TWM622602U - Wafer tape mounting apparatus and its corner cutting mechanism - Google Patents
Wafer tape mounting apparatus and its corner cutting mechanism Download PDFInfo
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- TWM622602U TWM622602U TW110211567U TW110211567U TWM622602U TW M622602 U TWM622602 U TW M622602U TW 110211567 U TW110211567 U TW 110211567U TW 110211567 U TW110211567 U TW 110211567U TW M622602 U TWM622602 U TW M622602U
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Abstract
本創作係關於一種晶圓貼膜設備及其切角機構,用於黏膜,此晶圓貼膜設備包括捲膜機構、傳送膜裝置、切膜機構及切角機構,捲膜機構用於置放黏膜;傳送膜裝置包含循環移動且吸附傳送黏膜的複數拉膜機構;切膜機構對應複數拉膜機構配置,切膜機構包含移動刀具;切角機構設置在捲膜機構與切膜機構之間,切角機構包含配置在黏膜兩側的二切角刀;其中,二切角刀用於在黏膜的兩側裁切出二缺角,移動刀具用於自二缺角完全切割並分離黏膜。藉此,使分離的黏膜的角端被切角而能夠配合框架外型。 This creation is about a wafer lamination equipment and its corner cutting mechanism, which are used for mucous membranes. The wafer lamination equipment includes a film rolling mechanism, a transfer film device, a film cutting mechanism and a corner cutting mechanism, and the film rolling mechanism is used for placing the mucosa; The film conveying device includes a plurality of film pulling mechanisms that move cyclically and absorb and transmit the mucous membrane; the film cutting mechanism corresponds to the configuration of the plurality of film pulling mechanisms, and the film cutting mechanism includes a moving knife; the angle cutting mechanism is arranged between the film rolling mechanism and the film cutting mechanism, and the angle cutting mechanism The mechanism includes two bevel cutters arranged on both sides of the mucosa; wherein, the two bevel cutters are used to cut two bevels on both sides of the mucosa, and the moving cutter is used to completely cut and separate the mucosa from the two bevels. Thereby, the corner ends of the separated mucous membranes can be chamfered to fit the frame shape.
Description
本創作係有關於一種貼膜設備,尤指一種晶圓貼膜設備及其切角機構。 This creation is about a lamination equipment, especially a wafer lamination equipment and its corner cutting mechanism.
目前市面上裁切膠膜的機台,都會利用一或複數刀具將放置載板上的膠膜,裁切呈多個圓形狀或方形的分離膠膜,而供後續框架黏接。 At present, the machines for cutting adhesive films on the market will use one or more cutters to cut the adhesive films placed on the carrier plate into a plurality of circular or square separating adhesive films for subsequent frame bonding.
然而,框架與膠膜黏接之步驟完成後,剩下的膠膜會呈現一個個的圓形或方形鏤空,並無法做後續利用,最後剩下的膠膜成為廢料丟棄,而有浪費資源之虞;且框架的角端會以圓角設計,進而方便拿取及避免碰撞損壞,因此如何裁切出配合框架外型的膠膜,且避免廢料之產生,係業界研發之重點。 However, after the step of bonding the frame and the adhesive film is completed, the remaining adhesive films will be hollowed out one by one, and cannot be used for subsequent use. Finally, the remaining adhesive films will be discarded as waste, which is a waste of resources. In addition, the corners of the frame are designed with rounded corners to facilitate access and avoid collision damage. Therefore, how to cut the film to match the shape of the frame and avoid the generation of waste is the focus of industry research and development.
有鑑於此,本創作人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本創作人改良之目標。 In view of this, the creator of the present invention has devoted himself to the research and application of the theory, and tried his best to solve the above-mentioned problems, which is the goal of the creator's improvement.
本創作提供一種晶圓貼膜設備及其切角機構,其係利用二切角刀在黏膜的兩側裁切出二缺角,移動刀具再自二缺角完全切割並分離黏膜,使分 離的黏膜的角端被切角而能夠配合框架外型,且沒有過多廢料之產生,以達到有效利用資源及節省成本之特點。 This creation provides a wafer lamination equipment and its corner cutting mechanism, which uses two corner cutters to cut two missing corners on both sides of the mucosa, and then moves the cutter to completely cut and separate the mucosa from the two corners, so that the separation The corner ends of the separated mucous membranes are cut to fit the shape of the frame, and there is no generation of excessive waste, so as to achieve the characteristics of efficient use of resources and cost saving.
