TWM621744U - Immersion liquid cooling tank assembly - Google Patents

Abstract

An immersion liquid cooling tank assembly includes a generally hexagonal tank, a condenser, a manifold system, and at least one top cover. The generally hexagonal tank includes a base and a plurality of side walls. The base and the plurality of sidewalls are connected. The condenser is located in the generally hexagonal tank and includes a plurality of condenser tubes. The manifold system is coupled to the condenser to assist in distributing liquid flow to and from the plurality of condenser tubes. The at least one top cover covers the generally hexagonal tank and is located generally opposite to the base.

Description

Submerged Liquid Cooling Tank Assembly

The present disclosure relates to a cooling system, and more particularly, to auxiliary cooling of a trough assembly such as a heat generating component in a server.

Computer components, like servers, contain numerous electronic components that are powered by a common power source. Servers generate a lot of heat due to the operation of internal electronic devices such as controllers, processors, memory, etc. Overheating due to the inability to remove heat effectively can shut down or hinder the operation of such devices. Due to improvements in high-performance systems, the heat that needs to be removed in new-generation electronic components is getting higher and higher. As more powerful components become available, traditional air cooling combined with fan systems is not sufficient to adequately remove the heat generated by the new generation of components.

Liquid cooling is currently the accepted solution for rapid heat removal due to its excellent thermal properties. Liquid cooling is more efficient at absorbing and transferring heat from heat-generating components, and can dissipate heat without creating noise pollution. In an immersion liquid cooling system, heat-generating components such as servos, switches, and storage devices are immersed in a tank of coolant. One type of existing immersion tank is the rectangular immersion tank. this existing class This type of slot has disadvantages when repairing or assembling, because the heat-generating components need to be moved up and down directly, which results in laborious and difficult repair or assembly operations. Additionally, some existing immersion tanks are limited in their ability to accommodate the desired number of condenser tubes, which limits the cooling potential of the tank.

Accordingly, there is a need for a submerged liquid cooling tank assembly that overcomes one or more of these disadvantages.

The terms embodiment and similar terms are intended to broadly refer to all subjects of the scope of this disclosure and the following claims. It should be understood that statements containing these terms should not limit the subject matter described herein or limit the meaning or scope of the claims that follow. Embodiments of the present disclosure encompassed herein are defined by the following claims rather than by novel content. This Novel is a high-level overview of various aspects of the present disclosure and introduces some concepts, which are further described in the specification section below. Novel Content is not intended to identify key or essential features of the claimed subject matter. Nor is the novel content intended solely for use in determining the scope of the claimed subject matter. The subject matter should be understood by reference to the entire specification of this disclosure, any or all drawings, and the appropriate portions of each claim.

According to one aspect of the present disclosure, a submerged liquid cooling tank assembly includes a generally hexagonal tank, a condenser, a manifold system, and at least one top cover. The generally hexagonal slot contains a base and a plurality of side walls. The base is connected to the side walls. The condenser is located in a generally hexagonal trough and contains a plurality of condenser tubes. A manifold system is coupled to the condensers to assist in distributing the liquid flow to the condenser tubes and Distributed from these condenser tubes. At least one top cover is generally opposite the base.

According to the configuration of the above-described embodiments, the submerged liquid cooling tank assembly is a hexagonal tank.

According to another configuration of the above embodiment, at least one of the side walls is substantially hexagonal. In another embodiment, at least two of the side walls are substantially hexagonal. In yet another embodiment, exactly two of the side walls are substantially hexagonal.

According to a further configuration of the above-described embodiment, the substantially hexagonal groove comprises metallic material.

In another aspect of the above embodiment, the outer shape of the condenser is a generally inverted trapezoid.

In another aspect of the above embodiment, the submerged liquid cooling tank assembly further includes a coolant located and contained within the generally hexagonal tank. In one embodiment, the coolant may be a hydrocarbon, and in another embodiment, the coolant may be water or an aqueous mixture.

In yet another aspect of the above-described embodiment, the submerged liquid cooling tank assembly further includes a plurality of heat generating components housed within the generally hexagonal tank. In one embodiment, the heat generating components include one or more of storage servers, application servers, switches and other electronic devices.

In yet another aspect of the above embodiment, the at least one cap is a plurality of caps.

