TWM623963U - Engagement assembly, frame assembly and electronic device - Google Patents
Engagement assembly, frame assembly and electronic device Download PDFInfo
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Abstract
Description
本創作係關於一種卡扣機制,特別是一種卡扣組件、框架組件及電子裝置。This creation relates to a buckle mechanism, in particular to a buckle component, a frame component and an electronic device.
在雲端領域中,伺服器(server)扮演著關鍵的角色,它能提供並實現網路用戶所要求的各種雲端服務,且隨著科技的進步,伺服器已廣泛地應用於如遊戲、語言處理、金融、生物醫藥、搜尋引擎、電子商務、社交網絡媒體等不同領域。In the cloud field, the server (server) plays a key role, it can provide and realize various cloud services required by network users, and with the advancement of technology, the server has been widely used in games, language processing, etc. , finance, biomedicine, search engine, e-commerce, social network media and other fields.
為了擴充、替換或安裝各種功能進入伺服器,伺服器機箱通常搭配有可拆卸式擴充模組,以讓使用者能將所需的電子元件、裝置固定於擴充模組的可拆卸式框架,再與框架一併安裝進入伺服器機箱。但隨著近幾年市場對伺服器效能需求越來越嚴苛,需要在機箱的有限空間中加入更高效能的模組,此改變壓縮了用於將擴充模組之框架固定於伺服器機箱的機構設計空間。例如目前傳統的擴充模組框架放入伺服器機箱後仍需仰賴手轉螺絲的鎖固才能完成固定,為此,擴充模組框架與伺服器機箱之間需要為手轉螺絲預留設置與操作的空間,且手轉螺絲施用後會突出於伺服器機箱之外,這些都不利於空間利用率的提升。In order to expand, replace or install various functions into the server, the server case is usually equipped with a detachable expansion module, so that the user can fix the required electronic components and devices on the detachable frame of the expansion module, and then Installs into the server chassis with the frame. However, as the market has become more and more demanding on server performance in recent years, it is necessary to add higher-performance modules in the limited space of the chassis. This change compresses the frame used for fixing expansion modules to the server chassis. institutional design space. For example, after the traditional expansion module frame is placed in the server chassis, it still needs to be locked by hand screws to complete the fixation. For this reason, the expansion module frame and the server chassis need to be reserved for the setting and operation of the manual screws. space, and the hand screw will protrude out of the server chassis after being applied, which is not conducive to the improvement of space utilization.
由此可知,有必要針對如何設計較不佔空間之固定機制,將是伺服器或其他相關領域積極研究的方向。It can be seen from this that it is necessary to design a fixed mechanism that takes up less space, which will be the direction of active research in servers or other related fields.
本創作之一實施例提供一種卡扣組件,適於連接一框體及一殼體,卡扣組件包括一卡扣件以及一導引件。卡扣件設置於框體。導引件設置於殼體。卡扣件可滑移地設置於導引件且可釋放地卡合於導引件,用以將框體固定於殼體。An embodiment of the present invention provides a buckle assembly, which is suitable for connecting a frame body and a casing. The buckle assembly includes a buckle member and a guide member. The clip is arranged on the frame body. The guide is arranged on the casing. The buckle is slidably disposed on the guide and releasably engaged with the guide, so as to fix the frame body to the casing.
本創作之另一實施例提供一種框架組件,適於連接一殼體,框架組件包括一框體、一卡扣件以及一導引件。卡扣件固定於框體。導引件設置於殼體。卡扣件相對導引件沿一第一方向移動再沿一第二方向滑動使卡扣件可移除地連接導引件,用以將框體固定於殼體,第一方向垂直第二方向。Another embodiment of the present invention provides a frame assembly suitable for connecting to a housing, the frame assembly includes a frame body, a snap member and a guide member. The clip is fixed on the frame body. The guide is arranged on the casing. The clip moves relative to the guide along a first direction and then slides along a second direction so that the clip can be removably connected to the guide for fixing the frame to the housing, the first direction is perpendicular to the second direction .
