JP7359473B2 - Irregular tube cooling and heat dissipation system - Google Patents

Description

TECHNICAL FIELD The present invention relates to the technical field of cooling systems, and particularly to a profiled tube cooling and heat dissipation system applied in products requiring cooling or heat dissipation.

Nowadays, many industries require the use of cooling systems, and many conventional cooling systems employ refrigerants. By connecting the evaporator, condenser, compressor, and piping system together, the refrigerant transitions from the liquid state to the gas state in the evaporator, and in the process, an endothermic effect works to generate low-temperature cold air. Although there are a variety of systems that employ refrigerant cooling technology, in which the gaseous refrigerant is transported to a condenser and then transferred to a liquid state, releasing heat from the material in the process, they all follow the principles described above. There is no deviation from this.

After physicist Thomas Johann Seebeck discovered the thermoelectric effect in 1821, he continued to conduct intensive research into materials science and technology. Cooling chips made by applying semiconductor materials have already achieved very good cooling efficiency, which is sufficient for a wide range of industrial applications, and allows people to reduce their dependence on refrigerants and become more environmentally friendly. It is possible to obtain the necessary cold using a thoughtful method. There are already some cooling systems constructed using cooling chip designs, however, the technology used for heat dissipation is not foolproof, and traditional condenser copper tubes and the outer surface of the copper tubes are Technology that relies on heat dissipation fins will become indispensable.

Conventional condensers usually use circular copper tubes, and their cross-sectional shape is circular, so based on the isoperimetric theorem, the circumference of a circle is the shortest among geometric shapes, and for the same reason, heat conduction and The circumferential surface on which heat can be exchanged is also the smallest, and the area of the wind receiving area is only half of the circumferential surface, and the leeward surface does not receive wind, which limits the heat exchange efficiency. In order to improve the heat exchange efficiency of the conventional circular copper tube, a large number of heat dissipation fins must be attached to the outside of the copper tube. However, adding more heat dissipation fins inevitably increases the manufacturing process and cost, and leads to the problem of insufficient efficiency without changing the pure air heat exchange.

In addition, when both ends of a conventional circular copper tube and other copper tubes are connected to form a circular circulation flow path, it is necessary to use a short section of the copper tube and first bend it into a semicircular connecting tube. There is. Then, after increasing the diameter of both ends of the circular copper tube mentioned above, insert the end of the semi-annular connecting tube into the end of the circular copper tube, and weld the end of the circular copper tube and the connecting tube. give Therefore, the craft work involved in making them is quite complicated.

In order to solve the above-mentioned conventional technical problems, the present invention provides a modified tube cooling and heat dissipation system including a cooling module, a heat dissipation module, and a conduit system. The cooling module includes a cooling chip, a liquid cooling tube, cooling fins, and a first fan, and is used to generate cold air. The heat dissipation module has a heat dissipation radiator and a second fan, and the heat dissipation radiator includes a plurality of heat dissipation pipes, and the heat dissipation module passes through a pipe system to transfer the heat of the cooling module to the heat dissipation radiator using a liquid as a medium. Once transported, the heat in the liquid is removed and the liquid is recirculated back to the cooling module. In particular, the liquid cooling tube and the heat dissipation tube are flat tube bodies made of extruded aluminum alloy, and are used to improve the heat dissipation area, so that it is not necessary to attach heat dissipation fins. The interiors of the liquid cooling tube and the heat dissipation tube are defined by a plurality of channels, and the liquid is circulated through the plurality of channels. A flow guide sleeve member is coupled to both ends of the liquid cooling pipe and the heat dissipation pipe, respectively, and the flow guide sleeve member may be used for connection with the pipe line system, and the flow guide sleeve member may be used for connection with the pipe system. It may be used to cascade the heat dissipation tubes to form a circulating heat dissipation flow path.

