TWM620176U - Light-emitting storage device - Google Patents

Abstract

A light-emitting storage device comprises a memory module with a PCB and a light-emitting module. The light-emitting module includes a plurality of light-emitting elements, a light guide unit and a heat dissipation unit. The light-emitting elements are mounted on and electrically connected to the PCB, and emit light toward the same side. The light guide unit has a light diffuser located on the light-emitting side of the light-emitting elements and used for diffusing light, a translucent portion spaced apart from the light diffuser, and a space layer between the light diffuser and the translucent portion. The light emitted by the light-emitting elements sequentially passes through the light diffuser, the space layer and the translucent portion. The heat dissipation unit is connected to the memory module, supports the light guide unit, and has two sidewalls which are spaced apart from each other and respectively cover two opposite sides of the light diffuser and the space layer.

Description

Light-emitting storage device

The present invention relates to a storage device for electronic data, in particular to a storage device that can emit light.

With the development of e-sports (abbreviated as e-sports) and the miniaturization of light-emitting elements (such as LED), in order to increase the visual effect, the case of the computer host for e-sports is transparent, so that the parts in the case can be seen , Some of the components are equipped with light-emitting elements, which can emit colorful changes of light when in use, making the appearance of the device more dazzling, and computer memory is also one of the light-emitting parts of the computer equipment used in e-sports.

Generally, luminous computer memory is equipped with multiple LEDs on the circuit board of the memory, and a light guide bar is arranged on the side edge of the circuit board to make the light uniform and avoid glare. Due to the spaced distribution of the LEDs, in order to avoid uneven brightness in the light guide bar where the LED is brighter and the LED is not darker, usually the light guide bar needs a uniform light layer with a thickness of at least 8 mm to make the light uniform. How to make the uniform light layer uniform light under the condition of a small thickness, there is still room for improvement.

Therefore, one of the objectives of the present invention is to provide a light-emitting storage device that can solve the aforementioned problems.

Therefore, in some embodiments, the light-emitting storage device of the present invention includes a memory module and a light-emitting module. The memory module includes a circuit board. The light-emitting module includes a plurality of light-emitting elements, a light guide unit and a heat dissipation unit. The light-emitting elements are arranged on the circuit board and are electrically connected to the circuit board, and the light-emitting elements emit light toward the same side. The light guide unit has a homogenizing plate part located on the light emitting side of the light emitting elements for diffusing light, a light emitting part spaced apart from the homogenizing plate part, and a space layer between the homogenizing plate part and the light emitting part , So that the light emitted by the light-emitting elements sequentially passes through the uniform light plate portion, the space layer and the light-emitting portion to emit light. The heat dissipation unit is connected to the memory module and holds the light guide unit, and has two side walls that are spaced apart and opposed to each other and respectively cover the light uniforming plate portion and both sides of the space layer.

In some embodiments, the homogenizing plate portion has a first light-incident surface and a first light-emitting surface located on opposite sides, and the light-emitting portion has a second light-incident surface facing and parallel to the first light-emitting surface and spaced apart from each other. Smooth surface, the thickness of the uniform light plate portion between the first light incident surface and the first light exit surface is not less than 2mm, the first light exit surface and the second light entrance surface jointly define the thickness of the space layer, the space The thickness of the layer is not less than 2mm.

In some embodiments, the homogenizing plate portion has a first light-incident surface and a first light-emitting surface located on opposite sides, and the light-emitting portion has a second light-incident surface facing and parallel to the first light-emitting surface and spaced apart from each other. Smooth surface, the thickness of the uniform light plate portion between the first light entrance surface and the first light exit surface is not greater than 2 cm, the first light exit surface and the second light entrance surface jointly define the thickness of the space layer, the space The thickness of the layer is not more than 2 cm.

In some embodiments, the circuit board has a first board edge for plugging into an electrical connector and a second board edge opposite to the first board edge, and the light-emitting elements face the second board The light is emitted from the edge side, the light homogenizing plate portion is disposed at the edge of the second board, and the first light incident surface and the board surface of the circuit board are perpendicular to each other. The light guide unit also has two connections integrally connected to both ends of the light emitting portion Each of the connecting portions has a limiting slot for the second plate edge to be embedded in and a card slot for accommodating the uniform light plate portion.

