TWM635405U - Heat exchange liquid-cooling panel device - Google Patents

Abstract

A heat exchange liquid cooling plate device, comprising a plate unit, the plate unit includes a first plate, a second plate welded to the first plate along an installation direction, a plate formed on the first plate and the second plate a fluid groove between them, two collecting grooves respectively connecting two opposite ends of the fluid groove, and two communication holes penetrating through one of the first plate and the second plate and respectively communicating with the collecting grooves, each The average height of the collecting groove along the installation direction is greater than the average height of the fluid groove along the installation direction, so as to achieve the effect of heat dissipation.

Description

Heat exchange liquid cold plate device

The present invention relates to a heat dissipation device, in particular to a heat exchange liquid cold plate device.

A vehicle battery cooling system, as shown in US Patent Publication No. US5937664A, uses the flow of gas to dissipate heat from the battery, but its main disadvantage is that the volume of the air-cooled device is relatively large.

Therefore, the recent technology has changed to a liquid cooling method for cooling, as shown in US Patent No. US8159823B2, which is to machine a heat-conducting material with a flow channel for liquid flow, then close the processing area, and finally pass through the flow channel. into the coolant to dissipate heat. However, the process of mechanical processing is complicated, and the method of sealing the processing area is also prone to failure due to long-term aging.

Therefore, the object of the present invention is to provide a heat exchange liquid cold plate device which overcomes the disadvantages of the prior art.

Therefore, the novel heat exchange liquid cooling plate device includes a plate unit, which includes a first plate, a second plate welded to the first plate along an installation direction, a plate formed on the first plate and the A fluid groove between the second plates, two collecting grooves respectively connecting two opposite ends of the fluid groove, and two communication holes penetrating through one of the first plate and the second plate and respectively communicating with the collecting grooves , the average height of each collecting groove along the installation direction is greater than the average height of the fluid groove along the installation direction.

The effect of the present invention is: by arranging the first plate, the second plate, the fluid groove and each collecting groove whose average height along the installation direction is greater than the average height of the fluid groove along the installation direction, it can To achieve the effect of heat dissipation.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numerals.

Referring to Figures 1, 2 and 3, a first embodiment of the novel heat exchange liquid-cooled plate device includes a plate unit 2, two partition plates 3, a bump 4, and two connecting pipes 5.

2, 3, 4, the plate unit 2 includes a first plate 21, a second plate 22 welded to the first plate 21 along an installation direction Z, a plate formed on the first plate 21 and the second A fluid groove 23 between the plates 22, two collecting grooves 24 respectively connected to two opposite ends of the fluid groove 23, and two through one of the first plate 21 and the second plate 22 and communicate with the collecting grooves respectively The communication hole 25 of the groove 24. In this embodiment, the communication holes 25 penetrate through the first plate 21 . It should be noted that the fluid groove 23 is a flow channel with a single flow direction, and the two opposite ends are the outlet and the inlet of the flow channel, which are respectively connected with the collecting grooves 24 .

Define the average height of the fluid groove 23 along the installation direction Z as a fluid groove height H1, the average height of each collecting groove 24 along the installation direction Z is a collecting groove height H2, and the thickness of the first plate 21 is between Between 0.2 mm and 2 mm, the thickness of the second plate 22 is between 0.2 mm and 2 mm, and the height H2 of the collecting tank is greater than the height H1 of the fluid tank. The first plate 21 and the second plate 22 are made of heat conducting material. In this embodiment, the heat conducting material is made of 3-series aluminum, but it is not limited thereto, and can also be other types of aluminum or steel.

The partition plates 3 are welded between the first plate 21 and the second plate 22 and located in the fluid groove 23 .

The protrusion 4 protrudes from the first plate 21 toward the fluid groove 23 .

The communication pipes 5 are respectively passed through the communication holes 25 .

By welding the first plate 21, the second plate 22 and the communicating pipes 5, and connecting the communicating pipes 5, the fluid groove 23, the collecting grooves 24 and the communicating holes 25 are formed A closed loop. In this embodiment, the fluid groove 23 and the collecting tank 24 are formed by recessing from the first plate 21 toward the direction away from the second plate 22, and the welded surface of the second plate 22 and the first plate 21 As a plane, the section of the fluid slot 23 perpendicular to the installation direction Z is U-shaped, and the partition plates 3 protrude from the first plate 21 corresponding to the fluid slot 23 toward the second plate 22 .

