TWM627478U - Special-shaped tube cooling and heat dissipation system - Google Patents

Abstract

The present invention discloses a special-shaped tube refrigeration and heat dissipation system, which includes a refrigeration module, a heat dissipation module and a piping system. The cooling module has a cooling chip, a liquid cooling tube, a cooling fin and a first fan for generating cold air. The heat dissipation module has a heat dissipation radiator and a second fan, and the heat dissipation radiator has a plurality of heat dissipation pipes. The heat of the cooling module is transported to the heat dissipation radiator through the liquid through the pipeline system, and then the heat in the liquid is discharged, so that the liquid is recirculated and returned to the heat dissipation block. Cooling module. In particular, the liquid cooling pipe and the heat dissipation pipe are flat tubes extruded from aluminum alloy to increase the heat dissipation area. The interior of the pipe is divided into a plurality of flow channels. The flow kit, the guide kit can be used to connect to the piping system, and it can also make most of the heat pipes connected in series to form a circulating heat flow channel. Thereby, the present invention can achieve the purpose of improving heat dissipation efficiency and eliminating the need for conventional heat dissipation fins.

Description

Special-shaped tube cooling and cooling system

This creation is related to the technical field of a refrigeration system, especially a special-shaped tube refrigeration and heat dissipation system that can be used in products that need to be cooled or dissipated.

Nowadays, many industries need to use refrigeration systems, and conventional refrigeration systems mostly use refrigerant technology, which is connected through evaporators, condensers, compressors and pipeline systems; the refrigerant changes from liquid to liquid in the evaporator. It is gaseous, and it has an endothermic effect in the process to generate low-temperature cold air; the gaseous refrigerant is transported to the condenser and then converted into a liquid state, and the material releases heat in the process; for example, all systems that use refrigerant refrigeration technology are inseparable from the above. basic principle.

However, since the thermoelectric effect was proposed by the physicist Thomas John Seebeck in 1821, after a hundred years of continuous improvement in material technology, cooling wafers made of semiconductor materials have been able to produce very good cooling efficiency, enough to be used in the industry. It is widely used to reduce people's dependence on refrigerants and obtain the required cooling in a more environmentally friendly way. At present, there are some cooling systems designed with cooling chips. However, the technology for heat dissipation is not perfect, and it still needs to rely on the copper tubes of the conventional condenser and the technology of cooling fins on the surface of the copper tubes.

Since conventional condensers are usually made of circular copper tubes, and their cross-sectional shape is circular, according to the isometric theorem, the perimeter of a circle is the smallest among the geometric shapes, and similarly, heat conduction and heat exchange can be performed. The circumferential surface of the heat exchanger is also the smallest, and the wind receiving area is only half of the circumference, and the leeward side is not affected by the wind, so the heat exchange efficiency is limited. In order to improve the heat exchange efficiency of the conventional circular copper tube, many heat dissipation fins must be combined outside the copper tube to improve the work efficiency. However, adding heat dissipation fins must increase a lot of manufacturing process and cost, and it does not change the pure air heat exchange, so as to solve the problem of low efficiency, so it is not a good technical solution.

In addition, when the two ends of the conventional circular copper pipe are to be connected with other copper pipes to form a circuitous circulation channel, a small section of copper pipe must be first bent into a semi-circular connecting pipe, and then the diameters of the two ends of the above-mentioned circular copper pipe must be bent. Stretch up, then insert the end of the semi-annular connecting pipe into the end of the circular copper pipe, and then weld the end of the circular copper pipe and the connecting pipe, so the manufacturing process is quite troublesome. Therefore, how to propose a cooling system using a cooling chip, the cooling and heat dissipation structure of which is simplified and easier to manufacture, and can improve the heat dissipation efficiency, is the subject to be actively overcome by the present invention.

The purpose of this creation is to provide a special-shaped tube cooling and heat dissipation system, which is composed of a cooling module, a heat dissipation module and a pipeline system, especially the liquid cooling pipe of the cooling module and the heat dissipation pipe of the cooling module The invention and its composition structure design can generate cold air for cooling, improve heat dissipation efficiency, and eliminate the need for heat dissipation fins.

