TWM622462U - Vapor chamber turbulent structure - Google Patents
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Abstract
一種均溫板擾流結構,包括一下板體與一上板體相互蓋合而構成內部中空狀,並具有由下板體與上板體共同形成的一蒸發部與一冷凝部、以及一連通於蒸發部與冷凝部之間的傳輸部;其中,傳輸部內係設有支撐於下板體與上板體之間的複數擾流柱,且擾流柱至少包含鄰近於蒸發部一端處的複數第一柱體、以及鄰近於冷凝部一端處的複數第二柱體,且各第一柱體彼此間的排列間距係小於各第二柱體彼此間的排列間距。A turbulent flow structure of a temperature equalizing plate, comprising a lower plate body and an upper plate body covered with each other to form an inner hollow shape, and has an evaporation part and a condensation part formed by the lower plate body and the upper plate body, and a communication part. A transmission part between the evaporation part and the condensation part; wherein, the transmission part is provided with a plurality of spoiler columns supported between the lower plate body and the upper plate body, and the spoiler column at least includes a plurality of turbulent columns adjacent to one end of the evaporation part The first cylinder and a plurality of second cylinders adjacent to one end of the condensation part, and the arrangement spacing between the first cylinders is smaller than the spacing between the second cylinders.
Description
本創作係與一種熱傳導元件有關,尤指一種均溫板擾流結構。This creation is related to a thermally conductive element, especially a vapor chamber spoiler structure.
按,現有的均溫板除了透過其一表面接觸熱源、另一表面作為冷凝而提供熱傳作用外,亦有配合不同的散熱需求場合而設計有各種形狀。例如透過類似於熱管(Heat Pipe)的設計,將均溫板一部分作為受熱、一部分作為冷凝,再視熱源與散熱位置的不同提供中間的傳輸形狀,藉以構成各式形狀的均溫板,以滿足均溫板適用於多變的應用環境等需求。According to this, in addition to providing heat transfer through one surface of the vapor chamber contacting the heat source and the other surface acting as condensation, the existing vapor chambers are also designed in various shapes to suit different heat dissipation requirements. For example, through the design similar to the heat pipe (Heat Pipe), part of the vapor chamber is used as heating and part as condensation, and then depending on the difference between the heat source and the heat dissipation position, the intermediate transmission shape is provided, so as to form various shapes of vapor chambers to meet the needs of Vapor chambers are suitable for changing application environments and other needs.
然而,在實際使用可能會面臨到一些問題,例如受限於形狀上所需的變化,亦可能影響到均溫板的功能或效能。眾所周知,均溫板係透過封存於其內部的工作流體產生汽液相變化,來提供熱傳作用;而當汽相或液相的工作流體在傳輸時,面臨均溫板形狀上的變化即可能影響其傳遞的流速,如均溫板的截面積由大變小時,通過的工作流體流速就會加快而產生變化。而若在汽化的工作流體加快時,也會使得回流的液態工作流體受到影響,甚至因此無法回流而造成俗稱的「乾燒」問題。因此,如何避免此一問題的產生,即為現今均溫板在設計上的重要課題之一。However, there may be some problems in practical use, such as being limited by the required changes in shape, which may also affect the function or performance of the vapor chamber. As we all know, the vapor chamber provides heat transfer by producing vapor-liquid phase changes in the working fluid stored in it; and when the vapor or liquid working fluid is transported, it is possible to face changes in the shape of the vapor chamber. The flow velocity that affects its transmission, such as the cross-sectional area of the temperature equalizing plate changes from large to small, the flow velocity of the passing working fluid will be accelerated and changed. If the vaporized working fluid is accelerated, the backflowing liquid working fluid will be affected, and even cannot be backflowed, resulting in the so-called "dry burning" problem. Therefore, how to avoid this problem is one of the important issues in the design of vapor chambers today.
有鑑於此,本創作人係為改善並解決上述之缺失,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本創作。In view of this, in order to improve and solve the above-mentioned deficiencies, the author of this book has devoted himself to research and the application of academic principles, and finally proposed a book with a reasonable design and effective improvement of the above deficiencies.
本創作之主要目的,在於可提供一種均溫板擾流結構,其係透過增設擾流結構的設計,藉以控制均溫板內部之工作流體的流速,避免因均溫板在形狀設計的需求上影響其熱傳遞之功能或效能。The main purpose of this creation is to provide a vapor chamber spoiler structure, which can control the flow rate of the working fluid inside the vapor chamber by adding a design of the spoiler structure, so as to avoid the need for the shape design of the vapor chamber. Affect its function or efficiency of heat transfer.