Under the condition that the height H2 of the collecting tank is greater than the height H1 of the fluid tank, the height H1 of the fluid tank is between 1.5 mm and 3.5 mm, and the height H2 of the collecting tank is between 2.0 mm and 4.0 mm.

Preferably, the height H1 of the fluid tank is between 1.5 mm and 2.5 mm, and the height H2 of the collecting tank is between 3.5 and 4.0 mm.

In this embodiment, the thickness of the first plate 21 is 1 mm, and the thickness of the second plate 22 is 1 mm.

It should be noted that the above-mentioned average height along the installation direction Z is a fixed value in different embodiments. For example, in this embodiment, the height H1 of the fluid tank is 2 mm, and the height H2 of the collecting tank is 4mm. Therefore, the condition that the height H2 of the collecting tank is not greater than the height H1 of the fluid tank is not within the scope of this application.

When in use, at least one of the first plate 21 or the second plate 22 is attached to a heat-dissipating object (not shown) such as a battery, and then one of the connecting pipes 5 is used as an input pipe to input cooling liquid, and the other of these communication pipes 5 is used as an output pipe to output the cooling liquid, and the cooling liquid will sequentially pass through the communication of the corresponding input pipe along the flow direction shown by the arrow in Figure 3 The pipe 5, the adjacent collecting tank 24, the fluid tank 23, another collecting tank 24 and the connecting pipe 5 corresponding to the output pipe are discharged, so as to absorb the heat of the object to be radiated and achieve circulation for heat dissipation Effect.

It should be noted that the arrangement of the partition plates 3 can achieve the effect of strengthening the structural strength between the first plate 21 and the second plate 22, and the arrangement of the protrusions 4 can make the cooling liquid flow through it to generate turbulence. , thereby increasing the cooling efficiency.

Since the first plate 21 and the second plate 22 are welded in an integrated furnace welding manner, the overall pressure resistance and heat conduction efficiency can be improved, and the problem of aging and failure can be avoided. At the same time, the production process is simple and the overall weight and volume Advantages of simplicity.

It should be noted that the fluid groove 23 can be designed as a meandering circuit, so that the fluid is evenly distributed on the entire plane, so as to provide a temperature uniform effect and achieve a better heat dissipation effect.

Referring to Fig. 5,6,7, a second embodiment of the present invention is similar to this first embodiment, and its difference is:

This second embodiment includes a plurality of bumps 4 . Here, eleven bumps 4 are taken as an example for illustration.

6, 7, 8, the fluid groove 23 and the collecting tank 24 are formed by recessing from the second plate 22 toward the direction away from the first plate 21, and the first plate 21 and the second plate 22 are welded The surface is plane, the number of the partition plates 3 is five, and protrudes from the second plate 22 corresponding to the fluid groove 23 toward the first plate 21 .

The protrusions 4 protrude from the second plate 22 toward the fluid slot 23 .

In this embodiment, the thickness of the first plate 21 is 2 mm, and the thickness of the second plate 22 is 2 mm. The fluid groove height H1 is 2 mm, and the header height H2 is 4 mm.

When in use, the cooling liquid will flow along the flow direction indicated by the arrow in FIG. 6 to dissipate heat.

In this way, the second embodiment can also achieve the same purpose and effect as the above-mentioned first embodiment.

Referring to Fig. 9,10,11, a third embodiment of the present invention is similar to this second embodiment, and its difference is:

The third embodiment includes a plurality of partition plates 3 and a plurality of protrusions 4 . The number and positions of the partition plates 3 and the bumps 4 are different from those of the second embodiment.

Referring to FIGS. 10 , 11 , and 12 , the partition plates 3 protrude from the second plate 22 corresponding to the fluid groove 23 toward the first plate 21 . The protrusions 4 protrude from the second plate 22 toward the fluid slot 23 .

In this embodiment, the thickness of the first plate 21 is 1 mm, and the thickness of the second plate 22 is 1 mm. The fluid groove height H1 is 2 mm, and the header height H2 is 4 mm.

