TWM620249U - Antenna structure - Google Patents

Abstract

An antenna structure includes: a circuit board and a chip antenna. The circuit board is provided with at least one bonding hole penetrating the circuit board, and at least one electrode layer and a feeding line are arranged on the periphery of the bonding hole, and the feeding line is electrically connected with the electrode layer. The chip antenna is provided with a base body, the base body is provided with a wiring section, one end of the wiring section is provided with a fixing section, and the fixing section is formed with a conductive layer. Wherein, the fixing section of the chip antenna is passed through the bonding hole of the circuit board, so that the conductive layer and the electrode layer are electrically fixed, so that the chip antenna is vertically fixed on the circuit board.

Description

Antenna structure

This creation is related to an antenna, especially an antenna structure in which a chip antenna passes through a circuit board and is electrically fixed to the circuit board.

With the popularity of the Internet, people increasingly rely on the Internet, and more and more mobile Internet devices have been developed, such as desktop computers, notebook computers, tablet computers, e-readers, and smart phones. When mobile Internet devices are popular in the market, it has also been reported that people are concerned about the need for network information acquisition and the convenience of network interpersonal interaction, followed by the stability of communication system reception and transmission.

True Wireless Stereo (TWS) headsets used on the market in recent years. The principle of the TWS headset means that the mobile device connects to the main (right) headset, and then the main (right) headset quickly connects to the secondary (left) headset wirelessly to achieve true wireless separation of the left and right channels of Bluetooth.

In the above-mentioned electronic products, it is necessary to transmit or receive through an antenna structure, which includes a circuit board and a chip antenna. The electrode layer of the chip antenna and the conductive layer of the circuit board are welded together, so that the chip antenna is welded to the circuit board in an upright manner, and the metal layer on the chip antenna is electrically connected to the feed line on the circuit board. link. In this way, the signals between electronic products can be transmitted or connected to the Internet for use.

Because the electrode layer of the chip antenna described above is soldered to the conductive layer of the circuit board through solder. After soldering, the length of the chip antenna itself plus the thickness of the solder increases the height of the chip antenna standing on the circuit board. The limited space for installing the antenna structure of the electronic product will make the antenna structure difficult to install. Secondly, when soldering electronic circuits, if the solder is not completely melted, removing the heat source will cause poor circuit connection, which is called cold solder joint. Therefore, during the installation process of the antenna structure, when the chip antenna is accidentally affected by external forces, the chip antenna is likely to be separated or fall off from the circuit board, causing damage to the antenna structure.

Therefore, the main purpose of this creation is to solve the traditional shortcomings. The antenna structure of this creation is redesigned so that after the chip antenna is vertically inserted through the circuit board, it is electrically connected to the circuit board, which not only makes the chip antenna stable and electrically fixed On the circuit board, the height of the chip antenna standing upright on the circuit board can be reduced at the same time, so that the antenna structure is easy to install and use on electronic products.

In order to achieve the above-mentioned purpose, this creation provides an antenna structure, including: a circuit board and a chip antenna. The circuit board is provided with at least one bonding hole penetrating the circuit board, and at least one electrode layer and a feeding line are arranged on the periphery of the bonding hole, and the feeding line is electrically connected with the electrode layer. The chip antenna is provided with a base body, the base body is provided with a wiring section, one end of the wiring section is provided with a fixing section, and the fixing section is formed with a conductive layer. Wherein, the fixing section of the chip antenna is passed through the bonding hole of the circuit board, so that the conductive layer and the electrode layer are electrically fixed, so that the chip antenna is vertically fixed on the circuit board.

In an example of this creation, the chip antenna is fixed to the circuit board in a vertical upright manner.

In an example of this creation, the chip antenna is fixed to the circuit board in a horizontal and upright manner.

In an example of this creation, a ground layer is formed on the front or back of the circuit board, or on the front and back of the circuit board, and a clearance area is formed on the back of the circuit board, and the clearance area corresponds to the electrode layer on the front of the circuit board.

