TWM637177U - Heat dissipation structure of printed circuit board - Google Patents

Abstract

A heat dissipation structure of a printed circuit board includes a plurality of heat dissipation layers, and the heat dissipation layers are layered and stacked from bottom to top, and are respectively used to contact a plurality of electronic components of a printed circuit board. Thereby, the heat dissipation structure of this creation can dissipate heat one by one to the electronic components of the printed circuit board through the heat dissipation layers stacked from bottom to top, thus having the following effects: First, it greatly improves the heat dissipation of this creation. The heat dissipation area of the heat dissipation structure has a good heat dissipation effect; secondly, the heat dissipation effect of the electronic components on the printed circuit board is greatly improved, and the low heat-resistant electronic components will not be damaged by exceeding the heat-resistant temperature.

Description

Heat dissipation structure of printed circuit board

The invention relates to a heat dissipation structure, in particular to a heat dissipation structure of a printed circuit board.

The heat sources of printed circuit boards include electronic components, substrates, and other parts. Among the above three heat sources, electronic components generate the highest heat, so the main heat source of printed circuit boards is electronic components. Conventional heat dissipation structures can dissipate heat from the electronic components of the printed circuit board.

However, the known heat dissipation structure is a single-layer sheet structure, and its inner side is in contact with a plurality of electronic components of the printed circuit board at the same time, thus causing the following problems: First, the heat dissipation area of the known heat dissipation structure is relatively insufficient, and the heat dissipation The effect is poor; second, affected by factors such as the different heat resistance of each electronic component of the printed circuit board and the different heat generation, the known heat dissipation structure has a limited effect on the heat dissipation of these electronic components of the printed circuit board, and the low heat resistance Electronic components are even easily damaged by exceeding the heat-resistant temperature.

The main purpose of this creation is to provide a heat dissipation structure for a printed circuit board, which can dissipate heat one by one for a plurality of electronic components of the printed circuit board.

In order to achieve the aforementioned purpose, the invention provides a heat dissipation structure of a printed circuit board, including a plurality of heat dissipation layers stacked from bottom to top, and respectively used to contact a plurality of electronic components of a printed circuit board.

In some embodiments, each of the heat dissipation layers includes a body and a bump, and the bump is disposed on the bottom surface of the body; wherein, the bodies of the heat dissipation layers are stacked from bottom to top, and the heat dissipation layers The bumps are respectively used to contact the electronic components of the printed circuit board.

In some embodiments, each of the heat dissipation layers further includes a heat pipe, the heat pipe includes a heat release end and a heat absorption end, the heat release end is disposed on the body, and the heat absorption end is connected to the bump.

In some embodiments, the heat sink is inserted into a socket of the protrusion.

In some embodiments, the insertion hole is located close to the bottom surface of the bump, so that the heat-absorbing end is close to the bottom surface of the bump.

In some embodiments, the heat release end is disposed on the bottom surface of the body.

In some embodiments, the heat absorbing end of the heat pipe of the upper heat dissipation layer passes through a through hole of the body of the lower heat dissipation layer.

In some embodiments, each of the heat dissipation layers further includes a temperature chamber, and the temperature chamber is disposed on the body.

In some embodiments, the temperature chamber is disposed on the bottom surface of the body.

In some embodiments, a heat dissipation space is formed between two bodies of two adjacent heat dissipation layers.

In some embodiments, each of the heat dissipation layers further includes two support portions, and the support portions are disposed on the bottom surface of the body; wherein, the support portions of the heat dissipation layer on the upper layer are against the heat dissipation layer on the lower layer. The main body makes the heat dissipation space formed between the two bodies of the two adjacent heat dissipation layers.

In some embodiments, the body of each heat dissipation layer defines at least one heat dissipation hole, and the at least one heat dissipation hole communicates with the heat dissipation space.

In some embodiments, the protrusion of the upper heat dissipation layer passes through a through hole of the body of the lower heat dissipation layer.

