TWM626422U - Crusher, wafer shaking device, and wafer cleaning system - Google Patents

Abstract

The present application provides a crusher, a wafer shaking device and a wafer cleaning system. The shredder contains a frame, a boat and a processing unit. The wafer boat is arranged on the frame and is configured to carry wafers. The processing device is arranged on the frame and between the frame and the wafer boat. The processing device is separated from the wafer boat. The processing device faces the opening of the wafer boat so that foreign objects separated from the wafer enter the processing device through the opening of the wafer boat. The processing device is configured to pulverize the foreign body.

Description

Shredders, Wafer Shakers and Wafer Cleaning Systems

The present application relates to the field of semiconductors, and in particular, to a shredder, a wafer shaking device and a wafer cleaning system.

The wafer fabrication process includes a photoresist stripping step or a metal lift-off step. The photoresist or metal is usually dissolved or stripped from the wafer surface with a chemical liquid during the photoresist removal and metal stripping steps. Photoresist or metal stripped from the wafer surface follows the flow of chemical fluids to downstream piping. However, if the size of the stripped photoresist or metal is too large, the large size photoresist or metal may block the pipeline, thereby causing abnormal operation of the process equipment.

In view of this, the present application provides a crusher, a wafer shaking device and a wafer cleaning system to solve the above technical problems.

The present application provides a shredder, a wafer shaking device and a wafer cleaning system, which can avoid the problem that large-sized foreign objects separated from the surface of the wafer block the downstream pipeline.

In a first aspect, the present application provides a crusher including a frame, a wafer boat and a processing device. The wafer boat is disposed on the frame and configured to carry a wafer, wherein the wafer boat includes a accommodating cavity, a first opening and a second opening, the accommodating cavity is configured to accommodate the wafer, the first opening An opening serves as a channel for the wafer to enter or leave the boat, and the second opening is opposite to the first opening, and the second opening serves as a channel for discharging foreign matter separated from the wafer in the receiving cavity . The processing device is disposed on the frame and is located between the frame and the wafer boat, wherein the processing device is disposed apart from the wafer boat, and the processing device faces the second opening of the wafer boat so that the foreign matter is removed from the wafer by the wafer. The second opening of the boat enters the processing device, and the processing device is configured to break up the foreign material.

In some embodiments, the processing device includes a pair of gears rotatably mounted on the frame.

In some embodiments, the processing device further includes a driving group connected to the pair of gears and configured to drive the pair of gears to rotate in opposite directions to each other.

In a second aspect, the present application provides a wafer shaking device, comprising: a rack, a shredder, and a lifting device. The rack includes opposing first and second ends. The crusher is arranged on the first end of the frame, and includes: a frame, a wafer boat and a processing device. The frame is fixedly connected with the first end of the frame. The wafer boat is disposed on the frame and configured to carry a wafer, wherein the wafer boat includes a accommodating cavity, a first opening and a second opening, the accommodating cavity is configured to accommodate the wafer, the first opening An opening serves as a channel for the wafer to enter or leave the boat, and the second opening is opposite to the first opening, and the second opening serves as a channel for discharging foreign matter separated from the wafer in the receiving cavity . The processing device is disposed on the frame and is located between the frame and the wafer boat, wherein the processing device is disposed apart from the wafer boat, and the processing device faces the second opening of the wafer boat so that the foreign matter is removed from the wafer by the wafer. The second opening of the boat enters the processing device, and the processing device is configured to break up the foreign material. The lifting device is disposed at the second end of the frame, and is configured to control the frame to move in a vertical direction to drive the crusher to reciprocate.

In some embodiments, the lifting device includes: a telescopic rod and a motor, the telescopic rod is fixedly connected with the second end of the frame, and the motor is connected with the telescopic rod, and is configured to control the movement of the telescopic rod telescopic.

In some embodiments, the processing device of the shredder includes a pair of gears rotatably mounted on the frame.

