CN116206999A - Pulper, wafer oscillating device and wafer cleaning system - Google Patents

Pulper, wafer oscillating device and wafer cleaning system Download PDF

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Publication number
CN116206999A
CN116206999A CN202111440234.4A CN202111440234A CN116206999A CN 116206999 A CN116206999 A CN 116206999A CN 202111440234 A CN202111440234 A CN 202111440234A CN 116206999 A CN116206999 A CN 116206999A
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CN
China
Prior art keywords
frame
wafer
boat
processing device
opening
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Pending
Application number
CN202111440234.4A
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Chinese (zh)
Inventor
黄立佐
吴进原
张修凯
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Grand Plastic Technology Corp
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Grand Plastic Technology Corp
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Priority to CN202111440234.4A priority Critical patent/CN116206999A/en
Publication of CN116206999A publication Critical patent/CN116206999A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C4/00—Crushing or disintegrating by roller mills
    • B02C4/02—Crushing or disintegrating by roller mills with two or more rollers
    • B02C4/08—Crushing or disintegrating by roller mills with two or more rollers with co-operating corrugated or toothed crushing-rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C4/00—Crushing or disintegrating by roller mills
    • B02C4/28—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C4/00—Crushing or disintegrating by roller mills
    • B02C4/28—Details
    • B02C4/30—Shape or construction of rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C2201/00—Codes relating to disintegrating devices adapted for specific materials
    • B02C2201/06—Codes relating to disintegrating devices adapted for specific materials for garbage, waste or sewage

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  • Engineering & Computer Science (AREA)
  • Food Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The application discloses pulper, wafer oscillation device and wafer cleaning system. The pulper comprises a frame, a boat and a processing device. The wafer boat is disposed on the frame and configured to carry wafers. The processing device is arranged on the frame and is positioned between the frame and the wafer boat. The processing device is arranged separately from the wafer boat. The processing apparatus faces the opening of the wafer boat such that foreign matter separated from the wafer enters the processing apparatus from the opening of the wafer boat. The processing device is configured to agitate the foreign matter so that particles going to downstream piping do not clog the piping to ensure smoothness of the piping system.

Description

Pulper, wafer oscillating device and wafer cleaning system
Technical Field
The present disclosure relates to the field of semiconductors, and more particularly, to a grinder, a wafer oscillating device and a wafer cleaning system.
Background
The wafer manufacturing process includes a photoresist removal (photoresist stripping) step or a metal lift-off step. Photoresist or metal is typically dissolved or stripped from the wafer surface with a chemical liquid during the photoresist removal and metal stripping steps. Photoresist or metal stripped from the wafer surface will follow the chemical liquid flow to downstream lines. However, if the size of the stripped photoresist or metal is too large, the large size photoresist or metal can clog the piping, thereby causing abnormal operation of the process equipment.
In view of the above, the present application provides a pulper, a wafer oscillating device and a wafer cleaning system, so as to solve the above technical problems.
Disclosure of Invention
The utility model provides a pulper, wafer concussion device and wafer cleaning system can avoid the problem that the large-scale foreign matter of follow surface separation of wafer blockked up the low reaches pipeline.
In a first aspect, the present application provides a shredder comprising a frame, a boat, and a processing device. The wafer boat is disposed on the frame and configured to carry wafers, wherein the wafer boat includes a receiving chamber configured to receive the wafers, a first opening serving as a passage for providing the wafers to enter or leave the wafer boat, and a second opening opposite to the first opening and serving as a passage for discharging foreign matters separated from the wafers in the receiving chamber. The processing device is disposed on the frame and between the frame and the boat, wherein the processing device is disposed spaced apart from the boat, and the second opening of the processing device facing the boat is such that the foreign matter enters the processing device from the second opening of the boat, and the processing device is configured to agitate the foreign matter.
In some embodiments, the processing device includes a pair of gears, and the pair of gears are rotatably mounted on the frame.
