TWM627703U - Light engine transmitter module and optical transceiver device including the same - Google Patents

Abstract

This creation provides a light engine transmitter module, including a base unit, a horizontal laser transmitter module, and an integrated optical circuit chip. The horizontal laser transmitter module is arranged on the base unit and is used for outputting laser beams in a horizontal direction. The integrated optical circuit chip is disposed on a side of the base unit corresponding to the horizontal laser transmitter module. The light receiving end of the integrated optical circuit chip is aligned with the laser beam of the horizontal laser transmitter module to drive the integrated optical circuit chip, and the integrated optical circuit chip is connected or coupled to the signal modulator , and according to the control signal of the signal modulator, a laser light signal is generated at the output end of the integrated optical circuit chip.

Description

Light engine transmitter module and optical transceiver device including the same

This creation is about an optical engine transmitter module and an optical transceiver device including the same, especially an optical engine transmitter module for high-speed transmission and an optical transceiver device including the same.

With the advancement of science and technology, the demand for data processing volume and processing speed has also increased significantly. Compared with the traditional copper wire as a transmission bridge, optical fiber transmission has the characteristics of higher bandwidth and low loss over long distances (such as single Mode fiber) or short-distance transmission (such as multimode fiber) has gradually replaced traditional copper wire transmission products.

In the field of optical fiber communication, the specification of QSFP (Quad Small Form-factor Pluggable) has been often used as a connector in the structure of optical communication system. Limited by the public regulations, the space of the connector is limited and must be used efficiently. However, with the demand for high speed, the space inside the QSFP has been used to the maximum extent, and the traditional architecture (such as PSM4) is used. The four TOSAs are coupled to the optical fiber as individual channels, which affects the use of the overall space. At transmission rates above 400G, a Digital Signal Processor (DSP) must be installed. However, based on the current architecture, it is indeed difficult to Install the digital signal processor; in addition, under high-speed operation, it is still necessary to use an active heat dissipation element (such as a cooling chip) to deheat the laser diode inside the TOSA, which is also difficult in the case of limited space. Then configure active heat dissipation components; in addition, the space for modulators, drivers, and preamplifiers (TIA) is limited based on the original architecture.

The main purpose of this creation is to provide a light engine transmitter module, including a base unit, a horizontal laser transmitter module, and an integrated optical circuit chip. The horizontal laser transmitter module is arranged on the base unit and is used for outputting a laser beam in a horizontal direction. The integrated optical circuit chip is disposed on the base unit on the side corresponding to the horizontal laser transmitter module, and the light receiving end of the integrated optical circuit chip is aligned with the horizontal laser transmitter module. A laser beam is used to drive the integrated optical circuit chip, the integrated optical circuit chip is connected to a signal modulator, and a laser beam is generated at the output end of the integrated optical circuit chip according to the control signal of the signal modulator signal.

Another object of the present invention is to provide an optical transceiver device, including a housing, a substrate, the aforementioned light engine transmitter module, an optical receiver module, and a parallel optical fiber module. The casing has an accommodating space, and one end of the casing has an electrical connection window, and the other end has an optical connection window. The base plate is disposed in the accommodating space, and one end of the base plate has an electrical connection port and passes through the electrical connection window. The light engine transmitter module is disposed on the substrate, and the light engine transmitter module is connected or coupled to the electrical connection port. The light receiver module is disposed on the substrate, and the light receiver module is connected or coupled to the electrical connection port. The parallel fiber optic module includes one or more optical receiver coupling units connected to the optical receiver module, one or more optical transmitter coupling units connected to the output end of the integrated optical circuit chip, a an optical transceiver coupling port connected to a window, and a plurality of coupling ports connected between the optical receiver coupling unit and the optical transceiver coupling port, and between the output end of the integrated optical circuit chip and the optical transceiver coupling port of fiber.

Therefore, this creative light engine transmitter module can effectively reduce the volume of the overall TOSA, effectively reduce the space used, so as to allow enough space for the device to be upgraded; in addition, in terms of a primary technical effect, this Creation can effectively improve the antipyretic efficiency in high-speed transmission.