In an example of this creation, the joint hole is provided inside the circuit board body or at the side of the circuit board body, and a side hole is formed in a U shape.

In an example of this creation, the joint hole is a single-hole type, a two-hole type or a three-hole type.

In an example of this creation, the chip antenna is made of ceramic material or glass fiber material.

In an example of this creation, the wiring section is provided with a metal layer.

In an example of this creation, the metal layer includes a plurality of straight lines provided on the surface of the substrate and a plurality of conductive pillars penetrating the substrate. The linear strips are wound on the substrate in a spiral shape with the conductive pillars.

In an example of this creation, the fixing section is a column, a plurality of pins, a plurality of terminals, a recess or a U-shaped notch.

In an example of this creation, the bonding hole is located on the side of the circuit board and has a specific distance from the side. An electrode layer is provided on the periphery of the bonding hole and the specific distance, and the electrode layer is connected to the The feed line is electrically connected.

In an example of this creation, the lower section of the U-shaped notch of the chip antenna penetrates the circuit board and is fixedly connected to the bonding hole, and the notch bridges a specific distance of the circuit board so that the conductive layer and The electrode layer is electrically connected.

The technical content and detailed description of this creation are now explained as follows with the diagrams:

Please refer to FIGS. 1-3, which are an exploded view of the antenna structure of the first embodiment of the present creation, the three-dimensional combination of FIG. 1 and the side sectional view of FIG. 2. As shown in the figure: the antenna structure of this creation includes: a circuit board 1 and a chip antenna 2. Wherein, the chip antenna 2 is electrically fixed to the circuit board 1 in an upright type through the circuit board 1.

The circuit board 1 has at least one bonding hole 11 penetrating the circuit board 1, and at least one electrode layer 12 is provided on the periphery of the bonding hole 11. In addition, a feed line 13 is provided on the circuit board 1, and the feed line 13 is electrically connected to the electrode layer 12. A ground layer (not shown in the figure) is made on the front or back of the circuit board 1, or the front and back, to provide antenna grounding. A clearance area (not shown in the figure) is made on the back of the circuit board 1. The clearance area corresponds to the electrode layer 12 on the front of the circuit board 1. The clearance area is mainly to keep the metal away from the antenna body (metal shield). It is also possible to change the resonant frequency by changing the size of the headroom area, and then the headroom area changes the division of the near field and the far field of the antenna to a certain extent. In this drawing, the joint hole 11 can be made inside the body of the circuit board 1 or at the side of the body of the circuit board 1 to form a side hole.

The chip antenna 2 is made of ceramic material or glass fiber material. The chip wire 2 includes a base 21 with a wiring section 22 on the base 21, and one end of the wiring section 22 is provided with a fixing section 23. A metal layer (not shown in the figure) is formed on the wiring section 22 by printing or etching technology. The metal layer is, for example, but not limited to, a plurality of straight lines arranged on the surface of the base 21 and a plurality of conductive posts penetrating through the base 21 The conductive pillars penetrate the substrate 21 and electrically connect the linear strips on the surface of the substrate 21, so that the linear strips and the conductive pillars form a metal layer spirally wound on the substrate 21. In addition, a conductive layer 24 electrically connected to the metal layer is provided on the fixing section 23. In this drawing, the fixing section 23 is a columnar shape, a plurality of pins, a plurality of terminals, or a U-shaped notch.

When the circuit board 1 and the chip antenna 2 are electrically connected, the fixing section 23 of the chip antenna 2 is passed through the bonding hole 11 of the circuit board 1 to electrically connect the conductive layer 24 and the electrode layer 12. After the circuit board 1 and the chip antenna 2 are fixed, the height of the chip antenna 2 can be vertically or horizontally fixed on the circuit board 1 is reduced, and at the same time, the chip antenna 2 is firmly electrically connected to the circuit board 1. Fixed connection. In the case of limited space for the antenna installation structure inside the electronic product, this antenna structure design can easily adjust the height of the chip antenna standing on the surface of the circuit board 1, which can greatly reduce the problem of installing the antenna structure of the electronic product.