In some embodiments, the processing device further comprises a drive set coupled to the pair of gears configured to drive the pair of gears to counter-rotate with respect to each other.
In a second aspect, the present application provides a wafer oscillating device, comprising: frame, pulper and elevating gear. The frame includes opposite first and second ends. The pulper is provided with the first end of the frame, comprising: frame, wafer boat and processing apparatus. The frame is fixedly connected with the first end of the frame. The wafer boat is disposed on the frame and configured to carry wafers, wherein the wafer boat includes a receiving chamber configured to receive the wafers, a first opening serving as a passage for providing the wafers to enter or leave the wafer boat, and a second opening opposite to the first opening and serving as a passage for discharging foreign matters separated from the wafers in the receiving chamber. The processing device is disposed on the frame and between the frame and the boat, wherein the processing device is disposed spaced apart from the boat, and the second opening of the processing device facing the boat is such that the foreign matter enters the processing device from the second opening of the boat, and the processing device is configured to agitate the foreign matter. The lifting device is arranged at the second end of the frame and is configured to control the frame to move along the vertical direction so as to drive the pulper to reciprocate.
In some embodiments, the lifting device comprises: the telescopic rod is fixedly connected with the second end of the frame, and the motor is connected with the telescopic rod and is configured to control the telescopic rod to stretch out and draw back.
In some embodiments, the processing device of the shredder includes a pair of gears, and the pair of gears are rotatably mounted on the frame.
In some embodiments, the processing device of the shredder further comprises a drive train coupled to the pair of gears configured to drive the pair of gears to counter-rotate with respect to each other.
In a third aspect, the present application provides a wafer cleaning system comprising: the device comprises a tank body, a pipeline group and a wafer oscillation device. The pipe set is connected to the tank body and configured to input or output a process liquid to or from an interior of the tank body. The wafer oscillation device comprises: frame, pulper and elevating gear. The frame includes opposite first and second ends. The pulper is provided with the first end of the housing, wherein the first end of the housing and the pulper are provided in the interior of the tank, and the pulper comprises: frame, wafer boat and processing apparatus. The frame is fixedly connected with the first end of the frame. The wafer boat is disposed on the frame and configured to carry wafers, wherein the wafer boat includes a receiving chamber configured to receive the wafers, a first opening serving as a passage for providing the wafers to enter or leave the wafer boat, and a second opening opposite to the first opening and serving as a passage for discharging foreign matters separated from the wafers in the receiving chamber. The processing device is disposed on the frame and between the frame and the boat, wherein the processing device is disposed spaced apart from the boat, and the second opening of the processing device facing the boat is such that the foreign matter enters the processing device from the second opening of the boat, and the processing device is configured to agitate the foreign matter. The lifting device is arranged at the second end of the frame and is configured to control the frame to move along the vertical direction so as to drive the pulper to reciprocate, wherein the second end of the frame and the lifting device are arranged outside the groove body.
In some embodiments, the tank of the wafer cleaning system includes an input port and an exhaust port, the input port being disposed at a side wall of the tank, and the exhaust port being disposed at a bottom of the tank and facing the processing device of the pulper, and the foreign matter being pulped by the processing device of the pulper being exhausted from the exhaust port; and the pipeline group of the wafer cleaning system comprises a circulating pipeline, and comprises an input pipeline, an output pipeline, a pump and a filter, wherein the input pipeline is connected with the input port of the tank body, the output pipeline is connected to the downstream of the tank body, the pump is connected with the input pipeline and the output pipeline, and the filter is arranged on the output pipeline.
In some embodiments, the lifting device of the wafer oscillation device comprises: the telescopic rod is fixedly connected with the second end of the frame, and the motor is connected with the telescopic rod and is configured to control the telescopic rod to stretch out and draw back.
In some embodiments, the processing device of the shredder includes a pair of gears, and the pair of gears are rotatably mounted on the frame.