為了達成上述之目的,本創作係提供一種均溫板擾流結構,包括一下板體與一上板體相互蓋合而構成內部中空狀,並具有由下板體與上板體共同形成的一蒸發部與一冷凝部、以及一連通於蒸發部與冷凝部之間的傳輸部;其中,傳輸部內係設有支撐於下板體與上板體之間的複數擾流柱,且擾流柱至少包含鄰近於蒸發部一端處的複數第一柱體、以及鄰近於冷凝部一端處的複數第二柱體,且各第一柱體彼此間的排列間距係小於各第二柱體彼此間的排列間距。In order to achieve the above-mentioned purpose, the present invention provides a temperature-spreading plate turbulence structure, which includes a lower plate body and an upper plate body overlapping with each other to form an inner hollow shape, and has a joint formed by the lower plate body and the upper plate body. The evaporation part, a condensation part, and a transmission part communicated between the evaporation part and the condensation part; wherein, the transmission part is provided with a plurality of spoiler columns supported between the lower plate body and the upper plate body, and the spoiler columns At least it includes a plurality of first cylinders adjacent to one end of the evaporation part and a plurality of second cylinders adjacent to one end of the condensation part, and the arrangement spacing between the first cylinders is smaller than the distance between the second cylinders. Arrange spacing.
為了使 貴審查委員能更進一步瞭解本創作之特徵及技術內容,請參閱以下有關本創作之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本創作加以限制者。In order to enable your reviewers to further understand the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation, however, the attached drawings are only for reference and illustration, and are not intended to limit this creation. .
請參閱圖1、圖2及圖3,係分別為本創作第一實施例之立體分解圖、立體組合示意圖及內部構造之平面示意圖。本創作係提供一種均溫板擾流結構,該均溫板1包括一下板體10與一上板體11相互蓋合而構成內部中空狀,並於該下板體10內披覆有毛細層12。所述毛細層12可以是編織網、燒結粉末或於該下板體10內形成溝槽。Please refer to FIG. 1 , FIG. 2 and FIG. 3 , which are a perspective exploded view, a three-dimensional combined schematic view, and a plan view of the internal structure of the first embodiment of the present invention, respectively. The present invention provides a temperature-spreading plate turbulence structure. The temperature-spreading
承上所述,該均溫板1之下板體10與上板體11係共同形成有一蒸發部A與一冷凝部B,即下板體10具有一對應蒸發部A的下蒸發部100與一對應冷凝部B的下冷凝部101,而上板體11亦具有一對應蒸發部A的上蒸發部110與一對應冷凝部B的上冷凝部111,且蒸發部A的面積可大於冷凝部B的面積。而該均溫板1之蒸發部A與冷凝部B之間,係具有一連通於蒸發部A與冷凝部B之間的傳輸部C,即下板體10具有一對應傳輸部C的下傳輸部102,而上板體11具有一對應傳輸部C的上傳輸部112。且該傳輸部C由蒸發部A至冷凝部B呈漸縮狀,以配合前述蒸發部A的面積大於冷凝部B的面積。Based on the above, the
如圖3所示,本創作主要係於上述傳輸部C內設有擾流結構,以防止由蒸發部A至冷凝部B呈漸縮狀的傳輸部C,造成汽化工作流體在通過時產生加速現象,因而影響液態工作流體的回流速度及其回流量,進而防止乾燒問題產生。其中,該傳輸部C內係設有所述擾流結構,所述擾流結構具體為支撐於下板體10與上板體11之間的複數擾流柱13所構成,並至少包含鄰近蒸發部A一端處的複數第一柱體130、以及鄰近冷凝部一端處的複數第二柱體131,且所述第一柱體130彼此間的排列間距d,係小於所述第二柱體131彼此間的排列間距D。其次,於傳輸部C內介於第一柱體130與第二柱體131之間,亦可設有複數第三柱體132,各第三柱體132則可由第一柱體130順勢排列至第二柱體131,以分佈於傳輸部C內而維持擾流效果者。As shown in Fig. 3, the present invention is mainly based on the fact that the above-mentioned transmission part C is provided with a turbulent flow structure to prevent the transmission part C that is tapered from the evaporation part A to the condensing part B, resulting in the acceleration of the vaporized working fluid when passing through. phenomenon, thus affecting the recirculation speed and recirculation amount of the liquid working fluid, thereby preventing the dry burning problem. Wherein, the transmission part C is provided with the spoiler structure, and the spoiler structure is specifically composed of a plurality of spoiler columns 13 supported between the
據此,如圖4所示,該均溫板1之蒸發部A可用於一熱源2上,而冷凝部B上則可設置複數鰭片3作為散熱。而當蒸發部A因熱源2而受熱時,均溫板1內部的工作流體汽化後會朝向冷凝部B,此時,由於各第一柱體130的排列間距d最小,所以可提供擾流效果而避免汽化工作流體發生加速現象。接著,如圖5所示,通過傳輸部C的汽化工作流體會不斷受到擾流結構的影響而逐漸減慢流速,在最後通過第二柱體131時,由於各第二柱體131的排列間距D最大,所以可以使通過後的汽化工作流體順利進入冷凝部B內,以進行冷卻。同時,由於在冷凝部B回復成液態的工作流體,係透遇位於下板體10內的毛細層12進行回流,再加上傳輸部C內的汽化工作流體已因擾流結構而不會發生加速現象,所以可以順勢透過毛細層12而維持其應有的毛細力並快速回流至蒸發部A,進而避免乾燒問題的產生。Accordingly, as shown in FIG. 4 , the evaporation part A of the
再請參閱圖1及圖2所示,本發明在上述蒸發部A與冷凝部B的上蒸發部110與上冷凝部111內皆設有複數支撐柱14,所述支撐柱14雖亦用於支撐下板體10與上板體11之間處,但因不考慮擾流問題而沒有如前述彼此間距的限制,可視實際蒸發部A與冷凝部B的面積大小來配置相應的數量;一般而言,所述支撐柱14分佈的密集度會較前述擾流柱13的密集度更為疏鬆或寬廣。Please refer to FIG. 1 and FIG. 2 again, the present invention is provided with a plurality of
是以,藉由上述之構造組成,即可得到本創作均溫板擾流結構。Therefore, through the above-mentioned structure composition, the present invention can be obtained with the air-spreading plate spoiler structure.
