TWM626529U - Electronic device - Google Patents

Abstract

An electronic device comprises a main board and a converting module is provided. The main board comprises a CPU, a power supplying unit, and a first slot. The first slot comprises a first defined pin, a first undefined pin, and a first power pin. The CPU is electrically connected to the first defined pin and the first undefined pin. The power supplying unit is electrically connected to the first power pin. The converting module is installed to the first slot and comprises a second slot and a power converting circuit. The second slot comprises a second defined pin, a third defined pin, and a second power pin. The second defined pin is electrically connected to the first defined pin. The third defined pin is electrically connected to the first undefined pin. The power converting circuit converts the first voltage to generate a second voltage supplied to the second power pin.

Description

electronic device

This case is about an electronic device, especially an electronic device that can support a variety of memory card specifications.

There are often compatibility issues between different specifications of memory. After a memory card with a new specification becomes available, motherboard suppliers will update their motherboard version according to the new memory specification. However, the new version of the motherboard is often unable to support the old memory card, forcing users to purchase expensive new specification memory card to use together.

This case provides an electronic device. The electronic device includes a mainboard and a conversion module. The mainboard includes a central processing unit, a power supply unit and a first slot. The first socket is suitable for a first memory specification and includes a first defined transmission contact, a first undefined transmission contact and a first power supply contact.

The central processing unit is electrically connected to the first defined transmission point and the first undefined transmission point respectively through a first line and a second line, and the power supply unit is electrically connected to the first power supply connection through a third line point to provide a first voltage suitable for the first memory specification to the first power contact.

The conversion module includes a first connector, a second slot and a power conversion circuit. The first connector is detachably mounted on the first socket and includes a first pin, a second pin and a third pin. The first pin is used to electrically connect to the first defined transmission contact, the second pin is used to electrically connect to the first undefined transmission contact, and the third pin is used to electrically connect to the first power supply contact .

The second socket is suitable for a second memory specification and includes a second defined transmission contact, a third defined transmission contact and a second power supply contact. The second defined transmission contact is electrically connected to the first defined transmission contact, and the third defined transmission contact is electrically connected to the first undefined transmission contact. The power conversion circuit is electrically connected to the first power contact through the third pin to receive the first voltage, and converts the first voltage into a second voltage suitable for the second memory specification and provides the second power contact, wherein, The second voltage is different from the first voltage.

Through the electronic device of this application, the user can install the memory card suitable for the second memory specification on the motherboard supporting the first memory specification through the conversion module for use. In this way, the user is not limited by the specifications of the mainboard (eg, the mainboard), but can freely choose a suitable memory card for use according to their needs.

The specific embodiments of the present case will be described in more detail below with reference to the schematic diagrams. The advantages and features of the present case will become more apparent from the following description and the scope of the patent application. It should be noted that the drawings are all in a very simplified form and in inaccurate proportions, and are only used to facilitate and clearly assist in explaining the purpose of the embodiments of the present application.

The first figure is a schematic diagram of an electronic device provided according to an embodiment of the present application. The electronic device 10 can be a computer host.

As shown in the figure, the electronic device 10 includes a motherboard 100 and a conversion module 200 . The motherboard 100 has a central processing unit 120 , a power supply unit 140 and a first slot 160 . The motherboard 100 has a single channel CH0 to support a single first socket 160 .

The first socket 160 is suitable for a first memory specification and includes at least one first defined transmission contact N11 , at least one first undefined transmission contact N12 and at least one first power supply contact N13 . In the figure, a first defined transmission contact N11, a first undefined transmission contact N12, and a first power supply contact N13 are shown as examples. The number of the first defined transmission contacts N11 , the first undefined transmission contacts N12 and the first power contacts N13 is determined according to the applicable first memory specification.

The first defined transmission contact N11 refers to a contact used for data transmission according to the first memory specification. The first undefined transmission contact N12 refers to a contact reserved for future use or an unconnected contact according to the first memory specification. The first power contact N13 refers to a contact for receiving voltage or for grounding according to the first memory specification.

In one embodiment, the first memory specification may be DDR5. However, it is not limited to this.