Please refer to FIGS. 4-6, which are an exploded view of the antenna structure of the second embodiment of the present creation, the three-dimensional combination of FIG. 4, and the side sectional view of FIG. 5. As shown in the figure: this embodiment is roughly the same as the first embodiment. The difference is that the joint holes 11a of the circuit board 1 are of porous design. In this embodiment, it is a two-hole type. At least one electrode layer 12a is provided thereon. The electrode layer 12a is electrically connected to the feed line 13.

The fixing section 23 of the chip antenna 2 is a plurality of pins 23a, and a conductive layer 24a is provided on the surface of the pins 23a. In this embodiment, the number of the pins 23a is two but is not limited to two.

When the circuit board 1 and the chip antenna 2 are electrically connected, the pins 23a of the chip antenna 2 are passed through the bonding holes 11a of the circuit board 1, so that the conductive layer 24a and the electrode layer 12a are electrically connected . The height of the chip antenna 2 that can be vertically or horizontally fixed to the circuit board 1 can be reduced, and the chip antenna 2 can be electrically fixed to the circuit board 1 stably.

Please refer to FIGS. 7-8, which are an exploded view of the antenna structure of the third embodiment of the present creation and the three-dimensional assembly diagram of FIG. 7. As shown in the figure: this embodiment is roughly the same as the first and second embodiments. The difference is that the joint hole 11b of the circuit board 1 is a multi-hole design. In this embodiment, it is a three-hole type. At least one electrode layer 12b is provided on the periphery of the device. The electrode layer 12b is electrically connected to the feed line 13. In this drawing, the electrode layer 12b is a pattern of Roman numeral II.

The fixing section 23 of the chip antenna 2 is a plurality of terminals 23b, and a conductive layer 24b is provided on the surface of the terminals 23b. In this embodiment, the number of the terminals 23b is three but is not limited to three.

When the circuit board 1 and the chip antenna 2 are electrically combined, the terminals 23b of the chip antenna 2 are passed through the bonding holes 11b of the circuit board 1, so that the conductive layer 24b and the electrode layer 12b are electrically connected. The height of the chip antenna 2 that can be vertically or horizontally fixed to the circuit board 1 can be reduced, and the chip antenna 2 can be electrically fixed to the circuit board 1 stably.

Please refer to FIGS. 9-10, which are an exploded diagram of the antenna structure of the fourth embodiment of the present creation and the three-dimensional assembly of FIG. 9. As shown in the figure: this embodiment is roughly the same as the first, second, and third embodiments. The difference is that the joint hole 11 of the circuit board 1 is designed as a side hole 11c, and at least An electrode layer 12c. The electrode layer 12c is electrically connected to the feed line 13. In this drawing, the side hole 11c is U-shaped.

The chip antenna 2 is provided with a recess 23c on one side of the fixing section 23, and a conductive layer 24c is provided on the surfaces of the fixing portion 23 and the recess 23c. In this drawing, the recess 23c is L-shaped.

When the circuit board 1 and the chip antenna 2 are electrically connected, the recess 23c of the chip antenna 2 is inserted through the circuit board 1 and fixed to the side hole 11c, so that the conductive layer 24c and the electrode layer 12c are electrically connected link. The height of the chip antenna 2 that can be vertically or horizontally fixed to the circuit board 1 can be reduced, and the chip antenna 2 can be electrically fixed to the circuit board 1 stably.

Please refer to FIGS. 11-13, which are an exploded view of the antenna structure of the fifth embodiment of the present creation and the three-dimensional combination of FIG. 11 and the side sectional view of FIG. 12. As shown in the figure: this embodiment is roughly the same as the first, second, third and fourth embodiments, but the difference is that the joint hole 11 of the circuit board 1 is a side hole 11d designed on the periphery of the side hole 11d. There is at least one electrode layer 12d. The electrode layer 12d is electrically connected to the feed line 13. In this drawing, the side hole 11d is U-shaped.