100: Optical transceiver device

10: Shell

10A: Upper shell

10B: Lower shell

11: Accommodating space

12: Electrical connection window

13: Optical connection window

20: Substrate

21: heat dissipation substrate

211: set slot

22: circuit board

221: Make way slot

222: electrical connection port

23: Flexible circuit board

30: Light Engine Transmitter Module

31: Base unit

311: Substrate

312: Refrigeration chip module

313: cooling base

32: Horizontal Laser Transmitter Module

321: Secondary circuit board

322: Laser Transmitter Unit

322A: Sub-base

322B: Edge-Firing Laser Diode

323: Isolator

324: Coupler lens

325: Focusing Lens

33: Integrated Optical Circuit Chip

331: Optical receiving end

332: output terminal

40: Optical receiver module

50: Parallel fiber module

51: Optical receiver coupling unit

52: Optical transmitter coupling unit

53: Optical transceiver coupling port

54A: Optical fiber

54B: Optical fiber

60: Signal Modulator

70: Preamp

200: Optical Transceiver Device

20A: Substrate

30A: Light Engine Transmitter Module

321C: Sensor Circuit Arrangement

325D: Focusing Lens

40A: Optical receiver module

41A: Light sensor

50A: Parallel Fiber Module

51A: Optical receiver coupling unit

52A: Optical Transmitter Coupling Unit

53A: Optical transceiver coupling port

54AA: Optical fiber

54AB: Optical fiber

70A: Preamplifier

IC: 45 degree bevel

C1: Sensor circuit board

C2: Thermistor

C3: Monitor light sensor

FIG. 1 is a schematic diagram of the appearance of the optical transceiver device in the present creation.

FIG. 2 is an exploded schematic diagram of the structure of the optical transceiver device in the present invention.

FIG. 3 is a schematic view of the appearance of an embodiment of the light engine transmitter module in the present creation.

FIG. 4 is a schematic exploded view of the structure of one embodiment of the light engine transmitter module in the present creation.

FIG. 5 is a schematic view of the appearance of another embodiment of the light engine transmitter module in the present creation.

FIG. 6 is a schematic view of the appearance of another embodiment of the optical transceiver device in the present invention.

FIG. 7 is a schematic diagram of the appearance of another embodiment of the light engine transmitter module in the present creation.

FIG. 8 is a schematic view of the appearance of another embodiment of the light engine transmitter module in the present invention.

For the detailed description and technical content of this creation, the accompanying drawings are described as follows. Furthermore, the drawings in this creation are not necessarily drawn according to the actual scale for the convenience of description. These drawings and their proportions are not intended to limit the scope of this creation, and are described here in advance.

In a specific embodiment, the present invention can be used in conjunction with the architecture of QSFP (Quad Small Form-factor Pluggable), and more specifically, it can be used in conjunction with the architecture of QSFP28, QSFP+, Micro QSFP+, or its subsequent derivatives. , is not restricted in this creation.

The following describes an embodiment of the present invention, please refer to "FIG. 1" and "FIG. 2", which are the appearance schematic diagram and the structural exploded schematic diagram of the optical transceiver device in the present invention, as shown in the figure Show.

This embodiment discloses an optical transceiver device 100 , which mainly includes a casing 10 , a substrate 20 disposed inside the casing 10 , an optical engine transmitter module 30 , an optical receiver module 40 , and a parallel fiber optic module 50 .

The housing 10 has an accommodating space 11 therein, an electrical connection window 12 at one end of the housing 10 , and an optical connection window 13 at the other end (ie, the other end opposite to the electrical connection window 12 ). In one embodiment, the casing 10 is composed of an upper casing 10A and a lower casing 10B. After the upper casing 10A and the lower casing 10B are combined up and down, the accommodating space 11 is formed in the middle and reserved at one end. The electrical connection window 12 communicated with the accommodating space 11 and the optical connection window 13 communicated with the accommodating space 11 is reserved at the other end. The upper casing 10A and the lower casing 10B can be fixed by electric welding, laser welding, gluing, or any other method, which is not limited in the present invention.