In order to achieve the above purpose, the preferred technical solutions of the special-shaped tube cooling and heat dissipation system of the present invention include:

A cooling module, which has at least a cooling chip, a liquid cooling tube, a cooling fin and a first fan; the liquid cooling tube is attached to the hot surface of the cooling chip, and the cooling fin is attached to the the cooling surface of the cooling chip, the first fan drives air to pass through the cooling fin to generate cold air;

a heat dissipation module, which has a heat dissipation row and a second fan, the heat dissipation row has a plurality of heat dissipation pipes arranged in parallel, and the second fan drives air to pass through the surface of the heat dissipation row to discharge the heat of the heat dissipation row;

A pipeline system is connected between the liquid cooling pipe of the refrigeration module and the heat sink of the heat dissipation module, so that a cooling liquid in the heat sink is pumped to the liquid through a liquid pump in the pipeline A cold pipe, the cold liquid exchanges heat with the hot surface of the refrigerating chip in the liquid cooling pipe to become a hot liquid, and the hot liquid flows back to the heat sink to dissipate heat to become the cold liquid, which is characterized by:

The liquid-cooling pipe and the heat-dissipating pipe are respectively straight pipe bodies extruded from aluminum alloy, and are flat-shaped pipe bodies whose cross-sectional width is greater than their height; The flow channels at both ends are provided with integrally formed baffles between the flow channels;

The two ends of the liquid cooling tube are respectively combined with a first flow guide sleeve, and the first flow guide sleeve at one or both ends corresponds to the inner surface of the liquid cooling tube and is concavely provided with a first return flow connecting the two flow channels of the liquid cooling tube a groove, so that the flow channel of the liquid cooling tube forms a circuitous structure through the first return groove; the first guide sleeve is also provided with a first liquid inlet pipe and a first liquid outlet pipe, the first inlet pipe The liquid pipe and the first liquid outlet pipe are respectively connected to the pipeline system;

The plurality of radiating pipes are arranged in parallel at a distance from each other, and two ends of each radiating pipe are respectively combined with a second guide sleeve, and the second guide sleeve at one or both ends is concavely connected to the inner surface of the radiating pipe. The second return groove of the two flow channels of the heat dissipation pipe enables the flow channel of the heat dissipation pipe to form a circuitous structure through the second return groove; and a second liquid inlet is provided on the selected second guide sleeve pipe and a second liquid outlet pipe, the second liquid inlet pipe and the second liquid outlet pipe are respectively connected to the pipeline system.

In the above-mentioned special-shaped tube refrigeration and heat dissipation system, the liquid cooling tube has three flow channels and two partitions; between the two runners.

In the above-mentioned special-shaped tube refrigeration and heat dissipation system, the heat dissipation pipe has three flow channels and two partition plates, and the second return groove of the second guide sleeve includes and communicates with the three flow channels of the heat dissipation pipe. between the two flow channels.

In the above-mentioned special-shaped tube refrigeration and heat dissipation system, the upper and lower surfaces of the second guide sleeve are provided with connecting pipes that communicate with the return groove or flow channel, so that the heat sinks are arranged in parallel. The guide kits are connected together by this connecting tube.

The above-mentioned special-shaped tube refrigeration and heat dissipation system further includes a liquid storage tank, the liquid storage tank is connected to the pipeline system, and the cold liquid is stored in the liquid storage tank.

The above-mentioned special-shaped tube refrigeration and heat dissipation system further includes a pressure reducing valve, which is connected to the pipeline system. flow to the ball of the pressure relief valve.

In the above-mentioned special-shaped tube cooling and heat dissipation system, one side of the liquid cooling tube is attached to the hot side of the cooling chip through a graphite heat-conducting sheet or a plurality of clamps.

In the above-mentioned special-shaped tube cooling and heat dissipation system, a plurality of the cooling chips are arranged side by side on one side of the cooling fins, and the hot surfaces of the cooling chips are jointly attached to one side of the liquid cooling tube.

In the above-mentioned special-shaped tube cooling and heat dissipation system, one side of the cooling fin is attached to the cold side of the cooling chip through a graphite heat-conducting sheet.

In the above-mentioned special-shaped tube refrigeration and heat dissipation system, a water receiving tray is provided below the refrigeration module, the water receiving tray receives the water droplets condensed by the refrigeration module, and the water receiving tray can be communicated with the pipeline system.