In some implementations, the width of the light exit portion is smaller than the light homogenizing plate portion, and it also has an equal width section close to the light homogenizing plate portion and forming the second light incident surface, and an equal width section from the width section away from the light homogenizing plate A peak section with a tapered width in the direction of the part, the heat dissipation unit includes two heat-conducting plates respectively arranged adjacent to the two board surfaces of the circuit board, and each of the heat-conducting plates has a connecting plate part connected and fixed to the memory module and A limit plate portion bent and extended from the side of the connecting plate portion adjacent to the second plate edge; The side walls are respectively formed by the heat-conducting plates in the local areas where the connecting plate parts and the limiting plate parts are connected.

In some implementation aspects, the limit plate portions each form a hollow area at the positions corresponding to the width sections.

In some embodiments, the heat dissipation unit further has a bottom wall connected to the side walls, and each of the side walls has a vertical wall portion vertically connected to the bottom wall, and a vertical wall portion extending from the vertical wall portion and opposite to the bottom wall. Spaced first lateral wall portions and a second lateral wall portion extending vertically from the vertical wall portion and spaced apart from the first lateral wall portion, the first lateral wall portions of the side walls extend oppositely and are spaced apart from each other to form A light channel and the bottom wall jointly form a first accommodating space for accommodating the circuit board, and the second transverse wall portions of the side walls extend oppositely and are spaced apart from each other to define the two sides of the space layer and are connected to the two sides of the space layer. The first horizontal wall portion jointly forms a second accommodating space for accommodating the uniform light plate portion, the light emitting portion is in the shape of a plate and is connected to the second horizontal wall portions by the second light incident surface side, and the light emitting elements face The optical channel settings.

The present invention has at least the following effects: by the space layer located between the light emitting portion and the light homogenizing plate portion, the thickness required by the light homogenizing plate portion can be reduced, that is, the light emitted from the light emitting portion can be uniform and not visually affected. There are differences in light and dark areas. Not only can the material of the uniform light plate part be saved, but also the overall thickness of the uniform light structure can be reduced.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.

Referring to FIGS. 1 and 2, a first embodiment of a light-emitting storage device of the present invention includes a memory module 1 and a light-emitting module 2. In the first embodiment, the memory module 1 is a memory used in a computer mainframe, and includes a circuit board 11 and a plurality of chips 12 disposed on the circuit board 11. The circuit board 11 has a first board edge 111 for plugging into an electrical connector (not shown) and a second board edge 112 opposite to the first board edge 111. The light emitting module 2 includes a plurality of light emitting elements 21, a light guide unit 22 and a heat dissipation unit 23.

The light-emitting elements 21 are disposed on the circuit board 11 and electrically connected to the circuit board 11, and the light-emitting elements 21 emit light toward the same side. In the first embodiment, the light-emitting elements 21 are LEDs and are arranged on the circuit board 11 near the second board edge 112 along the length direction of the circuit board 11 and emit light toward the second board edge 112 side. That is, the light-emitting directions of the light-emitting elements 21 are parallel to the surface of the circuit board 11. The light guide unit 22 extends along the length direction of the circuit board 11 in a strip shape and is disposed at the second board edge 112.

2 to 5, the light guide unit 22 has a uniform light plate portion 221 located on the light-emitting side of the light-emitting elements 21 for diffusing light, a light-emitting portion 222 spaced apart from the light uniform plate portion 221, and a light-emitting portion 222 between the light-emitting elements 21 The space layer 223 between the uniform light plate portion 221 and the light emitting portion 222 allows the light emitted by the light emitting elements 21 to sequentially pass through the uniform light plate portion 221, the space layer 223 and the light emitting portion 222 to emit light. The homogenizing plate portion 221 may be made of plastic materials such as polycarbonate (PC) or acrylic (PMMA) doped with an atomizer, and has the function of scattering and diffusing light. With the space layer 223 located between the light emitting portion 222 and the light homogenizing plate portion 221, the required thickness of the light homogenizing plate portion 221 can be reduced, that is, the light emitted from the light emitting portion 222 can be uniform without any visual effects. The difference between light and dark areas.

