foot 22 can respectively form a second upper bent surface 2221 and a second lower bent surface 2222, and the second pin protection layer 52 may be configured to cover the second upper bending surface 2221 and the second lower bending surface 2222 of the second bending section 222B, so that the second bending of the second exposed portion 222 of the second conductive pin 22 The segment 222B can pass through the protection of the second pin protection layer 52 to avoid breakage or cracks.

值得注意的是,舉例來說,在第一導電接腳21以及第二導電接腳22被彎折之前,第一接腳保護層51可以具有用於部分地裸露第一裸露部212的一第一開口(圖未示),並且第二接腳保護層52可以具有用於部分地裸露第二裸露部222的一第二開口(圖未示)。It should be noted that, for example, before the first conductive pin 21 and the second conductive pin 22 are bent, the first pin protection layer 51 may have a first pin protection layer for partially exposing the first exposed portion 212. An opening (not shown), and the second pin protection layer 52 may have a second opening (not shown) for partially exposing the second exposed portion 222 .

[實施例的有益效果][Advantageous Effects of Embodiment]

本創作的其中一有益效果在於,本創作所提供的一種捲繞型電容器封裝結構P,其能通過“接腳保護組件5包括被配置以用於覆蓋第一導電接腳21的一部分的一第一接腳保護層51以及被配置以用於覆蓋第二導電接腳22的一部分的一第二接腳保護層52”以及“第一接腳保護層51以及第二接腳保護層52分別設置在第一導電接腳21的第一裸露部212以及第二導電接腳22的第二裸露部222上”的技術方案,以使得第一接腳保護層51以及第二接腳保護層52可以分別被配置以用於分別保護第一導電接腳21的第一裸露部212以及第二導電接腳22的第二裸露部222,藉此以避免第一導電接腳21以及第二導電接腳22在進行彎折過程中發生斷裂或者裂痕的情況。One of the beneficial effects of the present invention is that the wound type capacitor packaging structure P provided by the present invention can pass through the "pin protection component 5 including a first conductive pin 21 configured to cover a part A pin protection layer 51 and a second pin protection layer 52 configured to cover a part of the second conductive pin 22" and "the first pin protection layer 51 and the second pin protection layer 52 are provided respectively. On the first exposed portion 212 of the first conductive pin 21 and the second exposed portion 222 of the second conductive pin 22” so that the first pin protection layer 51 and the second pin protection layer 52 can respectively configured to respectively protect the first exposed portion 212 of the first conductive pin 21 and the second exposed portion 222 of the second conductive pin 22, thereby avoiding the first conductive pin 21 and the second conductive pin 22 When a break or crack occurs during the bending process.

以上所公開的內容僅為本創作的優選可行實施例,並非因此侷限本創作的申請專利範圍,所以凡是運用本創作說明書及圖式內容所做的等效技術變化,均包含於本創作的申請專利範圍內。The content disclosed above is only the preferred feasible embodiment of this creation, and does not limit the scope of patent application for this creation. Therefore, all equivalent technical changes made by using the instructions and drawings of this creation are included in the application of this creation. within the scope of the patent.

P:捲繞型電容器封裝結構 1:捲繞式組件 11:捲繞式正極導電箔片 12:捲繞式負極導電箔片 13:捲繞式隔離片 2:導電組件 21:第一導電接腳 211:第一內埋部 212:第一裸露部 2121:第一上彎折表面 2122:第一下彎折表面 212P:第一預備彎折段 212B:第一彎折段 212E:第一延伸段 22:第二導電接腳 2221:第二上彎折表面 2222:第二下彎折表面 221:第二內埋部 222:第二裸露部 222P:第二預備彎折段 222B:第二彎折段 222E:第二延伸段 3:封裝組件 31:封裝殼體 32:底端封閉結構 4:底部座板 4001:第一穿孔 4002:第二穿孔 5:接腳保護組件 51:第一接腳保護層 510:第一末端部 5100:第一開口 52:第二接腳保護層 520:第二末端部 5200:第二開口 P: wound capacitor packaging structure 1: Winding components 11: Coiled positive electrode conductive foil 12: Winding negative electrode conductive foil 13: Winding separator 2: Conductive components 21: The first conductive pin 211: The first embedded part 212: The first exposed part 2121: The first upper bending surface 2122: The first lower bending surface 212P: The first preparatory bending section 212B: the first bending section 212E: The first extension 22: Second conductive pin 2221: Second upper bending surface 2222: The second lower bending surface 221: The second embedded part 222: The second exposed part 222P: The second preparatory bending section 222B: the second bending section 222E: Second extension 3: Packaging components 31: Packaging shell 32: Bottom closed structure 4: Bottom seat plate 4001: First piercing 4002: Second piercing 5: Pin protection components 51: The first pin protection layer 510: first terminal part 5100: first opening 52: Second pin protection layer 520: second terminal part 5200: second opening

圖1為本創作所提供的捲繞式組件以及導電組件相互配合的立體示意圖。FIG. 1 is a three-dimensional schematic view of the cooperation between the winding component and the conductive component provided by the invention.

圖2為本創作第一實施例所提供的捲繞型電容器封裝結構的部分剖面示意圖(當第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部尚未被彎折時)。Fig. 2 is a partial cross-sectional schematic diagram of the wound capacitor package structure provided by the first embodiment of the present invention (when the first exposed part of the first conductive pin and the second exposed part of the second conductive pin have not been bent ).