In some embodiments, the processing device of the shredder further comprises a drive train coupled to the pair of gears configured to drive the pair of gears to counter-rotate with respect to each other.
Compared with the prior art, the wafer vibration device with the pulper and the wafer cleaning system can be used for crushing large-size foreign matters separated from the surface of the wafer into small-size particles, so that the small-size particles going to the downstream pipeline can not block the pipeline, and smoothness of the pipeline system is ensured.
Drawings
Technical solutions and other advantageous effects of the present application will be made apparent from the following detailed description of specific embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a first perspective view of a wafer oscillating device according to an embodiment of the present application.
Fig. 2 is a second perspective view of the wafer oscillating device according to the embodiment of the application.
Fig. 3 shows an enlarged view of a portion a of fig. 1.
FIG. 4 shows a schematic diagram of the operation of a pulper according to an embodiment of the application.
Fig. 5 shows a schematic diagram of a wafer cleaning system according to an embodiment of the present application.
Detailed Description
Example embodiments are now described more fully with reference to the accompanying drawings. However, the example embodiments may be embodied in many different forms and should not be construed as limited to the examples set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The drawings are merely schematic illustrations of the present application and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus a repetitive description thereof will be omitted.
Referring to fig. 1 and 2, fig. 1 shows a first perspective view of a wafer oscillating device according to an embodiment of the present application, and fig. 2 shows a second perspective view of the wafer oscillating device according to an embodiment of the present application. The wafer oscillation device 20 includes a grinder 10. The pulper 10 includes a frame 11, a boat 12, and a processing device 13. The frame 11 includes a flat plate and a boss 112. The plate has a basket 111 and a boss 112 is provided on the plate. The frame 11 is made to comprise two different levels of surface by the boss 112, namely the surface of the flat plate and the upper surface of the boss 112.
As shown in fig. 1, the boat 12 is disposed on a boss 112 of the frame 11. It should be appreciated that the boat 12 is detachably placed on the frame 11, such as by a robotic arm or handling mechanism to effect the combination or separation of the boat 12 and the frame 11. The wafer boat 12 is configured to carry wafers W, and includes a first opening 121, a second opening 122, and a receiving chamber 123. The receiving chamber 123 is configured to receive one or more wafers W. The first opening 121 serves as a passage for providing the wafers W into or out of the boat 12. The second opening 122 is opposite to the first opening 121, and the second opening 122 serves as a passage for discharging foreign matter separated from the wafer W in the accommodating chamber 123. The foreign matter separated from the wafer W includes photoresist, metal, thin film, and the like. Specifically, the wafer process includes a photoresist removal (photoresist stripping) step or a metal lift-off step. In the photoresist removing or metal stripping step, the photoresist and part of the metal on the surface of the wafer W are removed by the chemical liquid, and the foreign matters separated from the wafer W flow out of the boat 12 along with the chemical liquid.
As shown in fig. 1, the processing device 13 is provided on a flat plate of the frame 11. Since the surface of the flat plate of the frame 11 is lower than the upper surface of the boss 112, the processing device 13 is located between the frame 11 and the boat 12. It should be noted that the processing apparatus 13 is disposed apart from the boat 12, i.e., the processing apparatus 13 is spaced apart from the boat 12 by a vertical distance to avoid direct contact between the processing apparatus 13 and the boat 12 and the wafers W.
Referring to fig. 1 and 3, fig. 3 shows an enlarged view of a portion a of fig. 1. The processing device 13 includes a first gear 131 and a second gear 132, and the first gear 131 and the second gear 132 are rotatably mounted on the frame 11. Specifically, the frame 11 includes a pair of mounting brackets 113, and the pair of mounting brackets 113 are fixed to a flat plate of the frame 11. Both ends of the rotation shaft of the first gear 131 and the second gear 132 protrude to the outside and are rotatably assembled with the pair of mounting frames 113, respectively.