(1) According to the structural design of the liquid cooling tube of the cooling module and the heat dissipation tube of the heat dissipation radiator, it is also possible to use extruded aluminum tubes as the liquid cooling tube and the heat dissipation tube.
(2) The multi-channel structure in the liquid cooling tube and the heat dissipation tube makes it possible to circulate the liquid in the flat-shaped channels, greatly increasing the number of paths through which the liquid flows. At the same time, the area for heat exchange can be increased by the flat tubular peripheral wall, and a good heat exchange effect can be achieved without requiring additional attachment of other fins.
(3) The flow guide sleeve member of the present invention may be a plastic component, so that the liquid cooling tube and the heat dissipation tube can be integrated with the flow guide sleeve member more quickly and conveniently. According to the recirculation groove structure of the flow guide sleeve member, the multiple channels inside the liquid cooling tube and the heat dissipation tube are in continuous communication, extending the path through which the liquid flows, and dissipating the heat of the liquid. Improves the effect of bypassing the flow to the radiator.

FIG. 1 is a system schematic diagram of the irregular tube cooling and heat dissipation system of the present invention. 1 is a perspective view showing an embodiment of a cooling module of the present invention. FIG. 1 is an exploded perspective view showing an embodiment of the cooling module of the present invention. FIG. 3 is a front view showing an embodiment of one cooling chip in one cooling module of the present invention. FIG. 3 is a front view showing an embodiment of a plurality of cooling chips in one cooling module of the present invention. 1 is a cross-sectional view showing an embodiment of a liquid cooling tube of the present invention. FIG. 1 is an exploded perspective view showing an embodiment of a liquid cooling tube of the present invention. FIG. 1 is a perspective view showing an embodiment of a heat dissipation radiator of the present invention. FIG. 1 is a front view showing an embodiment of a heat dissipation radiator of the present invention. 1 is an enlarged perspective view of a portion of an embodiment of a heat dissipation tube of the present invention. FIG. 3 is a cross-sectional view showing the flow direction of hot liquid in the heat dissipation tube of the present invention. FIG. 7 is a cross-sectional view showing the flow direction of hot liquid in another heat dissipation tube of the present invention.

As shown in FIG. 1, the irregular tube cooling and heat dissipation system of the present invention removes unnecessary waste heat after generating the required cold air through the cooling chip 10. Alternatively, it includes one or more cooling modules A1, a heat dissipation module B2, and a conduit system C3. Among them, as shown in FIGS. 1 to 4, the cooling module A1 includes at least a cooling chip 10, a liquid cooling pipe 20, a cooling fin 30, and a first fan 40. The cooling chip 10 is a type of semiconductor that can be freely cooled and temperature controlled by direct current, and is an existing product, with one side being a cold surface 11 and the other side being a hot surface 12. With the existing technology, when the cooling chip 10 is energized, its cold surface 11 absorbs heat, while its hot surface 12 causes heat radiation, and the temperature difference between the cold surface 11 and the hot surface 12 reaches 58 degrees Celsius. . The liquid cooling tube 20 is bonded to the hot surface 12 of the cooling chip 10 via a graphite thermally conductive sheet or a plurality of clamps 33, thereby inputting the cold liquid into the liquid cooling tube 20 and dissipating the heat of the cooling chip 10. It is used to exchange heat with the surface 12, converting the cold liquid into a hot liquid and draining it before removing the amount of heat released from the hot surface 12. The cooling fin 30 has a heat dissipating fin structure made of aluminum alloy, and its flat surface 32 is bonded to the cold surface 11 of the cooling chip 10 via a graphite thermally conductive sheet or a plurality of clamps 33, and the other surface is bonded to the cold surface 11 of the cooling chip 10. has a large number of fins 31. The first fan 40 is preferably a radial fan, and generates (blows out) cool air by urging air to pass through the cooling fins 30 in conjunction with a motor (not shown). Furthermore, an axial fan may be used as the first fan 40, and similar effects can be achieved. In addition, referring to FIG. 5, a large number of cooling chips 10 can be installed in parallel on one surface of the cooling fins 30 at the same time, and the thermal surface 12 of each cooling chip 10 can be shared by one liquid cooling pipe 20. There is.