圖3為本創作第一實施例所提供的捲繞型電容器封裝結構的部分剖面示意圖(當第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部被彎折後)。Fig. 3 is a partial cross-sectional schematic diagram of the wound capacitor package structure provided by the first embodiment of the present invention (after the first exposed part of the first conductive pin and the second exposed part of the second conductive pin are bent) .

圖4為本創作第二實施例所提供的捲繞型電容器封裝結構的部分剖面示意圖(當第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部尚未被彎折時)。4 is a partial cross-sectional schematic view of the package structure of the wound capacitor provided by the second embodiment of the present invention (when the first exposed part of the first conductive pin and the second exposed part of the second conductive pin have not been bent ).

圖5為本創作第二實施例所提供的捲繞型電容器封裝結構的部分剖面示意圖(當第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部被彎折後)。Fig. 5 is a partial cross-sectional schematic diagram of the wound capacitor package structure provided by the second embodiment of the present invention (after the first exposed part of the first conductive pin and the second exposed part of the second conductive pin are bent) .

圖6為本創作第三實施例所提供的捲繞型電容器封裝結構的部分剖面示意圖(當第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部尚未被彎折時)。Fig. 6 is a partial cross-sectional schematic diagram of the packaging structure of the winding type capacitor provided by the third embodiment of the present invention (when the first exposed part of the first conductive pin and the second exposed part of the second conductive pin have not been bent ).

圖7為本創作第三實施例所提供的捲繞型電容器封裝結構的部分剖面示意圖(當第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部被彎折後)。Fig. 7 is a partial cross-sectional schematic diagram of the wound capacitor package structure provided by the third embodiment of the present invention (after the first exposed part of the first conductive pin and the second exposed part of the second conductive pin are bent) .

圖8為本創作第四實施例所提供的捲繞型電容器封裝結構的部分剖面示意圖(當第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部尚未被彎折時)。Fig. 8 is a partial cross-sectional schematic diagram of the wound capacitor package structure provided by the fourth embodiment of the present invention (when the first exposed part of the first conductive pin and the second exposed part of the second conductive pin have not been bent ).

圖9為本創作第四實施例所提供的捲繞型電容器封裝結構的部分剖面示意圖(當第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部被彎折後)。FIG. 9 is a partial cross-sectional schematic view of the packaging structure of the wound capacitor provided by the fourth embodiment of the present invention (after the first exposed part of the first conductive pin and the second exposed part of the second conductive pin are bent) .

圖10為本創作第五實施例所提供的捲繞型電容器封裝結構的部分剖面示意圖(當第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部尚未被彎折時)。Fig. 10 is a partial cross-sectional schematic diagram of the wound capacitor package structure provided by the fifth embodiment of the present invention (when the first exposed part of the first conductive pin and the second exposed part of the second conductive pin have not been bent ).

圖11為本創作第五實施例所提供的捲繞型電容器封裝結構的部分剖面示意圖(當第一導電接腳的第一裸露部以及第二導電接腳的第二裸露部被彎折後)。FIG. 11 is a partial cross-sectional schematic diagram of the wound capacitor package structure provided by the fifth embodiment of the present invention (after the first exposed part of the first conductive pin and the second exposed part of the second conductive pin are bent) .

P:捲繞型電容器封裝結構 P: wound capacitor packaging structure

1:捲繞式組件 1: Winding components

2:導電組件 2: Conductive components

21:第一導電接腳 21: The first conductive pin

211:第一內埋部 211: The first embedded part

212:第一裸露部 212: The first exposed part

212B:第一彎折段 212B: the first bending section

212E:第一延伸段 212E: The first extension

22:第二導電接腳 22: Second conductive pin

221:第二內埋部 221: The second embedded part

222:第二裸露部 222: The second exposed part

222B:第二彎折段 222B: the second bending section

222E:第二延伸段 222E: Second extension

3:封裝組件 3: Packaging components

31:封裝殼體 31: Packaging shell

32:底端封閉結構 32: Bottom closed structure

4:底部座板 4: Bottom seat plate

4001:第一穿孔 4001: First piercing

4002:第二穿孔 4002: Second piercing

5:接腳保護組件 5: Pin protection components

51:第一接腳保護層 51: The first pin protection layer

52:第二接腳保護層 52: Second pin protection layer

Claims (10)