As shown in fig. 2 and 3, the processing device 13 includes a driving group, which is connected to the first gear 131 and the second gear 132, and configured to drive the first gear 131 and the second gear 132 to rotate. The drive group comprises a drive gear 23 and a long rod 24, wherein one end of the long rod 24 is connected with the drive gear 23, and the other end is connected with the driver. The driving gear 23 is intermeshed with one of the first gear 131 and the second gear 132. The driver controls the long rod 24 to rotate around the shaft, so that the driving gear 23 rotates together, and the driving gear 23 drives one of the first gear 131 and the second gear 132 to rotate. It should be appreciated that in some embodiments, other ways of rotating the first gear 131 and the second gear 132 may be employed.
Referring to FIG. 4, a schematic diagram of the operation of the pulper 10 according to an embodiment of the present application is shown. The first gear 131 and the second gear 132 of the processing device 13 of the pulper 10 are engaged with each other, and the first gear 131 and the second gear 132 are rotated in reverse (as indicated by arrow directions in fig. 4) to each other. As shown in fig. 1, one side of the processing apparatus 13 corresponds to the basket empty part 111 of the frame 11, and the other opposite side of the processing apparatus 13 faces the second opening 122 of the boat 12, so that foreign matter enters the processing apparatus 13 from the second opening 122 of the boat 12, and the processing apparatus 13 is configured to pulverize the foreign matter. Specifically, as shown in fig. 4, by the first gear 131 and the second gear 132 being engaged with each other and rotated in opposite directions to each other, foreign matters (such as metal 61, photoresist 62) entering into a gap between the first gear 131 and the second gear 132 are crushed by the gear extrusion, so that the large-sized foreign matters are crushed into small-sized particles.
As shown in fig. 1 and 2, the wafer oscillating device 20 further includes a frame 21 and a lifting device 22. The housing 21 includes opposite first and second ends 211, 212. The pulper 10 is arranged at a first end 211 of the frame 21, and the frame 11 of the pulper 10 is fixedly connected with the first end 211 of the frame 21. The lifting device 22 is disposed at the second end 212 of the frame 21, and is configured to control the frame 21 to move along the vertical direction to drive the pulper 10 to reciprocate. Lifting device 22 the lifting device comprises a telescopic rod 221 and a motor 222. The telescoping rod 221 is fixedly connected to the second end 212 of the frame 21, and the motor 222 is connected to the telescoping rod 221 and configured to control telescoping of the telescoping rod 221 and, in turn, movement of the frame 21 to different levels.
Referring to fig. 5, a schematic diagram of a wafer cleaning system 1 according to an embodiment of the present application is shown. The wafer cleaning system 1 includes the wafer oscillating device 20, the tank 30 and the pipeline set. The specific structure of the wafer oscillating device 20 and the pulper 10 is the same as that described above, and the detailed description thereof is omitted herein. Furthermore, the first end 211 of the frame 21 of the wafer oscillation device 20 and the grinder 10 are movably disposed inside the tank 30, and the second end 212 of the frame 21 and the lifting device 22 are disposed outside the tank 30. It should be noted that when the lifting device 22 of the wafer oscillating device is started, the wafer W oscillates up and down, so as to promote frequent contact between the wafer W and the chemical liquid to accelerate the reaction. Furthermore, the foreign matter is accelerated away from the surface of the wafer W by the oscillating motion.
As shown in fig. 5, the tank body 30 includes an outer tank 301 and an inner tank 302, and the outer tank 301 surrounds the inner tank 302. The walls of the outer tank 301 are higher than the walls of the inner tank 302 so that liquid overflowing from the outer tank 301 will enter the inner tank 302. The top of both the outer tank 301 and the inner tank 302 have openings, and the openings at the top of the inner tank 302 serve as passages for the boats 12 of the shredder 10 to enter or leave the tank body 30. The side wall of the outer tank 301 is provided with an input port and a first discharge port, wherein the input port has a level higher than that of the first discharge port. The bottom of the inner tank 302 is provided with a second discharge port, wherein the second discharge port has a lower level than the first discharge port. The second discharge port faces the processing device 13 of the shredder 10, and foreign matter mashed by the processing device 13 of the shredder 10 is discharged from the second discharge port.