於本創作實施例中,本創作係提供一種晶圓貼膜設備,用於一黏膜及一框架,該晶圓貼膜設備包括:一捲膜機構,用於置放所述黏膜;一傳送膜裝置,包含循環移動且吸附傳送所述黏膜的複數拉膜機構;一切膜機構,對應該複數拉膜機構配置,該切膜機構包含一移動刀具;以及一切角機構,設置在該捲膜機構與該切膜機構之間,該切角機構包含配置在所述黏膜兩側的二切角刀;其中,該二切角刀用於在所述黏膜的兩側裁切出二缺角,該移動刀具用於自所述二缺角完全切割並分離所述黏膜,所述框架對應分離的所述黏膜黏接。 In this creative embodiment, the present invention provides a wafer lamination device for a mucous membrane and a frame, the wafer lamination device includes: a film roll mechanism for placing the mucous membrane; a transfer membrane device, It includes a plurality of film pulling mechanisms that circulate and move and adsorb and transmit the mucous membrane; all film mechanisms are configured corresponding to the plurality of film pulling mechanisms, and the film cutting mechanism includes a moving knife; and a cutting angle mechanism, which is arranged between the film rolling mechanism and the cutting Between the membrane mechanisms, the corner cutting mechanism comprises two corner cutting knives arranged on both sides of the mucosa; wherein, the two corner cutting knives are used to cut two missing corners on both sides of the mucosa, and the moving cutter is used for cutting two corners. After completely cutting and separating the mucous membranes from the two missing corners, the frame corresponds to the separated mucous membranes.
於本創作實施例中,本創作係提供一種晶圓貼膜設備的切角機構,用於一黏膜,該切角機構包括:二切角刀,對應所述黏膜的兩側配置,該二切角刀用於在所述黏膜的兩側裁切出二缺角。 In this creative embodiment, the present creative system provides a corner cutting mechanism of a wafer lamination equipment, which is used for a mucosa. The corner cutting mechanism includes: two corner cutting knives, which are arranged on both sides of the mucosa, and the two corner cutting tools are A knife is used to cut two bevels on both sides of the mucosa.
基於上述,移動刀具能夠自其一缺角始移動且切割黏膜至另一缺角,移動刀具的水平移動距離大於黏膜的寬度,使移動刀具直接切斷黏膜,且分離的黏膜形狀配合框架的外型,而沒有廢料之產生,以達到有效利用資源及節省成本之特點,及防止黏膜發生掀角情形。 Based on the above, the moving tool can move from one missing corner and cut the mucosa to the other missing corner. The horizontal moving distance of the moving tool is greater than the width of the mucosa, so that the moving tool can directly cut the mucosa, and the shape of the separated mucosa matches the outer surface of the frame. Type, without the generation of waste, in order to achieve the characteristics of efficient use of resources and cost savings, and to prevent the occurrence of tilting of the mucosa.
基於上述,因移動刀具常需校正或更換,切膜機構設置在複數拉膜機構的上方,進而與拉膜機構有一段距離,更能方便移動刀具之校正或更換,且避免校正或更換移動刀具之過程碰撞、移動到拉膜機構。 Based on the above, since the moving tool often needs to be calibrated or replaced, the film cutting mechanism is arranged above the multiple film pulling mechanisms, and is further away from the film pulling mechanism, which is more convenient for the calibration or replacement of the moving tool, and avoids the need to correct or replace the moving tool. During the process, it collides and moves to the film pulling mechanism.