In some embodiments, the processing device of the shredder further includes a driving group connected to the pair of gears and configured to drive the pair of gears to rotate in opposite directions to each other.

In a third aspect, the present application provides a wafer cleaning system, comprising: a tank body, a pipeline group and a wafer oscillation device. The pipeline set is connected to the tank body, and is configured to input a process liquid into the tank body or output the process liquid from the inside of the tank body. The wafer shaking device includes: a frame, a crusher and a lifting device. The rack includes opposing first and second ends. The crusher is provided with the first end of the rack, wherein the first end of the rack and the crusher are arranged in the interior of the tank, and the crusher includes: a frame, a crystal boat and a processing device. The frame is fixedly connected with the first end of the frame. The wafer boat is disposed on the frame and configured to carry a wafer, wherein the wafer boat includes a accommodating cavity, a first opening and a second opening, the accommodating cavity is configured to accommodate the wafer, the first opening An opening serves as a channel for the wafer to enter or leave the boat, and the second opening is opposite to the first opening, and the second opening serves as a channel for discharging foreign matter separated from the wafer in the receiving cavity . The processing device is disposed on the frame and is located between the frame and the wafer boat, wherein the processing device is disposed apart from the wafer boat, and the processing device faces the second opening of the wafer boat so that the foreign matter is removed from the wafer by the wafer. The second opening of the boat enters the processing device, and the processing device is configured to break up the foreign material. The lifting device is disposed at the second end of the frame, and is configured to control the frame to move in a vertical direction to drive the crusher to reciprocate, wherein the second end of the frame and the lifting device are disposed at outside of the tank.

In some embodiments, the tank body of the wafer cleaning system includes an input port and a discharge port, the input port is disposed on the side wall of the tank body, and the discharge port is disposed at the bottom of the tank body and faces the shredder The processing device of the crusher, and the foreign matter crushed by the processing device of the crusher is discharged from the discharge port; and the pipeline group of the wafer cleaning system includes a circulation pipeline, including an input pipeline , an output pipeline, a pump and a filter, the input pipeline is connected with the input port of the tank body, the output pipeline is connected to the downstream of the tank body, the pump connects the input pipeline and the output pipeline, and the filter is arranged on the output pipeline.

In some embodiments, the lifting device of the wafer shaking device includes: a telescopic rod and a motor, the telescopic rod is fixedly connected to the second end of the rack, and the motor is connected to the telescopic rod, configured In order to control the expansion and contraction of the telescopic rod.

In some embodiments, the processing device of the shredder includes a pair of gears rotatably mounted on the frame.

In some embodiments, the processing device of the shredder further includes a driving group connected to the pair of gears and configured to drive the pair of gears to rotate in opposite directions to each other.

Compared with the prior art, the present application provides a wafer oscillating device with a crusher and a wafer cleaning system, which can crush the large-sized foreign objects separated from the wafer surface into small-sized particles, so that the small size of the particles going to the downstream pipeline can be reduced. Size particles will not block the pipeline to ensure smooth pipeline system.

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments, however, can be embodied in various forms and should not be construed as limited to the examples set forth herein. Rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The drawings are merely schematic illustrations of the present application and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repeated descriptions will be omitted.

Referring to FIGS. 1 and 2, FIG. 1 shows a first perspective view of a wafer oscillating device according to an embodiment of the present application, and FIG. 2 shows a second perspective view of the wafer oscillating device according to an embodiment of the present application. The wafer shaking device 20 includes a shredder 10 . The crusher 10 includes a frame 11 , a boat 12 and a processing device 13 . Frame 11 includes flat plates and bosses 112 . The flat plate has a hollow portion 111, and a boss 112 is provided on the flat plate. The frame 11 includes two surfaces with different levels by means of the bosses 112 , that is, the surface of the flat plate and the upper surface of the bosses 112 .