As shown in fig. 5, the pipe group is connected to the tank 30 and configured to input the process liquid into the inside of the tank 30 or output the process liquid from the inside of the tank 30. Specifically, the line set of the wafer cleaning system 1 includes a circulation line 31, a first liquid inlet line 32, a second liquid inlet line 33, and a liquid discharge line. One end of the first liquid feed line 32 is connected to the chemical liquid supply apparatus 40, and the other end extends to the top of the tank body 30 and is right open to the top of the outer tank 301 to inject the chemical liquid into the outer tank 301. One end of the second liquid inlet pipe 33 is connected to the deionized water supply apparatus 50, and the other end extends to the top of the tank body 30 and is right open to the top of the outer tank 301 to inject the chemical liquid into the outer tank 301. In the present embodiment, the process liquid includes a chemical liquid and deionized water, but is not limited thereto.
As shown in fig. 5, the circulation line 31 of the line group includes an input line 311, an output line 312, a pump 313, a first filter 314, and a second filter 315. One end of the input pipe 311 is connected to the input port of the outer tank 301 of the tank body 30, and the other end is connected to the pump 313. The output line 312 is connected at one end to the tank body 30 downstream of the inner tank 302 and at the other end to the pump 313. Specifically, the wafer cleaning system 1 includes a acid collection box 35. The acid collecting box 35 is connected to the second discharge port of the inner tank 302, and the acid collecting box 35 is also connected to one end of the output line 312 of the circulation line 31. A first filter 314 is provided on the output line 312 and a second filter 315 is provided on the input line 311. By providing the first filter 314 on the output line 312, damage to the pump 313 caused by foreign matter entering the interior of the pump 313 can be avoided.
As shown in fig. 5, the drain line 34 of the line set includes a first section and a second section. The first section connects the first discharge opening of the outer tank 301 of the tank body 30 and the acid collecting box 35. The second section connects the acid collecting box 35 and the waste liquid collecting device. A first valve 341 is provided in a first section of the drain line 34 and a second valve 342 is provided in a second section of the drain line 34. Further, a third valve 316 is provided in the output line 312 of the circulation line 31, and a fourth valve 317 is provided in the input line 311 of the circulation line 31. A fifth valve 321 is provided in the first liquid inlet line 32. A sixth valve 331 is provided in the second liquid inlet line 33.
When the wafer cleaning system 1 of the present application is applied in the photoresist removing step or the metal stripping step of the wafer process, the fifth valve 321 of the first liquid inlet pipeline 32 is opened, and the chemical liquid is input into the tank 30. The circulation of chemical liquid from the outer tank 301 to the inner tank 302 prevents photoresist or impurities from sticking back to the wafer W. Specifically, during the cleaning of the wafer W, the first valve 341 and the second valve 342 are closed, and the third valve 316 and the fourth valve 317 are opened. The chemical liquid flows from the bottom of the inner tank 302 to the acid collecting box 35, is filtered by the first filter 314, and is filtered again by the second filter 315 by the pump 313 and is then returned to the outer tank 301. The returned chemical liquid then overflows from the outer tank 301 into the inner tank 302, thus creating a liquid circulation flow that removes photoresist or metal strip steps. It should be noted that the photoresist or metal stripped from the surface of the wafer W will pass through the pulper 10 of the wafer oscillating device 20 as the chemical liquid flows. The shredder 10 shreds large-sized foreign objects into small-sized metal or photoresist. And, the acid collecting box 35 may collect the crushed particles. By the design of the pulper 10, clogging of downstream piping of the tank body 30, such as the circulation piping 31 and piping between the tank body 30 and the acid collecting box 35, with large-sized foreign matter can be prevented.