The substrate 20 is disposed in the accommodating space 11 . One end of the substrate 20 has an electrical connection port 222 and passes through the electrical connection window 12 . In one embodiment, the substrate 20 mainly includes a heat dissipation substrate 21 and a circuit board 22 disposed on the heat dissipation substrate 21 . The heat dissipation base plate 21 is provided with a setting slot 211 for the light engine transmitter module 30 to be set, and the circuit board 22 is provided with an escape slot 221 corresponding to the position above the setting slot 211. The module 30 is directly disposed on the heat dissipation substrate 21 to increase the heat dissipation efficiency. In one embodiment, the electrical connection port 222 may be a gold finger disposed at one end of the circuit board 22 , which is not limited in the present invention. Since the light engine transmitter module 30 is directly disposed on the heat dissipation substrate 21, in order to connect the circuit on the circuit board 22 to the electronic device on the light engine transmitter module 30, in one embodiment, a flexible circuit can be used. The board 23 is bridged by the circuit on the circuit board 22 to the secondary circuit board on the light engine transmitter module 30 , which is not limited in this invention. In one embodiment, the substrate 20 is provided with a signal modulator 60 and a preamplifier 70. In the present invention, Not restricted. In one embodiment, the material of the heat dissipation substrate 21 is copper tungsten alloy (CuW), which is used to improve the heat dissipation efficiency in the vertical direction, which is not limited in the present invention.

The light engine transmitter module 30 is disposed on the substrate 20 , and the light engine transmitter module 30 is connected or coupled to the electrical connection port 222 . The light engine transmitter module 30 is mainly connected to the signal modulator 60, and the laser light signal is generated by the control signal output by the signal modulator 60, and is transmitted to the optical fiber for transmission. Specifically, the signal modulator 60 can be, for example, a digital signal processor (DSP), which is used to convert the digital signal into an analog signal and then drive the light engine transmitter module 30. In the present invention is not restricted. It should be noted here that although the light engine transmitter module 30 is a bare device in this creation, in other embodiments, the light engine transmitter module 30 can also be packaged as a chip and implemented, which will be described later. Next, several different embodiments of the light engine transmitter module 30 will be described. It should be noted here that the “connection or coupling” refers to direct or indirect connection. Specifically, the light engine transmitter module 30 can be connected through other electronic devices (such as the signal modulator 60 ). Connected to the electrical connection port 222, or directly connected to the electrical connection port 222, this part depends on the location where other electronic devices are arranged, that is to say, this creation does not exclude the embodiment where other electronic devices are not arranged therebetween. This is stated in advance.

The optical receiver module 40 is disposed on the substrate 20 , and the optical receiver module 40 is connected or coupled to the electrical connection port 222 . In one embodiment, the photoreceiver module 40 may include one or a plurality of photodiodes (PDs) according to the number of channels. The photodiodes receive optical signals and convert them into electrical signals. It should be specially stated here that the “connection or coupling” refers to direct or indirect connection. The amplifier 70) is connected to the electrical connection port 222, or is directly connected to the electrical connection port 222. This part depends on the location where other electronic devices are installed, that is, this creation does not exclude the case where other electronic devices are not installed in between. Example, Explain first here.

The parallel fiber optic module 50 includes one or more optical receiver coupling units 51 connected to the optical receiver module 40, and one or more optical transmitter coupling units 52 connected to the optical engine transmitter module 30. , the optical transceiver coupling port 53 passing through the optical connection window 13, a plurality of optical fibers 54A connected between the optical receiver coupling unit 51 and the optical transceiver coupling port 53, and a plurality of optical fibers connected to the light engine transmitter The optical fiber 54B between the module 30 and the optical transceiver coupling port 53 . In one embodiment, the parallel fiber optic module 50 is an MT-MT fiber optic cable, which is not limited in the present invention. In one embodiment, the light receiver coupling unit 51 covers the top of the light sensor of the light receiver module 40, and is positioned on the circuit board 22 when it is calibrated to the optimal coupling position; the light receiver The coupling unit 51 is provided with a 45-degree angle mirror, which is used to turn the output beam of the optical fiber 54A by 90 degrees and then transmit it to the receiving surface of the optical sensor. In one embodiment, the light transmitter coupling unit 52 is aligned and coupled to the output end of the IC chip in the light engine transmitter module 30 , and the structure of the light engine transmitter module 30 will be exemplified later. Examples are described in detail.

