TWM631107U - touch layer structure - Google Patents

Abstract

A touch layer structure includes a first conductive layer, a first pattern layer, a second pattern layer, a second conductive layer, an adhesive layer and a transparent panel. The first conductive layer has a first pattern. The first pattern layer is formed with a second pattern complementary to the first pattern. The second pattern layer is formed on at least one of the first conductive layer and the first pattern layer in a third pattern, and does not completely shield the first conductive layer. The second conductive layer is formed on at least one of the first conductive layer and the first pattern layer in a fourth pattern complementary to the third pattern. The second conductive layer is at least partially in contact with the first conductive layer. The touch layer structure can have a very thin thickness, and can realize a three-dimensional three-dimensional sensing circuit configuration and a patterned appearance.

Description

touch layer structure

The present invention relates to a touch layer structure, in particular to a touch layer structure including a first conductive layer and a second conductive layer.

Electronic products with touch function can be operated by user's finger contact or pressing, and a sensing circuit needs to be configured in the touch area to realize the sensing and transmission of touch signals.

TW I711957 B discloses a touch decorative film, which includes a decorative layer, a printing layer, a touch sensing layer and an adhesive layer. The printing layer is independently formed on the decorative layer to produce a patterned appearance, and the touch sensing layer is independently formed to In order to achieve the function of touch sensing, it is difficult to further reduce the thickness of the touch decorative film, and it is difficult to realize a three-dimensional three-dimensional sensing circuit configuration.

Therefore, the purpose of the present invention is to provide a touch layer structure that can overcome the above shortcomings of the prior art.

Therefore, the novel touch layer structure includes a first conductive layer, a first pattern layer, a second pattern layer, a second conductive layer, an adhesive layer and a transparent panel. The first conductive layer has a first pattern. The first conductive layer is formed of conductive ink. The first pattern layer is formed with a second pattern complementary to the first pattern, and is located on the same plane as the first conductive layer. The first pattern layer is formed by UV-curable ink to make. The second pattern layer is formed on at least one of the first conductive layer and the first pattern layer in a third pattern, and does not completely shield the first conductive layer. The second pattern layer is formed of UV-curable ink. The second conductive layer is formed on at least one of the first conductive layer and the first pattern layer with a fourth pattern complementary to the third pattern, and is located on the same plane as the second pattern layer. The second conductive layer is at least partially in contact with the first conductive layer and is formed of conductive ink. The adhesive layer is located on the second pattern layer and the second conductive layer, and is formed by conductive adhesive. The transparent panel is attached to the adhesive layer.

The effect of the present invention is that the touch layer structure can have a very thin thickness, and can realize a three-dimensional three-dimensional sensing circuit configuration and a patterned appearance.

1: film substrate layer

2: The first conductive layer

20: The first pattern

3: The first pattern layer

30: Second pattern

4: The second pattern layer

40: The third pattern

5: The second conductive layer

50: Fourth pattern

6: Adhesive layer

7: Transparent panel

71: Groove

8: perforation

9: Conductive parts

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, wherein: [FIG. 1] is a schematic cross-sectional view illustrating the steps of the first embodiment of the touch layer structure of the present invention ( a); [FIG. 2] is a schematic cross-sectional view illustrating step (b) of the manufacturing method of the first embodiment; [FIG. 3] is a schematic cross-sectional view illustrating step (c) of the manufacturing method of the first embodiment; [ Fig. 4 is a schematic sectional view illustrating step (d) of the manufacturing method of the first embodiment; [Fig. 5] is a schematic sectional view illustrating step (e) of the manufacturing method of the first embodiment; [Fig. 6] is a A schematic cross-sectional view illustrating step (f) of the manufacturing method of the first embodiment; [FIG. 7] is a schematic cross-sectional view illustrating step (h) of the manufacturing method of the first embodiment; [FIG. 8] is a schematic cross-sectional view, Step (f ' ) of the manufacturing method of the second embodiment of the novel touch layer structure is described; and [FIG. 9] is a schematic cross-sectional view illustrating the step (i) of the manufacturing method of the second embodiment.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are designated by the same reference numerals.

The present invention will be further described with respect to the following embodiments, but it should be understood that these embodiments are only used for illustration and should not be construed as a limitation of the implementation of the present invention.