一種捲繞型電容器封裝結構,其包括: 一捲繞式組件,所述捲繞式組件包括一捲繞式正極導電箔片、一捲繞式負極導電箔片以及兩個捲繞式隔離片; 一導電組件,所述導電組件包括電性接觸所述捲繞式正極導電箔片的一第一導電接腳以及電性接觸所述捲繞式負極導電箔片的一第二導電接腳; 一封裝組件,所述捲繞式組件被包覆在所述封裝組件的內部; 一底部座板,所述底部座板設置在所述封裝組件的底端,以用於承載所述封裝組件;以及 一接腳保護組件,所述接腳保護組件包括被配置以用於覆蓋所述第一導電接腳的一部分的一第一接腳保護層以及被配置以用於覆蓋所述第二導電接腳的一部分的一第二接腳保護層; 其中,兩個所述捲繞式隔離片的其中之一設置在所述捲繞式正極導電箔片與所述捲繞式負極導電箔片之間,且所述捲繞式正極導電箔片與所述捲繞式負極導電箔片兩者其中之一設置在兩個所述捲繞式隔離片之間; 其中,所述第一導電接腳包括被容置在所述封裝組件內部的一第一內埋部以及裸露在所述封裝組件外部的一第一裸露部,且所述第二導電接腳包括被容置在所述封裝組件內部的一第二內埋部以及裸露在所述封裝組件外部的一第二裸露部; 其中,所述第一導電接腳的所述第一裸露部以及所述第二導電接腳的所述第二裸露部穿過所述底部座板而裸露在外,且所述第一接腳保護層以及所述第二接腳保護層分別設置在所述第一導電接腳的所述第一裸露部以及所述第二導電接腳的所述第二裸露部上。 A wound capacitor package structure, comprising: A wound-type assembly comprising a wound-type positive electrode conductive foil, a wound-type negative electrode conductive foil and two wound-type separators; a conductive component comprising a first conductive pin electrically contacting the wound positive conductive foil and a second conductive pin electrically contacting the wound negative conductive foil; a packaging component, the roll-type component is wrapped inside the packaging component; a bottom seat plate disposed at the bottom end of the packaging assembly for carrying the packaging assembly; and a pin protection assembly including a first pin protection layer configured to cover a portion of the first conductive pin and configured to cover the second conductive pin a part of a second pin protection layer; Wherein, one of the two wound-type separators is arranged between the wound-type positive electrode conductive foil and the wound-type negative electrode conductive foil, and the wound-type positive electrode conductive foil and One of the wound negative electrode conductive foils is arranged between the two wound separators; Wherein, the first conductive pin includes a first embedded part accommodated inside the package component and a first exposed part exposed outside the package component, and the second conductive pin includes a second embedded part accommodated inside the package component and a second exposed part exposed outside the package component; Wherein, the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin are exposed outside through the bottom seat plate, and the first pin protects layer and the second pin protection layer are respectively disposed on the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin. 如請求項1所述的捲繞型電容器封裝結構, 其中,所述封裝組件包括被配置以用於收容所述捲繞式組件的一封裝殼體以及設置在所述封裝殼體的內部且與所述封裝殼體相互配合的一底端封閉結構,且所述封裝組件被所述封裝殼體以及所述底端封閉結構所完全包覆; 其中,所述底部座板具有一第一穿孔以及一第二穿孔,所述第一導電接腳以及所述第二導電接腳分別穿過的所述底部座板的所述第一穿孔以及所述第二穿孔,且所述第一接腳保護層的一第一末端部以及所述第二接腳保護層的一第二末端部分別設置在所述底部座板的所述第一穿孔以及所述第二穿孔的內部; 其中,當所述第一導電接腳的所述第一裸露部被彎折而形成一第一彎折段以及連接於所述第一彎折段的一第一延伸段時,所述第一接腳保護層被配置以用於圍繞且覆蓋所述第一導電接腳的所述第一裸露部的所述第一彎折段,以使得所述第一導電接腳的所述第一裸露部的所述第一彎折段透過所述第一接腳保護層的保護以避免產生斷裂或者裂痕; 其中,當所述第二導電接腳的所述第二裸露部被彎折而形成一第二彎折段以及連接於所述第二彎折段的一第二延伸段時,所述第二接腳保護層被配置以用於圍繞且覆蓋所述第二導電接腳的所述第二裸露部的所述第二彎折段,以使得所述第二導電接腳的所述第二裸露部的所述第二彎折段透過所述第二接腳保護層的保護以避免產生斷裂或者裂痕; 其中,所述第一接腳保護層為一第一後製噴塗層或者一第一後製塗佈層,且所述第二接腳保護層為一第二後製噴塗層或者一第二後製塗佈層; 其中,所述第一接腳保護層具有用於部分地裸露所述第一裸露部的所述第一彎折段的一第一開口,且所述第二接腳保護層具有用於部分地裸露所述第二裸露部的所述第二彎折段的一第二開口。 The package structure of winding type capacitor as claimed in claim 1, Wherein, the packaging assembly includes a packaging casing configured to accommodate the roll-up assembly and a bottom closure structure disposed inside the packaging casing and cooperating with the packaging casing, And the packaging component is completely covered by the packaging shell and the bottom closing structure; Wherein, the bottom seat plate has a first through hole and a second through hole, and the first through hole and the second conductive pin of the bottom seat plate pass through respectively. The second through hole, and a first end portion of the first pin protection layer and a second end portion of the second pin protection layer are respectively arranged in the first through hole and the bottom seat plate the interior of the second perforation; Wherein, when the first exposed portion of the first conductive pin is bent to form a first bent section and a first extension section connected to the first bent section, the first The pin protection layer is configured to surround and cover the first bent section of the first exposed portion of the first conductive pin, so that the first exposed portion of the first conductive pin The first bending section of the part is protected by the protection layer of the first pin to avoid breakage or cracks; Wherein, when the second bare part of the second conductive pin is bent to form a second bent section and a second extension section connected to the