In use, the cooling liquid will flow along the flow direction indicated by the arrow in FIG. 10 to dissipate heat.

In this way, the third embodiment can also achieve the same purpose and effect as the above-mentioned second embodiment.

To sum up, by arranging the first plate 21, the second plate 22, the fluid groove 23 and each set whose average height along the installation direction Z is greater than the average height of the fluid groove 23 along the installation direction Z Launder 24, and can reach the effect of carrying out heat dissipation, so can really reach the purpose of this novelty.

But the above-mentioned person is only the embodiment of the present invention, and should not limit the scope of implementation of the present invention with this, and all simple equivalent changes and modifications made according to the patent scope of the present application and the content of the patent specification are still within the scope of the present invention. Within the scope covered by this patent.

2: Plate unit 21: First plate 22: Second plate 23: Fluid tank 24: collecting tank 25: Connecting hole 3: Divider board 4: Bump 5: connecting pipe H1: Fluid tank height H2: Height of collecting tank Z: installation direction

Other features and effects of the present invention will be clearly presented in the implementation manner with reference to the drawings, wherein: Fig. 1 is a three-dimensional assembled view of a first embodiment of the novel heat exchange liquid cold plate device; Fig. 2 is a three-dimensional exploded view of the first embodiment; Fig. 3 is a three-dimensional exploded view of the first embodiment at another viewing angle; Fig. 4 is an incomplete sectional schematic diagram obtained along line IV-IV in Fig. 1; Fig. 5 is a three-dimensional assembled view of a second embodiment of the novel heat exchange liquid cooling plate device; Fig. 6 is a three-dimensional exploded view of the second embodiment; Fig. 7 is a three-dimensional exploded view of the second embodiment at another viewing angle; Fig. 8 is an incomplete sectional schematic view obtained along the line VIII-VIII in Fig. 5; Fig. 9 is a three-dimensional assembled view of a third embodiment of the novel heat exchange liquid cooling plate device; Fig. 10 is a three-dimensional exploded view of the third embodiment; Fig. 11 is a three-dimensional exploded view of the third embodiment at another viewing angle; and FIG. 12 is an incomplete cross-sectional schematic view taken along the line XII-XII in FIG. 9 .

21: First plate

22: Second plate

23: Fluid tank

24: collecting tank

25: Connecting hole

3: Divider board

4: Bump

5: connecting pipe

Z: installation direction

Claims (9)

A heat exchange liquid cold plate device, comprising: A plate unit, including a first plate, a second plate welded to the first plate along an installation direction, a fluid groove formed between the first plate and the second plate, two fluid grooves connected respectively The collecting grooves at the two opposite ends, and two communication holes that penetrate through one of the first plate and the second plate and respectively communicate with the collecting grooves, the average height of each collecting groove along the installation direction is greater than the The average height of the fluid bath along this mounting direction. The heat exchange liquid cold plate device according to claim 1, wherein the average height of the fluid tank along the installation direction is between 1.5 mm and 3.5 mm. The heat exchange liquid cold plate device as claimed in claim 1, wherein the average height of the collecting tank along the installation direction is between 2.0 mm and 4.0 mm. The heat exchange liquid cold plate device as described in claim 1, wherein, the average height of the fluid tank along the installation direction is between 1.5 mm and 2.5 mm, and the average height of the header tank along the installation direction is between 3.5 mm and 2.5 mm. Between 4.0mm. The heat exchange liquid cooling plate device according to claim 1 further comprises at least one partition plate welded between the first plate and the second plate and located in the fluid tank. The heat exchange liquid cooling plate device according to claim 1 further comprises at least one protrusion protruding from at least one of the first plate and the second plate toward the fluid groove. The heat exchange liquid cold plate device according to claim 1, further comprising two communication pipes, and the communication pipes are respectively passed through the communication holes. The heat exchange liquid cooling plate device as claimed in claim 1, wherein the first plate and the second plate are made of thermally conductive materials. The heat exchange liquid-cooled plate device according to claim 1, wherein the thickness of the first plate is between 0.2 mm and 2 mm, and the thickness of the second plate is between 0.2 mm and 2 mm.

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