The manufacturing method of the touch layer structure of the first embodiment of the present invention includes the following steps:

Step (a): Referring to FIG. 1, a first pattern 20 is printed on a film substrate layer 1 to form a conductive ink [containing UV-curable coating (WA-Clear gold oil produced by Daqin Chemical Co., Ltd.). ) and a conductive material (silver powder)] to form the first conductive layer 2. In this embodiment, the material of the film substrate layer 1 is polyvinyl alcohol (PVA). The material of the film substrate layer 1 can be polyvinyl alcohol (PVA), acrylonitrile-butadiene-styrene copolymer (ABS), nylon, polymethylpentene (PMP), polyethylene terephthalate Diester (PET), polybutylene terephthalate (PBT), polyvinylpyrrolidone (PVP), polyethylene (PE), polypropylene (PP), or a combination thereof. The conductive material can be conductive carbon material (eg, carbon black, carbon nanotubes), metal powder (eg, silver powder, copper powder), conductive polymer (eg, PEDOT), or a combination thereof.

Step (b): Referring to FIG. 2, a second pattern 30 complementary to the first pattern 20 is printed on the film substrate layer 1 to form a UV-curable ink (WA produced by Daqin Chemical Co., Ltd. -K ink) to form the first pattern layer 3, the first pattern layer 3 and the first conductive layer 2 are located on the same plane. In a specific implementation form, the The first pattern layer 3 is gradually formed on the film substrate by a variety of UV-curable inks (such as WA-K, WA-C, WA-M, WA-Y inks produced by Daqin Chemical Co., Ltd.). layer 1 (not shown).

Step (c): Referring to FIG. 3, a third pattern 40 is printed on at least one of the first conductive layer 2 and the first pattern layer 3 to form a UV-curable ink (Daqin Chemical Co., Ltd. The second pattern layer 4 formed by the produced WA-C ink) does not completely shield the first conductive layer 2 . In this embodiment, the second pattern layer 4 is formed on part of the first conductive layer 2 and part of the first pattern layer 3 . In a specific embodiment, the second pattern layer 4 is made of a variety of UV-curable inks (such as WA-K, WA-C, WA-M, WA-Y inks produced by Daqin Chemical Co., Ltd.) It is formed step by step on part of the first conductive layer 2 and part of the first pattern layer 3 (not shown).

Step (d): Referring to FIG. 4, a fourth pattern 50 complementary to the third pattern 40 is printed on at least one of the first conductive layer 2 and the first pattern layer 3 to form a conductive ink [containing The second conductive layer 5 formed by the UV-curable coating (WA-Clear gold oil) and the conductive material (silver powder)], the second conductive layer 5 and the second pattern layer 4 are located on the same plane, and the second conductive layer 5 is on the same plane. The layer 5 is at least partially in contact with the first conductive layer 2 .

Step (e): Referring to FIG. 5, on the second pattern layer 4 and the second conductive layer 5, a conductive adhesive [containing a UV-curable adhesive (UE010 adhesive produced by Daqin Chemical Co., Ltd.) is formed. ) and a conductive material (silver powder)] to form the adhesive layer 6. The conductive material can be conductive carbon material (eg, carbon black, carbon nanotubes), metal powder (eg, silver powder, copper powder), conductive polymer (eg, PEDOT), or a combination thereof.

Step (f): Referring to FIG. 6 , a polycarbonate transparent panel 7 is pasted on the adhesive layer 6 to obtain the touch layer structure. The material of the transparent panel 7 can be polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), or a combination thereof.

Step (g): irradiating the first conductive layer 2 , the first pattern layer 3 , the second pattern layer 4 , the second conductive layer 5 and the adhesive layer 6 with ultraviolet light to cure them.

Step (h): Referring to FIG. 7 , the film substrate layer 1 is removed from the first conductive layer 2 and the first pattern layer 3 to obtain the touch layer structure of the first embodiment.

Referring to FIG. 7 , the touch layer structure of the first embodiment includes a first conductive layer 2 , a first pattern layer 3 , a second pattern layer 4 , a second conductive layer 5 , an adhesive layer 6 and a transparent panel 7.

The first conductive layer 2 has a first pattern 20 and is formed of conductive ink [containing UV-curable paint (WA-Clear gold oil) and conductive material (silver powder)].

The first pattern layer 3 is formed on the film substrate layer 1 with a second pattern 30 complementary to the first pattern 20 , and is located on the same plane as the first conductive layer 2 . The first pattern layer 3 is formed of UV-curable ink (WA-K ink).

The second pattern layer 4 is formed on at least one of the first conductive layer 2 and the first pattern layer 3 with a third pattern 40 , and does not completely shield the first conductive layer 2 . The second pattern layer 4 is formed of UV-curable ink (WA-C ink). In this embodiment, the second pattern layer 4 is formed on part of the first conductive layer 2 and part of the first pattern layer 3 .