second bent section, the second The pin protection layer is configured to surround and cover the second bent section of the second exposed portion of the second conductive pin, so that the second exposed portion of the second conductive pin The second bent section of the portion is protected by the second pin protective layer to avoid breakage or cracks; Wherein, the first pin protection layer is a first post-production spray coating or a first post-production coating layer, and the second pin protection layer is a second post-production spray coating or a second post-production coating Coating layer; Wherein, the first pin protection layer has a first opening for partially exposing the first bent section of the first exposed portion, and the second pin protection layer has a first opening for partially exposing A second opening of the second bent section of the second exposed portion is exposed. 如請求項1所述的捲繞型電容器封裝結構, 其中,所述封裝組件包括被配置以用於收容所述捲繞式組件的一封裝殼體以及設置在所述封裝殼體的內部且與所述封裝殼體相互配合的一底端封閉結構,且所述封裝組件被所述封裝殼體以及所述底端封閉結構所完全包覆; 其中,所述底部座板具有一第一穿孔以及一第二穿孔,所述第一導電接腳以及所述第二導電接腳分別穿過的所述底部座板的所述第一穿孔以及所述第二穿孔,且所述第一接腳保護層的一第一末端部以及所述第二接腳保護層的一第二末端部分別設置在所述底部座板的所述第一穿孔以及所述第二穿孔的內部; 其中,當所述第一導電接腳的所述第一裸露部被彎折而形成一第一彎折段以及連接於所述第一彎折段的一第一延伸段後,所述第一導電接腳的所述第一裸露部的所述第一彎折段的一上端區域與一下端區域分別形成一第一上彎折表面以及一第一下彎折表面,所述第一接腳保護層被配置以用於覆蓋所述第一彎折段的所述第一上彎折表面以及所述第一下彎折表面,以使得所述第一導電接腳的所述第一裸露部的所述第一彎折段透過所述第一接腳保護層的保護以避免產生斷裂或者裂痕; 其中,當所述第二導電接腳的所述第二裸露部被彎折而形成一第二彎折段以及連接於所述第二彎折段的一第二延伸段後,所述第二導電接腳的所述第二裸露部的所述第二彎折段的一上端區域與一下端區域分別形成一第二上彎折表面以及一第二下彎折表面,所述第二接腳保護層被配置以用於覆蓋所述第二彎折段的所述第二上彎折表面以及所述第二下彎折表面,以使得所述第二導電接腳的所述第二裸露部的所述第二彎折段透過所述第二接腳保護層的保護以避免產生斷裂或者裂痕; 其中,所述第一接腳保護層為一第一後製噴塗層或者一第一後製塗佈層,且所述第二接腳保護層為一第二後製噴塗層或者一第二後製塗佈層。 The package structure of winding type capacitor as claimed in claim 1, Wherein, the packaging assembly includes a packaging casing configured to accommodate the roll-up assembly and a bottom closure structure disposed inside the packaging casing and cooperating with the packaging casing, And the packaging component is completely covered by the packaging shell and the bottom closing structure; Wherein, the bottom seat plate has a first through hole and a second through hole, and the first through hole and the second conductive pin of the bottom seat plate pass through respectively. The second through hole, and a first end portion of the first pin protection layer and a second end portion of the second pin protection layer are respectively arranged in the first through hole and the bottom seat plate the interior of the second perforation; Wherein, when the first exposed portion of the first conductive pin is bent to form a first bent section and a first extension section connected to the first bent section, the first An upper end region and a lower end region of the first bent section of the first exposed portion of the conductive pin respectively form a first upper bent surface and a first lower bent surface, and the first pin The protection layer is configured to cover the first upper bending surface and the first lower bending surface of the first bending section, so that the first exposed portion of the first conductive pin The first bending section is protected by the protection layer of the first pin to avoid breakage or cracks; Wherein, when the second exposed portion of the second conductive pin is bent to form a second bent section and a second extension section connected to the second bent section, the second An upper end region and a lower end region of the second bent section of the second exposed portion of the conductive pin respectively form a second upper bent surface and a second lower bent surface, and the second pin The protection layer is configured to cover the second upper bending surface and the second lower bending surface of the second bending section, so that the second exposed portion of the second conductive pin The second bent section of the second pin is protected by the protective layer of the second pin to avoid breakage or cracks; Wherein, the first pin protection layer is a first post-production spray coating or a first post-production coating layer, and the second pin protection layer is a second post-production spray coating or a second post-production coating Make the coating layer. 