TWM622448U - Inductors structure - Google Patents

Abstract

An inductor structure in which a complex group of inductor circuits in parallel and series and at least one lead wire connecting two adjacent inductor circuits are embedded in an insulator, so that each of the inductor circuits forms a solid structure of a spiral coil to increase the inductor value and quality factor, so the inductor structure of this creation does not need to use a mixture of conventional magnetic conductor parts and conventional magnetic powders to meet the required requirements.

Description

Inductor structure

The present invention relates to an inductance structure, especially a coil inductance structure consisting of a plurality of parallel and series-connected substrate-based inductors that can be embedded in a package substrate.

In general semiconductor application devices, such as communication or high-frequency semiconductor devices, it is often necessary to electrically connect most passive components of radio frequency (radio frequency), such as resistors, inductors, capacitors and oscillators, to the packaged semiconductor chips, so that Make the semiconductor chip have a specific current characteristic or send out a signal. For example, there are many types of traditional inductors, with their various applications (filtering, choke, DC-DC converter, etc., but not limited to the above) and their advantages and disadvantages.

Taking the spiral inductance element commonly used in devices with RF modules as an example, under the requirement of high-density component configuration and miniaturization of RF modules, the distance between each component is reduced, and it also makes it easier for each component. Electromagnetic interference is generated. Therefore, how to avoid electromagnetic interference between various components, and how to provide better magnetic shielding, anti-electromagnetic interference capability, and miniaturization of the inductive component itself are the challenges faced by traditional inductive components. problem.

In addition, how to provide lower magnetic loss and eddy current effect and higher inductance value of spiral inductance element in high frequency application, so as to obtain a better Q value, thereby reducing the energy consumption of the inductive element and improving the performance, so as to achieve a good Electricity is another problem that traditional inductance components have to overcome constantly.

Based on the above problems, the industry such as the TWI611439 patent (as shown in FIG. 1 ) uses the magnetic covering element 130 to provide magnetic shielding and anti-electromagnetic interference capability, but the magnetic permeability of the magnetic powder mixed with the insulating material is lower than that of the original magnetic powder. The ground is relatively low, so that the mixture still limits the inductance element's ability to improve inductance value, magnetic shield and anti-electromagnetic interference.

Furthermore, when the magnetic powder is mixed in the insulating material, the uniformity of the mixture is poor, which makes it difficult to control the magnetic permeability. After the magnetic powder is formed on the carrier plate, it is not suitable for the circuit patterning process due to its material properties, so it cannot be used in the subsequent process. The build-up circuit is fabricated on the electrical layer or the magnetic coating.

In addition, the coil element 100 of the TWI611439 patent is made by injection molding, transfer molding or low temperature co-firing, etc., resulting in poor processability, so it can only be processed in a small area, and cannot be mass-produced on a large board, resulting in the processing cost of the inductor. In addition, the geometric accuracy of the produced coil element is not good, resulting in poor inductance value accuracy (Tolerance).

Therefore, how to overcome the above-mentioned problems of the prior art has become an urgent issue to be overcome in the current industry.

In view of the problems of the prior art, the present invention provides an inductance structure, which includes: an insulator; a plurality of inductance lines, which are stacked by a plurality of coils spaced in layers and buried in the insulator, and each layer has at least two Coils that are parallel but not electrically connected to each other, wherein each of the inductance lines is at least one single-turn spiral coil, and the outermost coils of one of the inductance lines are electrically connected to each other; a plurality of wall-shaped conductors are embedded in the insulator and connected to any two adjacently stacked coils; a first conductive column embedded in the insulator and electrically connected to the coil at the bottom layer of the inductance circuit, and at least one of the first conductive columns The end surface is exposed on the insulator and connected to an electrical contact pad; and a second conductive column, It is embedded in the insulator and is electrically connected to the coil on the bottom layer of the inductance circuit, and at least one end surface of the second conductive column is exposed to the insulator and connected to an electrical contact pad.

In the aforementioned inductor structure, the pattern shape of the conductor corresponds to a partial arc section of the inductor circuit.

In the aforementioned inductor structure, the pattern shape of the conductor corresponds to all sections of the inductor circuit.

In the above-mentioned inductor structure, the pattern shape of each of the conductors of the partial layers of the plurality of wall-shaped conductors corresponds to the entire section of the inductor circuit, and the conductors of the partial layers of the plurality of wall-shaped conductors The pattern shape corresponds to a local section of the inductor circuit.

In the above-mentioned inductor structure, the shape of the coils of the coils on the same layer of the multiple inductor lines is two semicircles.