The special-shaped tube cooling and cooling system of this creation can achieve the following effects:

(1) Through the structural design of the liquid cooling pipe of the refrigeration module and the heat dissipation pipe of the heat dissipation row, aluminum extrusion pipes can be used as the liquid cooling pipe and the heat dissipation pipe.

(2) The multi-flow channel structure in the liquid cooling pipe and the heat dissipation pipe can make the liquid circulate in the flat-shaped flow channel, which greatly improves the flow of the liquid; There is no need to add other fins to achieve a good heat exchange effect.

(3) In this creation, the diversion kit can be a plastic-molded component, which can more quickly and conveniently combine the liquid cooling tube and the heat dissipation tube with the diversion kit. The backflow groove structure of the guide sleeve enables the liquid cooling pipe to communicate with a plurality of flow channels inside the heat dissipation pipe, prolongs the liquid circulation stroke, and improves the effect of the liquid flowing back through the heat dissipation radiator.

Hereinafter, the structural features and other functions and purposes of this creation will be described in detail as follows according to the accompanying drawings:

Referring to FIG. 1 , the special-shaped tube cooling and heat dissipation system of the present invention generates the required cooling air by cooling the chip, and then removes the unnecessary waste heat. A preferred embodiment of the invention includes one or more cooling molds. Group A1, a cooling module B2 and a piping system C3, wherein:

Referring to FIGS. 1 to 4 , the cooling module A1 has at least a cooling chip 10 , a liquid cooling tube 20 , a cooling fin 30 and a first fan 40 . The cooling chip 10 is a semiconductor that can be freely cooled and temperature controlled by direct current. It is an existing product. One side is a cold side 11 and the other side is a hot side 12. According to the prior art, the cooling chip is energized. At 10:00, the cold surface 11 can generate heat absorption, while the hot surface 12 can generate heat release, and the temperature difference between the cold surface 11 and the hot surface 12 reaches 58°C. The liquid cooling tube 20 is attached to a hot surface 12 of the cooling wafer 10 through a graphite thermal conductive sheet or a plurality of clamps 33 , and a cooling liquid is input into the liquid cooling tube 20 for connecting with the cooling wafer 10 . The hot surface 12 performs heat exchange, so that the cold liquid is converted into a hot liquid to flow out, thereby removing the heat released by the hot surface 12 . The cooling fin 30 is a heat dissipation fin configuration made of aluminum alloy. One flat surface 32 of the cooling fin 30 is attached to the cold surface 11 of the cooling wafer 10 through a graphite heat-conducting sheet or a plurality of clamps 33 , and the other surface has a plurality of fins 31. The first fan 40 is preferably a radial fan, driven by a motor (not shown) to drive air through the cooling fins 30 to generate (blow out) cold air; the first fan 40 can also be an axial fan , can also achieve the same effect. In addition, as shown in FIG. 5 , a plurality of the cooling chips 10 can also be arranged side by side on one side of the cooling fins 30 , and the hot surfaces 12 of the cooling chips 10 share a liquid cooling tube 20 .

The heat dissipation module B2 mainly implements a heat dissipation row 50 and a second fan 60. The heat dissipation row 50 is used for circulating the hot liquid flowing out of the liquid cooling pipe 20, so as to discharge the heat in the hot liquid. The second fan 60 is preferably an axial flow fan, which is disposed on one side of the radiator 50, and drives air to pass through the surface of the radiator 50, so that the cold air and the radiator 50 can exchange heat with each other, so as to discharge the radiator. 50 and the heat of hydrothermal.