As shown in fig. 5, when the chemical liquid is discharged from the tank 30 and the acid collecting box 35, the first valve 341 and the second valve 342 are opened, and the third valve 316 and the fourth valve 317 are closed. Thus, the particles and the used chemical liquid in the tank 30 and the acid box 35 can be discharged to the waste liquid collecting device.
As shown in fig. 5, when the cleaning tank 30 and the acid collecting box 35 are in use, the first valve 341 and the second valve 342 are closed, and the third valve 316, the fourth valve 317 and the sixth valve 331 are opened. Accordingly, deionized water may be injected into the tank 30 and the acid collecting box 35 from the deionized water supply apparatus 50. And, when the deionized water fills up the tank body 30, the sixth valve 331 is closed, and the deionized water is circulated through the circulation line 31 a plurality of times to wash the tank body 30 and the acid collecting box 35.
As shown in fig. 5, when deionized water is discharged from the tank 30 and the acid collecting box 35, the first valve 341 and the second valve 342 are opened, and the third valve 316 and the fourth valve 317 are closed. Thus, deionized water in the tank 30 and the acid box 35 can be discharged to the waste liquid collecting device.
As shown in fig. 5, when the tank 30 and the acid tank 35 are filled with chemical liquid, the first valve 341 and the second valve 342 are closed, and the third valve 316, the fourth valve 317, and the fifth valve 321 are opened. Thus, a chemical liquid (e.g., photoresist stripper) can be injected into the tank 30 and the acid box 35 from the chemical liquid supply device 40. When the tank 30 is filled with the chemical liquid, the fifth valve 321 is closed, and the chemical liquid is circulated through the circulation line 31 a plurality of times, so that the chemical liquid concentration is uniformly distributed in the tank.
Compared with the prior art, the wafer vibration device with the pulper and the wafer cleaning system can be used for crushing large-size foreign matters separated from the surface of the wafer into small-size particles, so that the small-size particles going to the downstream pipeline can not block the pipeline, and smoothness of the pipeline system is ensured.
The foregoing is merely a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions should be covered in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (12)

1. A pulper, characterized in that it comprises:
a frame;
a wafer boat disposed on the frame and configured to carry wafers, wherein the wafer boat includes a receiving chamber configured to receive the wafers, a first opening serving as a passage for providing the wafers to enter or leave the wafer boat, and a second opening opposite to the first opening, and serving as a passage for discharging foreign matters separated from the wafers within the receiving chamber; and
and a processing device disposed on the frame and between the frame and the boat, wherein the processing device is disposed apart from the boat, and the second opening of the processing device facing the boat is such that the foreign matter enters the processing device from the second opening of the boat, and the processing device is configured to agitate the foreign matter.
2. The shredder according to claim 1, wherein the processing apparatus comprises a pair of gears and the pair of gears are rotatably mounted on the frame.
3. The shredder according to claim 2, wherein the processing apparatus further comprises a drive train coupled to the pair of gears configured to drive the pair of gears to counter-rotate with respect to each other.
4. The utility model provides a wafer oscillation device which characterized in that, wafer oscillation device includes:
a housing including opposed first and second ends;
a pulper provided at the first end of the housing, comprising:
the frame is fixedly connected with the first end of the rack;
a wafer boat disposed on the frame and configured to carry wafers, wherein the wafer boat includes a receiving chamber configured to receive the wafers, a first opening serving as a passage for providing the wafers to enter or leave the wafer boat, and a second opening opposite to the first opening, and serving as a passage for discharging foreign matters separated from the wafers within the receiving chamber; and
a processing device disposed on the frame and between the frame and the boat, wherein the processing device is disposed apart from the boat, and the second opening of the processing device facing the boat causes the foreign matter to enter the processing device through the second opening of the boat,
and the processing device is configured to pulverize the foreign matter; and
and the lifting device is arranged at the second end of the frame and is configured to control the frame to move along the vertical direction so as to drive the pulper to reciprocate.