In the aforementioned inductor structure, the cross-sectional shape of the first conductive column corresponds to the pattern shape of the connected electrical contact pad.

In the aforementioned inductor structure, the cross-sectional shape of the second conductive column corresponds to the pattern shape of the connected electrical contact pad.

In the above-mentioned inductor structure, a shielding layer embedded in the insulator is further included, which is composed of a plurality of conductive line segments that are not electrically connected to each other, and the shielding layer shields at least one of the plurality of inductive lines. The outer side is not electrically connected to the inductive circuit.

It can be seen from the above that the inductor structure of the present creation is mainly designed to improve the inductance value and quality factor through the design of the spiral coils with multiple parallel arrays and multiple layers of inductor lines in series. Therefore, compared with the prior art, the inductors of the present creation The structure can meet the required requirements without using the mixture of the conventional magnetic conductive member and the conventional magnetic powder, thus overcoming various deficiencies of the conventional technology.

100: Coil Components

130: Magnetic wrap

3: Inductor structure

3a: Inductor body

20: Insulator

20a: First side

20b: Second side

22a, 22b, 32a, 32b, 32c, 32d: Inductive lines

220, 221, 222, 223: Coils

221a, 222a, 223a: Coil Sets

23, 33a, 33b, 43: Conductors

24a: the first conductive column

24b: second conductive column

25a: first electrical contact pad

25b: second electrical contact pad

26: Surface treatment layer

27b: Insulating protective layer

300: Open area

31a, 31b: Masking layer

310: Line segment

38: Conductor line

320: starting point

321: First relay point

322: Second relay point

323: Third relay point

324: Fourth relay point

325: stop point

H: Thickness

t: distance

FIG. 1 is a schematic cross-sectional view of a conventional inductor structure.

FIG. 2 is a schematic cross-sectional view of the inductor structure of the present invention.

FIG. 2-1 is a schematic cross-sectional view of another aspect of FIG. 2 .

FIG. 2A is a schematic cross-sectional view of another embodiment of the inductor structure of the present invention.

2A-1 is a schematic cross-sectional view of another aspect of FIG. 2A.

FIG. 2B is a schematic cross-sectional view of another embodiment of the inductor structure of the present invention.

FIG. 2B-1 is a schematic cross-sectional view of another aspect of FIG. 2B .

FIG. 3A is a schematic top plan view of one side of the insulator of FIG. 2-1 .

FIG. 3B , FIG. 3C and FIG. 3D are schematic top plan views of the coils of each layer of FIG. 2 .

FIG. 3E is a schematic bottom plan view of the other side of the insulator of FIG. 2 .

FIG. 3F is a schematic bottom plan view of another side of the inductor structure of FIG. 2 .

3F-1 to 3F-4 are schematic top plan views of other aspects of FIG. 3A.

The following specific embodiments are used to illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the contents disclosed in the specification for the understanding and reading of those who are familiar with the art, and are not intended to limit the implementation of this creation. Therefore, it has no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size will not affect the production of this creation. The effect and the purpose that can be achieved should still fall within the scope that the technical content disclosed in this creation can cover. At the same time, the terms such as "above", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of implementation of this creation. Changes or adjustments to their relative relationships, provided that there is no substantial change in the technical content, shall also be regarded as the scope of the implementation of this creation.

FIG. 2 is a schematic cross-sectional view of the inductor structure 3 of the present invention. As shown in FIG. 2 , the inductance structure 3 includes an insulator 20 and an inductance body 3 a embedded in the insulator 20 , and the inductance body 3 a includes a plurality of groups (two left and right groups as shown in FIG. 2 ) Parallel) inductance lines 32a, 32b, and a conductive line 38 connecting each group of inductance lines 32a, 32b.

The insulator 20 has opposite first side 20a and second side 20b. In this embodiment, the insulator 20 is a dielectric material, such as ABF (Ajinomoto Build-up Film), photosensitive resin, Polyimide (PI), Bismaleimide Triazine (BT), FR5 Prepreg (PP), Molding Compound, Epoxy Molding Compound (EMC) or other suitable materials. The preferred material of the insulator 20 is PI, ABF or EMC which is easy to do circuit processing.

The inductance lines 32a, 32b are three-dimensional helical coils, which constitute a three-dimensional (3D) frame by the multi-layer (such as three-layer) coils 221, 222, 223 and the conductors 33a, 33b, wherein the two groups of inductance lines 32a, The coils 221 of 32b are connected in series by the conducting lines 38 .