The second conductive layer 5 is formed on at least one of the first conductive layer 2 and the first pattern layer 3 with a fourth pattern 50 complementary to the third pattern 40, and is 4-position with the second pattern layer on the same plane. The second conductive layer 5 is at least partially in contact with the first conductive layer 2 and is formed of conductive ink [containing UV-curable paint (WA-Clear gold oil) and conductive material (silver powder)].

The adhesive layer 6 is formed on the second pattern layer 4 and the second conductive layer 5, and is formed of conductive adhesive [containing UV-curable adhesive (UE010 adhesive) and conductive material (silver powder)].

The transparent panel 7 is attached to the adhesive layer 6 . In this embodiment, the transparent panel 7 is a polycarbonate transparent panel 7 .

The manufacturing method of the touch layer structure of the second embodiment of the present invention includes all the steps of the above-mentioned first embodiment, and further includes the following steps:

Step (f ′ ): Referring to FIG. 8 , before step (f), a plurality of perforations 8 are formed in the transparent panel 7 through the interior of the transparent panel 7 with a laser, and lasers are used on the transparent panel 7 . A groove 71 connecting at least two through holes 8 is formed on the surface.

Step (i): Referring to FIG. 9 , after the step (f ′ ), a conductive member 9 is formed in the groove 71 to connect the at least two through holes 8 . In this embodiment, the conductive member 9 is a three-dimensional printed wire.

Referring to FIG. 9 , the touch layer structure of the second embodiment includes all the structures of the above-mentioned first embodiment, and further includes a conductive member 9 . In this embodiment, a plurality of through holes 8 are formed inside the transparent panel 7 , and a groove 71 is formed on the surface of the transparent panel 7 connecting at least two through holes 8 . The conductive member 9 is formed in the groove 71 and is connected to the at least two through holes 8 .

In summary, the novel touch layer structure can have a very thin thickness, and can be realized by the first pattern layer 3 , the first conductive layer 2 , the second conductive layer 5 and the second pattern layer 4 The three-dimensional three-dimensional sensing circuit configuration and the patterned appearance can indeed achieve the purpose of the present invention.

However, the above are only examples of the present invention, which should not limit the scope of the present invention. Simple equivalent changes and modifications made in the contents of the book are still within the scope of this new patent.

2: The first conductive layer

3: The first pattern layer

4: The second pattern layer

5: The second conductive layer

6: Adhesive layer

7: Transparent panel

Claims (7)

A touch layer structure, comprising: a first conductive layer, the first conductive layer has a first pattern, the first conductive layer is formed by conductive ink; a second pattern formed with a complementary to the first pattern and A first pattern layer located on the same plane as the first conductive layer, the first pattern layer is formed by UV-curable ink; a third pattern is formed on the first conductive layer and the first pattern layer a second pattern layer on at least one of them, the second pattern layer does not completely shield the first conductive layer, the second pattern layer is formed by UV-curable ink; one is complementary to the third pattern The fourth pattern is formed on at least one of the first conductive layer and the first pattern layer and is located on a second conductive layer on the same plane as the second pattern layer, the second conductive layer and the first conductive layer The layers are at least partially in contact, the second conductive layer is formed by conductive ink; an adhesive layer on the second pattern layer and the second conductive layer, the adhesive layer is formed by conductive glue; and a paste Transparent panel on the adhesive layer. The touch layer structure according to claim 1, wherein the conductive ink comprises an ultraviolet light-curable coating and a conductive material, and the conductive material is selected from conductive carbon material, metal powder, conductive polymer or a combination thereof. The touch layer structure according to claim 1, wherein the conductive adhesive comprises a UV-curable adhesive and a conductive material, and the conductive material is selected from conductive carbon material, metal powder, conductive polymer or a combination thereof. The touch layer structure of claim 1, wherein the adhesive layer is formed on the second pattern layer and the second conductive layer. The touch layer structure according to claim 1, wherein the material of the transparent panel is selected from polycarbonate, acrylonitrile-butadiene-styrene copolymer, polymethyl methacrylate or a combination thereof. The touch layer structure of claim 1, wherein a plurality of perforations penetrating through the transparent panel are formed inside the transparent panel, and a groove connecting at least two perforations is formed on the surface of the transparent panel. The touch layer structure according to claim 6, further comprising a conductive member formed in the groove and connected to the at least two through holes.

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