The heat dissipation module B2 is implemented so as to mainly include a heat dissipation radiator 50 and a second fan 60, and the heat dissipation radiator 50 is provided for bypassing the hot liquid flowing out from the liquid cooling pipe 20 described above. It is used to discharge the amount of heat in the heated liquid. The second fan 60 is preferably an axial fan, and is installed on one side of the heat dissipation radiator 50 to encourage air to pass through the surface of the heat dissipation radiator 50, thereby exchanging heat between the cold air and the heat dissipation radiator 50. It is used to discharge heat from the heat dissipation radiator 50 and the hot liquid.

The conduit system C3 is a conduit used to circulate the above-mentioned cold liquid and hot liquid to the cooling module A1 and the heat radiation module B2. The cold liquid in the heat radiation radiator 50 is sent to the liquid cooling pipe 20 via the liquid pump 70 in the pipe line, and the cold liquid flows into the liquid cooling pipe 20 to cool the cooling chip 10. The hot liquid exchanges heat with the hot surface 12 of the hot liquid to become a hot liquid, and the hot liquid is recirculated into the heat dissipating radiator 50 to radiate heat and become a cold liquid. Specifically, the pipe line system C3 includes a first pipe line 71 that allows cold liquid to flow from the heat dissipation radiator 50 into the liquid cooling pipe 20, and a second pipe line that allows hot liquid to flow back from the liquid cooling pipe 20 to the heat dissipation radiator 50. 72. Among them, a liquid pump 70 is installed in the first pipe line 71, and a liquid storage tank 80 is installed in the second pipe line 72, and the liquid required for the system is stored in the liquid storage tank 80. A pressure reducing valve 90 is also implemented in the second line 72 and is used to reduce too high a pressure in the line system C3.

Referring to FIGS. 2, 3, 6, and 7, one of the main features of the present invention is that the liquid cooling tube 20 described above is a straight tube made of extruded aluminum alloy, and has a width in the cross-sectional direction. is a flat tube whose height is larger than that, and three channels 21a, 21b, and 21c are formed inside the liquid cooling tube 20, with both ends directly connected to each other, and between each channel 21a, 21b, and 21c, This is to interpose an integrally molded partition plate 22. A first flow guide sleeve member 23 is connected to both ends of the liquid cooling pipe 20, and two flow guide sleeve members 23 are connected to the first flow guide sleeve member 23 at one or both ends of the liquid cooling pipe 20, corresponding to the inner surface of the liquid cooling pipe 20. A first reflux groove 231 is recessed to communicate between the channels, and the channels 21a, 21b, and 21c of the liquid cooling tube 20 are formed to have a structure in which they flow in a detour manner via the first reflux groove 231. (see FIG. 6), and the time for liquid flow and heat exchange can be extended. The first flow guide sleeve member 23 is provided with a first liquid inlet pipe 24 and a first liquid outlet pipe 25, respectively. It is used to connect to the road system C3.

Referring to FIGS. 8, 9 and 10, as another feature of the present invention, the heat dissipation radiator 50 described above includes a plurality of heat dissipation tubes 51 and a second flow connected to both ends of the plurality of heat dissipation tubes 51. A guide sleeve member 52 is included. The plurality of heat dissipation tubes 51 are arranged in parallel with each other at a predetermined distance, and each heat dissipation tube 51 is a straight tube body made of extruded aluminum alloy, and each straight tube body has a width in the cross-sectional direction that is larger than its height. It is a large flat tubular body, and three channels 511a, 511b, and 511c are formed in the interior thereof, the two ends of which are directly connected, and an integrally molded partition plate 512 is interposed between each channel 511a, 511b, and 511c. . As shown in FIGS. 11 and 12, the second flow guide sleeve member 52 is provided with at least one second return groove 521 corresponding to the two flow paths of the heat dissipation tube 51. One second flow guide sleeve member 52 is provided with a second liquid inlet pipe 53 and a second liquid outlet pipe 54 (see FIG. 8). The second liquid inlet pipe 53 and the second liquid outlet pipe 54 are communicated with the selected second recirculation groove 521, respectively, and their other ends are connected to the first pipe line 71 and the second pipe line of the pipe line system C3. 72. As a result, both ends of the heat dissipation tube 51 are hermetically connected to the second recirculation groove 521, and the second recirculation groove 521 is communicated between the two channels of the heat dissipation tube 51, so that the hot liquid is transferred into the heat dissipation tube 51. It is possible to make the liquid flow in a detour into the flow paths 511a, 511b, and 511c to extend the time for liquid distribution and heat exchange.