The effect of this creation is that the heat dissipation structure of this creation can dissipate heat one by one to the electronic components of the printed circuit board through the heat dissipation layers stacked from bottom to top, so it has the following effects: first, greatly The heat dissipation area of the heat dissipation structure of this creation is increased, and the heat dissipation effect is good; secondly, the heat dissipation effect on the electronic components of the printed circuit board is greatly improved, and the low heat-resistant electronic components will not be damaged by exceeding the heat-resistant temperature.

The implementation of this creation will be described in more detail below in conjunction with the drawings and component symbols, so that those who are familiar with the art can implement it after studying this manual.

Fig. 1 is a perspective view of the heat dissipation structure of this creation, Fig. 2 is an exploded view of the heat dissipation structure of this creation, Fig. 3 is a perspective view of the lower heat dissipation layer 10 of this creation, and Fig. 4 is a perspective view of the middle heat dissipation layer 20 of this creation, Fig. 5 is a perspective view of the upper heat dissipation layer 30 of this creation, FIG. 6 is a cross-sectional view of line VI-VI in FIG. 1 , and FIG. 7 is a cross-sectional view of line VII-VII in FIG. 1 . As shown in FIGS. 1 to 7 , the invention provides a heat dissipation structure of a printed circuit board, including a plurality of heat dissipation layers 10 , 20 , 30 , and the heat dissipation layers 10 , 20 , 30 are stacked from bottom to top.

FIG. 8 is a perspective view of the heat dissipation structure of the present invention installed on the housing 100, FIG. 9 is a cross-sectional view of line IX-IX in FIG. 8, and FIG. 10 is a cross-sectional view of line X-X in FIG. As shown in Fig. 8, Fig. 9 and Fig. 10, the heat dissipation structure of the present invention is installed on a casing 100, and the printed circuit board 110 is arranged inside the casing 100, and these heat dissipation layers 10, 20, 30 respectively contact the printed circuit board 110 The plurality of electronic components 1101 , 1102 , 1103 , the heat dissipation layers 10 , 20 , 30 respectively absorb heat from the electronic components 1101 , 1102 , 1103 of the printed circuit board 110 . Thereby, the heat dissipation structure of the present invention can achieve a one-to-one heat dissipation effect on the electronic components 1101 , 1102 , 1103 of the printed circuit board 110 through the heat dissipation layers 10 , 20 , 30 .

The quantity of the heat dissipation layers 10 , 20 , 30 is related to the quantity of the electronic components 1101 , 1102 , 1103 of the printed circuit board 110 .

For example, as shown in FIG. 8 , FIG. 9 and FIG. 10 , the number of electronic components 1101 of the printed circuit board 110 is one, the number of electronic components 1102 of the printed circuit board 110 is one, and the number of electronic components 1103 of the printed circuit board 110 is one. The number of the electronic components 1101 , 1102 , 1103 on the printed circuit board 110 is three. Therefore, as shown in Figures 1 to 7, in a preferred embodiment, the number of these heat dissipation layers 10, 20, 30 is three and is respectively defined as a lower heat dissipation layer 10, a middle heat dissipation layer 20 and an upper heat dissipation layer The layer 30, the lower heat dissipation layer 10, the middle heat dissipation layer 20 and the upper heat dissipation layer 30 are stacked in layers from bottom to top. In other words, the lower heat dissipation layer 10 is located in the lowermost layer, the middle heat dissipation layer 20 is located in the middle layer, and the upper heat dissipation layer 30 is located in the uppermost layer. As shown in Figures 8, 9 and 10, the lower heat dissipation layer 10 is used to contact the electronic components 1101 of the printed circuit board 110, the middle heat dissipation layer 20 is used to contact the electronic components 1102 of the printed circuit board 110, and the upper heat dissipation layer 30 is used to contact the electronic components 1101 of the printed circuit board 110. The electronic component 1103 contacts the printed circuit board 110 . The lower heat dissipation layer 10 absorbs the heat of the electronic components 1101 of the printed circuit board 110 , the middle heat dissipation layer 20 absorbs the heat of the electronic components 1102 of the printed circuit board 110 , and the upper heat dissipation layer 30 absorbs the heat of the electronic components 1103 of the printed circuit board 110 . The heat of the lower heat dissipation layer 10 is transferred to the middle heat dissipation layer 20 , the heat of the middle heat dissipation layer 20 is transferred to the upper heat dissipation layer 30 , and the heat of the upper heat dissipation layer 30 is taken away by external air. In this way, the heat dissipation structure of the present invention can achieve a one-to-one heat dissipation effect on the electronic components 1101 , 1102 , 1103 of the printed circuit board 110 through the lower heat dissipation layer 10 , the middle heat dissipation layer 20 and the upper heat dissipation layer 30 .

