TWM627124U - Heat dissipation apparatus - Google Patents

Abstract

The present invention creates a heat dissipation device, comprising an aluminum base and at least one or both of a copper two-phase flow element or a copper heat conduction element, the aluminum base has an upper side and a lower side, and is located on the A bonding area is formed on the lower side to provide a copper intercalation layer. Either or both of the copper two-phase flow element or the copper heat conduction element are arranged in the bonding area, so as to be in phase with the copper intercalation layer. In combination, the present invention enables the aluminum base and the copper two-phase flow element and/or the copper heat conduction element of dissimilar metals to be directly welded and combined without the need for a nickel treatment process through the arrangement of the copper intercalation layer. By.

Description

heat sink

The present invention relates to a heat dissipation device, especially a copper two-phase flow element that provides a copper embedded layer on the joint area where the aluminum base is to be combined, so that the aluminum base and a different metal /Or the copper heat conduction element can be directly welded to the heat sink without going through the nickel treatment process.

According to this, conventional radiators or heat dissipation modules are generally made of copper or aluminum material. Since copper has the characteristics of high heat conduction efficiency, conventional heat sinks or heat dissipation modules are usually made of copper material as the heat dissipation base. As the heat generated by the conduction execution unit (central processing unit, graphics card chip or other transistor or heat source) for heat exchange; but if the heat sink or heat dissipation module is made of copper, its weight is extremely heavy and the cost is high; therefore The current method is to directly use copper materials for components that are in contact with the heat source and will be absorbed into the heat source (such as heat conduction units (pieces, bodies, seats), copper plates, and two-phase flow elements (such as heat pipes, vapor chambers, etc.) The other components (combined fins, fins, heat sinks, heat sinks) are made of relatively light-weight and low-cost aluminum material to reduce weight and cost. For example, in order to provide a good heat transfer effect, the current general aluminum extruded heat sinks are often directly combined or recessed at the bottom of the heat sink to facilitate the installation of at least one copper heat pipe with better heat conduction or temperature uniformity. A metal copper plate is used to cover the plate or a metal copper plate is used to contact the heat source. However, because the aluminum surface of the aluminum extrusion radiator is easily oxidized, and the high melting point oxide (Al2O3) generated during the welding process will directly hinder the fusion with the copper metal and bring difficulties to welding, because if the copper metal and the When the aluminum metal is directly welded, the part where the two copper and aluminum materials are directly welded will be prone to cracks due to the large brittleness after welding; and when the copper metal and the aluminum metal are welded, the weld close to the copper metal side It is easy to form eutectic such as cuAl2 in the material, and the eutectic structure such as cuAl2 will be distributed near the grain boundaries of the material, and it is easy to cause fatigue or cracks between the grain boundaries. Moreover, the melting point and eutectic temperature of copper and aluminum are very different, so when the surface of the aluminum metal is completely melted in the fusion welding operation, the copper metal is still in a solid state; on the contrary, when the copper metal is melted, the aluminum metal has long been. It melts a lot and cannot coexist in a eutectic or eutectic state, which greatly increases the difficulty of welding copper and aluminum. In addition, because the welding seam is prone to pores, and the thermal conductivity of copper metal and aluminum metal is very good, the molten pool metal crystallizes quickly during welding, so that the metallurgical reaction gas at high temperature cannot escape, so pores are easily generated. Based on the above problems, the reason why the contact surface between the aluminum extrusion radiator and the copper heat pipe and/or metal copper plate cannot be directly welded. Therefore, in order to solve the above-mentioned problems that the two dissimilar metal materials of aluminum and copper cannot be directly welded and the above-mentioned extension problems, the method adopted by the industry is to place the aluminum extruded heat sink on the surface of the copper heat pipe and/or the metal copper plate in contact with the surface. After surface treatment and modification, it is convenient to weld two dissimilar metals; that is, a layer of electroless nickel plating should be formed in advance on the bottom of the aluminum extruded heat sink and the inner surface of the groove or its opposite bonding contact surface. Nickel plating allows two dissimilar metals (the two dissimilar metals are aluminum and copper) to be welded. Those who are currently familiar with the art are the use of electroless nickel plating as a metal surface modification technique, which provides unique deposit properties, including deposit uniformity in deep depressions, holes and blind holes; among which electroless plating Nickel can also be called chemical nickel plating (Chemical Deposition) or autocatalytic plating method (Autocatalytic Plating) and it is classified into three types according to phosphorus content: low phosphorus, medium phosphorus and high phosphorus. The biggest difference between electroless nickel plating and electroplating is that the working environment is under the condition of no current, the metal ions are reduced by the reducing agent in the solution, and the surface of the test piece must be catalyzed before electroless nickel plating. However, although the above-mentioned method can solve the welding problem between the aluminum base and the copper heat transfer member, it also brings about environmental protection and other problems. After the electroless nickel plating process, a large amount of industrial waste liquid containing heavy metals or chemical substances will be produced, and a large amount of waste water containing yellow phosphorus and other toxic substances will be produced in the industrial waste liquid. Yellow phosphorus sewage contains yellow phosphorus at a concentration of 50-390 mg/L. Yellow phosphorus is a highly toxic substance, which is extremely harmful to the liver and other organs when it enters the human body. Long-term drinking of phosphorus-containing water can cause osteoporosis and osteonecrosis of the mandible. Therefore, the current environmental awareness in various countries has begun to pay attention to and banned this electroless nickel plating related process, so efforts are made to promote non-toxic processes to protect the environment. In addition, the recent instability and severe shortage of nickel and phosphorus raw materials in electroless nickel plating in the global supply chain will also lead to higher overall costs. Accordingly, how to weld and combine two dissimilar metals without using surface modification treatment is a problem that needs to be overcome urgently at present.