The pipeline system C3 is a pipeline for circulating the cooling liquid and the hot liquid in the cooling module A1 and the cooling module B2, and is connected to the liquid cooling pipe 20 of the cooling module A1 and the cooling module A1. Between the heat sinks 50 of the heat dissipation module B2, the cold liquid in the heat sink 50 is pumped to the liquid cooling pipe 20 through a liquid pump 70 in the pipeline, and the cold liquid is in the liquid cooling pipe 20 with the cooling liquid. The hot surface 12 of the cold wafer 10 exchanges heat to form a hot liquid, and the hot liquid flows back to the heat sink 50 to dissipate heat and become a cold liquid. Specifically, the piping system C3 includes a first piping 71 for allowing the cooling liquid to flow from the heat sink 50 to the liquid cooling pipe 20 , and a first piping 71 for allowing the hot liquid to return from the liquid cooling pipe 20 to the heat dissipation block 50 . The second pipeline 72 . The first pipeline 71 can be provided with the liquid pump 70, the second pipeline 72 can be provided with a liquid storage tank 80, and the liquid storage tank 80 can store the liquid required by the system; and the second pipeline 72 A pressure relief valve 90 may be implemented in the piping system for reducing excessive pressure in the piping system.

Referring to FIGS. 2 , 3 , 6 and 7 , one of the main features of the present invention is that the above-mentioned liquid cooling tube 20 is a straight tube body extruded from aluminum alloy, and is a flat shape whose width in the cross-sectional direction is greater than its height. Tube body; three flow channels 21a, 21b, 21c are formed in the liquid cooling tube 20, which are directly connected to both ends thereof, and there is an integrally formed partition 22 between each of the flow channels 21a, 21b, 21c. Two ends of the liquid cooling tube 20 are respectively combined with a first guide sleeve 23, and the first guide sleeve 23 at one or both ends of the first guide sleeve 23 is recessed corresponding to the inner surface of the liquid cooling tube 20 and communicated between the two flow channels. A return groove 231 enables the flow channels 21a, 21b, 21c of the liquid cooling tube 20 to form a circuitous structure through the first return groove 231 (as shown in FIG. 6 ), prolonging the time of liquid circulation and heat exchange. The first guide sleeve 23 can be respectively provided with a first liquid inlet pipe 24 and a first liquid outlet pipe 25, and the first liquid inlet pipe 24 and the first liquid outlet pipe 25 are respectively used for connecting to the above-mentioned pipeline. System C3.

Referring to FIG. 8 , FIG. 9 and FIG. 10 , another feature of the present invention is that the heat dissipation radiator 50 has a plurality of heat dissipation pipes 51 , and a second guide element 52 combined with both ends of the plurality of heat dissipation pipes 51 . The plurality of radiating pipes 51 are arranged in parallel at a distance from each other. Each radiating pipe 51 is a straight pipe body extruded from aluminum alloy. Three flow channels 511a, 511b, and 511c are formed which are directly connected to both ends thereof, and an integrally formed partition 512 is provided between each of the flow channels 511a, 511b, and 511c. Referring to FIG. 11 and FIG. 12 , at least one return groove 521 is concavely formed in the second guide sleeve 52 corresponding to the two flow channels of the heat dissipation pipe 51 , and one of the second guide sleeve 52 is provided with a first return groove 521 . Two liquid inlet pipes 53 and a second liquid outlet pipe 54 (as shown in FIG. 8 ). The second liquid inlet pipe 53 and the second liquid outlet pipe 54 are respectively connected to the selected return groove 521, and the other ends thereof are connected to the first pipeline 71 and the second pipeline 72 of the pipeline system C3. Thereby, both ends of the heat dissipation pipe 51 are sealed and combined with the return groove 521 respectively, so that the return groove 521 is communicated between the two flow channels of the heat dissipation pipe 51 , and the hot liquid in the heat dissipation pipe 51 is The flow channels 511a, 511b, and 511c flow in a detour, thereby prolonging the time for liquid circulation and heat exchange.

Referring to FIGS. 8 and 9 again, the upper and lower surfaces of the second guide member 52 are provided with connecting pipes 55 and 56 connected to the return groove 521 or the flow channel, so that most of the heat dissipation radiators 50 are arranged in parallel. The second guide sleeves 52 at both ends of the pipe 51 are connected together up and down through the connecting pipes 55 and 56 . In this way, after the hot liquid circulates between the three flow channels 511a, 511b, 511c in one heat dissipation pipe 51 in a detour (as shown in FIG. 11 ), it flows to the next heat dissipation pipe through the connecting pipes 55 and 56 The pipe 51 circulates in a detour (as shown in Figure 12), and then flows to the next radiating pipe 51. In this way, connecting most of the radiating pipes 51 in series prolongs the circulation stroke of the hydrothermal fluid and improves its heat exchange effect. In addition, it is not necessary to implement conventional heat dissipation fins on the outer wall of the tube, and a good heat dissipation effect can also be achieved.