For example, the number of electronic components 1101 of the printed circuit board 110 is one, the number of electronic components 1102 of the printed circuit board 110 is zero, and the number of electronic components 1103 of the printed circuit board 110 is one, so the number of electronic components 1103 of the printed circuit board 110 is one. The total number of these electronic components 1101, 1103 is two. Therefore, in some embodiments, the number of these heat dissipation layers 10, 30 is two and are respectively defined as a lower heat dissipation layer 10 and an upper heat dissipation layer 30, and the lower heat dissipation layer 10 and the upper heat dissipation layer 30 are layered from bottom to top. stack. In other words, the lower heat dissipation layer 10 is located at the lowermost layer, and the upper heat dissipation layer 30 is located at the uppermost layer. The lower heat dissipation layer 10 is used to contact the electronic components 1101 of the printed circuit board 110 , and the upper heat dissipation layer 30 is used to contact the electronic components 1103 of the printed circuit board 110 . The lower heat dissipation layer 10 absorbs the heat of the electronic components 1101 of the printed circuit board 110 , and the upper heat dissipation layer 30 absorbs the heat of the electronic components 1103 of the printed circuit board 110 . The heat of the lower heat dissipation layer 10 is transferred to the upper heat dissipation layer 30 , and the heat of the upper heat dissipation layer 30 is taken away by the external air. In this way, the heat dissipation structure of the present invention can achieve a one-to-one heat dissipation effect on the electronic components 1101 , 1103 of the printed circuit board 110 through the lower heat dissipation layer 10 and the upper heat dissipation layer 30 .

For example, the number of electronic components 1101 of the printed circuit board 110 is one, the number of electronic components 1102 of the printed circuit board 110 exceeds two, and the number of electronic components 1103 of the printed circuit board 110 is one, so the number of electronic components 1103 of the printed circuit board 110 The overall number of the electronic components 1101, 1102, 1103 is more than three. Therefore, in some embodiments, the number of these heat dissipation layers 10, 20, 30 is more than three and are respectively defined as a lower heat dissipation layer 10, a plurality of middle heat dissipation layers 20 and an upper heat dissipation layer 30, the lower heat dissipation layer 10, the The middle heat dissipation layer 20 and the upper heat dissipation layer 30 are stacked in layers from bottom to top. In other words, the lower heat dissipation layer 10 is located at the bottom layer, the middle heat dissipation layers 20 are located at the middle layer, and the upper heat dissipation layer 30 is located at the uppermost layer. The lower heat dissipation layer 10 is used to contact the electronic components 1101 of the printed circuit board 110, the middle heat dissipation layers 20 are used to contact the electronic components 1102 of the printed circuit board 110, and the upper heat dissipation layer 30 is used to contact the electronic components of the printed circuit board 110 1103. The lower heat dissipation layer 10 absorbs the heat of the electronic components 1101 of the printed circuit board 110, the middle heat dissipation layers 20 absorb the heat of the electronic components 1102 of the printed circuit board 110, and the upper heat dissipation layer 30 absorbs the heat of the electronic components 1103 of the printed circuit board 110. heat. The heat of the lower heat dissipation layer 10 is transferred to the middle heat dissipation layers 20 , the heat of the middle heat dissipation layers 20 is transferred to the upper heat dissipation layer 30 , and the heat of the upper heat dissipation layer 30 is taken away by the external air. Thereby, the heat dissipation structure of the present invention can achieve one-to-one heat dissipation effect on the electronic components 1101 , 1102 , 1103 of the printed circuit board 110 through the lower heat dissipation layer 10 , the middle heat dissipation layers 20 and the upper heat dissipation layer 30 .