As shown in FIG. 1 , the wafer boat 12 is installed on the boss 112 of the frame 11 . It should be understood that the wafer boat 12 is detachably placed on the frame 11 , for example, the combination or separation of the wafer boat 12 and the frame 11 is realized by a robotic arm or a handling mechanism. The wafer boat 12 is configured to carry the wafer W, and includes a first opening 121 , a second opening 122 and an accommodating cavity 123 . The accommodating cavity 123 is configured to accommodate one or more wafers W. As shown in FIG. The first opening 121 serves as a channel for the wafer W to enter or leave the wafer boat 12 . The second opening 122 is opposite to the first opening 121 , and the second opening 122 serves as a passage for discharging the foreign matter separated from the wafer W in the accommodating cavity 123 . The foreign matter separated from the wafer W includes photoresist, metal, thin film, and the like. Specifically, the wafer fabrication process includes a photoresist stripping step or a metal lift-off step. In the photoresist removal or metal stripping step, the photoresist and part of the metal on the surface of the wafer W are removed with the chemical liquid, and the foreign matter separated from the wafer W will flow out of the wafer boat 12 along with the chemical liquid.

As shown in FIG. 1 , the processing device 13 is provided on the flat plate of the frame 11 . Since the surface of the flat plate of the frame 11 is lower than the upper surface of the boss 112 , the processing device 13 is located between the frame 11 and the wafer boat 12 . It should be noted that the processing device 13 is separated from the wafer boat 12 , that is, the processing device 13 and the wafer boat 12 are separated by a vertical distance, so as to avoid direct contact between the processing device 13 and the wafer boat 12 and the wafer W.

Referring to Figures 1 and 3, Figure 3 shows an enlarged view of part A of Figure 1 . The processing device 13 includes a first gear 131 and a second gear 132 , and the first gear 131 and the second gear 132 are rotatably mounted on the frame 11 . Specifically, the frame 11 includes a pair of mounting brackets 113 , and the pair of mounting brackets 113 are fixed on the flat plate of the frame 11 . Both ends of the rotation shafts of the first gear 131 and the second gear 132 protrude to the outside, and are respectively rotatably assembled with the pair of mounting brackets 113 .

As shown in FIGS. 2 and 3 , the processing device 13 includes a drive group, which is connected to the first gear 131 and the second gear 132 correspondingly, and is configured to drive the first gear 131 and the second gear 132 to rotate. The driving group includes a driving gear 23 and a long rod 24, wherein one end of the long rod 24 is connected with the driving gear 23, and the other end is connected with the driver. The drive gear 23 meshes with one of the first gear 131 and the second gear 132 . When the driver control rod 24 rotates around the axis, it drives the driving gear 23 to rotate together, so that the driving gear 23 drives one of the first gear 131 and the second gear 132 to rotate. It should be understood that, in some embodiments, other ways may also be used to rotate the first gear 131 and the second gear 132 .

Referring to FIG. 4 , it shows a schematic diagram of the operation of the grinder 10 according to the embodiment of the present application. The first gear 131 and the second gear 132 of the processing device 13 of the shredder 10 are meshed with each other, and the first gear 131 and the second gear 132 rotate in opposite directions to each other (in the direction of the arrow in FIG. 4 ). As shown in FIG. 1 , one side of the processing device 13 corresponds to the hollow portion 111 of the frame 11 , and the other opposite side of the processing device 13 faces the second opening 122 of the wafer boat 12 , so that foreign objects are removed from the second opening 122 of the wafer boat 12 . The two openings 122 enter the processing device 13, and the processing device 13 is configured to shred the foreign matter. Specifically, as shown in FIG. 4, through the first gear 131 and the second gear 132, which mesh with each other and rotate in opposite directions, foreign objects (such as metal 61, light The resistance 62) will be crushed due to the extrusion of the gear, so that the large-sized foreign objects are crushed into small-sized particles.