Specifically, the uniform light plate portion 221 has a first light-incident surface 221a and a first light-emitting surface 221b located on opposite sides, and the light-emitting portion 222 has a first light-emitting surface 221b opposite to and parallel to and spaced apart from each other. Two light-incident surface 222a. The thickness T1 of the uniform light plate portion 221 between the first light-incident surface 221a and the first light-emitting surface 221b is not less than 2mm, and the thickness T1 is not less than 2mm to have better mechanical strength and not easy to break. The maximum value is not limited, but considering actual use, it is better to be no more than 2cm. The first light-emitting surface 221b and the second light-incident surface 222a jointly define the thickness T2 of the space layer 223, and the thickness T2 of the space layer 223 is not less than 2 mm. Compared with the general uniform layer that needs at least 8mm thickness to achieve the effect of uniform light, the thickness T1 of the uniform light plate portion 221 can be only 2mm, and the thickness T2 of the space layer 223 is not less than 2mm to achieve a more uniform light. This has a good effect, not only can save the material of the uniform light plate portion 221, but also can reduce the overall thickness of the uniform light structure. Similarly, the maximum value of the thickness T2 is not limited, but it is preferably not more than 2 cm in consideration of actual use.

In the first embodiment, the uniform light plate portion 221 is disposed at the second plate edge 112 and the first light incident surface 221 a and the board surface of the circuit board 11 are perpendicular to each other. As shown in FIG. 3, the width of the light emitting portion 222 is smaller than that of the light homogenizing plate portion 221 and also has an equal width section 222b that is close to the light homogenizing plate portion 221 and forms the second light incident surface 222a, and an equal width section 222b from the same width section 222b. A peak section 222c with a tapered width away from the uniform light plate portion 221. The light guide unit 22 also has two connecting portions 224 integrally connected to the two ends of the light emitting portion 222, and each of the connecting portions 224 has a limiting groove 225 for the second plate edge 112 to be embedded in and a light homogenizing plate.部221的卡槽226。 Section 221 of the card slot 226. The light-emitting portion 222 and the connecting portions 224 can be made of a transparent plastic material such as polycarbonate (PC). The connecting portions 224 are symmetrical to each other and extend from the two ends of the light-emitting portion 222 and are closer to the light-emitting portion 222. The protrusions protrude downward, and the limiting grooves 225 and the clamping grooves 226 are formed on the protruding part. The grooves 226 are respectively recessed from the opposite inner sides of the connecting portions 224 and collectively accommodate the light uniforming plate portion 221, so that the uniforming plate portion 221 and the light emitting portion 222 are positioned relative to each other while maintaining a fixed distance to form the space layer 223 . The limiting grooves 225 are respectively recessed from the bottom surface of the connecting portions 224 and penetrate the connecting portions 224 along the length direction of the circuit board 11 for the second board edge 112 of the circuit board 11 to be embedded, so that the The light guide unit 22 is positioned relative to the circuit board 11.

The heat dissipation unit 23 is connected to the memory module 1 and holds the light guide unit 22, and has two sidewalls 231 spaced apart from each other and respectively covering the two sides of the uniform light plate portion 221 and the space layer 223. The side walls 231 can be used to reflect light. In the first embodiment, the heat dissipating unit 23 includes two heat conducting plates 23A respectively arranged adjacent to the two board surfaces of the circuit board 11. The heat conducting plates 23A can be made of metal, for example, and each has a connecting plate portion 23A1 connected and fixed to the memory module 1 and a limit extending from the connecting plate portion 23A1 adjacent to the second plate edge 112 side. Position board part 23A2. The limiting plate portions 23A2 of the heat conducting plates 23A extend towards each other and jointly clamp the light emitting portion 222 and the connecting portions 224. The side walls 231 are respectively formed by the heat conducting plates 23A on the connecting plate portions 23A1 and the connecting plate portions 23A1. It is formed by the local area where the stop plate portion 23A2 meets. The position-limiting plate portions 23A2 respectively form a hollow area 23A3 at positions corresponding to the wide sections 222b, which can allow light to pass through. Specifically, the connecting plate portions 23A1 are bonded to the chip 12 of the memory module 1 with the heat-dissipating glue 3.