As shown in FIG. 3 , in a preferred embodiment, the lower heat dissipation layer 10 includes a body 11 and a bump 12 , and the bump 12 of the lower heat dissipation layer 10 is disposed on the bottom surface of the body 11 of the lower heat dissipation layer 10 . As shown in FIG. 4 , in a preferred embodiment, the middle heat dissipation layer 20 includes a body 21 and a bump 22 , and the bump 22 of the middle heat dissipation layer 20 is disposed on the bottom surface of the body 21 of the middle heat dissipation layer 20 . As shown in FIG. 5 , in a preferred embodiment, the upper heat dissipation layer 30 includes a body 31 and a bump 32 , and the bump 32 of the upper heat dissipation layer 30 is disposed on the bottom surface of the body 31 of the upper heat dissipation layer 30 . As shown in FIG. 1 , FIG. 2 , FIG. 6 and FIG. 7 , the body 11 of the lower heat dissipation layer 10 , the body 21 of the middle heat dissipation layer 20 and the body 31 of the upper heat dissipation layer 30 are stacked in layers from bottom to top. As shown in Figures 9 and 10, the bumps 12 of the lower heat dissipation layer 10 are used to contact the electronic components 1101 of the printed circuit board 110, the bumps 22 of the middle heat dissipation layer 20 are used to contact the electronic components 1102 of the printed circuit board 110, and the upper The bumps 32 of the heat dissipation layer 30 are used to contact the electronic components 1103 of the printed circuit board 110 . The bump 12 of the lower heat dissipation layer 10 absorbs the heat of the electronic component 1101 of the printed circuit board 110 and transfers it to the body 11 of the lower heat dissipation layer 10, and the bump 22 of the middle heat dissipation layer 20 absorbs the heat of the electronic component 1102 of the printed circuit board 110 and The heat is transferred to the body 21 of the middle heat dissipation layer 20 , and the bumps 32 of the upper heat dissipation layer 30 absorb the heat of the electronic components 1103 of the printed circuit board 110 and transfer it to the body 31 of the upper heat dissipation layer 30 . The body 11 of the lower heat dissipation layer 10 transfers heat to the body 21 of the middle heat dissipation layer 20, the body 21 of the middle heat dissipation layer 20 transfers heat to the body 31 of the upper heat dissipation layer 30, and the outside air takes away the heat of the body 31 of the upper heat dissipation layer 30. heat. In this way, the heat dissipation structure of the present invention can achieve a one-to-one heat dissipation effect on the electronic components 1101 , 1102 , 1103 of the printed circuit board 110 through the lower heat dissipation layer 10 , the middle heat dissipation layer 20 and the upper heat dissipation layer 30 .

As shown in Figures 2 to 7, in a preferred embodiment, the bump 22 of the middle heat dissipation layer 20 passes through a through hole 111 of the body 11 of the lower heat dissipation layer 10, and the bump 32 of the upper heat dissipation layer 30 passes through the middle heat dissipation layer. A through hole 211 of the body 21 of the layer 20 and another through hole 112 of the body 11 of the lower heat dissipation layer 10 . As shown in Figures 9 and 10, the bumps 12 of the lower heat dissipation layer 10 are used to directly contact the electronic components 1101 of the printed circuit board 110, and the bumps 22 of the middle heat dissipation layer 20 are used to directly contact the electronic components 1102 of the printed circuit board 110. , the bumps 32 of the upper heat dissipation layer 30 are used to directly contact the electronic components 1103 of the printed circuit board 110 . In this way, the heat dissipation structure of the present invention can achieve a one-to-one heat dissipation effect on the electronic components 1101 , 1102 , 1103 of the printed circuit board 110 through the lower heat dissipation layer 10 , the middle heat dissipation layer 20 and the upper heat dissipation layer 30 .