In this embodiment, the winding paths of the inductance lines 32a, 32b are from the starting point 320 (ie, one of the contacts) of the coil 223 of the inductance line 32a shown in FIG. 3D, through the first relay point 321 and conductive The body 33b arrives at the coil 222 of the inductance line 32a shown in FIG. 3C , and then passes through the second relay point 322 and the conductor 33a to the coil 221 of the inductance line 32a shown in FIG. 3B , and then passes through the conductive line 38 to to the coil 221 of the other inductance line 32b shown in FIG. 3B, and then through the coil 221 of the other inductance line 32b shown in FIG. 3B The third relay point 323 and the conductor 33a come to the coil 222 of the inductance line 32b shown in FIG. 3C, and finally, pass through the fourth relay point 324 and the conductor 33b of the coil 222 of the inductance line 32b shown in FIG. 3C Returning to the coil 223 of the inductance line 32b shown in FIG. 3D and ending at its stopping point 325 (ie, another contact), the shape of the circle pattern of the coils 221, 222, 223 of the same layer of the inductance lines 32a, 32b is as follows Two semicircles (ie, two D-like shapes) shown in FIGS. 3B , 3C and 3D .

Furthermore, the pattern shapes of the conductors 33a, 33b correspond to the partial arc segments of the coils 221, 222, 223 of the inductance lines 32a, 32b.

It should be understood that the inductance body 3a can be provided with a plurality of three-dimensional coils with winding paths according to requirements, such as the thickened inductance circuits 22a and 22b shown in FIG. The coil paths are defined as coil groups 221a, 222a, 223a, and each coil group is formed by stacking multiple layers of coils 220 through wall-shaped conductors 23. Alternatively, all the coils 221, 222, 223 can also be stacked with wall-shaped conductors 43 to form an inductance line 32c, 32d with a thicker thickness H, as shown in FIG. 2B, and the pattern shape of the conductor 43 corresponds to the inductance line 32c, All sections of coils 221, 222, 223 of 32d. It should be understood that the pattern shapes of the conductors 33a, 33b, 43 in the same inductor body 3a can correspond to all sections and/or partial sections of the coils 221, 222, 223 according to requirements, and the thickness of the inductor lines can be customized according to requirements. The design is not limited to the above.

The conductors 33a, 33b are stacked on the layers of coils 221, 222, 223, so that the conductors 33a, 33b are located between the layers of coils 221, 222, 223, so that the inductor body 3a is in the form of a vertical three-dimensional coil.

In this embodiment, the conductors 33a, 33b are wall-shaped, which correspond to the sections connecting the coils 221, 222, 223 of the layers of the inductance lines 32a, 32b, as shown in FIG. 3B to FIG. 3D, so compared with the conventional By using the laser to open conductive blind holes or through holes, the requirement of contacting the inductive lines 32a and 32b in a large area can be achieved.

Furthermore, the two contacts (ie, the starting point 320 and the stopping point 325 ) of the inductor body 3a are located at the outer ends of the two inductor lines 32a, 32b, respectively, serving as input ports and output ports. For example, the first conductive column 24a and the second conductive column 24b are embedded in the insulator 20, so that the first conductive column 24a communicates with the insulation The second side 20b of the body 20 and one of the inductive lines 32b are connected to one of the contacts (the stop point 325 shown in FIG. 3D ), and the second conductive post 24b communicates the second side 20b of the insulator 20 with the other The inductance line 32a is connected to another contact (the starting point 320 shown in FIG. 3D). It should be understood that the first conductive column 24a and the second conductive column 24b can communicate with the first side 20a of the insulator 20 as required.

In addition, the end surface of the first conductive post 24a is connected to a first electrical contact pad 25a provided on the second side 20b of the insulator 20 , and the end surface of the second conductive post 24b is connected to a first electrical contact pad 25a provided on the insulator 20 . The second electrical contact pads 25b on the two sides 20b, so that the first and second electrical contact pads 25a, 25b are used to connect other electronic components, the first and second electrical contact pads 25a, 25b can be provided On one side or both sides (as shown in Figure 2 and Figure 3A). For example, the first conductive pillars 24a and the second conductive pillars 24b are solid irregular pillars, and the cross-sectional shapes of the first conductive pillars 24a and the second conductive pillars 24b correspond to the connected first and second electrical properties The pattern shape of the contact pads 25a, 25b is to contact the first and second electrical contact pads 25a, 25b with more areas, so as to obtain the largest conduction area.