The following describes four different embodiments of the light engine transmitter module 30. Please refer to FIG. 3 and FIG. 4 first, which are schematic diagrams of the appearance of one embodiment of the light engine transmitter module in this creation, And a schematic diagram of the structure decomposition, as shown in the figure.

The light engine transmitter module 30 of this embodiment mainly includes a base unit 31 , a horizontal laser transmitter module 32 and an integrated optical circuit chip (Photonic Integrated Circuit Chip, PIC Chip) disposed on the base unit 31 )33.

The base unit 31 mainly includes a substrate 311, a thermoelectric cooling module (TEC module) 312 disposed on the substrate 311 for carrying the horizontal laser transmitter module 32, and a thermoelectric cooling module (TEC module) 312 disposed on the substrate 311. The base plate 311 is used for supporting the heat dissipation base 313 of the integrated optical circuit chip 33 . The cooling chip module 312 includes a cooling surface and The heat-generating surface and the cooling surface face upwards for carrying the heating elements and devices thereon, and the heat-generating surface faces downwards for contacting the bottom substrate 311 . In one embodiment, the material of the substrate 311 can be aluminum nitride (AlN), which is not limited in the present invention. In one embodiment, the power port of the cooling chip module 312 can be directly connected to the flexible circuit board 23; ) is coupled to the flexible circuit board 23 or the circuit board 22 , which is not limited in the present invention.

The horizontal laser transmitter module 32 is disposed on the base unit 31 for outputting a laser beam in the horizontal direction. In one embodiment, the horizontal laser transmitter module 32 includes a sub-circuit board 321 disposed on the cooling surface of the cooling chip module 312, disposed on the cooling surface and electrically connected to the sub-circuit board The laser transmitter unit 322 of 321, an isolator 323 arranged on one side of the laser transmitter unit 322 and aligned to the output direction of the laser transmitter unit 322, and an isolator 323 arranged on the laser transmitter unit 322 and a coupling lens 324 between the isolators 323, the coupling lens 324 is used for coupling the laser beam output by the laser transmitter unit 322 to the receiving end of the isolator 323, thereby improving the efficiency. In one embodiment, the laser emitter unit 322 includes a sub-mount 322A disposed on the cooling surface, and an edge-emitting laser diode 322B disposed on the sub-mount 322A. The base 322A conducts the high temperature of the edge-emitting laser diode 322B to the cooling surface of the bottom-side cooling chip module 312, and on the other hand, increases the height of the edge-emitting laser diode 322B to facilitate the Align to the focal length position of the coupling lens 324 .

The integrated optical circuit chip 33 is disposed on a side of the base unit 31 corresponding to the horizontal laser transmitter module 32 . The light receiving end 331 of the integrated optical circuit chip 33 is aligned with the laser beam of the horizontal laser transmitter module 32 to drive the integrated optical circuit chip 33 . The integrated optical circuit chip 33 is connected or coupled to the signal modulator 60 and generates a lightning bolt at the output end 332 of the integrated optical circuit chip 33 according to the control signal of the signal modulator 60 light signal. Specifically, the integrated optical circuit chip 33 uses a semiconductor manufacturing process to directly fabricate optical components (such as modulators, switches, optical splitters, etc.) in an integrated circuit, and transmit the optical signal of visible light through the optical waveguide, And use the electric field applied by the electrical signal to modulate the phase of the visible light, and thereby output the laser light signal. The implementation principle of the Photonic Integrated Circuit Chip (PIC Chip) 33 is not the intention of this creation. The scope of the limitation will not be repeated here. In one embodiment, the IC chip 33 is coupled to the circuit on the circuit board 22 via jumpers, so as to be coupled to the signal modulator 60 via the circuit board 22 to receive the control signal, in There are no restrictions in this creation.

Through the above configuration, the optical engine transmitter module 30 can achieve a minimal configuration, thereby realizing high-speed transmission of 400 Gbps or more than 400 Gbps under the QSFP specification.

In addition to the above-mentioned structure, in another embodiment, please refer to FIG. 5 , which is a schematic diagram of the appearance of another embodiment of the light engine transmitter module in the present creation, as shown in the figure.