As shown in FIGS. 1 and 2 , the wafer shaking device 20 further includes a rack 21 and a lifting device 22 . The frame 21 includes opposing first ends 211 and second ends 212 . The shredder 10 is disposed at the first end 211 of the frame 21 , and the frame 11 of the shredder 10 is fixedly connected with the first end 211 of the frame 21 . The lifting device 22 is disposed at the second end 212 of the frame 21, and is configured to control the frame 21 to move along the vertical direction to drive the crusher 10 to reciprocate. Lifting Device 22 The lifting device includes a telescopic rod 221 and a motor 222 . The telescopic rod 221 is fixedly connected with the second end 212 of the frame 21, and the motor 222 is connected with the telescopic rod 221, and is configured to control the telescopic rod 221 to extend and retract, thereby controlling the frame 21 to move to different levels.

Referring to FIG. 5, a schematic diagram of a wafer cleaning system 1 according to an embodiment of the present application is shown. The wafer cleaning system 1 includes the aforementioned wafer shaking device 20 , a tank body 30 and a pipeline group. The specific structures of the wafer oscillating device 20 and the shredder 10 are the same as those described above, and are not repeated here. Furthermore, the first end 211 of the rack 21 of the wafer shaking device 20 and the crusher 10 are movably disposed inside the tank body 30, and the second end 212 of the rack 21 and the lifting device 22 are disposed in the tank body. 30 exterior. It should be noted that when the lifting device 22 of the wafer oscillating device is activated, the wafer W will oscillate up and down accordingly, thereby promoting frequent contact between the wafer W and the chemical liquid to accelerate the reaction. Furthermore, the oscillating motion can accelerate the removal of the foreign matter from the surface of the wafer W. FIG.

As shown in FIG. 5 , the groove body 30 includes an outer groove 301 and an inner groove 302 , and the outer groove 301 surrounds the inner groove 302 . The tank wall of the outer tank 301 is higher than the tank wall of the inner tank 302 , so that the liquid overflowing from the outer tank 301 will enter the inner tank 302 . The tops of the outer tank 301 and the inner tank 302 both have openings, and the opening at the top of the inner tank 302 serves as a channel for the wafer boat 12 of the crusher 10 to enter or leave the tank body 30 . The side wall of the outer tank 301 is provided with an input port and a first discharge port, wherein the level of the input port is higher than that of the first discharge port. The bottom of the inner tank 302 is provided with a second discharge port, wherein the horizontal height of the second discharge port is lower than that of the first discharge port. The second discharge port faces the processing device 13 of the shredder 10 , and the foreign matter pulverized by the processing device 13 of the shredder 10 is discharged from the second discharge port.

As shown in FIG. 5 , the pipeline group is connected to the tank body 30 and configured to input the process liquid into the tank body 30 or output the process liquid from the inside of the tank body 30 . Specifically, the pipeline group of the wafer cleaning system 1 includes a circulation pipeline 31 , a first liquid inlet pipeline 32 , a second liquid inlet pipeline 33 and a liquid discharge pipeline. One end of the first liquid inlet pipeline 32 is connected to the chemical liquid supply device 40 , and the other end extends to the top of the tank body 30 and faces the opening of the top of the outer tank 301 to inject the chemical liquid into the outer tank 301 . One end of the second liquid inlet pipe 33 is connected to the deionized water supply device 50 , and the other end extends to the top of the tank body 30 and faces the opening of the top of the outer tank 301 to inject chemical liquid into the outer tank 301 . In this embodiment, the process liquid includes chemical liquid and deionized water, but is not limited thereto.