As shown in Figure 2, Figure 5 and Figure 6, in a preferred embodiment, the upper heat dissipation layer 30 further includes a heat pipe 33 (heat pipe, which can also be called a heat pipe), and the heat pipe 33 includes a heat release end 331 and a The heat absorbing end 332 and the heat releasing end 331 are disposed on the body 31 of the upper heat dissipation layer 30 , and the heat absorbing end 332 is connected to the bump 32 of the upper heat dissipation layer 30 . As shown in Figure 9 and Figure 10, there are two heat dissipation paths of the upper heat dissipation layer 30; the first heat dissipation path is that the bump 32 of the upper heat dissipation layer 30 is directly transmitted to the body 31 of the upper heat dissipation layer 30; the second heat dissipation path The path is that the heat absorbing end 332 absorbs the heat of the bump 32 of the upper heat dissipation layer 30, the heat absorbing end 332 transfers the heat to the heat releasing end 331, and the heat releasing end 331 transfers the heat to the body 31 of the upper heat dissipation layer 30; finally, the external air takes away The heat of the body 31 of the upper heat dissipation layer 30 . Thereby, the upper heat dissipation layer 30 can enhance the one-to-one heat dissipation effect of the electronic components 1103 of the printed circuit board 110 through the above two heat dissipation paths.

It should be noted that the inside of the heat pipe 33 is a closed cavity (not shown in the figure), and the closed cavity contains a working fluid (not shown in the figure). After the heat-absorbing end 332 absorbs the heat of the bump 32 of the upper heat dissipation layer 30, the liquid-phase working fluid at the heat-absorbing end 332 is vaporized into a gas-phase working fluid. A local high pressure is generated inside to drive the working fluid in the gas phase to flow to the heat release end 331 at a high speed. When the gas-phase working fluid contacts the cooler heat release end 331 , the gas-phase working fluid will condense into a liquid-phase working fluid, and the heat accumulated during vaporization will be released through the phenomenon of condensation. The condensed liquid-phase working fluid will flow back to the heat-absorbing end 332 by capillary phenomenon. The above-mentioned operation mode will be repeated inside the heat pipe 33 . In short, the continuous liquid-gas two-phase change of the working fluid inside the heat pipe 33 and the gas-liquid convection between the gas-liquid fluid between the heat-absorbing end 332 and the heat-discharging end 331 make the outer surface of the heat pipe 33 appear The characteristics of rapid temperature uniformity can achieve the purpose of heat transfer.

As shown in FIG. 2 , FIG. 5 , FIG. 6 and FIG. 7 , in a preferred embodiment, the heat sink end 332 is inserted into an insertion hole 321 of the protrusion 32 of the upper heat dissipation layer 30 . Therefore, the heat absorbing end 332 can not only be fixed on the bump 32 of the upper heat dissipation layer 30, but also can increase the contact area between the heat absorbing end 332 and the bump 32 of the upper heat dissipation layer 30, so that the heat absorbing end 332 can absorb the bump 32 of the upper heat dissipation layer 30. The effect of the heat, so that the heat of the bump 32 of the upper heat dissipation layer 30 can be transmitted to the body 31 of the upper heat dissipation layer 30 through the heat pipe 33 more quickly, and the effect of one-to-one heat dissipation on the electronic components 1103 of the printed circuit board 110 is improved. .

As shown in Figure 2, Figure 5, Figure 6 and Figure 7, in a preferred embodiment, the position of the jack 321 is close to the bottom surface of the bump 32 of the upper heat dissipation layer 30, so that the heat absorption end 332 is close to the protrusion of the upper heat dissipation layer 30. The bottom surface of block 32. More specifically, as shown in FIG. 9 and FIG. 10, the position of the heat-absorbing end 332 is the position where the bump 32 of the upper heat dissipation layer 30 is closest to the electronic component 1103 of the printed circuit board 110, and is also the position of the bump 32 of the upper heat dissipation layer 30. The hottest position enables the heat of the bump 32 of the upper heat dissipation layer 30 to be transferred to the body 31 of the upper heat dissipation layer 30 through the heat pipe 33 more quickly, thereby improving the effect of one-to-one heat dissipation on the electronic components 1103 of the printed circuit board 110 .