如請求項1所述的捲繞型電容器封裝結構, 其中,所述封裝組件包括被配置以用於收容所述捲繞式組件的一封裝殼體以及設置在所述封裝殼體的內部且與所述封裝殼體相互配合的一底端封閉結構,且所述封裝組件被所述封裝殼體以及所述底端封閉結構所完全包覆; 其中,所述底部座板具有一第一穿孔以及一第二穿孔,所述第一導電接腳以及所述第二導電接腳分別穿過的所述底部座板的所述第一穿孔以及所述第二穿孔,且所述第一接腳保護層的一第一末端部以及所述第二接腳保護層的一第二末端部分別設置在所述底部座板的所述第一穿孔以及所述第二穿孔的內部; 其中,當所述第一導電接腳的所述第一裸露部尚未被彎折而定義為一第一預備彎折段以及連接於所述第一預備彎折段的一第一延伸段時,所述第一接腳保護層被配置以用於圍繞且覆蓋所述第一導電接腳的所述第一裸露部的所述第一預備彎折段,以使得所述第一導電接腳的所述第一裸露部的所述第一預備彎折段透過所述第一接腳保護層而得到保護; 其中,當所述第二導電接腳的所述第二裸露部尚未被彎折而定義為一第二預備彎折段以及連接於所述第二預備彎折段的一第二延伸段時,所述第二接腳保護層被配置以用於圍繞且覆蓋所述第二導電接腳的所述第二裸露部的所述第二預備彎折段,以使得所述第二導電接腳的所述第二裸露部的所述第二預備彎折段透過所述第二接腳保護層而得到保護; 其中,所述第一接腳保護層為一第一後製噴塗層、一第一後製塗佈層、一第一預製貼附層或者一第一可拆卸耐熱彈性套件,且所述第二接腳保護層為一第二後製噴塗層、一第二後製塗佈層、一第二預製貼附層或者一第二可拆卸耐熱彈性套件; 其中,所述第一接腳保護層具有用於部分地裸露所述第一裸露部的所述第一預備彎折段的一第一開口,且所述第二接腳保護層具有用於部分地裸露所述第二裸露部的所述第二預備彎折段的一第二開口。 The package structure of winding type capacitor as claimed in claim 1, Wherein, the packaging assembly includes a packaging casing configured to accommodate the roll-up assembly and a bottom closure structure disposed inside the packaging casing and cooperating with the packaging casing, And the packaging component is completely covered by the packaging shell and the bottom closing structure; Wherein, the bottom seat plate has a first through hole and a second through hole, and the first through hole and the second conductive pin of the bottom seat plate pass through respectively. The second through hole, and a first end portion of the first pin protection layer and a second end portion of the second pin protection layer are respectively arranged in the first through hole and the bottom seat plate the interior of the second perforation; Wherein, when the first exposed portion of the first conductive pin has not been bent to define a first preliminary bending section and a first extension section connected to the first preliminary bending section, The first pin protection layer is configured to surround and cover the first pre-bending section of the first exposed portion of the first conductive pin, so that the first conductive pin The first pre-bending section of the first exposed portion is protected through the first pin protection layer; Wherein, when the second exposed portion of the second conductive pin has not been bent and is defined as a second preliminary bending section and a second extension section connected to the second preliminary bending section, The second pin protection layer is configured to surround and cover the second preparatory bending section of the second exposed portion of the second conductive pin, so that the second conductive pin The second preliminary bending section of the second exposed portion is protected through the second pin protection layer; Wherein, the first pin protection layer is a first post-production spraying layer, a first post-production coating layer, a first prefabricated attachment layer or a first detachable heat-resistant elastic sleeve, and the second The pin protection layer is a second post-production spraying layer, a second post-production coating layer, a second prefabricated adhesive layer or a second detachable heat-resistant elastic sleeve; Wherein, the first pin protection layer has a first opening for partially exposing the first preliminary bending section of the first bare part, and the second pin protection layer has a first opening for partially exposing A second opening of the second preliminary bending section of the second exposed portion is exposed. 如請求項1所述的捲繞型電容器封裝結構, 其中,所述封裝組件包括被配置以用於收容所述捲繞式組件的一封裝殼體以及設置在所述封裝殼體的內部且與所述封裝殼體相互配合的一底端封閉結構,且所述封裝組件被所述封裝殼體以及所述底端封閉結構所完全包覆; 其中,所述底部座板具有一第一穿孔以及一第二穿孔,所述第一導電接腳以及所述第二導電接腳分別穿過的所述底部座板的所述第一穿孔以及所述第二穿孔,且所述第一接腳保護層的一第一末端部以及所述第二接腳保護層的一第二末端部分別設置在所述底部座板的所述第一穿孔以及所述第二穿孔的內部; 其中,所述第一接腳保護層為一第一不可拆卸耐熱彈性層或者一第一可拆卸耐熱彈性套件,且所述第二接腳保護層為第二不可拆卸耐熱彈性層或者一第二可拆卸耐熱彈性套件; 其中,所述第一接腳保護層具有用於部分地裸露所述第一裸露部的一第一開口,且所述第二接腳保護層具有用於部分地裸露所述第二裸露部的一第二開口。 The package structure of winding type capacitor as claimed in claim 1, Wherein, the packaging assembly includes a packaging casing configured to accommodate the roll-up assembly and a bottom closure structure disposed inside the packaging casing and cooperating with the packaging casing, And the packaging component is completely covered by the packaging shell and the bottom closing structure; Wherein, the bottom seat plate has a first through hole and a second through hole, and the first through hole and the second conductive pin of the bottom seat plate pass through respectively. The second through hole, and a first end portion of the first pin protection layer and a second end portion of the second pin protection layer are respectively arranged in the first through hole and the bottom seat plate the interior of the second perforation; Wherein, the first pin protection layer is a first non-detachable heat-resistant elastic layer or a first detachable heat-resistant elastic sleeve, and the second pin protection layer is a second non-detachable heat-resistant elastic layer or a second Removable heat-resistant elastic kit; Wherein, the first pin protection layer has a first opening for partially exposing the first exposed portion, and the second pin protection layer has a first opening for partially exposing the second exposed portion. A second opening. 