In addition, a surface treatment layer 26 and/or solder material can be formed on the first and second electrical contact pads 25a, 25b to facilitate the connection of other electronic components, wherein the material for forming the surface treatment layer 26 is Nickel/Au (Ni/Au), Nickel/Palladium/Au (Ni/Pd/Au) or Organic Solder Preservative (OSP) etc. For example, an insulating protection layer 27b may be formed on the second side 20b of the insulator 20, and the first and second electrical contact pads 25a, 25b or the surface treatment layer 26 thereon may be exposed, wherein the insulating layer is formed The material of the protective layer 27b is a dielectric material, a photosensitive or non-photosensitive organic insulating material, such as solder resist, ABF, and EMC.

It should be understood that another insulating protective layer (not shown) can be formed on the first side 20a of the insulator 20, and the material of the other insulating protective layer is a dielectric material, a photosensitive or non-photosensitive organic insulating material , such as solder mask, ABF and EMC, etc., but not limited to the above. Further, the insulating protection layer 27b and the insulator 20 can be made of the same material or different materials, and when they are the same material, the material combination can be simplified.

In another aspect, as shown in FIGS. 2-1 , 2A-1 and 2B-1, at least one shielding layer 31a, 31b can be embedded in the insulator 20, which is composed of a plurality of shielding layers that are not electrically connected to each other. Conductive segment 310 for sexual connection (As shown in FIG. 3A and FIG. 3B ) assembled, and the shielding layers 31a, 31b at least shield one of the outer sides of the plurality of inductance lines 22a, 22b, 32a, 32b, 32c, 32d and are not electrically connected to the Inductive line.

The shielding layers 31a, 31b are embedded in the first side 20a and the second side 20b of the insulator 20 to be arranged on the upper and lower sides of the inductor body 3a to shield the inductor lines 22a, 22b, 32a, 32b, 32c, 32d, and the shielding layers 31a, 31b are not electrically connected to the inductor body 3a (or the inductor lines 32a, 32b), wherein the shielding layers 31a, 31b include a plurality of non-connected line segments 310 (eg 3A and 3E ), and the distance t between the line segments 310 may be the same or different.

In this embodiment, the shielding layers 31a and 31b are deposited by electroplating, sputtering or physical vapor deposition (PVD), and the line segments 310 may be arranged in a row. Patterns such as circular outlines, polygonal outlines (as shown in Fig. 3F-1) or other outlines, etc., can also be radial, multi-ring (as shown in Fig. 3F-2) or other shapes. It should be understood that the pattern of the line segment 310 may be a symmetrical form (as shown in FIG. 3F-2 or FIG. 3F-3 ) or an asymmetrical form (as shown in FIG. 3F-4 ).

Furthermore, the shielding layers 31a, 31b are magnetic conductive materials, which include iron (Fe), nickel (Ni), cobalt (Co), manganese (Mn), zinc (Zn) or their alloys, or other magnetic properties such as substance. In addition, the shielding layers 31a, 31b can also be formed by combining a magnetically conductive material and a non-magnetic metal such as copper (Cu), for example, electroplating or electroless copper (Cu) first, and then the magnetically conductive material, or firstly plated The magnetic conductive layer is then plated with non-magnetic metal.

In addition, one of the shielding layers 31b is not exposed on the first side 20a of the insulator 20 (as shown in FIG. 3F ), and the other shielding layer 31a may be exposed on the first side 20a of the insulator 20 , and is on the side of the insulator 20 . An insulating protective layer (not shown) may be formed on the first side 20a to cover the shielding layer 31a. For example, the shielding layer 31a can be recessed in the first side 20a to have better bonding force between the shielding layer 31a and the insulating protection layer.

Therefore, the inductor structure 3 of the present invention mainly forms the inductor body 3a through a three-dimensional winding path, so that the inductor lines 22a, 22b, 32a, 32b, 32c, 32d generate a plurality of opening regions 300, as shown in FIG. 3B to FIG. 3D shown to increase the magnetic induction area.

Furthermore, the inductor structure 3 forms a shielding layer 31a, 31b containing a magnetic conductive material on at least one side of the opposite sides of the inductor body 3a to cover the inductor lines 22a, 22b, 32a, 32b, 32c, 32d, it is preferable to form a set of opposite shielding layers 31a, 31b, so as to reduce the effect of electromagnetic interference and increase the ability of resisting the effect of electromagnetic interference, so as to improve the inductance value and the quality factor (or the Q value of the inductance, that is, ωL/ R, where ω represents the frequency, L is the inductance, and R is the resistance of the inductance). Further, in order to improve the Q value, the conductive connection between the layers of the inductor lines 22a, 22b, 32a, 32b, 32c, 32d can be formed by lithography patterned electroplating metal posts to form the conductors 23, 33a, 33b , 43, the shape of which corresponds to the solitary shape of each of the inductance lines 22a, 22b, 32a, 32b, 32c, 32d, as shown in FIG. 3B to FIG. 3D, in order to obtain a wider conductive area and reduce the resistance R of the inductance and more High thermal conductivity.