As shown in FIGS. 2 to 6 , in a preferred embodiment, the heat sink 332 passes through a through hole 212 of the body 21 of the middle heat dissipation layer 20 and a through hole 113 of the body 11 of the lower heat dissipation layer 10 . Thereby, the heat absorbing end 332 can extend through the middle heat dissipation layer 20 and the lower heat dissipation layer 10 in the shortest path, thereby improving the heat transfer effect of the heat pipe 33 .

In some embodiments, the lower heat dissipation layer 10 may also include a heat pipe 33 , and the middle heat dissipation layer 20 may also include a heat pipe 33 to improve the one-to-one heat dissipation effect of the two electronic components 1101 and 1102 of the printed circuit board 110 .

As shown in FIG. 2 , FIG. 5 and FIG. 7 , in a preferred embodiment, the upper heat dissipation layer 30 further includes a vapor chamber 34 disposed on the body 31 of the upper heat dissipation layer 30 . As shown in FIG. 9 , the vapor chamber 34 can absorb the heat of the body 31 of the upper heat dissipation layer 30 , and the external air takes away the heat of the vapor chamber 34 to improve the effect of one-to-one heat dissipation on the electronic components 1103 of the printed circuit board 110 .

It should be noted that the inside of the chamber 34 is a closed cavity (not shown), the closed cavity contains a working fluid (not shown), and the inner wall of the chamber 34 has a microstructure (not shown). After one side of the vapor chamber 34 absorbs heat from the body 31 of the upper heat dissipation layer 30, the liquid-phase working fluid near the side of the vapor chamber 34 is vaporized into a gas-phase working fluid. At this time, the gas-phase working fluid absorbs heat and the volume Rapid expansion causes local high pressure to be generated inside the vapor chamber 34 , so as to drive the gas-phase working fluid to quickly fill the entire interior of the vapor chamber 34 . When the gas-phase working fluid contacts the cooler area on the other side of the vapor chamber 34 , the gas-phase working fluid will condense into a liquid-phase working fluid, and the heat accumulated during vaporization will be released through condensation. The condensed liquid-phase working fluid will flow back to one side of the vapor chamber 34 through the capillary phenomenon of the microstructure. The above-mentioned operation mode will be carried out repeatedly in the inside of the temperature chamber 34 . In short, the continuous liquid-gas two-phase change of the working fluid inside the uniform temperature plate 34, and the convection of the gas-liquid fluid between one side and the other side of the uniform temperature plate 34 from gas to liquid, make the uniform temperature The outer surface of the plate 34 exhibits the characteristics of rapid temperature uniformity to achieve the purpose of heat transfer.

As shown in FIG. 2 , FIG. 5 and FIG. 7 , in a preferred embodiment, the temperature chamber 34 is disposed on the bottom surface of the body 31 of the upper heat dissipation layer 30 . In this way, the heat of the body 31 of the upper heat dissipation layer 30 can be taken away by the outside air more quickly through the vapor chamber 34 , thereby improving the effect of one-to-one heat dissipation on the electronic components 1103 of the printed circuit board 110 .

In some embodiments, the lower heat dissipation layer 10 may also include a temperature equalization plate 34, and the middle heat dissipation layer 20 may also include a temperature equalization plate 34, so as to improve the one-to-one heat dissipation effect of the two electronic components 1101, 1102 of the printed circuit board 110. Effect.