一種捲繞型電容器封裝結構,其包括: 一捲繞式組件; 一導電組件,所述導電組件包括一第一導電接腳以及一第二導電接腳; 一封裝組件,所述捲繞式組件被包覆在所述封裝組件的內部; 一底部座板,所述底部座板設置在所述封裝組件的底端;以及 一接腳保護組件,所述接腳保護組件包括被配置以用於覆蓋所述第一導電接腳的一部分的一第一接腳保護層以及被配置以用於覆蓋所述第二導電接腳的一部分的一第二接腳保護層; 其中,所述第一導電接腳包括裸露在所述封裝組件外部的一第一裸露部,且所述第二導電接腳包括裸露在所述封裝組件外部的一第二裸露部; 其中,所述第一導電接腳的所述第一裸露部以及所述第二導電接腳的所述第二裸露部穿過所述底部座板而裸露在外,且所述第一接腳保護層以及所述第二接腳保護層分別設置在所述第一導電接腳的所述第一裸露部以及所述第二導電接腳的所述第二裸露部上。 A wound capacitor package structure, comprising: a coiled assembly; A conductive component, the conductive component includes a first conductive pin and a second conductive pin; a packaging component, the roll-type component is wrapped inside the packaging component; a bottom seat plate disposed at the bottom end of the package assembly; and a pin protection assembly including a first pin protection layer configured to cover a portion of the first conductive pin and configured to cover the second conductive pin a part of a second pin protection layer; Wherein, the first conductive pin includes a first exposed portion exposed outside the package component, and the second conductive pin includes a second exposed portion exposed outside the package component; Wherein, the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin are exposed outside through the bottom seat plate, and the first pin protects layer and the second pin protection layer are respectively disposed on the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin. 如請求項6所述的捲繞型電容器封裝結構, 其中,所述封裝組件包括被配置以用於收容所述捲繞式組件的一封裝殼體以及設置在所述封裝殼體的內部且與所述封裝殼體相互配合的一底端封閉結構,且所述封裝組件被所述封裝殼體以及所述底端封閉結構所完全包覆; 其中,所述底部座板具有一第一穿孔以及一第二穿孔,所述第一導電接腳以及所述第二導電接腳分別穿過的所述底部座板的所述第一穿孔以及所述第二穿孔,且所述第一接腳保護層的一第一末端部以及所述第二接腳保護層的一第二末端部分別設置在所述底部座板的所述第一穿孔以及所述第二穿孔的內部; 其中,當所述第一導電接腳的所述第一裸露部被彎折而形成一第一彎折段以及連接於所述第一彎折段的一第一延伸段時,所述第一接腳保護層被配置以用於圍繞且覆蓋所述第一導電接腳的所述第一裸露部的所述第一彎折段,以使得所述第一導電接腳的所述第一裸露部的所述第一彎折段透過所述第一接腳保護層的保護以避免產生斷裂或者裂痕; 其中,當所述第二導電接腳的所述第二裸露部被彎折而形成一第二彎折段以及連接於所述第二彎折段的一第二延伸段時,所述第二接腳保護層被配置以用於圍繞且覆蓋所述第二導電接腳的所述第二裸露部的所述第二彎折段,以使得所述第二導電接腳的所述第二裸露部的所述第二彎折段透過所述第二接腳保護層的保護以避免產生斷裂或者裂痕; 其中,所述第一接腳保護層為一第一後製噴塗層或者一第一後製塗佈層,且所述第二接腳保護層為一第二後製噴塗層或者一第二後製塗佈層; 其中,所述第一接腳保護層具有用於部分地裸露所述第一裸露部的所述第一彎折段的一第一開口,且所述第二接腳保護層具有用於部分地裸露所述第二裸露部的所述第二彎折段的一第二開口。 The package structure of wound capacitors as claimed in item 6, Wherein, the packaging assembly includes a packaging casing configured to accommodate the roll-up assembly and a bottom closure structure disposed inside the packaging casing and cooperating with the packaging casing, And the packaging component is completely covered by the packaging shell and the bottom closing structure; Wherein, the bottom seat plate has a first through hole and a second through hole, and the first through hole and the second conductive pin of the bottom seat plate pass through respectively. The second through hole, and a first end portion of the first pin protection layer and a second end portion of the second pin protection layer are respectively arranged in the first through hole and the bottom seat plate the interior of the second perforation; Wherein, when the first exposed portion of the first conductive pin is bent to form a first bent section and a first extension section connected to the first bent section, the first The pin protection layer is configured to surround and cover the first bent section of the first exposed portion of the first conductive pin, so that the first exposed portion of the first conductive pin The first bending section of the part is protected by the protection layer of the first pin to avoid breakage or cracks; Wherein, when the second bare part of the second conductive pin is bent to form a second bent section and a second extension section connected to the second bent section, the second The pin protection layer is configured to surround and cover the second bent section of the second exposed portion of the second conductive pin, so that the second exposed portion of the second conductive pin The second bent section of the portion is protected by the second pin protective layer to avoid breakage or cracks; Wherein, the first pin protection layer is a first post-production spray coating or a first post-production coating layer, and the second pin protection layer is a second post-production spray coating or a second post-production coating Coating layer; Wherein, the first pin protection layer has a first opening for partially exposing the first bent section of the first exposed portion, and the second pin protection layer has a first opening for partially exposing A second opening of the second bent section of the second exposed portion is exposed. 