CN216486420U - Electronic device - Google Patents
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- CN216486420U CN216486420U CN202123445882.7U CN202123445882U CN216486420U CN 216486420 U CN216486420 U CN 216486420U CN 202123445882 U CN202123445882 U CN 202123445882U CN 216486420 U CN216486420 U CN 216486420U
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Abstract
The electronic device comprises a mainboard and a conversion module. The main board comprises a central processing unit, a power supply unit and a first slot. The first socket includes a first defined transmission contact, a first undefined transmission contact and a first power contact. The central processing unit is electrically connected with the first defined transmission contact and the first undefined transmission contact, and the power supply unit is electrically connected with the first power supply contact. The conversion module is mounted to the first slot and includes a second slot and a power conversion circuit. The second slot includes a second defined transmission contact, a third defined transmission contact and a second power contact. The second defined transmission contact is electrically connected to the first defined transmission contact, and the third defined transmission contact is electrically connected to the first undefined transmission contact. The power conversion circuit receives the first voltage and converts the first voltage into a second voltage.
Description
Technical Field
The present disclosure relates to an electronic device, and more particularly, to an electronic device capable of supporting multiple memory card specifications.
Background
The problem of compatibility often exists between memories with different specifications. After the memory card with the new specification is sold, the mainboard supplier updates the mainboard version according to the new memory specification. However, the new motherboard often cannot support the old memory card, forcing the user to purchase a new memory card with a high price.
SUMMERY OF THE UTILITY MODEL
An electronic device is provided. The electronic device comprises a mainboard and a conversion module. The main board comprises a central processing unit, a power supply unit and a first slot. The first slot is suitable for a first memory specification and comprises a first defined transmission contact, a first undefined transmission contact and a first power supply contact.
The central processing unit is electrically connected with the first defined transmission joint and the first undefined transmission joint through a first circuit and a second circuit respectively, and the power supply unit is electrically connected with the first power supply joint through a third circuit so as to provide a first voltage suitable for the first memory specification to the first power supply joint.
The conversion module comprises a first connector, a second slot and a power conversion circuit. The first connector is detachably mounted to the first slot and includes a first pin, a second pin and a third pin. The first pin is used for electrically connecting with the first defined transmission contact, the second pin is used for electrically connecting with the first undefined transmission contact, and the third pin is used for electrically connecting with the first power supply contact.
The second slot is suitable for a second memory specification and comprises a second defined transmission contact, a third defined transmission contact and a second power supply contact. The second defined transmission contact is electrically connected to the first defined transmission contact, and the third defined transmission contact is electrically connected to the first undefined transmission contact. The power conversion circuit is electrically connected with the first power contact through the third pin to receive the first voltage, and converts the first voltage into a second voltage suitable for the second memory specification and provides the second voltage to the second power contact, wherein the second voltage is different from the first voltage.
The conversion module is a conversion card.
The main board comprises a plurality of circuit boards, and the first circuit and the second circuit are positioned on the same circuit layer.
The second voltage is lower than the first voltage.
The power conversion circuit converts the first voltage into a plurality of second voltages, and provides the plurality of second voltages to the plurality of second power contacts.
The first memory specification is DDR5 and the second memory specification is DDR 4.
The bandwidth of the second memory specification is lower than the first memory specification.
The operating voltage of the second memory specification is higher than the first memory specification.
The second slot includes a second undefined transmission contact, and the second undefined transmission contact is a null contact.
Through the electronic device, a user can install the memory card suitable for the second memory specification on the mainboard supporting the first memory specification for use through the conversion module. Therefore, the user is not limited by the specification of the mainboard (such as the mainboard), and can freely select a proper memory card for use according to the requirement.
Drawings
FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the disclosure;
fig. 2 is a schematic diagram of an electronic device according to another embodiment of the disclosure; and
fig. 3 is a schematic diagram of an electronic device according to yet another embodiment of the disclosure.
Detailed Description
The embodiments of the present disclosure will be described in more detail with reference to the drawings. Advantages and features of the present disclosure will become apparent from the following description and claims. It is to be noted that the drawings are in a simplified form and are not to precise scale, which is only used for the purpose of facilitating and clearly explaining the embodiments of the present invention.