The main purpose of the present invention is to provide a copper embedded layer disposed on an aluminum base to form a bonding area, so that the copper two-phase flow element and/or copper heat conduction element of dissimilar metals are not It can be directly welded if surface modification is required, so as to effectively achieve a cooling device that reduces costs and protects the environment. In order to achieve the above-mentioned purpose, the present invention is a heat dissipation device, comprising: an aluminum base with an upper side and a lower side, wherein a bonding area is formed on the lower side, and the bonding area is provided with a copper embedded layer; at least Either or both of a copper two-phase flow element or copper heat conduction element are disposed in the bonding area, and either or both of the copper two-phase flow element or copper heat conduction element and the copper The intercalated layers are combined by mechanical processing. In addition, the above-mentioned lower side has at least one accommodating groove, the bonding area is selectively arranged on the accommodating groove or/and the lower side, and the copper two-phase flow element is embedded (embedded, implanted) in the accommodating groove. In the receiving groove, the copper two-phase flow element and/or the copper heat conduction element can be fixed in combination with the receiving groove and the copper embedded layer on the lower side, respectively. The above-mentioned copper intercalation layer is formed on the bonding area by mechanical processing, surface treatment process or chemical processing. The above-mentioned aluminum base is made of aluminum material or aluminum alloy material. The copper heat conduction element and the copper embedded layer in the bonding area are made of the same metal material, and the copper heat conduction element and the aluminum base are made of different metal materials. The above-mentioned copper intercalation layer has a deep surface and a surface contact surface, the surface contact surface is bonded on the bonding area, and the deep surface is bonded in the bonding area.