As shown in FIG. 1 , FIG. 2 , FIG. 4 , FIG. 6 and FIG. 7 , in a preferred embodiment, a first heat dissipation space 40 is formed between the body 11 of the lower heat dissipation layer 10 and the body 21 of the middle heat dissipation layer 20 . Specifically, the middle heat dissipation layer 20 further includes two support portions 23, the support portions 23 of the middle heat dissipation layer 20 are arranged on the bottom surface of the body 21 of the middle heat dissipation layer 20, and the support portions 23 of the middle heat dissipation layer 20 lean against the lower surface. The body 11 of the heat dissipation layer 10 forms a first heat dissipation space 40 between the body 11 of the lower heat dissipation layer 10 and the body 21 of the middle heat dissipation layer 20 . As shown in FIG. 1 , FIG. 2 , FIG. 5 , FIG. 6 and FIG. 7 , in a preferred embodiment, a second heat dissipation space 41 is formed between the body 21 of the middle heat dissipation layer 20 and the body 31 of the upper heat dissipation layer 30 . Specifically, the upper heat dissipation layer 30 further includes two support portions 35, the support portions 35 of the upper heat dissipation layer 30 are arranged on the bottom surface of the body 31 of the upper heat dissipation layer 30, and the support portions 35 of the upper heat dissipation layer 30 lean against The body 21 of the middle heat dissipation layer 20 forms a second heat dissipation space 41 between the body 21 of the middle heat dissipation layer 20 and the body 31 of the upper heat dissipation layer 30 . As shown in Fig. 8, Fig. 9 and Fig. 10, the external air can pass through the first heat dissipation space 40 and the second heat dissipation space 41 to take away the heat from the lower heat dissipation layer 10, the middle heat dissipation layer 20 and the upper heat dissipation layer 30, thereby improving the heat dissipation effect of the heat dissipation layer. The three electronic components 1101 , 1102 , and 1103 of the printed circuit board 110 have a one-to-one heat dissipation effect.

As shown in Fig. 2, Fig. 4, Fig. 6 and Fig. 7, in a preferred embodiment, the body 21 of the middle heat dissipation layer 20 offers a plurality of heat dissipation holes 213, and the heat dissipation holes 213 of the body 21 of the middle heat dissipation layer 20 simultaneously It communicates with the first heat dissipation space 40 and the second heat dissipation space 41 . As shown in Figure 1, Figure 2 and Figure 5, in a preferred embodiment, the body 31 of the upper heat dissipation layer 30 offers a plurality of heat dissipation holes 311, and the heat dissipation holes 311 of the body 31 of the upper heat dissipation layer 30 are simultaneously connected with the second The heat dissipation space 41 communicates with the external space. Thereby, the heat dissipation holes 213 of the body 21 of the middle heat dissipation layer 20 can increase the heat dissipation area of the body 21 of the middle heat dissipation layer 20, and can also increase the air fluidity of the first heat dissipation space 40. The heat dissipation holes 311 can increase the heat dissipation area of the body 31 of the upper heat dissipation layer 30, increase the air fluidity of the second heat dissipation space 41, and improve the one-to-one heat dissipation of the three electronic components 1101, 1102, 1103 of the printed circuit board 110. Effect.

In some embodiments, the body 11 of the lower heat dissipation layer 10 may also define a plurality of heat dissipation holes, and the heat dissipation holes of the body 11 of the lower heat dissipation layer 10 communicate with the first heat dissipation space 40 . Thereby, the heat dissipation holes of the body 11 of the lower heat dissipation layer 10 can increase the heat dissipation area of the body 11 of the lower heat dissipation layer 10, and can also increase the air fluidity of the first heat dissipation space 40, and improve the three electrons to the printed circuit board 110. The effect of one-to-one heat dissipation of elements 1101, 1102, 1103.

To sum up, the heat dissipation structure of the present invention can dissipate heat one by one to the electronic components 1101, 1102, 1103 of the printed circuit board 110 through the heat dissipation layers 10, 20, 30 stacked from bottom to top. It has the following effects: first, it greatly increases the heat dissipation area of the heat dissipation structure of this creation, and the heat dissipation effect is good; Affected by factors such as different heat generation, the heat dissipation effect on the electronic components 1101, 1102, 1103 of the printed circuit board 110 is greatly improved, and the electronic components 1101, 1102, 1103 with low heat resistance will not exceed the heat resistance temperature and be damaged.

The above-mentioned ones are only used to explain the preferred embodiments of this creation, and are not intended to limit this creation in any form. Therefore, any modifications or changes made to this creation under the same spirit of creation , should still be included in the category of protection intended for this creation.