如請求項6所述的捲繞型電容器封裝結構, 其中,所述封裝組件包括被配置以用於收容所述捲繞式組件的一封裝殼體以及設置在所述封裝殼體的內部且與所述封裝殼體相互配合的一底端封閉結構,且所述封裝組件被所述封裝殼體以及所述底端封閉結構所完全包覆; 其中,所述底部座板具有一第一穿孔以及一第二穿孔,所述第一導電接腳以及所述第二導電接腳分別穿過的所述底部座板的所述第一穿孔以及所述第二穿孔,且所述第一接腳保護層的一第一末端部以及所述第二接腳保護層的一第二末端部分別設置在所述底部座板的所述第一穿孔以及所述第二穿孔的內部; 其中,當所述第一導電接腳的所述第一裸露部被彎折而形成一第一彎折段以及連接於所述第一彎折段的一第一延伸段後,所述第一導電接腳的所述第一裸露部的所述第一彎折段的一上端區域與一下端區域分別形成一第一上彎折表面以及一第一下彎折表面,所述第一接腳保護層被配置以用於覆蓋所述第一彎折段的所述第一上彎折表面以及所述第一下彎折表面,以使得所述第一導電接腳的所述第一裸露部的所述第一彎折段透過所述第一接腳保護層的保護以避免產生斷裂或者裂痕; 其中,當所述第二導電接腳的所述第二裸露部被彎折而形成一第二彎折段以及連接於所述第二彎折段的一第二延伸段後,所述第二導電接腳的所述第二裸露部的所述第二彎折段的一上端區域與一下端區域分別形成一第二上彎折表面以及一第二下彎折表面,所述第二接腳保護層被配置以用於覆蓋所述第二彎折段的所述第二上彎折表面以及所述第二下彎折表面,以使得所述第二導電接腳的所述第二裸露部的所述第二彎折段透過所述第二接腳保護層的保護以避免產生斷裂或者裂痕; 其中,所述第一接腳保護層為一第一後製噴塗層或者一第一後製塗佈層,且所述第二接腳保護層為一第二後製噴塗層或者一第二後製塗佈層。 The package structure of wound capacitors as claimed in item 6, Wherein, the packaging assembly includes a packaging casing configured to accommodate the roll-up assembly and a bottom closure structure disposed inside the packaging casing and cooperating with the packaging casing, And the packaging component is completely covered by the packaging shell and the bottom closing structure; Wherein, the bottom seat plate has a first through hole and a second through hole, and the first through hole and the second conductive pin of the bottom seat plate pass through respectively. The second through hole, and a first end portion of the first pin protection layer and a second end portion of the second pin protection layer are respectively arranged in the first through hole and the bottom seat plate the interior of the second perforation; Wherein, when the first exposed portion of the first conductive pin is bent to form a first bent section and a first extension section connected to the first bent section, the first An upper end region and a lower end region of the first bent section of the first exposed portion of the conductive pin respectively form a first upper bent surface and a first lower bent surface, and the first pin The protection layer is configured to cover the first upper bending surface and the first lower bending surface of the first bending section, so that the first exposed portion of the first conductive pin The first bending section is protected by the protection layer of the first pin to avoid breakage or cracks; Wherein, when the second exposed portion of the second conductive pin is bent to form a second bent section and a second extension section connected to the second bent section, the second An upper end region and a lower end region of the second bent section of the second exposed portion of the conductive pin respectively form a second upper bent surface and a second lower bent surface, and the second pin The protection layer is configured to cover the second upper bending surface and the second lower bending surface of the second bending section, so that the second exposed portion of the second conductive pin The second bent section of the second pin is protected by the protective layer of the second pin to avoid breakage or cracks; Wherein, the first pin protection layer is a first post-production spray coating or a first post-production coating layer, and the second pin protection layer is a second post-production spray coating or a second post-production coating Make the coating layer. 如請求項6所述的捲繞型電容器封裝結構, 其中,所述封裝組件包括被配置以用於收容所述捲繞式組件的一封裝殼體以及設置在所述封裝殼體的內部且與所述封裝殼體相互配合的一底端封閉結構,且所述封裝組件被所述封裝殼體以及所述底端封閉結構所完全包覆; 其中,所述底部座板具有一第一穿孔以及一第二穿孔,所述第一導電接腳以及所述第二導電接腳分別穿過的所述底部座板的所述第一穿孔以及所述第二穿孔,且所述第一接腳保護層的一第一末端部以及所述第二接腳保護層的一第二末端部分別設置在所述底部座板的所述第一穿孔以及所述第二穿孔的內部; 其中,當所述第一導電接腳的所述第一裸露部尚未被彎折而定義為一第一預備彎折段以及連接於所述第一預備彎折段的一第一延伸段時,所述第一接腳保護層被配置以用於圍繞且覆蓋所述第一導電接腳的所述第一裸露部的所述第一預備彎折段,以使得所述第一導電接腳的所述第一裸露部的所述第一預備彎折段透過所述第一接腳保護層而得到保護; 其中,當所述第二導電接腳的所述第二裸露部尚未被彎折而定義為一第二預備彎折段以及連接於所述第二預備彎折段的一第二延伸段時,所述第二接腳保護層被配置以用於圍繞且覆蓋所述第二導電接腳的所述第二裸露部的所述第二預備彎折段,以使得所述第二導電接腳的所述第二裸露部的所述第二預備彎折段透過所述第二接腳保護層而得到保護; 其中,所述第一接腳保護層為一第一後製噴塗層、一第一後製塗佈層、一第一預製貼附層或者一第一可拆卸耐熱彈性套件,且所述第二接腳保護層為一第二後製噴塗層、一第二後製塗佈層、一第二預製貼附層或者一第二可拆卸耐熱彈性套件; 其中,所述第一接腳保護層具有用於部分地裸露所述第一裸露部的所述第一預備彎折段的一第一開口,且所述第二接腳保護層具有用於部分地裸露所述第二裸露部的所述第二預備彎折段的一第二開口。 