100:黏膜 100: mucous membrane
101:離型紙 101: Release paper
102:缺角 102: missing corners
200:框架 200: Frame
201:鏤空口 201: Hollow mouth
10:晶圓貼膜設備 10: Wafer sticking equipment
1:捲膜機構 1: Rolling film mechanism
11:黏膜固定軸 11: Mucosal fixation shaft
12:離型紙固定軸 12: Release paper fixed shaft
2:傳送膜裝置 2: Transfer film device
21:循環帶動機構 21: Circulation drive mechanism
22:拉膜機構 22: Film pulling mechanism
23:承載台 23: Bearing platform
231:第一負壓吸孔 231: The first negative pressure suction hole
232:第二負壓吸孔 232: The second negative pressure suction hole
233:第一凹槽 233: First groove
234:第三負壓吸孔 234: The third negative pressure suction hole
24:多孔質固定吸板 24: Porous fixed suction plate
25:多孔質活動吸板 25: Porous movable suction plate
251:活動基座 251: Active Pedestal
252:第二凹槽 252: Second groove
253:第四負壓吸孔 253: Fourth negative pressure suction hole
26、26’:多孔性材質板 26, 26': porous material board
3:切膜機構 3: Film cutting mechanism
31:水平驅動器 31: Horizontal Drive
32:垂直驅動器 32: Vertical Drive
33:移動刀具 33: Move the tool
34:保護外框 34: Protect the outer frame
4:搬移機構 4: Moving mechanism
41:下壓致動器 41: Press down the actuator
42:吸附件 42: Adsorber
43:推升致動器 43: Push-Up Actuator
5:切角機構 5: Chamfering mechanism
51:切角刀 51: Chamfering knife
511:柱體 511: Cylinder
512:角形刀刃 512: Angled blade
513:吹氣孔 513: Blow hole
514:容氣腔 514: air chamber
52:沖壓驅動器 52: Stamping Driver
53:限位座 53: Limit seat
531:導引軌道 531: Guide rail
532:正壓通管 532: Positive pressure pipe
533:容膜槽 533: Membrane tank
54:集料盒 54: Aggregate Box
55:復位彈簧 55: Return spring
56:橫向撐膜桿 56: Lateral membrane rod
d:拉伸方向 d: stretch direction
s:迴圈路徑 s: loop path
w1、w2:寬度 w1, w2: width
h1、h2:間隔距離 h1, h2: separation distance
θ:銳角 θ: acute angle
圖1係本創作貼膜設備之立體示意圖。 Figure 1 is a three-dimensional schematic diagram of the film sticking equipment of the present invention.
圖2係本創作貼膜設備之另一局部立體示意圖。 FIG. 2 is another partial perspective view of the film sticking equipment of the present invention.
圖3係本創作圖2之A區域之放大示意圖。 FIG. 3 is an enlarged schematic diagram of the area A of FIG. 2 of the present invention.
圖4係本創作切角機構之立體示意圖。 Figure 4 is a three-dimensional schematic diagram of the corner cutting mechanism of the present invention.
圖5係本創作切角機構之另一局部立體示意圖。 FIG. 5 is another partial perspective view of the corner cutting mechanism of the present invention.
圖6係本創作切角機構之第一使用狀態示意圖。 FIG. 6 is a schematic diagram of the first use state of the corner cutting mechanism of the present invention.
圖7係本創作切角機構之第二使用狀態示意圖。 FIG. 7 is a schematic diagram of the second use state of the corner cutting mechanism of the present invention.
圖8係本創作切角機構之第三使用狀態示意圖。 FIG. 8 is a schematic diagram of the third use state of the corner cutting mechanism of the present invention.
圖9係本創作切角機構之第四使用狀態示意圖。 FIG. 9 is a schematic diagram of the fourth use state of the corner cutting mechanism of the present invention.
圖10係本創作貼膜設備之第一使用狀態示意圖。 Fig. 10 is a schematic diagram of the first use state of the film-making device.
圖11係本創作貼膜設備之第二使用狀態示意圖。 Figure 11 is a schematic diagram of the second use state of the film-making device.
圖12係本創作拉膜機構之使用狀態示意圖。 Figure 12 is a schematic diagram of the use state of the film pulling mechanism of the present invention.
圖13係本創作切膜機構之第一使用狀態示意圖。 Figure 13 is a schematic diagram of the first use state of the film cutting mechanism of the present invention.
圖14係本創作切膜機構之第二使用狀態示意圖。 Figure 14 is a schematic diagram of the second use state of the film cutting mechanism of the present invention.
圖15係本創作切膜機構之第三使用狀態示意圖。 Figure 15 is a schematic diagram of the third use state of the film cutting mechanism of the present invention.
圖16係本創作貼膜設備之第三使用狀態示意圖。 Figure 16 is a schematic diagram of the third use state of the film-making device.
圖17係本創作貼膜設備之第四使用狀態示意圖。 Figure 17 is a schematic diagram of the fourth use state of the film-making device.