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings. The present invention provides a heat dissipation device 1, please refer to Figures 1, 2 and 3. The heat dissipation device 1 includes an aluminum base 11, at least one copper two-phase flow element 13 and a copper heat conduction element 15. The aluminum The base 11 is made of aluminum or aluminum alloy and other materials containing aluminum. In this embodiment, the aluminum base 11 is made of aluminum, and has an upper side 111 and a lower side 112. The upper side 111 faces to the side. A plurality of heat-dissipating fins 114 (or a set of heat-dissipating fins) made of aluminum material are protruded and arranged at intervals, and the heat-dissipating fins 114 and the aluminum base 11 constitute a heat sink (such as an aluminum extruder). type radiator). The lower side 112 of the above-mentioned aluminum base 11 has at least one accommodating groove 1121 , and a bonding area 1124 can be arranged only in the accommodating groove 1121 of the lower side 112 or can be arranged on the entire surface of the lower side 112 at the same time. and inside the accommodating groove 1121 . In this embodiment, the bonding area 1124 is selected to be disposed on the lower side surface 112 and the accommodating groove 1121 at the same time. The accommodating groove 1121 is radially (horizontally) from the side adjacent to the aluminum base 11 . The lower side surface 112 is bent and extended toward the other side of the aluminum base 11 for accommodating the copper two-phase flow element 13 . In addition, during the specific implementation, the aforementioned accommodating grooves 1121 can be plural, and the shape thereof can be, for example, an S shape, a U shape, an L shape, a figure 8 shape, a rectangle, or any combination of shapes. A copper embedding layer 12 is disposed on the bonding region 1124 . In this embodiment, the copper embedding layer 12 is disposed on the lower side surface 112 of the aluminum base 11 and the accommodating groove 1121 , the copper insertion layer 12 has a deep surface 121 and a surface contact surface 122 (for welding and bonding), and the surface contact surface 122 of the copper insertion layer 12 serves as the copper insertion layer 12 The exposed surface of the copper insert layer 12 is flush with the surface of the lower side 112 and the accommodating groove 1121 , and the deep surface 121 of the copper intercalation layer 12 is combined (such as snapping or embedding) in the lower side 112 and the accommodating groove 1121 (That is, the in-depth surface 121, the lower side surface 112 and the accommodating groove 1121 are closely connected or engaged with each other). The copper embedded layer 12 can be copper powder or copper foil or copper sheet or liquid copper through mechanical processing (such as air pressure, hydraulic pressure, stamping or hydraulic extrusion) or surface treatment process (such as spraying, printing ) or chemical processing (such as electroplating, anodizing) is combined on the lower side 112 and the accommodating groove 1121, and part of the copper embedded layer 12 will be directly engaged or embedded in the lower surface during the process of combining and forming. The deep surface 121 is formed by depositing the side surface 112 and the accommodating groove 1121 to strengthen the bonding force (bonding strength) of the copper insertion layer 12 , thereby preventing the copper insertion layer 12 from passing from the lower side surface 112 and The accommodating groove 1121 is peeled off (separated). When the copper two-phase flow element 13 is combined with the aluminum base 11 , the whole is embedded in the accommodating groove 1121 , and the copper two-phase flow element 13 and the copper of the accommodating groove 1121 are placed together. Into the layer 12 is combined (such as welding), wherein the shape of the copper two-phase flow element 13 is matched with the shape of the accommodating groove 1121. In the specific implementation, the number and shape of the copper two-phase flow element 13 The number and shape of the accommodating grooves 1121 can be matched, and the copper two-phase flow element 13 and the aluminum base 11 are made of different metal materials. In addition, the copper two-phase flow element 13 can be, for example, a heat pipe or a temperature equalizing plate. In this embodiment, the copper two-phase flow element 13 is described as a heat pipe embedded in the accommodating groove 1121, but it is not limited to this. The copper two-phase flow element 13 can also be a temperature equalizing plate disposed on the lower side surface 112 or in the accommodating groove 1121 . And the copper two-phase flow element 13 has a chamber 135, the chamber 135 is filled with a working fluid (such as pure water), and the inner wall of the chamber 135 is provided with a capillary structure 133 (such as sintered powder body, groove, mesh body, fiber, sliver body or any combination of the foregoing); the copper two-phase flow element 13 has a two-phase flow contact surface 131 and a two-phase flow joint surface 132, and the two-phase flow joint surface 132 is followed by The copper embedded layers 12 in the accommodating groove 1121 are combined (eg, welded), and the two-phase flow contact surface 131 is flush with the lower side 112 of the aluminum base 11 (the lower side can also be protruded or recessed). 112), the two-phase flow contact surface 131 will receive a heat and then conduct it to the whole copper two-phase flow element 13, so that the heat can be quickly and evenly conducted to the aluminum base by the copper two-phase flow element 13 11 on. Continuing to refer to Figures 1 and 3, the copper heat conduction element 15 is a copper plate body (such as a copper base plate). In this embodiment, the copper heat conduction element 15 and the copper insertion layer 12 are made of the same metal material, and the copper heat conduction The element 15 and the aluminum base 11 are made of different metal materials (ie, different metal materials). And the copper heat conduction element 15 has a heat absorption surface 151 and a heat transfer surface 152, the heat transfer surface 152 is connected with the copper embedded layer 12 of the lower side surface 112 of the aluminum base 11 and the copper two-phase The two-phase flow contact surfaces 131 of the flow element 13 are welded together. The heat-absorbing surface 151 of the copper heat-conducting element 15 is attached to a heating element (such as a central processing unit or a graphics processor or other heat-generating sources); the heat-absorbing surface 151 of the copper heat-conducting element 15 is used to absorb the heat The heat generated by the components is conducted to the heat transfer surface 152 , and then conducted to the aluminum base 11 through the copper intercalation layer 12 , and then the heat is dissipated by the plurality of heat dissipation fins 114 on the upper side 111 of the aluminum base 11 . Quickly dissipate heat outward. In an alternative embodiment, the bonding region 1124 is selected to be disposed on any one of the lower side surface 112 and the accommodating groove 1121 , and the copper intercalation layer 12 can be disposed on any one of the lower side surface 112 and the accommodating groove 1121 . one on. In the present invention, the copper intercalation layer 12 is provided in the bonding area 1124 to be bonded on the aluminum base 11 , so that the copper two-phase flow element 13 and/or the copper heat conduction element 15 of dissimilar metals can be directly connected to each other. It can be directly welded without going through the nickel treatment process, which can not only effectively reduce the cost, but also achieve environmental protection and solve the problem of the conventional shortage of nickel and phosphorus raw materials. The creation has been described in detail above, but the above is only a preferred embodiment of the creation, and should not limit the scope of implementation of the creation. That is, all equivalent changes and modifications made in accordance with the scope of the application of this creation shall still fall within the scope of the patent of this creation.