In another aspect of the above-described embodiment, a submerged liquid cooling tank assembly includes a generally hexagonal tank, a condenser, a manifold system, at least one top cover, a coolant, and a plurality of heat generating components. The roughly hexagonal slot contains the base and these side wall. The base is connected to the side walls. The condenser is located in a generally hexagonal trough and contains a plurality of condenser tubes. A manifold system is coupled to the condensers to assist in distributing the flow of liquid to and from the condenser tubes. At least one top cover is generally opposite the base. The coolant is contained within a generally hexagonal groove. The heat generating components are accommodated in substantially hexagonal slots.

According to another aspect of the present disclosure, the coolant may be a hydrocarbon. In another embodiment, the coolant may be water or an aqueous mixture.

According to one configuration of the above-described embodiment, the heat generating components include storage servers, application servers, switches, or other electronic devices.

According to another aspect of the present disclosure, a submerged liquid cooling tank assembly includes a hexagonal tank, a condenser, a manifold system, and at least one top cover. The hexagonal slot contains the base and the side walls. The base is connected to the side walls. Exactly two of the side walls are hexagonal. The condenser is located in a generally hexagonal trough and contains a plurality of condenser tubes. A manifold system is coupled to the condensers to assist in distributing the flow of liquid to and from the condenser tubes. At least one top cover is generally opposite the base.

According to the configuration of the above-described embodiment, the outer shape of the condenser is a substantially inverted trapezoid.

The above novelty is not intended to represent each implementation or every aspect of the present disclosure. Rather, the foregoing novel disclosure provides only examples of some of the novel aspects and features herein. The above and other features and advantages of the present disclosure will become apparent from the following detailed description of representative embodiments and modes for carrying out the disclosure, when taken in conjunction with the accompanying drawings and the appended claims. In view of the various embodiments made with reference to the accompanying drawings From the detailed description, additional aspects of the present disclosure will be apparent to those of ordinary skill in the art, a brief description of which is provided below.

100: Submerged Liquid Cooling Tank Assembly

110: Roughly hexagonal groove

112: Base

114, 116, 118, 120: Sidewalls

130: Condenser

132: Condenser pipe

140: Manifold system

142: The first manifold part

144: Second manifold part

146, 148: Larger opening

150, 152, 154: Top cover

158,160: Hub

170: Cold liquid line

172: Hot Liquid Line

202: Coolant

202a, 202b: Gaseous coolant molecules

202c, 202d: Liquid coolant molecules

203: Coolant level

204, 204c: Heating parts

204a: Group 1

204b: Second group

206, 208: Supporting Structures

A,B,C: Arrow

a: angle

The disclosure and its advantages will be better understood from the following description of exemplary embodiments in conjunction with reference to the accompanying drawings. These drawings depict only exemplary embodiments and are therefore not to be considered limiting of the scope of the various embodiments or the scope of the claims.

1A is a general front perspective view of a submerged liquid cooling tank assembly in accordance with one embodiment of the present disclosure.

FIG. 1B is a general back perspective view of the submerged liquid cooling tank assembly of FIG. 1A in accordance with one embodiment of the present disclosure.

Figure 2 is a translucent, general front perspective view of the submerged liquid cooling tank assembly of Figure 1A.

Fig. 3 is a top view of the submerged liquid cooling tank assembly of Fig. 1A.

FIG. 4 is a generally cross-sectional side view taken generally along the middle of the submerged liquid cooling tank assembly of FIG. 1A .

While the present disclosure is susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and will be described in further detail herein. It should be understood, however, that the present disclosure is not intended to be limited to the particular forms disclosed. On the contrary, the present disclosure is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure as defined by the appended claims.

Various embodiments are described with reference to the accompanying drawings, wherein like reference numerals are used throughout to refer to like or equivalent elements. The figures are not drawn to scale and are only used to illustrate the present disclosure. Several aspects of the present disclosure are described below for illustrative purposes with reference to example applications. It should be understood that numerous specific details, relationships and methods are set forth to provide a thorough understanding of the present disclosure. However, one of ordinary skill in the art will readily recognize that the present disclosure may be practiced without one or more of the specific details or by other means. In other instances, well-known structures or operations have not been shown in detail in order to avoid obscuring the disclosure. The various embodiments are not limited by the order of acts or events illustrated, as some acts may occur in different orders and/or concurrently with other acts or events. Furthermore, not all illustrated acts or events need to be performed in accordance with the methods of the present disclosure.