圖18係本創作框架及黏膜欲黏結之示意圖。 Figure 18 is a schematic diagram of the frame of this creation and the mucosa to be bonded.
圖19係本創作框架及黏膜之組合示意圖。 Figure 19 is a schematic diagram of the composition of the frame and the mucous membrane of this creation.
有關本創作之詳細說明及技術內容,將配合圖式說明如下,然而所附圖式僅作為說明用途,並非用於侷限本創作。 The detailed description and technical content of this creation will be described with the drawings as follows, but the attached drawings are only for illustrative purposes and are not intended to limit this creation.
請參考圖1至圖19所示,本創作係提供一種晶圓貼膜設備及其切角機構,用於一黏膜100及一框架200,此晶圓貼膜設備10主要包括一捲膜機構1、一傳送膜裝置2、一切膜機構3及一切角機構5;切角機構5主要包括二切角刀51。
Please refer to FIG. 1 to FIG. 19 , the present invention provides a wafer lamination equipment and its corner cutting mechanism, which are used for a
如圖1、圖10至圖11、圖16至圖17所示,捲膜機構1用於置放黏膜100,捲膜機構1包含一黏膜固定軸11及設置在黏膜固定軸11上方的一離型紙固定軸12,黏膜100整卷套設於黏膜固定軸11上,黏膜100的黏膠面貼附有一離型紙101,離型紙固定軸12用於捲收離型紙101。
As shown in FIG. 1 , FIG. 10 to FIG. 11 , and FIG. 16 to FIG. 17 , the
如圖1至圖2、圖10至圖17所示,傳送膜裝置2包含一循環帶動機構21及複數拉膜機構22,循環帶動機構21連接並帶動複數拉膜機構22沿一迴圈路徑s循環移動,每一拉膜機構22包含一承載台23、固定在承載台23一側的一多孔質固定吸板24及對應承載台23另一側往復移動的一多孔質活動吸板25,以令黏膜100被複數拉膜機構22吸附傳送而自黏膜固定軸11朝複數拉膜機構22的方向拉伸。
As shown in FIGS. 1 to 2 and FIGS. 10 to 17 , the
詳細說明如下,各多孔質固定吸板24與各多孔質活動吸板25分別位在各承載台23的頂面左、右兩側,每一承載台23的頂面下側設有複數第一負壓吸孔231及上側設有複數第二負壓吸孔232。其中,多孔質活動吸板25可透過氣壓缸或油壓缸帶動而相對多孔質固定吸板24移動,但不以此為限制。
The detailed description is as follows, each porous fixed
另外,每一承載台23的頂面一側設有一第一凹槽233及位在第一凹槽233內部的一或複數第三負壓吸孔234,每一多孔質固定吸板24包含嵌合於第一凹槽233的一多孔性材質板26。
In addition, a
再者,每一多孔質活動吸板25包含一活動基座251及一多孔性材質板26’,各活動基座251對應各承載台23另一側往復移動,且每一活動基座251
的頂面設有一第二凹槽252及位在第二凹槽252內部的一或複數第四負壓吸孔253,各多孔性材質板26’嵌合於各第二凹槽252。
Furthermore, each porous
並且,承載台23為不鏽鋼材質所構成,多孔性材質板26、26’為陶瓷材質所構成,陶瓷材質上設有供氣體流通的複數孔隙,使多孔質固定吸板24與多孔質活動吸板25可透過孔隙抽吸氣體,以達到多孔質固定吸板24與多孔質活動吸板25具有穩定吸附之功效。
In addition, the bearing
其中,多孔質固定吸板24與多孔質活動吸板25的外側間隔距離h1等於或大於黏膜100的寬度w1,多孔質固定吸板24與多孔質活動吸板25的內側間隔距離h2小於黏膜100的寬度w1,使多孔質固定吸板24與多孔質活動吸板25共同吸附黏膜100的兩側,且多孔質活動吸板25能夠帶動黏膜100的一側往遠離多孔質固定吸板24的方向移動而拉緊黏膜100。
Wherein, the distance h1 between the outer side of the porous fixed
此外,各多孔質活動吸板25遠離各多孔質固定吸板24的方向定義為一拉伸方向d,拉伸方向d與迴圈路徑s垂直配置。
In addition, the direction in which each porous
如圖1至圖3、圖10至圖11、圖13至圖17所示,切膜機構3對應複數拉膜機構22配置,切膜機構3能夠切割並分離黏膜100,框架200對應分離的黏膜100黏接。