As shown in FIGS. 8 and 9 again, connecting pipes 55 and 56 communicating with the second return groove 521 or the flow path are provided on the upper and lower surfaces of the second flow guide sleeve member 52, and the connecting pipes 55 and 56 are provided on the upper and lower surfaces of the second flow guide sleeve member 52, and the connecting pipes 55 and 56 are connected to the second return groove 521 or the flow path. The second flow guide sleeve members 52 at both ends of a plurality of heat dissipation tubes 51 arranged in parallel are vertically connected integrally through connecting tubes 55 and 56. As a result, the hot liquid is allowed to detour between the three channels 511a, 511b, and 511c in one heat dissipation pipe 51 (see FIG. 11), and then further passes through the connecting pipes 55 and 56. It flows into the next heat dissipation pipe 51 and then flows in a detour (see FIG. 12), and then flows into the next next heat dissipation pipe 51, and in this way, the plurality of heat dissipation pipes 51 By cascading the pipes, the flow path of the hot liquid can be extended, and the heat exchange effect can be increased. Moreover, a good heat radiation effect can be obtained without providing conventional heat radiation fins on the outer wall of the tube.

Referring again to FIG. 1, the pressure reducing valve 90 described above is connected to the second pipe line 72 or the first pipe line 71 of the pipe system C3, and the pressure reducing valve 90 includes a sphere 91 that can be expanded or contracted. The overpressure cold or hot liquid is allowed to flow into the sphere 91 of the pressure reducing valve 90, and upon pressure drop the liquid within the sphere 91 is recirculated into the circulation system. In addition, a water tray 100 may be provided below the cooling module A1, and the water tray 100 is used to catch water droplets condensed on the cooling module A1, and the water tray 100 is connected to the pipe system C3. The recovered water can also be applied in the present cooling and heat dissipation system.

A1 Cooling module B2 Heat dissipation module C3 Pipe system 10 Cooling chip 11 Cold surface 12 Hot surface 20 Liquid cooling tubes 21a, 21b, 21c Channel 22 Partition plate 23 First flow guide sleeve member 231 First return groove 24 First input Liquid pipe 25 First liquid output pipe 30 Cooling fin 31 Fin 32 Flat surface 33 Clamp 40 First fan 50 Heat radiation radiator 51 Heat radiation pipes 511a, 511b, 511c Flow path 512 Partition plate 52 Second flow guide sleeve member 521 Second reflux concave Groove 53 Second liquid inlet pipe 54 Second liquid outlet pipes 55, 56 Connecting pipe 60 Second fan 70 Liquid pump 71 First pipe line 72 Second pipe line 80 Liquid storage tank 90 Pressure reducing valve 91 Sphere 100 Water tray

Claims (10)