The difference between this embodiment and the previous embodiment is that the horizontal laser transmitter module 32 further includes a focusing lens 325 disposed between the isolator 323 and the light receiving end 331 of the integrated optical circuit chip 33 . The focusing lens 325 can further improve the transmission efficiency between the horizontal laser transmitter module 32 and the light receiving end 331 of the integrated optical circuit chip 33; when the transmission efficiency increases, the horizontal laser transmitter module can be reduced The power of group 32 further miniaturizes the size of the edge-emitting laser diodes 322B used and further reduces the need for antipyretics.

In another embodiment, please refer to FIG. 6 , which is a schematic diagram of the appearance of another embodiment of the optical transceiver device in the present invention, as shown in the figure.

The following only describes the difference between the embodiment of FIG. 6 and the embodiment of FIG. 1 : one of the differences between the optical transceiver device 200 of this embodiment and the previous embodiment In this embodiment, the photodiode (PD) 41A of the light receiver module 40A is disposed on the substrate 20A in an array form, and the photodiode 41A is connected or coupled to the preamplifier 70A. The number of the light sensors 41A is configured according to the number of channels, which is four channels in this embodiment.

The parallel fiber optic module 50A includes one or more optical receiver coupling units 51A connected to the optical receiver module 40A, and one or more optical transmitter coupling units 52A connected to the optical engine transmitter module 30A. , the optical transceiver coupling port 53A passing through the optical connection window 13, a plurality of optical fibers 54AA connected between the optical receiver coupling unit 51A and the optical transceiver coupling port 53A, and a plurality of optical fibers connected to the light engine transmitter Optical fiber 54AB between module 30A and the optical transceiver coupling port 53A. In this embodiment, the optical receiver coupling unit 51A can cut the end of the optical fiber 54AB into a 45-degree oblique angle IC, so that a total reflection surface is generated between the 45-degree oblique angle IC and the air or other medium, which is used to connect the optical fiber. The output beam of 54AB is turned 90 degrees and transmitted to the receiving surface of the light sensor 41A.

Another difference between the optical transceiver device 200 of the present embodiment and the previous embodiment is that the circuit board 22A on the substrate 20A omits the arrangement of the flexible circuit board 23, but the light engine transmitter on the circuit board 22A is omitted. Each device on the module 30A connects the circuit to the circuit on the circuit board 22A by means of jumper wires.

In another embodiment, please refer to FIG. 7 , which is a schematic diagram of the appearance of another embodiment of the light engine transmitter module in the present creation, as shown in the figure.

The difference between this embodiment and the light engine transmitter module 20 in FIGS. 3 and 4 is that a sensor circuit device 321C is used in this embodiment to replace the original sub-circuit board 321; The sensor circuit device 321C includes a sensor circuit board C1, and a thermistor C2 arranged on the sensor circuit board C1, the thermistor C2 is arranged at the middle position of the sensor circuit board C1, the thermistor C2 C2 is connected or coupled to the signal conditioning via the sensor circuit board C1 The inverter 60 is used to monitor the temperature of the thermoelectric cooling module (TEC module) 312; in another embodiment, the sensor circuit device 321C may further include two disposed on the sensor circuit board C1 On the monitor photodiode (Monitor Photodiode, MPD) C3, the monitor photodiode C3 is coupled to the reverse light-emitting surface of the laser emitter unit 322 to monitor the laser emitter unit 322 The output power is fed back to the signal modulator 60 for power modulation.

In addition to the above-mentioned structure, in another embodiment, please refer to FIG. 8 , which is a schematic diagram of the appearance of another embodiment of the light engine transmitter module in the present invention, as shown in the figure.

The difference between this embodiment and the previous embodiment is that the horizontal laser transmitter module 32 further includes a focusing lens 325D disposed between the isolator 323 and the light receiving end 331 of the integrated optical circuit chip 33 . The focusing lens 325D can further improve the transmission efficiency between the horizontal laser transmitter module 32 and the light receiving end 331 of the integrated optical circuit chip 33; when the transmission efficiency increases, the horizontal laser transmitter module can be reduced The power of group 32 further miniaturizes the size of the edge-emitting laser diodes 322B used and further reduces the need for antipyretics.