10: Lower cooling layer 11: Ontology 111,112: through hole 113: perforation 12: Bump 20: Medium heat dissipation layer 21: Ontology 211: through hole 212: perforation 213: cooling hole 22: Bump 23: Support part 30: Upper cooling layer 31: Ontology 311: cooling hole 32: Bump 321: jack 33: heat pipe 331: exothermic end 332: Heat-absorbing end 34: vapor chamber 35: support part 40: The first cooling space 41: Second cooling space 100: shell 110: Printed circuit board 1101, 1102, 1103: electronic components

FIG. 1 is a perspective view of the heat dissipation structure of the invention. Figure 2 is an exploded view of the heat dissipation structure of this creation. FIG. 3 is a perspective view of the lower heat dissipation layer of the invention. FIG. 4 is a perspective view of the middle heat dissipation layer of the invention. FIG. 5 is a perspective view of the upper heat dissipation layer of the invention. FIG. 6 is a cross-sectional view along line VI-VI of FIG. 1 . FIG. 7 is a cross-sectional view along line VII-VII of FIG. 1 . FIG. 8 is a perspective view of the heat dissipation structure of the invention installed on the casing. FIG. 9 is a cross-sectional view taken along line IX-IX of FIG. 8 . Fig. 10 is a cross-sectional view of line X-X in Fig. 8 .

10: Lower cooling layer

20: Medium heat dissipation layer

30: Upper cooling layer

311: cooling hole

40: The first cooling space

41: Second cooling space

Claims (13)

A heat dissipation structure for a printed circuit board, comprising: A plurality of heat dissipation layers are stacked from bottom to top, and are respectively used to contact a plurality of electronic components of a printed circuit board. The heat dissipation structure of the printed circuit board as described in claim 1, wherein each heat dissipation layer includes a body and a bump, and the bump is arranged on the bottom surface of the body; wherein, the bodies of the heat dissipation layers are formed from the bottom Stacking up in layers, the bumps of the heat dissipation layers are respectively used to contact the electronic components of the printed circuit board. The heat dissipation structure of the printed circuit board as described in claim 2, wherein each heat dissipation layer further includes a heat pipe, and the heat pipe includes a heat release end and a heat absorption end, the heat release end is arranged on the body, and the heat absorption end Connect the bump. The heat dissipation structure of the printed circuit board according to claim 3, wherein the heat sink end is inserted into a socket of the bump. The heat dissipation structure of the printed circuit board according to claim 4, wherein the position of the insertion hole is close to the bottom surface of the bump, so that the heat-absorbing end is close to the bottom surface of the bump. The heat dissipation structure of the printed circuit board according to claim 3, wherein the heat radiation end is arranged on the bottom surface of the body. The heat dissipation structure of a printed circuit board as claimed in claim 3, wherein the heat absorbing end of the heat pipe of the upper heat dissipation layer passes through a through hole of the body of the lower heat dissipation layer. The heat dissipation structure of a printed circuit board as claimed in claim 2, wherein each of the heat dissipation layers further includes a temperature chamber, and the temperature chamber is disposed on the body. The heat dissipation structure of the printed circuit board as claimed in claim 8, wherein the temperature chamber is arranged on the bottom surface of the main body. The heat dissipation structure of a printed circuit board according to claim 2, wherein a heat dissipation space is formed between two bodies of two adjacent heat dissipation layers. The heat dissipation structure of the printed circuit board according to claim 10, wherein each heat dissipation layer further includes two support parts, and the support parts are arranged on the bottom surface of the body; wherein, the support parts of the heat dissipation layer on the upper layer The heat dissipation space is formed between the two bodies of the two adjacent heat dissipation layers by abutting against the body of the heat dissipation layer located at the lower layer. The heat dissipation structure of a printed circuit board according to claim 10 or 11, wherein at least one heat dissipation hole is defined in the body of each heat dissipation layer, and the at least one heat dissipation hole communicates with the heat dissipation space. The heat dissipation structure of the printed circuit board as claimed in claim 2, wherein the bump of the heat dissipation layer on the upper layer passes through a through hole of the body of the heat dissipation layer on the lower layer.

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