As shown in FIG. 5 , the circulation pipeline 31 of the pipeline group includes an input pipeline 311 , an output pipeline 312 , a pump 313 , a first filter 314 and a second filter 315 . One end of the input pipeline 311 is connected to the input port of the outer tank 301 of the tank body 30 , and the other end is connected to the pump 313 . One end of the output pipeline 312 is connected to the downstream of the inner tank 302 of the tank body 30 , and the other end is connected to the pump 313 . Specifically, the wafer cleaning system 1 includes an acid collecting box 35 . The acid collecting box 35 is connected to the second outlet of the inner tank 302 , and the acid collecting box 35 is also connected to one end of the output pipeline 312 of the circulation pipeline 31 . The first filter 314 is provided on the output line 312 , and the second filter 315 is provided on the input line 311 . By arranging the first filter 314 on the output pipeline 312 , the damage of the pump 313 caused by foreign matter entering the inside of the pump 313 can be avoided.

As shown in Figure 5, the drain line 34 of the line set includes a first section and a second section. The first section connects the first discharge port of the outer tank 301 of the tank body 30 and the acid collecting box 35 . The second section connects the acid collecting box 35 and the waste liquid collecting device. A first valve 341 is provided in the first section of the drain line 34 , and a second valve 342 is provided in the second section of the drain line 34 . In addition, the output line 312 of the circulation line 31 is provided with a third valve 316 , and the input line 311 of the circulation line 31 is provided with a fourth valve 317 . A fifth valve 321 is provided in the first liquid inlet pipeline 32 . A sixth valve 331 is provided in the second liquid inlet pipeline 33 .

When the wafer cleaning system 1 of the present application is applied in the photoresist removal step or the metal stripping step of the wafer process, the fifth valve 321 of the first liquid inlet pipeline 32 is opened, and the chemical liquid is input into the tank body 30 . The circulation mode of the chemical liquid flowing from the outer tank 301 to the inner tank 302 prevents the photoresist or impurities from sticking back to the wafer W. Specifically, in the process of cleaning the wafer W, the first valve 341 and the second valve 342 are closed, and the third valve 316 and the fourth valve 317 are opened. The chemical liquid flows from the bottom of the inner tank 302 to the acid collecting box 35 , and after being filtered by the first filter 314 , the chemical liquid is filtered again by the pump 313 through the second filter 315 and sent back to the outer tank 301 . Next, the returned chemical liquid overflows from the outer tank 301 into the inner tank 302 , thus forming a liquid circulating flow for one photoresist removal or metal stripping step. It should be noted that the photoresist or metal stripped from the surface of the wafer W will pass through the shredder 10 of the wafer shaking device 20 along with the flow of the chemical liquid. The pulverizer 10 pulverizes large-sized foreign objects into small particles of metal or photoresist. In addition, the acid collecting box 35 can collect the crushed particles. The design of the crusher 10 can prevent large-sized foreign objects from blocking the downstream pipelines of the tank body 30 , such as the circulation pipeline 31 and the pipeline between the tank body 30 and the acid collecting box 35 .

As shown in FIG. 5, when the chemical liquid is discharged from the tank body 30 and the acid collecting box 35, the first valve 341 and the second valve 342 are opened, and the third valve 316 and the fourth valve 317 are closed. Therefore, the particles and the used chemical liquid in the tank body 30 and the acid collecting box 35 can be discharged to the waste liquid collecting device.

As shown in FIG. 5 , when cleaning the tank body 30 and the acid collecting box 35 , the first valve 341 and the second valve 342 are closed, and the third valve 316 , the fourth valve 317 and the sixth valve 331 are opened. Therefore, the deionized water can be injected into the tank body 30 and the acid collecting box 35 from the deionized water supply device 50 . In addition, when the tank body 30 is filled with deionized water, the sixth valve 331 is closed, and the deionized water is circulated multiple times through the circulation pipeline 31 to clean the tank body 30 and the acid collecting box 35 .

As shown in FIG. 5, when the deionized water is discharged from the tank body 30 and the acid collecting box 35, the first valve 341 and the second valve 342 are opened, and the third valve 316 and the fourth valve 317 are closed. Therefore, the deionized water in the tank body 30 and the acid collecting box 35 can be discharged to the waste liquid collecting device.