To sum up, this creative light engine transmitter module can effectively reduce the volume of the overall TOSA, effectively reduce the space used, so as to make enough space for the device to be upgraded; in addition, in terms of primary technical effects , this creation can effectively improve the antipyretic efficiency in high-speed transmission.

The creation has been described in detail above, but the above-mentioned is only a preferred embodiment of the creation, and should not limit the scope of the creation of this creation Equivalent changes and modifications shall remain within the scope of the patent for this creation.

100: Optical transceiver device

10: Shell

10A: Upper shell

10B: Lower shell

11: Accommodating space

12: Electrical connection window

13: Optical connection window

20: Substrate

21: heat dissipation substrate

211: set slot

22: circuit board

221: Make way slot

222: electrical connection port

23: Flexible circuit board

30: Light Engine Transmitter Module

40: Optical receiver module

50: Parallel fiber module

51: Optical receiver coupling unit

52: Optical transmitter coupling unit

53: Optical transceiver coupling port

54A: Optical fiber

54B: Optical fiber

60: Signal Modulator

70: Preamp

Claims (10)

A light engine transmitter module, comprising: a base unit; a horizontal laser transmitter module disposed on the base unit for outputting a laser beam in a horizontal direction; and An integrated optical circuit chip is disposed on the base unit on the side corresponding to the horizontal laser transmitter module, and the light receiving end of the integrated optical circuit chip is aligned with the horizontal laser transmitter module the laser beam to drive the integrated optical circuit chip, the integrated optical circuit chip is connected or coupled to a signal modulator, and according to the control signal of the signal modulator, the output end of the integrated optical circuit chip A laser light signal is generated. The light engine transmitter module of claim 1, wherein the base unit comprises a substrate, a cooling chip module disposed on the substrate for carrying the horizontal laser transmitter module, and a A heat dissipation base disposed on the substrate for carrying the integrated optical circuit chip. The light engine transmitter module of claim 2, wherein the horizontal laser transmitter module comprises a sub-circuit board disposed on the cooling surface of the cooling chip module, a sub-circuit board disposed on the cooling surface The laser emitter unit on and electrically connected to the sub-circuit board, and an isolator arranged on one side of the laser emitter unit and aligned to the output direction of the laser emitter unit. The light engine transmitter module of claim 3, wherein the laser transmitter unit comprises a sub-base disposed on the cooling surface, and an edge-fired laser disposed on the sub-base emitter diode. The light engine transmitter module of claim 3, wherein the horizontal laser transmitter module includes a light coupling lens disposed between the laser transmitter unit and the isolator. The light engine transmitter module of claim 5, wherein the horizontal laser transmitter module includes a focusing lens disposed between the isolator and the light receiving end of the integrated optical circuit chip. An optical transceiver device, comprising: a casing with an accommodating space in the casing, an electrical connection window at one end of the casing, and an optical connection window at the other end; a base plate disposed in the accommodating space, one end of the base plate has an electrical connection port and passes through the electrical connection window; A light engine transmitter module as described in any one of claims 1 to 6, disposed on the substrate, and the light engine transmitter module is connected or coupled to the electrical connection port; an optical receiver module disposed on the substrate, the optical receiver module is connected or coupled to the electrical connection port; and A parallel fiber optic module including one or more optical receiver coupling units connected to the optical receiver module, one or more optical transmitter coupling units connected to the output end of the integrated optical circuit chip, a The optical transceiver coupling port of the optical connection window, and a plurality of coupling ports connected between the optical receiver coupling unit and the optical transceiver coupling port, and between the output end of the integrated optical circuit chip and the optical transceiver coupling port fiber in between. The optical transceiver device of claim 7, wherein the substrate comprises a heat dissipation substrate and a circuit board disposed on the heat dissipation substrate, and a device for the light engine transmitter module is disposed on the heat dissipation substrate A slot, the circuit board is provided with a recess corresponding to the position above the setting slot. The optical transceiver device according to claim 8, wherein the material of the heat dissipation substrate is copper tungsten alloy (CuW). The optical transceiver device of claim 7, wherein the parallel fiber optic module is an MT-MT fiber optic cable.

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