Referring to FIG. 1 again, the pressure reducing valve 90 is connected to the second pipeline 72 or the first pipeline 71 of the pipeline system C3. The pressure reducing valve 90 is internally implemented with an expandable and shrinkable sphere 91, so that the The super-high pressure cold liquid or hot liquid flows to the ball 91 of the pressure reducing valve 90, and when the pressure drops, the liquid in the ball 91 is returned to the circulation system. In addition, a water receiving tray 100 may be provided below the refrigeration module A1, and the water receiving tray 100 is used to receive the water droplets condensed from the refrigeration module A1. water used in this refrigeration and cooling system.

To sum up, the special-shaped tube cooling and heat dissipation system of this creation has indeed been practical and creative, and the application of its technical means is undoubtedly novel, and the efficacy and design purpose are indeed consistent, and it has been called a reasonable progress to the point. . To this end, we have filed an application for a new type of patent in accordance with the law, but we urge the Jun Bureau to give it a detailed review and grant the patent for prayer.

A1: cooling module B2: cooling module C3: Piping system 10: Refrigeration wafer 11: Cold Noodles 12: Hot Noodles 20: Liquid cooling tube 21a, 21b, 21c: runner 22: Separator 23: The first diversion kit 231: The first reflow groove 24: The first liquid inlet pipe 25: The first liquid outlet pipe 30: Cooling fins 31: Fins 32: Flat surface 33: Fixtures 40: First fan 50: heat sink 51: heat pipe 511a, 511b, 511c: runners 512: Separator 52: Second diversion kit 521: Reflow groove 53: Second liquid inlet pipe 54: The second liquid outlet pipe 55, 56: connecting pipe 60: Second fan 70: Liquid pump 71: The first pipeline 72: Second pipeline 80: Tank 90: Pressure reducing valve 91: Sphere 100: water tray

[Fig. 1] The system schematic diagram of the special-shaped tube cooling and cooling system for this creation. [FIG. 2] is a three-dimensional schematic diagram of a preferred embodiment of a refrigeration module for the creation of the present invention. [FIG. 3] An exploded schematic diagram of a preferred embodiment of a refrigeration module for the creation of the present invention. FIG. 4 is a schematic front view of a preferred embodiment of a cooling chip in the cooling module of the present invention. [FIG. 5] A schematic diagram of a front view of a preferred embodiment of a plurality of cooling chips in a cooling module of the present invention. [FIG. 6] A schematic cross-sectional view of a preferred embodiment of the liquid cooling tube of the present invention. [FIG. 7] An exploded schematic diagram of a preferred embodiment of the liquid cooling tube of the present invention. [FIG. 8] A three-dimensional schematic diagram of a preferred embodiment of a heat sink for the creation of the present invention. [FIG. 9] A schematic diagram of a front view of a preferred embodiment of the heat dissipation radiator of the present invention. [FIG. 10] A partial enlarged schematic view of a preferred embodiment of the heat pipe of the invention. [Fig. 11] A schematic diagram of the flow direction of the thermal fluid in the heat pipe of the present invention. [Fig. 12] A schematic diagram of the flow direction of the hot liquid in another heat dissipation pipe of the present invention.

A1: cooling module

B2: cooling module

C3: Piping system

10: Refrigeration wafer

20: Liquid cooling tube

24: The first liquid inlet pipe

25: The first liquid outlet pipe

30: Cooling fins

31: Fins

40: First fan

50: heat sink

60: Second fan

70: Liquid pump

71: The first pipeline

72: Second pipeline

80: Tank

90: Pressure reducing valve

91: Sphere

100: water tray

Claims (10)