For example, elements and limitations disclosed in the Abstract, Novel Content, and Specification sections but not expressly set forth in the scope of the claim should not be incorporated into the scope of the claim, individually or collectively, by implication, inference, or otherwise. For the purposes of this specification, unless specifically stated otherwise, the singular includes the plural and vice versa. The word "comprising" means "including but not limited to". In addition, approximations such as "about", "almost", "substantially", "approximately" and the like may be used herein, for example, to mean "at", "nearly", "almost at", "at 3 -5%" or "within acceptable manufacturing tolerances", or any logical combination thereof.

Similarly, the terms "vertical" or "horizontal" are intended to additionally include "within 3-5% of the vertical or horizontal direction," respectively. In addition, things like "top", Directional words such as "bottom," "left," "right," "above," and "below" are intended to relate to the equivalent directions described in the description of the reference figures; understood in the context of the object or element being referenced, such as from the object or the usual location of the element; or as described here.

Figures IA and IB are perspective views of generally opposite sides of an immersion liquid cooling tank assembly 100 in accordance with one embodiment of the present disclosure. FIG. 2 is a translucent, generally backside perspective view of the immersion liquid cooling tank assembly 100 . As will be discussed below, the submerged liquid cooling tank assembly 100 is configured to house and cool heat generating components. Non-limiting examples of heat generating components that may be housed within the submerged liquid cooling tank assembly include, but are not limited to, storage servers, application servers, switches, and other electronic devices. Examples include, but are not limited to, central processing units (CPUs), dual inline memory modules (DIMMs), network cards, hard disk drives (HDDs), solid state drives (SSDs), graphics processing units (GPUs), or field Domain Programmable Gate Array (FPGA). It is envisioned that other heat generating components may be housed within the submerged liquid cooling tank assembly.

1A, 1B and 2, the submerged liquid cooling tank assembly 100 includes a generally hexagonal tank 110, a condenser 130 (FIG. 2), a manifold system 140 (FIG. 2), and a top cover 150 , 152, 154. The generally hexagonal slot 110 includes a base 112 and a plurality of side walls 114 , 116 , 118 and 120 . The base 112 and the side walls 114, 116, 118 and 120 are connected or attached to each other. In some embodiments, base 112 and sidewalls 114, 116, 118, and 120 may be integrally connected. In other embodiments, the base and sidewalls may be formed separately and securely attached together.

In one embodiment, the substantially hexagonal slot 110 is a hexagonal slot. In one embodiment, at least one of the side walls is substantially hexagonal. As shown in Figures 1A and 1B, exactly two of the side walls 114, 118 are generally hexagonal or hexagonal in shape. In other words, the profiles of the side walls 114, 118 are generally hexagonal or hexagonal in shape. It is envisioned that in further embodiments, at least two of the side walls are substantially hexagonal.

The other two of the side walls 116, 120 of Figures 1A and 1B are substantially rectangular in shape. It is envisioned that in further embodiments, the shape of two or more of the sidewalls may differ from that depicted in the submerged liquid cooling tank assembly. Side walls 114, 116, 118 and 120 in Figures 1A and 1B are exactly four side walls. It is envisioned that the side walls may differ in number from exactly four side walls.

Referring to Figures 2 and 3, the submerged liquid cooling tank assembly 100 includes a condenser 130 having an internal network of fluid conduits. The condenser 130 is located within the generally hexagonal groove 110 . In one embodiment, the fluid conduit used in condenser 130 is in the form of condenser tube 132 . As will be discussed below, the condenser tubes 132 used in the condenser 130 are desirable because of their high cooling efficiency in cooling the coolant from the gas phase to the liquid phase.

Condenser tubes 132 used in condenser 130 extend between opposite ends of manifold system 140 . More specifically, the condenser tube 132 used in the condenser 130 extends between the first manifold site 142 and the second manifold site 144 on the opposite side. Condenser tubes 132 in condenser 130 help to contain and transport liquid therethrough. As will be discussed below, the liquid in the condenser tube 132 is configured to receive or absorb heat transferred from the coolant (gas phase). The condenser tubes can be of various sizes and shapes. One non-limiting cross-sectional shape of the condenser tube is a generally circular form. Another non-limiting cross-sectional shape of the condenser tube is a generally elliptical form.

It is contemplated that the condenser tubes may be of other shapes, including polygonal shapes or other non-polygonal shapes. For example, the condenser tube may have a polygonal-shaped (eg, square or rectangular) cross-section. Of course, it is desirable that the shape and size of the condenser tubes are suitable for efficient heat transfer of the coolant (gas phase).