Fig. 1 is a schematic view of an electronic device according to an embodiment of the disclosure. The electronic device 10 may be a computer host.
As shown in the figure, the electronic device 10 includes a main board 100 and a conversion module 200. The motherboard 100 has a cpu 120, a power supply unit 140, and a first slot (slot) 160. The motherboard 100 has a single channel CH0 to support a single first slot 160.
The first socket 160 is suitable for a first memory specification and includes at least one first defined transmission contact N11, at least one first undefined transmission contact N12 and at least one first power contact N13. A first defined transmission contact N11, a first undefined transmission contact N12 and a first power contact N13 are shown as an example. The number of the first defined transmission node N11, the first undefined transmission node N12 and the first power node N13 is determined according to the applicable first memory specification.
The first defined transmission node N11 is a node for data transmission according to a first memory specification. The first undefined transmission contact N12 belongs to a contact reserved for future use or an unconnected contact according to the first memory specification. The first power contact N13 is a contact for receiving voltage or serving as a ground according to a first memory specification.
In one embodiment, the first memory specification may be DDR 5. But is not so limited.
The cpu 120 is electrically connected to the first defined transmission node N11 and the first undefined transmission node N12 through a first line T1 and a second line T2, respectively. The first line T1 and the second line T2 correspond to the channel CH 0. The power supply unit 140 is electrically connected to the first power contact N13 through a third line T3 to provide a first voltage V1 suitable for the first memory specification at the first power contact N13.
In one embodiment, the motherboard 100 may comprise a multi-layer circuit board on which the cpu 120 and the power supply unit 140 are disposed. The first circuit T1 and the second circuit T2 may be located on the same circuit layer of the multi-layer circuit board, such as the top circuit layer. The third line T3 for supplying power and the first line T1 or the second line T2 may be located at the same layer or different layers.
The conversion module 200 includes a first connector 220, a second socket 240, and a power conversion circuit 260. In one embodiment, the conversion module 200 may be a switch card.
The first connector 220 and the second slot 240 are located on two opposite sides of the adapter card, and the power conversion circuit 260 is disposed on the surface of the adapter card. But is not so limited. According to the size of the computer host or the requirement of the internal hardware configuration, in other embodiments, the first connector 220 and the second slot 240 may be located on two adjacent sides of the adapter card. In other embodiments, the second slot 240 may also be disposed on a surface of the adapter card.
The first connector 220 is detachably mounted to the first slot 160 of the motherboard 100 and includes at least one first pin P1, at least one second pin P2, and at least one third pin P3. The first pin P1 is electrically connected to the first defined transmission contact N11, the second pin P2 is electrically connected to the first undefined transmission contact N12, and the third pin P3 is electrically connected to the first power contact N13.
A first pin P1, a second pin P2, and a third pin P3 are shown for illustration. The number of the first pin P1, the second pin P2 and the third pin P3 is determined according to the first memory specification applicable to the first slot 160.
The second slot 240 is suitable for a second memory specification, and is used for installing a memory card of the second memory specification. The pin definition of the second memory specification is different from the first memory specification.
In one embodiment, the second memory specification is a previous generation memory specification of the first memory specification. In one embodiment, the bandwidth of the second memory specification is lower than the bandwidth of the first memory specification.
In one embodiment, the operating voltage of the second memory specification is higher than the first memory specification. For example, the first memory size may be DDR5 and the second memory size may be DDR 4.
The second socket 240 includes at least one second defined transmission contact N21, at least one second undefined transmission contact N22, at least one third defined transmission contact N23, and at least one second power contact N24. A second defined transmission node N21, a second undefined transmission node N22, a third defined transmission node N23 and three second power nodes N24 are shown for illustration.
The numbers of the second defined transmission contact N21, the second undefined transmission contact N22, the third defined transmission contact N23 and the second power contact N24 are determined according to the second memory specification and the first memory specification applicable to the second slot 240.