A special-shaped tube refrigeration and heat dissipation system, comprising: A cooling module, which has at least a cooling chip, a liquid cooling tube, a cooling fin and a first fan; the liquid cooling tube is attached to the hot surface of the cooling chip, and the cooling fin is attached to the the cooling surface of the cooling chip, the first fan drives air to pass through the cooling fin to generate cold air; a heat dissipation module, which has a heat dissipation row and a second fan, the heat dissipation row has a plurality of heat dissipation pipes arranged in parallel, and the second fan drives air to pass through the surface of the heat dissipation row to discharge the heat of the heat dissipation row; A pipeline system is connected between the liquid cooling pipe of the refrigeration module and the heat sink of the heat dissipation module, so that a cooling liquid in the heat sink is pumped to the liquid through a liquid pump in the pipeline A cold pipe, the cold liquid exchanges heat with the hot surface of the refrigerating chip in the liquid cooling pipe to become a hot liquid, and the hot liquid flows back to the heat sink to dissipate heat to become the cold liquid, which is characterized by: The liquid-cooling pipe and the heat-dissipating pipe are respectively straight pipe bodies extruded from aluminum alloy, and are flat-shaped pipe bodies whose cross-sectional width is greater than their height; The flow channels at both ends are provided with integrally formed baffles between the flow channels; The two ends of the liquid cooling tube are respectively combined with a first flow guide sleeve, and the first flow guide sleeve at one or both ends corresponds to the inner surface of the liquid cooling tube and is concavely provided with a first return flow connecting the two flow channels of the liquid cooling tube a groove, so that the flow channel of the liquid cooling tube forms a circuitous structure through the first return groove; the first guide sleeve is also provided with a first liquid inlet pipe and a first liquid outlet pipe, the first inlet pipe The liquid pipe and the first liquid outlet pipe are respectively connected to the pipeline system; The plurality of radiating pipes are arranged in parallel at a distance from each other, and two ends of each radiating pipe are respectively combined with a second guide sleeve, and the second guide sleeve at one or both ends is concavely connected to the inner surface of the radiating pipe. The second return groove of the two flow channels of the heat dissipation pipe enables the flow channel of the heat dissipation pipe to form a circuitous structure through the second return groove; and a second liquid inlet is provided on the selected second guide sleeve pipe and a second liquid outlet pipe, the second liquid inlet pipe and the second liquid outlet pipe are respectively connected to the pipeline system. The special-shaped tube refrigeration and heat dissipation system as claimed in claim 1, wherein the liquid cooling tube has three flow channels and two partitions; Between two of the three runners. The special-shaped pipe refrigeration and heat dissipation system according to claim 1, wherein the heat dissipation pipe has three flow passages and two partition plates, and the second return groove of the second guide sleeve includes three channels connected to the heat dissipation pipe. between two of the runners. The special-shaped tube refrigeration and heat dissipation system as claimed in claim 1 or 3, wherein the upper and lower surfaces of the second guide sleeve are provided with connecting pipes connected to the return groove or flow channel, so that most of the heat sinks are arranged in parallel. The second guide sleeves at both ends of the heat dissipation pipe are connected together through the connecting pipe. The special-shaped tube refrigeration and heat dissipation system as claimed in claim 1 further comprises a liquid storage tank, the liquid storage tank is connected to the pipeline system, and the cold liquid is stored in the liquid storage tank. The special-shaped tube refrigeration and heat dissipation system as claimed in claim 5, further comprising a pressure reducing valve, the pressure reducing valve is connected to the pipeline system, and the pressure reducing valve has an expandable and contractible sphere, so that the excessive pressure The cold liquid flows to the ball of the pressure reducing valve. The special-shaped tube cooling and heat dissipation system according to claim 1 or 2, wherein one side of the liquid cooling tube is attached to the hot side of the cooling wafer through a graphite heat-conducting sheet or a plurality of clamps. The special-shaped tube cooling and heat dissipation system as claimed in claim 1 or 2, wherein a plurality of the cooling chips are arranged side by side on one side of the cooling fins, and the hot surfaces of the cooling chips are jointly attached to the liquid cooling side of the tube. The special-shaped tube cooling and heat dissipation system as claimed in claim 8, wherein one side of the cooling fin is attached to the cold side of the cooling chip through a graphite heat-conducting sheet. The special-shaped tube refrigeration and heat dissipation system as claimed in claim 1, wherein a water receiving tray is arranged below the refrigeration module, the water receiving tray receives the water droplets condensed from the refrigeration module, and the water receiving tray can be communicated with the pipeline system.

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