5. A wafer oscillating device according to claim 4, wherein said lifting device comprises: the telescopic rod is fixedly connected with the second end of the frame, and the motor is connected with the telescopic rod and is configured to control the telescopic rod to stretch out and draw back.
6. A wafer oscillating apparatus as defined in claim 4, wherein said processing means of said pulper comprises a pair of gears, and said pair of gears are rotatably mounted on said frame.
7. A wafer oscillating apparatus as defined in claim 4, wherein said processing means of said pulper further comprises a drive train coupled to said pair of gears and configured to drive said pair of gears to counter-rotate with respect to each other.
8. A wafer cleaning system, the wafer cleaning system comprising:
a tank body;
a pipe set connected to the tank body and configured to input or output a process liquid to or from an inside of the tank body; and
a wafer oscillation device, comprising:
a housing including opposed first and second ends;
a shredder provided at the first end of the housing, wherein the first end of the housing and the shredder are provided within the interior of the tank, and the shredder comprises:
the frame is fixedly connected with the first end of the rack;
a wafer boat disposed on the frame and configured to carry wafers, wherein the wafer boat includes a receiving chamber configured to receive the wafers, a first opening serving as a passage for providing the wafers to enter or leave the wafer boat, and a second opening opposite to the first opening, and serving as a passage for discharging foreign matters separated from the wafers within the receiving chamber; and
a processing device disposed on the frame and between the frame and the boat, wherein the processing device is disposed apart from the boat, and the second opening of the processing device facing the boat is such that the foreign matter enters the processing device from the second opening of the boat, and the processing device is configured to agitate the foreign matter; and
and the lifting device is arranged at the second end of the frame and is configured to control the frame to move along the vertical direction so as to drive the pulper to reciprocate, wherein the second end of the frame and the lifting device are arranged outside the groove body.
9. The wafer cleaning system of claim 8, wherein the tank of the wafer cleaning system includes an input port and an exhaust port, the input port being provided at a side wall of the tank, and the exhaust port being provided at a bottom of the tank and facing the processing device of the shredder, and the foreign matter shredded by the processing device of the shredder being exhausted from the exhaust port; and
the pipeline group of the wafer cleaning system comprises a circulating pipeline, and comprises an input pipeline, an output pipeline, a pump and a filter, wherein the input pipeline is connected with the input port of the tank body, the output pipeline is connected to the downstream of the tank body, the pump is connected with the input pipeline and the output pipeline, and the filter is arranged on the output pipeline.
10. The wafer cleaning system of claim 8, wherein the lifting device of the wafer oscillation device comprises: the telescopic rod is fixedly connected with the second end of the frame, and the motor is connected with the telescopic rod and is configured to control the telescopic rod to stretch out and draw back.
11. The wafer cleaning system of claim 8, wherein the processing device of the pulper comprises a pair of gears, and the pair of gears are rotatably mounted on the frame.
12. The wafer cleaning system of claim 8, wherein the processing device of the pulper further comprises a drive train coupled to the pair of gears configured to drive the pair of gears to counter-rotate with respect to each other.
CN202111440234.4A 2021-11-30 2021-11-30 Pulper, wafer oscillating device and wafer cleaning system Pending CN116206999A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111440234.4A CN116206999A (en) 2021-11-30 2021-11-30 Pulper, wafer oscillating device and wafer cleaning system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111440234.4A CN116206999A (en) 2021-11-30 2021-11-30 Pulper, wafer oscillating device and wafer cleaning system

Publications (1)

Publication Number Publication Date
CN116206999A true CN116206999A (en) 2023-06-02

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CN202111440234.4A Pending CN116206999A (en) 2021-11-30 2021-11-30 Pulper, wafer oscillating device and wafer cleaning system

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