As shown in FIGS. 1 to 3 , 10 to 11 , and 13 to 17 , the
進一步說明如下,切膜機構3包含一水平驅動器31、一垂直驅動器32及一移動刀具33,移動刀具33為一錐形刀片,水平驅動器31設置在複數拉膜機構22的上方,垂直驅動器32固接於水平驅動器31且跟隨水平驅動器31左、右水平移動,移動刀具33固接於垂直驅動器32且跟隨垂直驅動器32上、下垂直移動,使得移動刀具33可跟隨水平驅動器31移動一水平移動距離,及跟隨垂直驅動器32移動一垂直移動距離。
Further description is as follows, the
另外,拉膜機構22會以相鄰抵靠的排列方式吸附黏膜100,黏膜100被吸附在相鄰抵靠的二拉膜機構22上時,水平驅動器31會位在相鄰的數第一
負壓吸孔231與複數第二負壓吸孔232之間,讓移動刀具33能以一刀方式完全切割並分離黏膜100,同時避免廢料之產生,以達到有效利用資源及節省成本之特點。
In addition, the
再者,切膜機構3更包含一保護外框34,保護外框34罩蓋在水平驅動器31、垂直驅動器32及移動刀具33的外部下方,垂直驅動器32能夠帶動移動刀具33藏收於保護外框34內,讓移動刀具33不使用時可藏收於保護外框34,進而提高切膜機構3之使用安全性。
Furthermore, the film-cutting
如圖1、圖4至圖11、圖16至圖17所示,切角機構5設置在捲膜機構1與切膜機構3之間,切角機構5包含配置在黏膜100兩側的二切角刀51。其中,本實施例之二切角刀51設置在黏膜100上方,但不以此為限制。
As shown in FIGS. 1 , 4 to 11 , and 16 to 17 , the
其中,二切角刀51用於在黏膜100的兩側裁切出二缺角102,移動刀具33用於自二缺角102完全切割並分離黏膜100,即移動刀具33能夠自其一缺角102始沿著拉伸方向d移動且切割黏膜100至另一缺角102,移動刀具33的水平移動距離大於黏膜100的寬度w1,以令移動刀具33能夠完全切割並分離黏膜100,框架200再對應分離的黏膜100黏接。
Among them, the two
另外,切角機構5更包括二沖壓驅動器52,二沖壓驅動器52連接於二切角刀51且帶動二切角刀51朝接近黏膜100方向移動,以帶動二切角刀51對黏膜100的兩側沖壓而裁切出二缺角102。
In addition, the
再者,每一切角刀51具有一柱體511,每一柱體511一端固接於各沖壓驅動器52及另一端延伸有一角形刀刃512與設有配置在角形刀刃512內部的複數吹氣孔513,且每一柱體511設有連通複數吹氣孔513的一容氣腔514。
Furthermore, each
其中,本實施例之角形刀刃512的內側呈V字形而具有一銳角θ,使黏膜100的兩側被裁切出的缺角102也呈V字形,且複數吹氣孔513之孔洞尺寸
較大者對應角形刀刃512的內側設置,又本實施例之角形刀刃512為五角形環刀,但不以此為限制,角形刀刃512也可為三角形環刀。
Wherein, the inner side of the
此外,切角機構5更包括二限位座53、二集料盒54及二復位彈簧55,二集料盒54配置在二限位座53的下方,每一限位座53設有一導引軌道531及一正壓通管532,各柱體511容置且滑移於各導引軌道531,各正壓通管532與各容氣腔514能夠相對設置且彼此連通,讓正壓通管532透過容氣腔514給予複數吹氣孔513正壓氣流,各復位彈簧55一端連接於各柱體511及另一端連接於各限位座53,使復位彈簧55用於帶動切角刀51朝遠離黏膜100方向復位。
In addition, the
又,切角機構5更包括一橫向撐膜桿56,橫向撐膜桿56配置在二限位座53的一側,每一限位座53設有與橫向撐膜桿56相對且與各導引軌道531連通的一容膜槽533,黏膜100的下方被橫向撐膜桿56頂抵且兩側經過各容膜槽533,進而讓導引軌道531導引切角刀51確實地移動至黏膜100的兩側。
In addition, the
如圖1、圖10至圖11、圖16至圖17所示,本創作晶圓貼膜設備10更包括一搬移機構4,搬移機構4設置在複數拉膜機構22遠離捲膜機構1的一端,搬移機構4包含一下壓致動器41、固接於下壓致動器41且跟隨下壓致動器41垂直移動的一吸附件42及設置在吸附件42下方的一推升致動器43,推升致動器43能夠帶動各拉膜機構22上升或下降,吸附件42能夠吸附框架200並壓制框架200和分離的黏膜100相互黏接。
As shown in FIG. 1 , FIG. 10 to FIG. 11 , and FIG. 16 to FIG. 17 , the present
如圖18至圖19所示,框架200內部設有一鏤空口201,鏤空口201會裸露黏膜100的黏膠面以黏貼晶圓,且因被分離的黏膜100形狀呈矩形或方形,所以框架200為一矩形框體或一方形框體,框架200的寬度w2實質上等於(實質上等於即等於或些微大於)黏膜100的寬度w1,且框架200的角端為方便拿取及避免碰撞損壞會以圓角設計,分離的黏膜100的角端能夠被切角機構5裁切成缺角102,使黏膜100的外周緣完全藏收在框架200內,進而讓被分離的黏膜100形