The outer shape of the condenser 130 shown in FIG. 2 is a substantially inverted trapezoid. More specifically, the outer shape of the condenser 130 is an inverted isosceles trapezoid. The profile of the condenser 130 as shown in FIG. 2 is desirable because the heat transfer area is enlarged, which allows for greater and faster heat transfer between the coolant (gas phase) and the condenser 130 .

The submerged liquid cooling tank assembly 100 of FIG. 2 properly includes a condenser 130 . It is envisioned that the submerged liquid cooling tank assembly may contain multiple condensers. This will depend on the required cooling capacity of the submerged liquid cooling tank assembly. The required cooling capacity will depend on factors such as the number and size of heat generating components, the size of the submerged liquid cooling tank assembly, and the type and amount of coolant used.

As shown in FIG. 3 , the condenser 130 extends between the first manifold portion 142 of the manifold system 140 and the second manifold portion 144 on the opposite side. A manifold system 140 is coupled to the condenser 130 to assist in distributing the flow of liquid to and from the plurality of condenser tubes. The first manifold site 142 processes and distributes cold liquids (eg, water), while the second manifold site 144 processes and enhances removal of hot liquids (eg, water). The first manifold site 142 has fluid with the cold liquid line 170 At least one larger opening 146 that conducts. The cold liquid line 170 contains cold liquid (eg, water) entering at least one larger opening 146 in the first manifold site 142, which also contains a plurality of openings formed therein to receive the cold liquid and It is distributed to the condenser line 132 of the condenser 130 .

The second manifold site 144 has at least one larger opening 148 in fluid communication with the hot liquid line 172 . The hot liquid line 172 removes hot liquid (eg, water) entering the at least one larger opening 148 in the pipe. The second manifold site 144 also includes a plurality of openings formed therein that collect the hot liquid from the plurality of condenser tubes 132 and enhance its removal via the hot liquid line 172 . The hot liquid line 172 carries away the heat generated by the heat generating components.

The outer shape of the first manifold portion 142 as shown in FIG. 2 is a substantially inverted trapezoid. More specifically, the outer shape of the first manifold portion 142 is an inverted isosceles trapezoid. The outer shape of the first manifold portion 142 as shown in FIG. 2 substantially corresponds to the outer shape of the condenser 130 . The shape (not shown) of the second manifold portion 144 is the same as the shape of the first manifold portion 142 . It is envisioned that the first manifold site and the second manifold site may be of different shapes and sizes.

The submerged liquid cooling tank assembly also includes at least one top cover. Referring back to FIGS. 1A and 1B , the submerged liquid cooling tank assembly 100 includes a first top cover 150 , a second top cover 152 and a third top cover 154 . The first, second and third caps 150 , 152 , 154 cover the generally hexagonal slot 110 and are located generally opposite the base 112 . The first, second and third top covers 150, 152, 154 help to cool the tank pack for submerged liquids Device 100 provides an enclosed environment or system.

At least one or both of the plurality of caps may be movable or removable to allow access to heat generating components housed in the generally hexagonal slot. Specifically, as shown in Figures 1A and 1B, the first and second top covers 150, 152 are movable or removable to allow access to heat generating components. To assist in moving between the open and closed positions, the first and second top covers 150, 152 utilize respective hinges 158, 160. Specifically as shown in FIG. 1B , the hinge 158 connects the first top cover 150 to the side wall 120 . Similarly, the hinge 160 of FIG. 1A connects the second top cover 152 to the side wall 116 . It is envisioned that other mechanisms other than hubs may also be used to facilitate the entry and exit of multiple heat generating components.

Still referring to FIGS. 1A and 1B , the third top cover 154 is shown. The third top cover 154 is removable or removable to assist with repair or maintenance. The third top cover 154 helps provide a closed environment or system for the submerged liquid cooling tank assembly 100 when the first and second top covers 150, 152 are in the closed position. In one embodiment, the third top cover 154 may also assist in positioning and securing the condenser 130 and manifold system 140 in a desired location separated from the coolant (liquid phase). The third cap 154 includes a first of a plurality of holes aligned with the cold liquid line 170 and the at least one larger opening 146 of the first manifold site 142 as shown in FIG. 3 . The third cap 154 also includes a second hole of the plurality of holes aligned with the hot liquid line 172 and the at least one larger opening 148 of the second manifold site 144 as shown in FIG. 3 .

It is envisioned that in other embodiments, the at least one cap may be configured differently than shown in Figures 1A and 1B. For example, at least one Each cap may be a continuous cap in which at least one portion may be removed or moved to allow access to the interior of the generally hexagonal slot 110 .