a cooling module having at least a cooling chip, a liquid cooling tube, a cooling fin, and a first fan; a heat radiation module having a heat radiation radiator; and a second fan; the liquid cooling tube of the cooling module and the heat radiation module. and a pipe system connected between the heat dissipating radiator and the heat dissipating radiator,
The liquid cooling tube is bonded to the hot surface of the cooling chip, the cooling fin is bonded to the cold surface of the cooling chip, and the first fan generates cold air by urging air to pass through the cooling fin. used to generate
The heat dissipation radiator includes a plurality of heat dissipation tubes arranged in parallel, and the second fan is used to discharge heat from the heat dissipation radiator by encouraging air to pass through a surface of the heat dissipation radiator. is,
The cold liquid in the heat dissipation radiator is sent to the liquid cooling pipe via a liquid pump in the pipe, and the cold liquid exchanges heat with the hot surface of the cooling chip in the liquid cooling pipe. The hot liquid becomes a hot liquid, and the hot liquid is recirculated into the heat dissipating radiator to radiate heat and become the cold liquid,
The liquid cooling tube and the heat dissipation tube are each a straight tube body made of extruded aluminum alloy, and are flat tube bodies whose width in the cross-sectional direction is larger than their height. Two or more channels are formed in the interior, the ends of which are directly connected, and an integrally formed partition plate is interposed between each channel,
A first flow guide sleeve member is connected to both ends of the liquid cooling tube, and the first flow guide sleeve member at one or both ends has the liquid cooling tube connected to the inner surface of the liquid cooling tube. A first reflux groove that communicates with the two channels of the tube is recessed, and the flow path of the liquid cooling tube is formed to have a detour flow through the first reflux groove. The first flow guide sleeve member is also provided with a first liquid inlet pipe and a first liquid outlet pipe, and each of the first liquid inlet pipe and the first liquid outlet pipe is connected to the pipe line system. is,
The plurality of heat dissipation tubes are arranged in parallel at a predetermined distance from each other, and a second flow guide sleeve member is connected to both ends of each of the heat dissipation tubes, and the second flow guide sleeve member is connected to both ends of each of the heat dissipation tubes. The guide sleeve member is provided with a second reflux groove corresponding to the inner surface of the heat radiating tube and communicating with the two flow paths of the heat radiating tube, and the flow path of the heat radiating tube is connected to the second reflux groove. The selected second flow guide sleeve member is formed to have a structure for bypassing the flow through the concave groove, and the selected second flow guide sleeve member is provided with a second liquid inlet pipe and a second liquid outlet pipe, and the second liquid inlet pipe is provided with a second liquid inlet pipe and a second liquid outlet pipe. The irregular tube cooling and heat dissipation system is characterized in that the tube and the second liquid output tube are respectively connected to the pipeline system. The liquid cooling tube includes three channels and two partition plates, and the first return groove of the first flow guide sleeve member is one of the three channels of the liquid cooling tube. The irregular tube cooling and heat dissipation system according to claim 1, characterized in that the two channels are in communication with each other. The heat dissipation tube includes three channels and two partition plates, and the second return groove of the second flow guide sleeve member is one of the three flow channels of the heat dissipation tube. The irregular tube cooling and heat dissipation system according to claim 1, characterized in that the two channels are in communication with each other. Connection pipes communicating with the second return groove or flow path are provided on the upper and lower surfaces of the second flow guide sleeve member, and the second The irregular tube cooling and heat dissipation system according to claim 1 or 3, characterized in that a flow guide sleeve member is integrally connected through the connecting tube. The irregular tube cooling and heat dissipation system according to claim 1, further comprising a liquid storage tank connected to the pipe system, and storing the cold liquid in the liquid storage tank. further comprising a pressure reducing valve coupled into the conduit system, the pressure reducing valve having an inflatable or deflated sphere for causing the overpressure cold liquid to flow to the bulb of the pressure reducing valve. A profiled tube cooling and heat dissipation system according to claim 5, characterized in: The irregular shaped tube cooling and heat dissipation according to claim 1 or 2, characterized in that one surface of the liquid cooling tube is bonded to the heating surface of the cooling chip via a graphite heat conductive sheet or a plurality of clamps. system. A plurality of the cooling chips are simultaneously installed in parallel on one surface of the cooling fin, and a thermal surface of each cooling chip is commonly bonded to one surface of the liquid cooling tube. Item 2. The irregularly shaped tube cooling and heat dissipation system according to item 2. 9. The irregular tube cooling and heat dissipation system according to claim 8, wherein one surface of the cooling fin is bonded to the cold surface of the cooling chip via a graphite thermally conductive sheet. The modified tube cooling system according to claim 1, characterized in that a water tray is provided below the cooling module, and the water tray communicating with the pipe system receives water droplets condensed on the cooling module. heat dissipation system.

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