The central processing unit 120 is electrically connected to the first defined transmission node N11 and the first undefined transmission node N12 through a first line T1 and a second line T2, respectively. The first line T1 and the second line T2 correspond to the channel CH0. The power supply unit 140 is electrically connected to the first power contact N13 through a third line T3 to provide a first voltage V1 suitable for the first memory specification to the first power contact N13.

In one embodiment, the motherboard 100 may include a multi-layer circuit board on which the central processing unit 120 and the power supply unit 140 may be disposed. The first circuit T1 and the second circuit T2 can be located on the same circuit layer of the multilayer circuit board, for example, the uppermost circuit layer. The third circuit T3 for supplying power and the first circuit T1 or the second circuit T2 may be located on the same circuit layer, or may be located on different circuit layers.

The conversion module 200 includes a first connector 220 , a second socket 240 and a power conversion circuit 260 . In one embodiment, the conversion module 200 may be a riser card.

The first connector 220 and the second slot 240 are located on opposite sides of the riser card, and the power conversion circuit 260 is disposed on the surface of the riser card. However, it is not limited to this. According to the size of the computer host or the requirements of its internal hardware configuration, in other embodiments, the first connector 220 and the second slot 240 may also be located on two adjacent sides of the riser card. Furthermore, in other embodiments, the second slot 240 may also be disposed on the surface of the riser card.

The first connector 220 is detachably mounted on the first socket 160 on the motherboard 100 and includes at least one first pin P1 , at least one second pin P2 and at least one third pin P3 . The first pin P1 is used to electrically connect to the first defined transmission contact N11, the second pin P2 is used to electrically connect to the first undefined transmission contact N12, and the third pin P3 is used to electrically connect The first power contact N13.

In the figure, a first pin P1, a second pin P2 and a third pin P3 are shown as examples. The number of the first pin P1 , a second pin P2 and a third pin P3 is determined according to the first memory specification applicable to the first socket 160 .

The second slot 240 is suitable for a second memory specification for installing a memory card of the second memory specification. The pin definition of the second memory specification is different from that of the first memory specification.

In one embodiment, the second memory specification is a predecessor memory specification of the first memory specification. In one embodiment, the bandwidth of the second memory specification is lower than that of the first memory specification.

In one embodiment, the operating voltage of the second memory specification is higher than that of the first memory specification. For example, the first memory specification may be DDR5, and the second memory specification may be DDR4.

The second slot 240 includes at least one second defined transmission contact N21, at least one second undefined transmission contact N22, at least one third defined transmission contact N23, and at least one second power supply contact N24. The figure shows a second defined transmission contact N21, a second undefined transmission contact N22, a third defined transmission contact N23, and three second power supply contacts N24 as examples.

The number of the second defined transmission contacts N21 , the second undefined transmission contacts N22 , the third defined transmission contacts N23 and the second power contacts N24 is based on the second memory specification applicable to the second socket 240 and 1st memory specification.

Further, the second defined transmission contact N21 and the third defined transmission contact N23 are contacts used for data transmission according to the second memory specification. The difference between the two is that the second defined transmission contact N21 has a corresponding first defined transmission contact N11 under the first memory specification; the third defined transmission contact N23 is compared to the second memory specification. For the contacts specific to the first memory specification, there is no corresponding first defined transmission contact N11 under the first memory specification. For example, if the first memory specification is DDR5 and the second memory specification is DDR4, the third defined transmission contact N23 can be a clock enable contact, a memory address input ) contact and command and address parity input (command and address parity input) contact; the second defined transmission contact N21 is the signal contact defined by the standard DDR4 specification minus the third defined transmission contact Contact used for point N23.

The second undefined transmission contact N22 refers to a contact reserved for future use or an unconnected contact according to the second memory specification. The second power contact N24 refers to a contact for receiving voltage or for grounding according to the second memory specification.

The second defined transmission node N21 is electrically connected to the first defined transmission node N11, and is then electrically connected to the central processing unit 120 through the first line T1. The second undefined transmission contact N22 is an empty connection. The third defined transmission node N23 is electrically connected to the first undefined transmission node N12, and is further electrically connected to the central processing unit 120 through the second line T2. That is to say, the first line T1 is used to transmit the signals of the first memory specification, including the signals unique to the first memory specification compared with the second memory specification, and the first memory specification and the second memory specification. Signals common to memory specifications. The second line T2 is used to transmit signals specific to the second memory specification compared to the first memory specification.