Referring back to FIG. 2 , the submerged liquid cooling tank assembly 100 includes a coolant 202 and a plurality of heat generating components 204 located within and housed within the generally hexagonal tank 110 . Specifically, the heat-generating components 204 include a first group 204a of the plurality of heat-generating components 204 and a second group 204b of the plurality of heat-generating components 204 . The coolant 202 may be selected from a variety of coolants to assist in removing heat generated from the plurality of heat generating components 204 by directly contacting those components. In one embodiment, the coolant is a thermally conductive dielectric liquid coolant. Coolant 202 assists in removing heat generated by heat generating components 204 by directly contacting those components. Liquids used as coolants generally have very good insulating properties, so that contact with heat-generating components can be achieved in a safe manner. The coolant 202 changes easily between its liquid and gas phases, and is at the desired temperature.

The type of coolant is selected based on thermal design requirements. Non-limiting examples of coolants include fluorocarbons, water (eg, deionized water, aqueous mixtures, and hydrocarbons). It is envisioned that other coolants may be used that can remove and absorb heat from heat generating components stored within the generally hexagonal slot.

The plurality of heat generating components 204 shown in FIG. 2 are a plurality of servers. It may be composed of a plurality of heat generating components 204 . One of the heat-generating components 204 (heat-generating component 204c ) is depicted in the process of being removed from the generally hexagonal slot 110 . The heat generating component 204c is removed in the general direction of arrow A. As shown in FIG. For greater clarity, the second top cover 152 (shown in FIGS. 1A and 1B ) has been Removed from Figure 2. As described above, the first and second top covers 150 , 152 are moved from the closed position to the open position via the respective hinges 158 , 160 to allow access to the plurality of heat generating components 204 . Non-limiting examples of heat generating components that may be housed within the submerged liquid cooling tank assembly include, but are not limited to, storage servers, application servers, switches, or other electronic devices. Examples include, but are not limited to, CPUs, DIMMs, network cards, HDDs, SSDs, GPUs, or FPGAs.

The first group 204a of the plurality of heat generating components 204 is placed on the support structure 206 . The support structure 206 in this embodiment extends from the side wall 114 through the interior of the generally hexagonal slot 110 to the side wall 118 on the opposite side. The support structure 206 is configured to support and position the first set 204a of the plurality of heat generating components 204 . The support structure 206 is configured to bear against the first set 204a of the plurality of heat generating components 204 . The support structure 206 is sloped to assist in positioning and removing the heat generating components 204 from the submerged liquid cooling tank assembly 100 . As shown in FIG. 2, the support structure 206 is generally inclined at an angle a, which is about 20 degrees to about 80 degrees, and typically about 30 degrees to about 75 degrees, or about 35 degrees to about 70 degrees.

The heat transfer process is best illustrated in Figure 4, which is a generally cross-sectional side view taken generally along the middle of the submerged liquid cooling tank assembly 100 of Figure 1A. The submerged liquid cooling tank assembly is configured for a two-phase immersion process. During this process, the two-phase temperature evaporation process cools the heat-generating components via the coolant 202 . The coolant 202 in FIG. 4 surrounds the first group 204a and the second group 240b of the plurality of heat generating components 204 . Coolant level 203 shows the level of coolant 202 . Because the coolant 202 (liquid phase) contacts heat For the first set 204a and the second set 204b of components, the coolant molecules in the liquid phase become gaseous molecules of the coolant. These multiple gaseous coolant molecules are depicted in Figure 4 as small circles. For greater clarity, only gaseous coolant molecules 202a, 202b are indicated in Figure 4. These gaseous coolant molecules 202a, 202b move in the general direction of arrow B. When the gaseous molecules travel in the general direction of arrow B, the gaseous molecules contact the condenser 130 . After contacting the condenser, the gaseous coolant molecules are converted into liquid coolant molecules. These liquid coolant molecules are depicted in Figure 4 as roughly oval or drop-shaped. For greater clarity, only the liquid coolant molecules 202c, 202d are indicated in Figure 4. The liquid coolant molecules then return to the coolant bath in the general direction of arrow C.

The substantially hexagonal groove 110 contains a metallic material. Non-limiting metallic materials that can be used to form the generally hexagonal grooves include steel. Examples of steels that can be used to form generally hexagonal channels include, but are not limited to, stainless steel and cold rolled steel (eg: SGCC steel). It is envisioned that materials other than metallic materials may also be used to form the substantially oval grooves if these materials have the desired properties including strength to hold the material inside. The support structures 206 , 208 may be formed using the same materials used to form the generally hexagonal slot 110 .