狀去配合框架200的外型,以達到防止黏膜100發生掀角情形,且避免黏膜100過多廢料之產生,而有效地完全利用到黏膜100的每一分材料,達到節省成本之功效。
As shown in FIG. 18 to FIG. 19 , a
其中,最佳實施為框架200的寬度w2大於黏膜100的寬度w1約1mm左右,以令框架200的外周緣尺寸些微大於黏膜100的外周緣尺寸。
Preferably, the width w2 of the
此外,循環帶動機構21、水平驅動器31、垂直驅動器32、下壓致動器41、推升致動器43、沖壓驅動器52之最佳實施例為一氣壓缸或一油壓缸,吸附件42為一真空吸盤,但不以此為限制。
In addition, the best embodiment of the circulating
如圖1至圖19所示,本創作晶圓貼膜設備10及拉膜機構22之使用狀態,其係利用任兩拉膜機構22會以相鄰抵靠的排列方式吸附黏膜100,且黏膜100被拉膜機構22吸附時,多孔質固定吸板24與多孔質活動吸板25會共同吸附黏膜100的兩側,且多孔質活動吸板25能夠帶動黏膜100的一側往遠離多孔質固定吸板24的方向移動而拉緊黏膜100。
As shown in FIG. 1 to FIG. 19 , the use state of the
再者,二沖壓驅動器52帶動二切角刀51在黏膜100的兩側裁切出二缺角102,切角刀51下壓至正壓通管532與容氣腔514相對設置且彼此連通時,正壓通管532會給予複數吹氣孔513正壓氣流,且複數吹氣孔513之孔洞尺寸較大者對應角形刀刃512的內側設置,讓缺角102的廢料快速且順利地被吹入集料盒54中收集。藉此,防止缺角102的廢料貼附在角形刀刃512上而影響下一次切角,使切角機構5具有切角順暢之優點。
Furthermore, the
又,黏膜100被吸附在相鄰抵靠的二拉膜機構22上時,水平驅動器31與二缺角102會位在相鄰的數第一負壓吸孔231與複數第二負壓吸孔232之間,垂直驅動器32帶動移動刀具33伸出保護外框34外,水平驅動器31再帶動移動刀具33沿著拉伸方向d移動且在兩承載台23之間的縫隙切割黏膜100,移動刀具33能夠自其一缺角102始沿著拉伸方向d移動且切割黏膜100至另一缺角102,且移
動刀具33的水平移動距離大於黏膜100的寬度w1,使移動刀具33能夠完全切割並分離黏膜100,同時分離的黏膜100的角端形成有缺角102。
In addition, when the
之後,吸附有分離的黏膜100的拉膜機構22會進入搬移機構4的作業區域,因黏膜100的黏膠面相對承載台23朝上設置,推升致動器43帶動拉膜機構22上升,吸附件42吸附框架200且帶動框架200下移,進而壓制框架200和黏膜100的黏膠面相互黏接,將相互黏接的框架200和黏膜100搬離承載台23後,拉膜機構22會移動至抵靠另一拉膜機構22且吸附黏膜100,以達到複數拉膜機構22沿迴圈路徑s循環移動之動作。
After that, the
藉此,多孔質活動吸板25帶動黏膜100的一側往遠離多孔質固定吸板24的方向移動時,將給予黏膜100一拉力,進而將黏膜100拉緊整平,以讓後續框架200及晶圓與黏膜100之黏貼更平整緊密,並使晶圓之製程或檢測更佳穩定。
Thereby, when the porous
另外,習知吸附承載台為全不鏽鋼材質所構成有吸附力不足之問題,習知吸附承載台為全陶瓷材質所構成有成本昂貴及易破裂之問題;相較下,本創作利用承載台23由不鏽鋼材質所構成,承載台23兩側的多孔質固定吸板24與多孔質活動吸板25由陶瓷材質所構成,進而減少陶瓷材質範圍,使拉膜機構22具有節省成本及加強結構強度之優點,同時陶瓷材質設置在承載台23的兩側,使拉膜機構22在拉緊黏膜100時吸附力充足。
In addition, the conventional adsorption carrier is made of all stainless steel, which has the problem of insufficient adsorption force, and the conventional adsorption carrier is composed of all ceramic materials, which has the problem of high cost and easy to break; It is made of stainless steel, and the porous fixed
再者,因移動刀具33常需校正或更換,切膜機構3設置在複數拉膜機構22的上方,進而與拉膜機構22有一段距離,更能方便移動刀具33之校正或更換,且避免校正或更換移動刀具33之過程碰撞、移動到拉膜機構22。
Furthermore, since the moving