The power conversion circuit 260 is electrically connected to the first power contact N13 through the third pin P3 to receive the first voltage V1, and converts the first voltage V1 into a second voltage V2 suitable for the second memory specification to provide the second power source The contact point N24, wherein the second voltage V2 is different from the first voltage V1.

In one embodiment, the first voltage V1 is single, the number of the second voltages V2 is plural, and the number of the second power contacts N24 is plural. The power conversion circuit 260 converts the first voltage V1 into a plurality of second voltages V2 to be supplied to the second power contacts N24 respectively. In addition, in one embodiment, the voltage levels of the second voltages V2 are all lower than the first voltage V1. For example, if the first memory specification is DDR5, the second memory specification is DDR4; the first voltage V1 is the 5V voltage provided by the motherboard 100, and the first voltage V1 is converted to generate five second voltages V2, namely VDD, VPP, Vref, VTT and VDSPD.

In one embodiment, the power conversion circuit 260 may include a Buck Converter or a Low Dropout Regulator (LDO) to receive the first voltage V1 and convert the second voltage with a lower voltage level v2. However, it is not limited to this. In other embodiments, the power conversion circuit 260 may also include a boost converter.

The second figure is a schematic diagram of an electronic device provided according to another embodiment of the present application.

Compared with the embodiment in the first figure, the electronic device 30 of this embodiment includes a motherboard 300 and two conversion modules 400a, 400b. The motherboard 300 has two channels CHA, CHB, each channel CHA, CHB supports a first slot 360a, 360b respectively, and each channel CHA, CHB has a first line T1a, T1b and a second line T2a, T2b.

The central processing unit 120 is electrically connected to the first sockets 360a, 360b through the first lines T1a, T1b and the second lines T2a, T2b, respectively. The power supply unit 140 is electrically connected to the first slots 360a, 360b through the third lines T3a, T3b, respectively. The two conversion modules 400a, 400b are respectively used to be detachably installed in the two first slots 360a, 360b.

The main difference between this embodiment and the embodiment in the first figure is that the motherboard 300 of this embodiment has two channels CHA, and the CHB supports two first sockets 360a and 360b, which can be installed with two conversion modules 400a and 400b for use. , instead of having only a single first slot 160 to install a single conversion module 200 as in the first embodiment. As far as each of the first slots 360a, 360b and the corresponding conversion modules 400a, 400b in this embodiment are concerned, the configuration is similar to the first slot 160 and the conversion module 200 in the embodiment of the first figure. This will not be repeated.

The third figure is a schematic diagram of an electronic device provided according to another embodiment of the present application.

Compared with the embodiment in the first figure, the electronic device 50 of this embodiment includes a motherboard 500 and two conversion modules 600a, 600b. The motherboard 500 has a single channel CH1, and the channel CH1 simultaneously supports two first sockets 560a, 560b. The central processing unit 120 is electrically connected to the first sockets 560a, 560b through the first lines T1a, T1b and the second lines T2a, T2b of the channel CH1, respectively. The power supply unit 140 is electrically connected to the first slots 560a, 560b through the third lines T3a, T3b, respectively.

The difference between this embodiment and the embodiment in FIG. 1 is that the single channel CH1 of the motherboard 500 of this embodiment corresponds to two first lines T1a, T1b and two second lines T2a, T2b, and supports two first lines T1a, T1b A slot 560a, 560b is installed with two conversion modules 600a, 600b for use, instead of having only a single first slot 160 for installing a single conversion module 200 as in the first embodiment. As for each of the first slots 560a, 560b and the corresponding conversion modules 600a, 600b in this embodiment, the configuration is similar to the first slot 160 and the conversion module 200 in the embodiment of the first figure. This will not be repeated.

Through the electronic devices 10, 30, 50 of this application, the user can install the memory card suitable for the second memory specification on the host computer supporting the first memory specification through the conversion modules 200, 400a, 400b, 600a, 600b Plates 100, 300, 500 are used. In this way, the user is not limited by the specifications of the first slots 160, 360a, 360b, 560a, 560b on the motherboards 100, 300, 500, and can freely choose a suitable memory card A generation of cheaper memory cards) for use.