本創作之又一實施例提供一種電子裝置,包括一殼體、一框體、一卡扣件以及一導引件。框體可移除地裝設於殼體。卡扣件設置於框體。導引件設置於殼體。卡扣件沿一第一方向移動而疊設於導引件,卡扣件再沿一第二方向相對導引件滑動而可釋放地卡合於導引件,使框體設置於殼體。Yet another embodiment of the present invention provides an electronic device including a casing, a frame, a fastener and a guide. The frame body is removably installed on the housing. The clip is arranged on the frame body. The guide is arranged on the casing. The buckling piece moves along a first direction and is stacked on the guide piece, and the buckling piece slides relative to the guide piece along a second direction to be releasably engaged with the guide piece, so that the frame body is arranged on the casing.
應用本創作實施例的卡扣組件、框架組件及電子裝置,由於卡扣組件之卡扣件與導引件分別設置於框體與殼體,且卡扣件可藉由滑移設置於導引件的方式卡合導引件,從而將框體固定於殼體,藉此,使用者只需要將所欲安裝的框體相對殼體沿特定方向滑移等簡單步驟即可快速地完成安裝,省略了採用手轉螺絲的傳統做法,因此在伺服器的地應用中,不再需要於擴充模組之框架與伺服器機箱之間額外保留手轉螺絲的設置與操作的空間,有助於整體空間利用率的提升。Applying the buckle component, the frame component and the electronic device of the present invention, the buckle component and the guide component of the buckle component are respectively disposed on the frame body and the casing, and the buckle component can be arranged on the guide by sliding The guide piece is engaged with the guide piece by means of a piece, so as to fix the frame body to the casing, whereby the user only needs to slide the frame body to be installed relative to the casing in a specific direction to complete the installation quickly. The traditional method of using hand-turn screws is omitted, so in the application of the server, it is no longer necessary to reserve additional space for the setting and operation of hand-turn screws between the frame of the expansion module and the server case, which is helpful for the overall Improved space utilization.
以上之關於本創作揭露內容之說明及以下之實施方式之說明,係用以示範與解釋本創作之精神與原理,並且提供本創作之專利申請範圍更進一步之解釋。The above description of the disclosed content of this creation and the description of the following implementations are used to demonstrate and explain the spirit and principle of this creation, and provide further explanations of the scope of the patent application of this creation.
圖1係顯示本創作之一實施例之電子裝置的局部放大立體分解示意圖。需先說明的是,為達圖面簡潔及便於觀看之目的,圖式簡化或省略了例如走線、擴充卡、硬碟、電路板以及其他架體等與本創作之精神非直接關聯之電子/非電子構件。FIG. 1 is a partially enlarged perspective exploded schematic diagram showing an electronic device according to an embodiment of the present invention. It should be noted that, for the purpose of simplicity and ease of viewing, the diagram simplifies or omits electronics that are not directly related to the spirit of this creation, such as wiring, expansion cards, hard disks, circuit boards, and other racks. /Non-electronic components.