The chip antenna 2 is provided with a notch 23d on one side of the fixing section 23, and a conductive layer 24d is provided on the periphery of the notch 23d. In this drawing, the notch 23d is U-shaped, and the opening of the notch 23d and the body of the chip antenna 2 are arranged in a perpendicular relationship with each other.

When the circuit board 1 and the chip antenna 2 are electrically connected, the notch 23d of the chip antenna 2 is inserted through the circuit board 1 and fixed to the side hole 11d, so that the conductive layer 24d and the electrode layer 12d are electrically connected . The height of the chip antenna 2 that is vertically fixed on the circuit board 1 (the chip antenna 2 and the circuit board 1 are arranged in a perpendicular relationship to each other) can be reduced, and the chip antenna 2 can be firmly connected to the circuit board 1 at the same time. Sexual fixation.

Please refer to FIGS. 14-15, which are an exploded view of the antenna structure of the sixth embodiment of the present creation and the three-dimensional combined view of FIG. 14. As shown in the figure: this embodiment is roughly the same as the first, second, third, fourth and fifth embodiments, but the difference is that the joint hole 11 of the circuit board 1 is a side hole 11e designed on the periphery of the side hole 11e At least one electrode layer 12e is provided thereon. The electrode layer 12e is electrically connected to the feed line 13. In this drawing, the side hole 11e is U-shaped.

The chip antenna 2 is provided with a notch 23e on one side of the fixing section 23, and a conductive layer 24e is provided on the periphery of the notch 23e. In this drawing, the notch 23e is U-shaped, and the opening of the notch 23e and the body of the chip antenna 2 are arranged in a coaxial relationship.

When the circuit board 1 and the chip antenna 2 are electrically combined, the notch 23e of the chip antenna 2 is inserted through the circuit board 1 and fixed to the side hole 11e, so that the conductive layer 24e and the electrode layer 12e are electrically connected . The chip antenna 2 can be fixed to the circuit board 1 vertically or horizontally, and the height of the chip antenna 2 after being fixed can be reduced, and the chip antenna 2 can be firmly and electrically fixed to the circuit board 1. .

Please refer to FIGS. 16-17, which are an exploded view of the antenna structure of the seventh embodiment of the present creation and the three-dimensional assembly diagram of FIG. 16. As shown in the figure: this embodiment is roughly the same as the first, second, third, fourth, fifth, and sixth embodiments. A specific distance A is left on the side, and an electrode layer 12f is provided on the periphery of the bonding hole 11 and the specific distance A. The electrode layer 12f is electrically connected to the feed line 13.

The chip antenna 2 is provided with a notch 23f on one side of the fixing section 23, and a conductive layer 24f is provided on the periphery of the notch 23f. In this drawing, the notch 23f is U-shaped, and the opening of the notch 23f is arranged in a vertical relationship with the body of the chip antenna 2.

When the circuit board 1 and the chip antenna 2 are electrically combined, the lower section 231f of the notch 23f of the chip antenna 2 penetrates the circuit board 1 and is fixedly connected to the joint hole 11, and the notch 23f is connected to the circuit board 1 The conductive layer 24f is electrically connected to the electrode layer 12f at a specific distance A. The chip antenna 2 can be fixed to the circuit board 1 vertically or horizontally, and the height of the chip antenna 2 after being fixed can be reduced, and the chip antenna 2 can be firmly and electrically fixed to the circuit board 1. .

However, the above is only the preferred embodiment of this creation, and it is not intended to limit the scope of patent protection of this creation. Therefore, all equivalent changes made by using this creation specification or schematic content are included in the rights of this creation in the same way. Within the scope of protection, he shall be combined to Chen Ming.