1: heat sink 11: Aluminum base 111: upper side 112: lower side 1121: accommodating slot 1124: binding region 114: cooling fins 12: Copper insertion layer 121: In-depth face 122: Surface contact surface 13: Copper two-phase flow element 131: Two-phase flow interface 132: Two-phase flow joint surface 133: capillary structure 135: Chamber 15: Copper heat conduction element 151: Endothermic Surface 152: Heat transfer surface

Figure 1 is a three-dimensional exploded schematic diagram of the creation. Figure 2 is a schematic diagram of the three-dimensional combination of the creation. Figure 3 is a schematic cross-sectional view of Figure 2 of the creation.

1: heat sink

11: Aluminum base

111: upper side

112: lower side

1121: accommodating slot

1124: binding region

114: cooling fins

12: Copper insertion layer

122: Surface contact surface

13: Copper two-phase flow element

131: Two-phase flow interface

132: Two-phase flow joint surface

15: Copper heat conduction element

151: Endothermic Surface

152: Heat transfer surface

Claims (9)

A heat dissipation device, comprising: an aluminum base with an upper side and a lower side, wherein the lower side forms a bonding area, and the bonding area is provided with a copper intercalation layer; and At least one copper two-phase flow element is arranged in the bonding area, so that the copper two-phase flow element can be combined with the copper intercalation layer. The heat dissipation device according to claim 1, wherein the lower side has at least one accommodating groove, the bonding area is disposed in the accommodating groove, and the copper two-phase flow element is a heat pipe buried in the In the accommodating groove, the copper two-phase flow element is combined with the copper embedded layer in the accommodating groove. The heat dissipating device as described in item 2 of the scope of the patent application further comprises a copper heat conduction element, a heat transfer surface of the copper heat conduction element, the copper embedded layer on the lower side and one of the two-phase flow elements Combined sideways. The heat dissipating device as described in claim 1, wherein the copper intercalation layer is formed on the bonding area by mechanical processing, surface treatment process or chemical processing. The heat dissipation device of claim 1, wherein the copper intercalation layer has a deep surface and a surface contact surface, the surface contact surface is bonded to the bonding area, and the deep surface is bonded to the bonding within the area. The heat dissipation device as described in claim 1, wherein the upper side surface of the aluminum base is provided with a plurality of heat dissipation fins. The heat dissipation device as described in claim 1, wherein the copper two-phase flow element is a temperature equalizing plate disposed on the lower side. A heat dissipation device, comprising: an aluminum base with an upper side and a lower side, wherein a bonding area is formed on the lower side; a copper intercalation layer disposed on the bonding region; and At least one copper heat conduction element is arranged in the bonding area, so that the copper heat conduction element can be combined with the copper insertion layer. The heat dissipation device as described in claim 8, wherein the copper heat conduction element is a copper base plate.

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