請參閱圖1,本創作之一實施例提出了一種電子裝置9,電子裝置9可以但不限於是一種電腦主機、伺服器主機或能置放於電腦主機或伺服主機內的模組的部分或全部,但本創作並非以此為限。電子裝置9可包括一殼體90,所述之殼體90為電子裝置9中用於容置或承載各種所需的電子/非電子模組或組件的殼件的局部或全部。例如,殼體90適於容置一框架組件8之一框體80,所述之框體80可以但不限於是以任何合適材質所製成之單一殼件或多件殼體相組裝所構成的框架,可用於承載或容置一或多個所需的功能單元(未繪示),所述之功能單元可以但不限於是硬碟、記憶體或擴充卡等適於加入電子裝置9的任何合適電子構件,可與框體80一併安裝至殼體90內,藉此,框架組件8與其框體80上之功能單元能共同構成一個擴充模組,以將所需的功能加入電子裝置9。Referring to FIG. 1, an embodiment of the present invention proposes an
為使框體80穩固地組裝於殼體90,於本實施例中,電子裝置9可更包括一卡扣組件1,藉由卡扣組件1,框架組件8之框體80可僅透過放置進入殼體90(如沿圖示之第一方向D1)再相對殼體90滑移(如沿圖示之第二方向D2)等簡單步驟即可快速地固定於電子裝置9之殼體90,從而實現擴充模組的免工具安裝。以下,將針對卡扣組件1進行詳細說明。In order to stably assemble the
具體地,請接續參閱圖2~3,圖2係顯示本創作之一實施例之框架組件及其上之卡扣組件的仰視立體示意圖,圖3係顯示本創作之一實施例之電子裝置的進一步局部放大立體分解示意圖。Specifically, please continue to refer to FIGS. 2-3. FIG. 2 is a bottom perspective schematic diagram showing a frame assembly and a snap-on assembly thereon according to an embodiment of the present invention, and FIG. 3 shows a schematic diagram of an electronic device according to an embodiment of the present invention. Further partial enlarged three-dimensional exploded schematic diagram.
於本實施例中,卡扣組件1可包括多個卡扣件10以及多個導引件20。大致上,卡扣件10設置於框體80,導引件20設置於殼體90,卡扣件10可滑移地設置於導引件20且可釋放地卡合於導引件20,以將框體80可拆卸地固定於殼體90。卡扣件10與導引件20以一對一相互搭配的方式共分成兩組構件,由於這兩組卡扣件10與導引件20具有實質上相同或相似的結構,故為達簡要說明之目的,以下僅以其中一組卡扣件10與導引件20等相關內容為例來說明卡扣組件1。In this embodiment, the
於本實施例中,卡扣件10整體略呈片狀或厚度較薄的長條狀,且可以但不限於是由塑膠或金屬等合適材質所一體成型,卡扣件10可沿第一方向D1放置而疊設於導引件20之一側,且可再沿第二方向D2相對導引件20滑動於一第一位置(如圖4A~4B所示)及一第二位置(如圖5A~5B所示)之間。所述之第一方向D1與第二方向D2可為實質上相互垂直的兩個假想參考方向,即第一方向D1實質上垂直於第二方向D2。In this embodiment, the
進一步來看,卡扣件10整體可實質上垂直於框架組件8之框體80,其可包括一固定部110以及一彈臂部120,固定部110為卡扣件10上用於連接於框架組件8之框體80的部分,可利用螺絲、鉚釘或焊接等任何合適方式直接地或間接地固定於框體80,但本創作並非以此為限。例如於本創作另一實施例之卡扣組件中,其卡扣件之固定部也可一體成形於框架組件之框體,換句話說,所述卡扣組件之卡扣件可與框架組件之框體為一體成型的單體結構。Looking further, the whole of the
彈臂部120自固定部110向外延伸(如沿著第二方向D2),可於接受一定程度的外力時產生形變而相對固定部110擺動,且可藉由本身材質的彈性而在外力取消時自動復位。並且,於本實施例中,彈臂部120突設有一卡勾結構121,如圖所示,卡勾結構121例如是自彈臂部120朝向導引件20的表面突出,適於卡合於導引件20。The