As shown in FIG. 5, when the tank body 30 and the acid collecting box 35 are filled with chemical liquid, the first valve 341 and the second valve 342 are closed, and the third valve 316, the fourth valve 317 and the fifth valve 321 are opened. Therefore, the chemical liquid (eg, photoresist removing liquid) can be injected into the tank body 30 and the acid collecting box 35 from the chemical liquid supply device 40 . In addition, when the chemical liquid is filled with the tank body 30, the fifth valve 321 is closed, and the chemical liquid is circulated for many times through the circulation pipeline 31, so that the concentration of the chemical liquid is evenly distributed in the tank body.

Compared with the prior art, the present application provides a wafer oscillating device with a crusher and a wafer cleaning system, which can crush the large-sized foreign objects separated from the wafer surface into small-sized particles, so that the small size of the particles going to the downstream pipeline can be reduced. Size particles will not block the pipeline to ensure smooth pipeline system.

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited to this. Any person with ordinary knowledge in the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should cover within the scope of protection of this application. Therefore, the protection scope of the present application shall be subject to the protection scope of the application patent scope.

1: Wafer cleaning system

10: Crusher

11: Frame

111: Basket Empty Department

112: Boss

113: Mounting bracket

12: Crystal Boat

121: The first opening

122: Second Opening

123: accommodating cavity

13: Processing device

131: First gear

132: Second gear

20: Wafer shaking device

21: Rack

211: First End

212: Second End

22: Lifting device

221: Telescopic rod

222: Motor

23: Drive gear

24: Long pole

30: tank body

301: Outer slot

302: Inner groove

31: Circulation pipeline

311: Input pipeline

312: output pipeline

313: Pump

314: First Filter

315: Second filter

316: The third valve

317: Fourth valve

32: The first liquid inlet pipeline

321: Fifth valve

33: Second liquid inlet pipeline

331: The sixth valve

34: Drain line

341: First valve

342: Second valve

35: Acid collection box

40: Chemical liquid supply equipment

50: Deionized water supply equipment

61: Metal

62: Photoresist

W: Wafer

A: Enlarged picture

FIG. 1 shows a first perspective view of a wafer oscillating device according to an embodiment of the present application; FIG. 2 shows a second perspective view of the wafer oscillating device according to an embodiment of the present application; Figure 3 shows an enlarged view of part A of Figure 1; FIG. 4 shows a schematic diagram of the operation of a shredder according to an embodiment of the present application; and FIG. 5 shows a schematic diagram of a wafer cleaning system according to an embodiment of the present application.

10: Crusher

11: Frame

111: Basket Empty Department

112: Boss

12: Crystal Boat

121: The first opening

122: Second Opening

123: accommodating cavity

13: Processing device

20: Wafer shaking device

21: Rack

212: Second End

222: Motor

W: Wafer

A: Enlarged picture

Claims (12)