此外,如圖6所示,在本創作第二實施例中,該均溫板1可透過不同形狀的蒸發部A來對應不同的熱源2或複數熱源2,同時,也可以視可提供的冷凝位置而增設冷凝部B,並於各冷凝部B與蒸發部A之間皆具有一所述傳輸部C,其形狀上的設計可視實際的熱源2與散熱位置作配置,惟獨在傳輸部C內皆可透過本創作擾流結構的設計,以降低或避免汽化工作流體在傳輸時發生加速現象而影響回流效果,避免乾燒問題,進而使該均溫板1仍可視實際環境需求而變更其外形設計,以達到適用多樣化環境變化的需求。In addition, as shown in FIG. 6 , in the second embodiment of the present invention, the
綜上所述,本創作確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合新型專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障創作人之權利。To sum up, this creation can indeed achieve the intended purpose of use, and solve the lack of conventional knowledge, and because it is very novel and progressive, it fully meets the requirements for a new type of patent application, and the application is filed in accordance with the Patent Law. The patent in this case is granted to protect the rights of the creator.
惟以上所述僅為本創作之較佳可行實施例,非因此即拘限本創作之專利範圍,故舉凡運用本創作說明書及圖式內容所為之等效技術、手段等變化,均同理皆包含於本創作之範圍內,合予陳明。However, the above descriptions are only the preferred feasible embodiments of this creation, and therefore the patent scope of this creation is limited. Therefore, any changes in equivalent technologies and means made by using the description and drawings of this creation shall be treated in the same way. Included in the scope of this creation, it is hereby stated.
<本創作> 1:均溫板 10:下板體 100:下蒸發部 101:下冷凝部 102:下傳輸部 112:上傳輸部 11:上板體 110:上蒸發部 111:上冷凝部 12:毛細層 13:擾流柱 130:第一柱體 131:第二柱體 132:第三柱體 14:支撐柱 A:蒸發部 B:冷凝部 C:傳輸部<This creation> 1: uniform temperature plate 10: Lower body 100: Lower Evaporation Department 101: Lower condensation part 102: Lower Transmission Department 112: Upper Transmission Department 11: Upper body 110: Upper Evaporation Department 111: Upper condensation part 12: capillary layer 13: Spoiler column 130: The first cylinder 131: The second cylinder 132: The third cylinder 14: Support column A: Evaporation part B: condensation part C: Transmission Department
圖1係本創作第一實施例之立體分解圖。FIG. 1 is an exploded perspective view of the first embodiment of the present invention.
圖2係本創作第一實施例之立體組合示意圖。FIG. 2 is a schematic three-dimensional assembly diagram of the first embodiment of the present invention.
圖3係本創作第一實施例內部構造之平面示意圖。FIG. 3 is a schematic plan view of the internal structure of the first embodiment of the present invention.
圖4係本創作第一實施例之使用狀態示意圖。FIG. 4 is a schematic diagram of the use state of the first embodiment of the present invention.
圖5係根據圖4之5-5斷面剖視圖。FIG. 5 is a sectional view according to section 5-5 of FIG. 4 .
圖6係本創作第二實施例之使用狀態示意圖。FIG. 6 is a schematic diagram of the use state of the second embodiment of the present invention.
1:均溫板 1: uniform temperature plate
130:第一柱體 130: The first cylinder
131:第二柱體 131: The second cylinder
132:第三柱體 132: The third cylinder
14:支撐柱 14: Support column
A:蒸發部 A: Evaporation part
B:冷凝部 B: condensation part
C:傳輸部 C: Transmission Department
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