於本實施例中,導引件20整體略呈片狀或厚度較薄的長條狀,且可以但不限於是由塑膠或金屬等合適材質所一體成型,導引件20可包括一主體部200,主體部200整體可實質上垂直於電子裝置9之殼體90,且可以螺絲、鉚釘或焊接等任何合適方式固定於電子裝置9之殼體90,但本創作並非以此為限。於本創作另一實施例之卡扣組件中,其導引件之主體部也可一體成形於電子裝置之殼體,換句話說,所述卡扣組件之導引件可與電子裝置之殼體為一體成型的單體結構。In this embodiment, the
進一步來看,主體部200具有一卡合部201,可以但不限於是主體部200的一末端,卡扣件10之彈臂部120上的卡勾結構121可移除地卡合於卡合部201,以將卡扣件10固定於導引件20。於此補充說明的是,於本實施例中,卡扣件10之彈臂部120與固定部110可夾一角度,所述角度可小於180度,換句話說,彈臂部120相對於固定部110往特定方向(如往導引件20的方向)傾斜,藉此,可加強彈臂部120上之卡勾結構121施加於導引件20之卡合部201的預壓力,從而有助於增加卡勾結構121對卡合部201的卡合強度。Looking further, the
此外,於本實施例中,卡扣件10還包括一導引突部130突設於固定部110,如圖所示,導引突部130例如是自固定部110朝向導引件20的表面突出,並且,卡扣件10還包括一導引槽131,導引槽131是由固定部110與導引突部130之表面所共同圍繞而成,導引槽131沿第二方向D2延伸;相應於此,導引件20之主體部200突設有一導引條210,如圖所示,導引條210例如是自主體部200朝向卡扣件10的表面突出,導引條210沿第二方向D2延伸,適於可滑移地插入導引槽131。藉由導引突部130與導引條210的搭配,能確保卡扣件10在所預定的方向上(即第二方向D2)上滑移於所述第一位置(如圖4A~4B所示)與所述第二位置(如圖5A~5B所示)之間。In addition, in the present embodiment, the
補充說明的是,導引件20可為對稱的結構,如圖所示,單一個導引件20可包括兩個卡合部201與兩個導引條210,卡合部201可以但不限於位於主體部200的相對兩末端,導引條210介於卡合部201之間且彼此相間隔開,以於其之間形成一導引入口O,所述導引入口O適於讓卡扣件10之導引突部130通過,以使卡扣件10在沿第一方向D1活動而疊設於導引件20時,令導引槽131移動至對應導引條210的位置。It should be added that the
另外,於本實施例中,導引件20之卡合部201可具有一導引斜面211,位於卡合部201朝向卡扣件10之一側,且與第二方向D2呈一角度,當卡扣件10處於第一位置時,卡扣件10之彈臂部120上的卡勾結構121可對應或抵接於導引斜面211,而當卡扣件10沿第二方向D2相對導引件20往第二位置滑移的過程中,導引斜面211可經由與卡勾結構121的接觸而迫使彈臂部120之末端產生相對遠離導引件20的形變,從而有助於使卡勾結構121移動至可順勢卡合至導引件20之卡合部201的位置。In addition, in this embodiment, the engaging
於此,請接續圖1進一步參閱圖4A~5B以及圖6,以介紹卡扣組件1的操作,圖4A~5B係顯示本創作之一實施例之框架組件經由卡扣組件組裝於電子裝置之殼體的操作示意圖,圖6係顯示本創作之一實施例之電子裝置於框架組件經由卡扣組件安裝定位的局部放大立體示意圖。4A to 5B and FIG. 6, to introduce the operation of the
首先,如圖1與圖4A~4B所示,使用者可先將框架組件8之框體80沿第一方向D1放入電子裝置9之殼體90,藉以讓框體80上的卡扣件10對接於在殼體90上的導引件20。過程中,卡扣件10隨著框體80一併沿第一方向D1移動,且其導引突部130可沿第一方向D1通過導引件20之導引入口O,使得卡扣件10能移動至疊設於導引件20的位置。此時,卡扣件10處於第一位置,彈臂部120與彈臂部120上之卡勾結構121可未接觸或僅輕觸導引件20,因而仍實質上維持於原本的位置與狀態,並且,卡勾結構121可對應於導引件20的導引斜面211,而卡扣件10之導引槽131處於對應導引件20之導引條210的位置。First, as shown in FIG. 1 and FIGS. 4A-4B , the user can first put the