A shredder, comprising: a frame; a wafer boat, disposed on the frame, configured to carry a wafer, wherein the wafer boat includes an accommodating cavity, a first opening and a second opening, the accommodating cavity The cavity is configured to accommodate the wafer, the first opening serves as a passage for the wafer to enter or leave the wafer boat, and the second opening is opposite to the first opening, and the second opening serves to drain the accommodating cavity a passage for foreign matter separated from the wafer within; and a processing device disposed on the frame and between the frame and the wafer boat, wherein the processing device is separated from the wafer boat, and the processing device faces The second opening of the wafer boat allows the foreign matter to enter the processing device from the second opening of the wafer boat, and the processing device is configured to break up the foreign matter. The shredder of claim 1, wherein the processing device includes a pair of gears, and the pair of gears are rotatably mounted on the frame. The shredder of claim 2, wherein the processing device further comprises a drive group connected to the pair of gears and configured to drive the pair of gears to rotate in opposite directions to each other. A wafer oscillating device, comprising: a frame, including opposite first ends and second ends; a crusher, set on the first end of the frame, comprising: a frame, and the first end of the frame One end is fixedly connected; a wafer boat is disposed on the frame and configured to carry a wafer, wherein the wafer boat includes an accommodating cavity, a first opening and a second opening, and the accommodating cavity is configured to accommodate the wafer, the first opening serves as a channel for the wafer to enter or leave the boat, and the second opening is relative to the first opening an opening, and the second opening serves as a channel for discharging the foreign matter separated from the wafer in the accommodating cavity; and a processing device disposed on the frame and between the frame and the wafer boat, wherein the processing device being spaced apart from the wafer boat, and the processing device faces the second opening of the wafer boat so that the foreign matter enters the processing device from the second opening of the wafer boat, and the processing device is configured to crush the foreign matter; and a lifting device, disposed at the second end of the frame, configured to control the frame to move along the vertical direction to drive the crusher to reciprocate. The wafer shaking device according to claim 4, wherein the lifting device comprises: a telescopic rod and a motor, the telescopic rod is fixedly connected with the second end of the rack, and the motor is connected with the telescopic rod, is configured to control the telescoping of the telescopic rod. The wafer shaking device of claim 4, wherein the processing device of the shredder includes a pair of gears, and the pair of gears are rotatably mounted on the frame. The wafer shaking device according to claim 6, wherein the processing device of the shredder further comprises a driving group connected with the pair of gears and configured to drive the pair of gears to rotate in opposite directions to each other. A wafer cleaning system, comprising: a tank body; a pipeline set connected to the tank body, configured to input a process liquid into the tank body or output the process liquid from the inside of the tank body; and A wafer oscillating device, comprising: a frame including opposite first ends and second ends; a shredder, provided with the first end of the frame, wherein the first end of the frame and the shredder are arranged in the interior of the tank, and the shredder comprises: a frame, and the The first end of the frame is fixedly connected; a wafer boat is arranged on the frame and configured to carry a wafer, wherein the wafer boat includes a accommodating cavity, a first opening and a second opening, the accommodating cavity The cavity is configured to accommodate the wafer, the first opening serves as a passage for the wafer to enter or leave the wafer boat, and the second opening is opposite to the first opening, and the second opening serves to drain the accommodating cavity a passage for foreign matter separated from the wafer within; and a processing device disposed on the frame and between the frame and the wafer boat, wherein the processing device is spaced from the wafer boat, and the processing device faces The second opening of the wafer boat allows the foreign matter to enter the processing device through the second opening of the wafer boat, and the processing device is configured to crush the foreign matter; and a lifting device disposed on the first portion of the rack The two ends are configured to control the frame to move along the vertical direction to drive the crusher to reciprocate, wherein the second end of the frame and the lifting device are arranged outside the tank body. The wafer cleaning system according to claim 8, wherein the tank body of the wafer cleaning system comprises an input port and a discharge port, the input port is provided on the side wall of the tank body, and the discharge port is provided on the side wall of the tank body The processing device at the bottom and facing the crusher, and the foreign matter crushed by the processing device of the crusher is discharged from the discharge port; and the pipeline group of the wafer cleaning system includes a circulation pipe Road, including an input pipeline, an output pipeline, a pump and a filter, the input pipeline is connected with the input port of the tank body, the output pipeline is connected to the downstream of the tank body, and the pump is connected The input pipeline and the output pipeline, and the filter are arranged on the output pipeline. The wafer cleaning system according to claim 8, wherein the lifting device of the wafer shaking device comprises: a telescopic rod and a motor, the telescopic rod is fixedly connected with the second end of the rack, and the motor It is connected with the telescopic rod, and is configured to control the telescopic rod's expansion and contraction. The wafer cleaning system of claim 8, wherein the processing device of the shredder includes a pair of gears, and the pair of gears are rotatably mounted on the frame. The wafer cleaning system of claim 11, wherein the processing device of the shredder further comprises a driving group connected with the pair of gears and configured to drive the pair of gears to rotate in opposite directions to each other.

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