綜上所述,本創作之晶圓貼膜設備及其切角機構,確可達到預期之使用目的,而解決習知之缺失,並具有產業利用性、新穎性與進步性,完全符合專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障 創作人之權利。 To sum up, the wafer lamination equipment and its corner cutting mechanism of this creation can indeed achieve the intended purpose of use, solve the lack of conventional knowledge, and have industrial application, novelty and progress, and fully meet the requirements of patent application. If you file an application in accordance with the Patent Law, please check and approve the patent in this case to ensure that creator's rights.
100:黏膜 100: mucous membrane
101:離型紙 101: Release paper
200:框架 200: Frame
10:晶圓貼膜設備 10: Wafer sticking equipment
1:捲膜機構 1: Rolling film mechanism
11:黏膜固定軸 11: Mucosal fixation shaft
12:離型紙固定軸 12: Release paper fixed shaft
2:傳送膜裝置 2: Transfer film device
21:循環帶動機構 21: Circulation drive mechanism
22:拉膜機構 22: Film pulling mechanism
23:承載台 23: Bearing platform
24:多孔質固定吸板 24: Porous fixed suction plate
25:多孔質活動吸板 25: Porous movable suction plate
3:切膜機構 3: Film cutting mechanism
31:水平驅動器 31: Horizontal Drive
32:垂直驅動器 32: Vertical Drive
34:保護外框 34: Protect the outer frame
4:搬移機構 4: Moving mechanism
41:下壓致動器 41: Press down the actuator
42:吸附件 42: Adsorber
43:推升致動器 43: Push-Up Actuator
5:切角機構 5: Chamfering mechanism
52:沖壓驅動器 52: Stamping Driver
53:限位座 53: Limit seat
54:集料盒 54: Aggregate Box
55:復位彈簧 55: Return spring
Claims (18)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110211567U TWM622602U (en) | 2021-09-30 | 2021-09-30 | Wafer tape mounting apparatus and its corner cutting mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110211567U TWM622602U (en) | 2021-09-30 | 2021-09-30 | Wafer tape mounting apparatus and its corner cutting mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM622602U true TWM622602U (en) | 2022-01-21 |
Family
ID=80786027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW110211567U TWM622602U (en) | 2021-09-30 | 2021-09-30 | Wafer tape mounting apparatus and its corner cutting mechanism |
Country Status (1)
Country | Link |
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TW (1) | TWM622602U (en) |
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2021
- 2021-09-30 TW TW110211567U patent/TWM622602U/en unknown
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