接著,如圖1、圖5A~5B與圖6所示,使用者可將框架組件8沿第二方向D2進一步推入電子裝置9之殼體90,藉以讓其框體80上之卡扣件10往第二位置移動以卡合殼體90上之導引件20。過程中,卡扣件10隨著框體80沿第二方向D2相對導引件20滑動,使得導引件20之導引條210可插入對應之導引槽131,由於導引槽131與導引條210均沿第二方向D2延伸,因而可確保卡扣件10沿第二方向D2往第二位置滑移。並且,導引件20之導引斜面211可經由與卡勾結構121的抵接而迫使彈臂部120之末端產生相對遠離導引件20的形變,從而在卡扣件10往第二位置活動時令卡勾結構121能順勢地滑移至導引件20之末端而卡合於卡合部201。此時,卡扣件10處於第二位置,其卡勾結構121卡合於導引件20之卡合部201,可防止卡扣件10脫離第二位置,並且,導引條210容置於導引槽131內,因而限制了卡扣件10往第一方向D1或相反於第一方向D1的活動自由度,此外,導引條210此時還可抵接於導引槽131的最深處,從而可避免卡扣件10繼續往第二方向D2過度移動。也就是說,卡扣件10此時在全方向上受到導引件20的限制,使得框體80能穩固地固定於殼體90上,從而完成框架組件8安裝於殼體90的操作。Next, as shown in FIG. 1 , FIGS. 5A-5B and FIG. 6 , the user can further push the
當欲拆卸框架組件8時,也只需要簡單的步驟即可完成。例如可對卡扣件10之彈臂部120的末端施力以使卡勾結構121脫離導引件20之卡合部201,屆時即可反向地先將框架組件8沿相反於第二方向D2的方向滑移至使導引條210脫離導引槽131的狀態(也就是卡扣件10從第二位置滑移到第一位置),即可再將框架組件8沿相反於第一方向D1的方向自殼體90中取出。When the
由此可知,藉由本實施例所述之卡扣組件1,使用者只需要將所欲安裝的框架組件8沿一方向(即第一方向D1)放入電子裝置9之殼體90後再沿另一方向(即第二方向D2)相對殼體90滑移等簡單的步驟即可快速地完成框架組件8至電子裝置9的免工具安裝。反之,使用者只需要扳動卡扣件10再反向前述操作即可快速地完成框架組件8脫離電子裝置9的免工具拆卸。也就是說,應用有本實施例之卡扣組件1有助於提升擴充模組的拆裝作業效率。It can be seen from this that, with the
不僅如此,由於卡扣組件1之卡扣件10與導引件20是相互疊設的片狀結構,且卡扣件10與導引件20可分別實質上垂直於框架組件8之框體80與電子裝置9之殼體90,因此卡扣件10與導引件20適於配置在電子裝置9內未被其他電子/非電子元件或組件佔用的狹長形區域或所述電子/非電子元件或組件之間的狹長形閒置空間,從而達到提高空間利用率的效果。相較於擴充模組之框架仰賴手轉螺絲來固定於伺服器機箱而需要在兩者之間保留手轉螺絲的設置與操作空間的傳統設計來說,應用有本實施例之卡扣組件1的電子裝置9的殼體90與框架組件8的框體80則可省略及避免採用手轉螺絲及為其保留的設置與操作空間。Not only that, because the
當然,前述實施例僅是本創作之其中一示例,並非用於限制本創作,本領域具有通常知識可理解的是,在不違背本創作前述精神的情況下,當可對本創作之卡扣組件依據實際需求進行合適的修飾與調整,例如於另一實施例中,卡扣組件可僅包括一組卡扣件與導引件。Of course, the foregoing embodiment is only one example of the present creation, and is not intended to limit the present creation. It can be understood by those with ordinary knowledge in the art that, without violating the foregoing spirit of the present creation, the buckle assembly of the present creation can be Appropriate modifications and adjustments can be made according to actual needs. For example, in another embodiment, the buckle assembly may only include a set of buckles and guides.