The above are only preferred embodiments of this case, and do not impose any limitations on this case. Any person skilled in the art who does not deviate from the technical means of this case, makes any form of equivalent replacement or modification to the technical means and technical content disclosed in this case, all of which are within the content of the technical means of this case. still falls within the scope of protection of this case.

10, 30, 50: Electronic Devices 100,300,500: Motherboard 120: Central Processing Unit 140: Power supply unit 160, 360a, 360b, 560a, 560b: first slot 200, 400a, 400b, 600a, 600b: Conversion modules 220: first connector 240: Second slot 260: Power conversion circuit CH0,CHA,CHB,CH1: channel N11: The first defined transmission contact N12: The first undefined transmission contact N13: The first power contact T1, T1a, T1b: first line T2, T2a, T2b: Second line T3, T3a, T3b: the third line V1: first voltage P1: the first pin P2: second pin P3: The third pin N21: Second defined transmission contact N22: Second undefined transmission contact N23: Third defined transmission contact N24: Second power contact V2: The second voltage

The first figure is a schematic diagram of an electronic device provided according to an embodiment of the present application; The second figure is a schematic diagram of an electronic device provided according to another embodiment of the present application; and The third figure is a schematic diagram of an electronic device provided according to another embodiment of the present application.

10: Electronics

100: Motherboard

120: Central Processing Unit

140: Power supply unit

160: first slot

200: Conversion Module

220: first connector

240: Second slot

260: Power conversion circuit

CH0: channel

N11: The first defined transmission contact

N12: The first undefined transmission contact

N13: The first power contact

T1: The first line

T2: Second line

T3: Third line

V1: first voltage

P1: the first pin

P2: second pin

P3: The third pin

N21: Second defined transmission contact

N22: Second undefined transmission contact

N23: Third defined transmission contact

N24: Second power contact

V2: The second voltage

Claims (9)

An electronic device comprising: a motherboard, comprising; a central processing unit; a power supply unit; and a first socket, suitable for a first memory specification, the first socket includes a first defined transmission contact, a first undefined transmission contact and a first power supply contact; Wherein, the central processing unit is electrically connected to the first defined transmission contact and the first undefined transmission contact through a first line and a second line, respectively, and the power supply unit is electrically connected through a third line connecting the first power contact to provide a first voltage suitable for the first memory specification to the first power contact; and A conversion module, including: A first connector is detachably mounted on the first socket and includes a first pin, a second pin and a third pin, wherein the first pin is used for electrically connecting the first pin a defined transmission contact, the second pin is used for electrically connecting the first undefined transmission contact, the third pin is used for electrically connecting the first power supply contact; a second socket, suitable for a second memory specification, the second socket includes a second defined transmission contact, a third defined transmission contact and a second power contact, wherein; the first Two defined transmission contacts are electrically connected to the first defined transmission contact, and the third defined transmission contact is electrically connected to the first undefined transmission contact; and A power conversion circuit is electrically connected to the first power contact through the third pin to receive the first voltage, and converts the first voltage into a second voltage suitable for the second memory specification to provide the A second power contact, wherein the second voltage is different from the first voltage. The electronic device of claim 1, wherein the conversion module is a riser card. The electronic device of claim 2, wherein the motherboard comprises a multi-layer circuit board, and the first circuit and the second circuit are located on the same circuit layer. The electronic device of claim 1, wherein the second voltage is lower than the first voltage. The electronic device of claim 1, wherein the number of the second power contacts is plural, the number of the second voltages is plural, and the second voltages have different voltage levels, the power conversion The circuit converts the first voltage into the second voltages and supplies them to the second power contacts respectively. The electronic device of claim 1, wherein the first memory specification is DDR5, and the second memory specification is DDR4. The electronic device of claim 1, wherein the bandwidth of the second memory specification is lower than that of the first memory specification. The electronic device of claim 1, wherein the operating voltage of the second memory specification is higher than that of the first memory specification. The electronic device of claim 1, wherein the second slot includes a second undefined transmission contact, and the second undefined transmission contact is an empty connection.

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