Further, the second defined transmission node N21 and the third defined transmission node N23 are nodes for data transmission according to a second memory specification. The difference between the two is that the second defined transmission node N21 has a corresponding first defined transmission node N11 under the first memory specification; the third defined transmission contact N23 is a contact specific to the second memory specification compared to the first memory specification, and there is no corresponding first defined transmission contact N11 under the first memory specification. For example, if the first memory specification is DDR5, the second memory specification is DDR4, the third defined transmission node N23 may be a clock enable (clock enable) node, a memory address input (memory address input) node, and a command and address parity input (command and address parity input) node; the second defined transmission node N21 is the signal node defined by the standard DDR4 specification, which deducts the node used by the third defined transmission node N23.
The second undefined transmission node N22 belongs to a node reserved for future use or a node not connected according to the second memory specification. The second power contact N24 is a contact for receiving voltage or serving as a ground according to a second memory specification.
The second defined transmission node N21 is electrically connected to the first defined transmission node N11, and further electrically connected to the cpu 120 through a first line T1. The second undefined transmission contact N22 is null. The third defined transmission node N23 is electrically connected to the first undefined transmission node N12, and further electrically connected to the CPU 120 via the second line T2. That is, the first line T1 is used to transmit signals of the first memory specification, including signals specific to the first memory specification and signals common to both the first and second memory specifications, as compared to the second memory specification. The second line T2 is used to transmit signals specific to the second memory specification as compared to the first memory specification.
The power conversion circuit 260 is electrically connected to the first power contact N13 through a third pin P3 to receive a first voltage V1, and converts the first voltage V1 into a second voltage V2 suitable for a second memory specification and provides the second voltage V24 to the second power contact N8575, wherein the second voltage V2 is different from the first voltage V1.
In one embodiment, the first voltage V1 is single, the number of the second voltages V2 is plural, and the number of the second power contacts N24 is plural. The power conversion circuit 260 converts the first voltage V1 into a plurality of second voltages V2, and provides the second voltages V2 to the second power contacts N24, respectively. In one embodiment, the voltage levels of the second voltage V2 are lower than the first voltage V1. For example, if the first memory specification is DDR5, the second memory specification is DDR 4; the first voltage V1 is 5V provided by the motherboard 100, and the first voltage V1 generates five second voltages V2, i.e., VDD, VPP, Vref, VTT, and VDDSPD.
In one embodiment, the power conversion circuit 260 may include a Buck Converter (Buck Converter) or a low dropout regulator (LDO) to receive the first voltage V1 and convert it into the second voltage V2 with a lower voltage level. But is not so limited. In other embodiments, the power conversion circuit 260 may also include a Boost Converter (Boost Converter).
Fig. 2 is a schematic diagram of an electronic device according to another embodiment of the disclosure.
Compared to the embodiment of fig. 1, the electronic device 30 of the present embodiment includes a main board 300 and two converting modules 400a and 400 b. The motherboard 300 has two channels CHA, CHB, each supporting a first slot 360a, 360b, and each having a first line T1a, T1b and a second line T2a, T2 b.
The cpu 120 is electrically connected to the first slots 360a and 360b through the first wires T1a and T1b and the second wires T2a and T2b, respectively. The power supply unit 140 is electrically connected to the first slots 360a and 360b through the third lines T3a and T3b, respectively. The two conversion modules 400a, 400b are detachably mounted to the two first slots 360a, 360b, respectively.
The main difference between this embodiment and the embodiment of fig. 1 is that the motherboard 300 of this embodiment has two channels CHA, CHB supporting two first slots 360a, 360b for installing two conversion modules 400a, 400b, rather than having only a single first slot 160 for installing a single conversion module 200 as in the embodiment of fig. 1. For the first slots 360a and 360b and the corresponding conversion modules 400a and 400b of the present embodiment, the configuration thereof is similar to that of the first slot 160 and the conversion module 200 in the embodiment of fig. 1, and details thereof are omitted.
Fig. 3 is a schematic diagram of an electronic device according to yet another embodiment of the disclosure.
Compared to the embodiment of fig. 1, the electronic device 50 of the present embodiment includes a main board 500 and two converting modules 600a and 600 b. The motherboard 500 has a single channel CH1, and the channel CH1 supports two first slots 560a, 560 b. The cpu 120 is electrically connected to the first sockets 560a and 560b through the first lines T1a and T1b and the second lines T2a and T2b of the channel CH1, respectively. The power supply unit 140 is electrically connected to the first sockets 560a, 560b through the third wires T3a, T3b, respectively.