The package structure of wound capacitors as claimed in item 6, Wherein, the packaging assembly includes a packaging casing configured to accommodate the roll-up assembly and a bottom closure structure disposed inside the packaging casing and cooperating with the packaging casing, And the packaging component is completely covered by the packaging shell and the bottom closing structure; Wherein, the bottom seat plate has a first through hole and a second through hole, and the first through hole and the second conductive pin of the bottom seat plate pass through respectively. The second through hole, and a first end portion of the first pin protection layer and a second end portion of the second pin protection layer are respectively arranged in the first through hole and the bottom seat plate the interior of the second perforation; Wherein, when the first exposed portion of the first conductive pin has not been bent to define a first preliminary bending section and a first extension section connected to the first preliminary bending section, The first pin protection layer is configured to surround and cover the first pre-bending section of the first exposed portion of the first conductive pin, so that the first conductive pin The first pre-bending section of the first exposed portion is protected through the first pin protection layer; Wherein, when the second exposed portion of the second conductive pin has not been bent and is defined as a second preliminary bending section and a second extension section connected to the second preliminary bending section, The second pin protection layer is configured to surround and cover the second preparatory bending section of the second exposed portion of the second conductive pin, so that the second conductive pin The second preliminary bending section of the second exposed portion is protected through the second pin protection layer; Wherein, the first pin protection layer is a first post-production spraying layer, a first post-production coating layer, a first prefabricated attachment layer or a first detachable heat-resistant elastic sleeve, and the second The pin protection layer is a second post-production spraying layer, a second post-production coating layer, a second prefabricated adhesive layer or a second detachable heat-resistant elastic sleeve; Wherein, the first pin protection layer has a first opening for partially exposing the first preliminary bending section of the first bare part, and the second pin protection layer has a first opening for partially exposing A second opening of the second preliminary bending section of the second exposed portion is exposed. 如請求項6所述的捲繞型電容器封裝結構, 其中,所述封裝組件包括被配置以用於收容所述捲繞式組件的一封裝殼體以及設置在所述封裝殼體的內部且與所述封裝殼體相互配合的一底端封閉結構,且所述封裝組件被所述封裝殼體以及所述底端封閉結構所完全包覆; 其中,所述底部座板具有一第一穿孔以及一第二穿孔,所述第一導電接腳以及所述第二導電接腳分別穿過的所述底部座板的所述第一穿孔以及所述第二穿孔,且所述第一接腳保護層的一第一末端部以及所述第二接腳保護層的一第二末端部分別設置在所述底部座板的所述第一穿孔以及所述第二穿孔的內部; 其中,所述第一接腳保護層為一第一不可拆卸耐熱彈性層或者一第一可拆卸耐熱彈性套件,且所述第二接腳保護層為第二不可拆卸耐熱彈性層或者一第二可拆卸耐熱彈性套件; 其中,所述第一接腳保護層具有用於部分地裸露所述第一裸露部的一第一開口,且所述第二接腳保護層具有用於部分地裸露所述第二裸露部的一第二開口。 The package structure of wound capacitors as claimed in item 6, Wherein, the packaging assembly includes a packaging casing configured to accommodate the roll-up assembly and a bottom closure structure disposed inside the packaging casing and cooperating with the packaging casing, And the packaging component is completely covered by the packaging shell and the bottom closing structure; Wherein, the bottom seat plate has a first through hole and a second through hole, and the first through hole and the second conductive pin of the bottom seat plate pass through respectively. The second through hole, and a first end portion of the first pin protection layer and a second end portion of the second pin protection layer are respectively arranged in the first through hole and the bottom seat plate the interior of the second perforation; Wherein, the first pin protection layer is a first non-detachable heat-resistant elastic layer or a first detachable heat-resistant elastic sleeve, and the second pin protection layer is a second non-detachable heat-resistant elastic layer or a second Removable heat-resistant elastic kit; Wherein, the first pin protection layer has a first opening for partially exposing the first exposed portion, and the second pin protection layer has a first opening for partially exposing the second exposed portion. A second opening.
TW111212266U 2022-11-09 2022-11-09 Winding-type capacitor package structure TWM637790U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI826264B (en) * 2023-02-17 2023-12-11 鈺邦科技股份有限公司 Wound capacitor package structure and sealing component thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI826264B (en) * 2023-02-17 2023-12-11 鈺邦科技股份有限公司 Wound capacitor package structure and sealing component thereof

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