1: circuit board 11, 11a, 11b: joint holes 11c, 11d, 11e: side hole 12, 12a, 12b, 12c, 12d, 12e, 12f: electrode layer 13: feed-in line 2: Chip antenna 21: Matrix 22: Wiring section 23: Fixed connection section 23a: pin 23b: Terminal 23c: Depressed part 23d, 23e, 23f: gap 231f: Lower part 24, 24a, 24b, 24c, 24d, 24e, 24f: conductive layer A: Specific distance

Figure 1 is an exploded schematic diagram of the antenna structure of the first embodiment of this creation;

Figure 2 is a schematic diagram of the three-dimensional combination of Figure 1;

Figure 3 is a schematic side sectional view of Figure 2;

Figure 4 is an exploded schematic diagram of the antenna structure of the second embodiment of this creation;

Figure 5 is a schematic diagram of the three-dimensional combination of Figure 4;

Figure 6 is a schematic side sectional view of Figure 5;

Figure 7 is an exploded schematic diagram of the antenna structure of the third embodiment of the present creation;

FIG. 8 is a schematic diagram of the three-dimensional combination of FIG. 7;

Figure 9 is an exploded schematic diagram of the antenna structure of the fourth embodiment of the present creation;

Fig. 10 is a schematic diagram of the three-dimensional combination of Fig. 9;

Figure 11 is an exploded schematic diagram of the antenna structure of the fifth embodiment of the present creation;

Figure 12 is a schematic diagram of the three-dimensional combination of Figure 11;

Figure 13 is a schematic side sectional view of Figure 12;

Figure 14 is an exploded schematic diagram of the antenna structure of the sixth embodiment of this creation;

FIG. 15 is a schematic diagram of the three-dimensional combination of FIG. 14;

Figure 16 is an exploded schematic diagram of the antenna structure of the seventh embodiment of this creation;

FIG. 17 is a schematic diagram of the three-dimensional assembly of FIG. 16.

1: circuit board

11: Joint hole

12: Electrode layer

13: feed-in line

2: Chip antenna

21: Matrix

22: Wiring section

23: Fixed connection section

24: conductive layer

Claims (12)

An antenna structure, including: A circuit board with at least one bonding hole penetrating the circuit board, at least one electrode layer and a feed line are provided on the periphery of the bonding hole, and the feed line is electrically connected to the electrode layer; A chip antenna having a base thereon, the base having a wiring section, one end of the wiring section is provided with a fixing section, and the fixing section is formed with a conductive layer; Wherein, the fixing section of the chip antenna is passed through the bonding hole of the circuit board, so that the conductive layer and the electrode layer are electrically fixed, so that the chip antenna is vertically fixed on the circuit board. According to the antenna structure of claim 1, the chip antenna is fixed to the circuit board in a vertical upright manner. According to the antenna structure of claim 1, the chip antenna is fixed to the circuit board in a horizontal and vertical manner. According to the antenna structure of claim 1, a ground layer is formed on the front or back of the circuit board, or the front and back of the circuit board, and a clearance area is formed on the back of the circuit board, and the clearance area corresponds to the electrode layer on the front of the circuit board. According to the antenna structure of claim 1, the joint hole is provided inside the circuit board body or at the side of the circuit board body, and a side hole is formed in a U shape. According to the antenna structure of claim 1, the joint hole is of a single hole type, a two hole type or a three hole type. According to the antenna structure of claim 1, the chip antenna is made of ceramic material or glass fiber material. According to the antenna structure of claim 1, a metal layer is provided on the wiring section. According to the antenna structure of claim 8, the metal layer includes a plurality of straight lines provided on the surface of the base body and a plurality of conductive pillars penetrating the base body, and the conductive pillars penetrate the base body and electrically connected to the surface of the base body The linear strips on the upper side make the linear strips and the conductive pillars spirally wound on the substrate. According to the antenna structure of claim 1, the fixing section is a column shape, a plurality of pins, a plurality of terminals, a recess, or a U-shaped notch. According to the antenna structure of claim 10, the bonding hole is located on the side of the circuit board and has a specific distance from the side, an electrode layer is provided on the periphery of the bonding hole and the specific distance, and the electrode The layer is electrically connected with the feed line. According to the antenna structure of claim 11, the lower part of the U-shaped notch of the chip antenna penetrates the circuit board and is fixedly connected to the joint hole, and the notch is connected across a specific distance of the circuit board to make the conductive The layer is electrically connected to the electrode layer.

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