雖然本創作以前述之實施例揭露如上,然其並非用以限定本創作。在不脫離本創作之精神和範圍內,所為之更動與潤飾,均屬本創作之專利保護範圍。關於本創作所界定之保護範圍請參考所附之申請專利範圍。Although the present invention is disclosed in the foregoing embodiments, it is not intended to limit the present invention. Changes and modifications made without departing from the spirit and scope of this creation belong to the scope of patent protection of this creation. For the protection scope defined by this creation, please refer to the attached patent application scope.
1:卡扣組件 9:電子裝置 8:框架組件 10:卡扣件 20:導引件 80:框體 90:殼體 110:固定部 120:彈臂部 121:卡勾結構 130:導引突部 131:導引槽 200:主體部 201:卡合部 211:導引斜面 210:導引條 D1:第一方向 D2:第二方向 O:導引入口1: Snap components 9: Electronics 8: Frame Components 10: Snaps 20: Guide 80: Frame 90: Shell 110: Fixed part 120: elastic arm 121: hook structure 130: Guide protrusion 131: Guide groove 200: main body 201: Engagement Department 211: Guide Bevel 210: Guide bar D1: first direction D2: Second direction O: guide inlet
圖1係顯示本創作之一實施例之電子裝置的局部放大立體分解示意圖。 圖2係顯示本創作之一實施例之框架組件及其上之卡扣組件的仰視立體示意圖。 圖3係顯示本創作之一實施例之電子裝置的進一步局部放大立體分解示意圖。 圖4A~5B係顯示本創作之一實施例之框架組件經由卡扣組件組裝於電子裝置之殼體的操作示意圖。 圖6係顯示本創作之一實施例之電子裝置於框架組件經由卡扣組件安裝定位的局部放大立體示意圖。 FIG. 1 is a partially enlarged perspective exploded schematic diagram showing an electronic device according to an embodiment of the present invention. FIG. 2 is a bottom perspective schematic diagram showing a frame assembly and a snap-on assembly thereon according to an embodiment of the present invention. FIG. 3 is a further partially enlarged perspective exploded schematic diagram showing an electronic device according to an embodiment of the present invention. FIGS. 4A-5B are schematic diagrams illustrating operations of assembling the frame assembly to the casing of the electronic device via the snap assembly according to an embodiment of the present invention. FIG. 6 is a partially enlarged perspective view showing the mounting and positioning of the electronic device on the frame component via the snap component according to an embodiment of the present invention.
1:卡扣組件 1: Snap components
9:電子裝置 9: Electronics
8:框架組件 8: Frame Components
10:卡扣件 10: Snaps
20:導引件 20: Guide
80:框體 80: Frame
90:殼體 90: Shell
D1:第一方向 D1: first direction
D2:第二方向 D2: Second direction
Claims (20)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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TW110210818U TWM623963U (en) | 2021-09-13 | 2021-09-13 | Engagement assembly, frame assembly and electronic device |
CN202122615472.6U CN216249052U (en) | 2021-09-13 | 2021-10-28 | Buckle assembly, frame assembly and electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW110210818U TWM623963U (en) | 2021-09-13 | 2021-09-13 | Engagement assembly, frame assembly and electronic device |
Publications (1)
Publication Number | Publication Date |
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TWM623963U true TWM623963U (en) | 2022-03-01 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW110210818U TWM623963U (en) | 2021-09-13 | 2021-09-13 | Engagement assembly, frame assembly and electronic device |
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CN (1) | CN216249052U (en) |
TW (1) | TWM623963U (en) |
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2021
- 2021-09-13 TW TW110210818U patent/TWM623963U/en unknown
- 2021-10-28 CN CN202122615472.6U patent/CN216249052U/en active Active
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