The difference between the present embodiment and the embodiment of fig. 1 is that the single channel CH1 of the motherboard 500 of the present embodiment corresponds to two first lines T1a, T1b and two second lines T2a, T2b, and supports two first slots 560a, 560b to mount two conversion modules 600a, 600b for use, instead of having only a single first slot 160 to mount a single conversion module 200 as in the embodiment of fig. 1. Regarding the first slots 560a, 560b and the corresponding conversion modules 600a, 600b of the present embodiment, the configuration thereof is similar to the first slot 160 and the conversion module 200 in the embodiment of fig. 1, and details thereof are not repeated herein.
With the electronic device 10, 30, 50 of the present disclosure, a user can install a memory card suitable for the second memory specification on the motherboard 100, 300, 500 supporting the first memory specification through the conversion module 200, 400a, 400b, 600a, 600 b. Thus, the user is not limited by the specification of the first slot 160, 360a, 360b, 560a, 560b of the motherboard 100, 300, 500, and can freely select a suitable memory card (e.g., a memory card with a lower price in the previous generation) for use according to the requirement.
Although the present invention has been described with reference to the above embodiments, it is not intended to limit the present invention, and those skilled in the art can make modifications and variations without departing from the spirit and scope of the present invention.
Claims (9)
1. An electronic device, comprising:
a main board including;
a central processing unit;
a power supply unit; and
a first slot adapted to a first memory specification, the first slot including a first defined transmission contact, a first undefined transmission contact, and a first power contact;
the central processing unit is electrically connected to the first defined transmission contact and the first undefined transmission contact through a first circuit and a second circuit, respectively, and the power supply unit is electrically connected to the first power contact through a third circuit to provide a first voltage suitable for the first memory specification to the first power contact; and
a conversion module, comprising:
a first connector detachably mounted to the first socket and including a first pin for electrically connecting to the first defined transmission contact, a second pin for electrically connecting to the first undefined transmission contact, and a third pin for electrically connecting to the first power contact;
a second slot adapted to a second memory specification, the second slot including a second defined transmission node, a third defined transmission node and a second power node, wherein the second defined transmission node is electrically connected to the first defined transmission node, and the third defined transmission node is electrically connected to the first undefined transmission node; and
and a power conversion circuit electrically connected to the first power contact through the third pin to receive the first voltage, and convert the first voltage into a second voltage suitable for the second memory specification and provide the second voltage to the second power contact, wherein the second voltage is different from the first voltage.
2. The electronic device of claim 1, wherein the conversion module is a riser card.
3. The electronic device of claim 2, wherein the motherboard comprises a multi-layer circuit board, and the first circuit and the second circuit are located on the same circuit layer.
4. The electronic device of claim 1, wherein said second voltage is lower than said first voltage.
5. The electronic device of claim 1, wherein the number of the second power contacts is plural, the number of the second voltages is plural, and the plural second voltages have different voltage levels, and the power conversion circuit converts the first voltage into the plural second voltages and provides the plural second voltages to the plural second power contacts, respectively.
6. The electronic device of claim 1, wherein the first memory size is DDR5 and the second memory size is DDR 4.
7. The electronic device of claim 1, wherein the bandwidth of the second memory size is lower than the bandwidth of the first memory size.
8. The electronic device of claim 1, wherein the operating voltage of the second memory specification is higher than the first memory specification.
9. The electronic device of claim 1, wherein the second slot comprises a second undefined transmission contact, and the second undefined transmission contact is a null contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123445882.7U CN216486420U (en) | 2021-12-30 | 2021-12-30 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123445882.7U CN216486420U (en) | 2021-12-30 | 2021-12-30 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216486420U true CN216486420U (en) | 2022-05-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123445882.7U Active CN216486420U (en) | 2021-12-30 | 2021-12-30 | Electronic device |
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| CN (1) | CN216486420U (en) |
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2021
- 2021-12-30 CN CN202123445882.7U patent/CN216486420U/en active Active
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