In addition, the shielding layers 31a, 31b can be selected from magnetic conductive materials that meet the magnetic permeability conditions according to the requirements of the inductance value.

To sum up, the inductor structure 3 of the present creation can be fabricated by the processing method of a circuit board (PCB) or a carrier board, so as to easily mass-produce a large board area, and it adopts a coreless form. The patterned build-up circuit method forms the magnetic conductive material by electroplating or deposition, so that the precision of the shielding layers 31a and 31b can be controlled extremely well. The spiral shapes of the inductance lines 22a, 22b, 32a, 32b, 32c, 32d and the patterns of the shielding layers 31a, 31b) have good precision, and the precision control of the inductance value is excellent.

Furthermore, since the patterned circuit process can be easily performed using magnetic conductive materials and insulating layers and insulating layers, the inductor structure 3 is beneficial to various designs and applications.

In addition, the shielding layers 31a, 31b are designed by the unconnected line segments 310 to improve the Improve the magnetic shielding effect and its ability to resist electromagnetic (EMI) interference, and reduce the influence of eddy current and magnetic loss on the Q value.

In addition, compared with the configuration of the iron core blocks in the prior art, the thicknesses of the inductor lines 22a, 22b, 32a, 32b, 32c, and 32d of the inductor structure 3 of the present invention can be adjusted according to the requirements without the need to configure the iron core blocks, so that the Easy to miniaturize, so that the end product can meet the needs of miniaturization. It should be understood that, compared with the configuration of the magnetic powder dielectric layer in the prior art, the insulator 20 of the inductor structure 3 of the present invention is easy to manufacture without doping magnetic powder, so the manufacturing cost can be further reduced, so that the end product is more economical. need.

The above-mentioned embodiments are used to illustrate the principles and effects of the present invention, but not to limit the present invention. Anyone skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the present creation. Therefore, the protection scope of the rights of this creation should be listed in the patent application scope mentioned later.

3: Inductor structure

3a: Inductor body

20: Insulator

20a: First side

20b: Second side

221, 222, 223: Coils

24a: the first conductive column

24b: second conductive column

25a: first electrical contact pad

25b: second electrical contact pad

26: Surface treatment layer

27b: Insulating protective layer

32a, 32b: Inductive lines

38: Conductor line

33a, 33b: Conductors

Claims (8)

An inductive structure comprising: an insulator; A plurality of inductance circuits are stacked and buried in the insulator by stacking a plurality of coils spaced in layers, and each layer has at least two parallel coils that are not electrically connected to each other, wherein each of the inductance circuits is at least a single coil helical coils, and the outermost coils of the inductance circuit are electrically connected to each other; A plurality of wall-shaped conductors are embedded in the insulator and connect any two adjacent coils stacked at intervals; a first conductive column embedded in the insulator and electrically connected to the coil on the bottommost layer of the inductance circuit, and at least one end surface of the first conductive column is exposed from the insulator and connected to an electrical contact pad; and A second conductive column is embedded in the insulator and electrically connected to the bottom coil of the inductance circuit, and at least one end surface of the second conductive column is exposed on the insulator and connected to an electrical contact pad. The inductor structure according to claim 1, wherein the pattern shape of the conductor corresponds to a partial arc section of the inductor circuit. The inductor structure according to claim 1, wherein the pattern shape of the conductor corresponds to all sections of the inductor circuit. The inductor structure as claimed in claim 1, wherein the pattern shape of each of the conductors in the partial layers of the plurality of wall-shaped conductors corresponds to the entire section of the inductor circuit, and the part of the plurality of wall-shaped conductors The pattern shape of each conductor of the layer corresponds to a local section of the inductor circuit. The inductor structure according to claim 1, wherein the shape of the coil body pattern of the coils on the same layer of the plurality of inductor lines is two semicircles. The inductor structure of claim 1, wherein the cross-sectional shape of the first conductive column corresponds to the pattern shape of the connected electrical contact pad. The inductor structure of claim 1, wherein the cross-sectional shape of the second conductive column corresponds to the pattern shape of the connected electrical contact pad. The inductor structure as claimed in claim 1 further comprises a shielding layer embedded in the insulator, which is composed of a plurality of conductive line segments that are not electrically connected to each other, and the shielding layer shields at least the plurality of inductors One of the outer sides of the circuit is not electrically connected to the inductive circuit.

Images