The submerged liquid cooling tank assembly 100 generates utility passively because no additional components are required to assist in the interaction of the coolant 202 (liquid phase) with the heat generating components 204 or between the coolant 202 (gas phase) and the condenser 130 Interaction. Thus, the submerged liquid cooling tank assembly 100 is a passive tank.

The foregoing description of the present embodiments, including the illustrated embodiments, has been presented for purposes of illustration and description only, and is not intended to be exhaustive or limited to the precise form disclosed. Various modifications, adaptations and uses thereof will be apparent to those of ordinary skill in the art.

Although the disclosed embodiments have been illustrated and described with respect to one or more embodiments, equivalent changes and modifications will occur and will become known to others of ordinary skill in the art after a reading and understanding of this specification and the accompanying drawings . Furthermore, although a particular feature of the present disclosure may be disclosed with respect to only one of several implementations, such feature may be combined with one of the other implementations if desired and advantageous for any given or particular application. or a combination of multiple other features.

While various embodiments of the present disclosure have been described above, it should be understood that they have been presented by way of example only, and not limitation. Various changes to the disclosed embodiments may be made in accordance with the disclosures herein without departing from the spirit or scope of the present disclosure. Accordingly, the breadth and scope of the present disclosure should not be limited by any of the above-described embodiments. Instead, the scope of the present disclosure should be defined in accordance with the appended claims and their equivalents.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the present disclosure. As used herein, the singular forms "a" ("a", "an" and "the") are intended to include the plural forms as well, unless the context clearly dictates otherwise. Furthermore, with respect to the terms "including" (including and includes), "having" (having, has, and with), or variations thereof, as used in the specification and/or the scope of claims, these terms are intended to be used in a manner similar to the term " "comprising" is included in the Inside.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. Furthermore, terms (like those defined in common dictionaries) should be interpreted as having meanings consistent with their meanings in the context of the relevant field, and unless explicitly so defined, they are not to be interpreted herein in an idealized or overly formal sense .

100: Submerged Liquid Cooling Tank Assembly

110: Roughly hexagonal groove

112: Base

114, 116: Sidewalls

150, 152, 154: Top cover

160: Hub

170: Cold liquid line

172: Hot Liquid Line

Claims (10)

A submerged liquid cooling tank assembly comprising: a substantially hexagonal tank including a base and a plurality of side walls, the base being connected to the side walls; a condenser located in the substantially hexagonal tank and comprising a plurality of side walls condenser tubes; a manifold system coupled to the condenser to assist in distributing liquid flow in and out of the condenser tubes; and at least one top cover covering the generally hexagonal slot and generally opposite the base. The slot assembly of claim 1, wherein the substantially hexagonal slot is hexagonal. The trough assembly of claim 1, wherein at least one of the side walls is substantially hexagonal. The slot assembly of claim 1, wherein the substantially hexagonal slot comprises a metallic material. The tank assembly of claim 1, wherein an outer shape of the condenser is a substantially inverted trapezoid. The slot assembly of claim 1, further comprising a The coolant is located and contained within the generally hexagonal groove. The slot assembly of claim 1, further comprising a plurality of heat generating components housed in the substantially hexagonal slot. A submerged liquid cooling tank assembly comprising: a substantially hexagonal tank including a base and a plurality of side walls, the base being connected to the side walls; a condenser located in the substantially hexagonal tank and comprising a plurality of side walls condenser tubes; a manifold system coupled to the condenser to assist in distributing liquid flow in and out of the condenser tubes; at least one top cover covering the substantially hexagonal groove and substantially opposite the base; a A coolant is accommodated in the substantially hexagonal groove; and a plurality of heat generating components are accommodated in the substantially hexagonal groove. A submerged liquid cooling tank assembly comprising: a hexagonal tank including a base and a plurality of side walls, the base being connected to the side walls, wherein exactly two of the side walls are hexagonal; a condenser , located within the hexagonal tank and containing a plurality of condenser tubes; a manifold system coupled to the condenser to assist in distributing the flow of liquid into and out of the condenser tubes; and At least one top cover covers the hexagonal groove and is substantially opposite to the base. The trough assembly of claim 9, wherein an outer shape of the condenser is a generally inverted trapezoid.

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