Referring to FIGS. 6 and 7, a second embodiment of the light-emitting storage device of the present invention can be applied to, for example, a flash drive, which includes a memory module 1 and a light-emitting module 2. The memory module 1 includes a circuit board 11 and a plurality of chips 12 arranged on the circuit board 11. The light emitting module 2 includes a plurality of light emitting elements 21, a light guide unit 22 and a heat dissipation unit 23.

The light-emitting elements 21 are disposed on the circuit board 11 and are electrically connected to the circuit board 11. The light-emitting elements 21 emit light toward the same side. In the second embodiment, the light-emitting direction of the light-emitting elements 21 is perpendicular to the circuit board 11 Of the board surface.

The light guide unit 22 in the second embodiment is substantially the same as the light guide unit 22 in the first embodiment, and also has a uniform light plate portion 221, a light exit portion 222, and a space layer 223. The difference is that in the first embodiment, In the second embodiment, the homogenizing plate portion 221 is arranged parallel to the surface of the circuit board 11, and the light emitting portion 222 has a plate shape. The second embodiment has the same uniform light effect as the first embodiment.

In the second embodiment, the heat dissipation unit 23 is a metal shell with two side walls 231 and a bottom wall 232 connecting the side walls 231. Each of the side walls 231 has a vertical wall portion 233 vertically connected to the bottom wall 232, a first horizontal wall portion 234 extending vertically from the vertical wall portion 233 and spaced apart from the bottom wall 232, and a vertical wall portion 233 vertical from the vertical wall portion 233 The second lateral wall portion 235 extends and is spaced apart from the first lateral wall portion 234. The first lateral wall portions 234 of the side walls 231 extend oppositely and are spaced apart from each other to form a light channel 236 and together with the bottom wall 232 form a first accommodating space 237 for accommodating the circuit board 11. The second lateral wall portions 235 of the side walls 231 extend oppositely and are spaced apart from each other to define two sides of the space layer 223 and together with the first lateral wall portions 234 form a second container for accommodating the uniform light plate portion 221.置空间238. The light emitting portion 222 is connected to the second horizontal wall portions 235 at the side of the second light incident surface 222 a, and the light emitting elements 21 are disposed toward the light channel 236.

However, the above are only examples of the present model. When the scope of implementation of the present model cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present model and the contents of the patent specification shall still belong to This new patent covers the scope.

1: Memory module 11: Circuit board 111: first board edge 112: second board edge 12: chip 2: Light-emitting module 21: Light-emitting element 22: Light guide unit 221: Homogeneous plate department 221a: The first light-incident surface 221b: The first light-emitting surface 222: Light Emitting Department 222a: The second light-incident surface 222b: equal width section 222c: Peak section 223: Space Layer 224: Connection 225: limit slot 226: card slot 23: Cooling unit 231: Sidewall 232: Bottom Wall 233: Standing Wall 234: The first transverse wall 235: Second Transverse Wall 236: Optical Channel 237: First housing space 238: second housing space 23A: Thermal conductive plate 23A1: connecting plate part 23A2: Limiting plate section 23A3: hollow area 3: Thermal glue T1: thickness T2: thickness

The other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, among which: Figure 1 is a perspective view of a first embodiment of the new type of luminous storage device; Figure 2 is a perspective exploded view of the first embodiment; Figure 3 is a schematic cross-sectional view of the first embodiment; 4 is a schematic front view of the first embodiment, in which a heat dissipation unit of the first embodiment is not shown; Figure 5 is an exploded view corresponding to Figure 4; FIG. 6 is an incomplete three-dimensional schematic diagram of a second embodiment of the new type of light-emitting storage device; and Fig. 7 is a schematic front view of the second embodiment.

1: Memory module

11: Circuit board

111: first board edge

112: second board edge

12: chip

2: Light-emitting module

21: Light-emitting element

22: Light guide unit

221: Homogeneous plate department

221a: The first light-incident surface

221b: The first light-emitting surface

222: Light Emitting Department

222a: The second light-incident surface

222b: equal width section

222c: Peak section

223: Space Layer

224: Connection

225: limit slot

23: Cooling unit

231: Sidewall

23A: Thermal conductive plate

23A1: connecting plate part

23A2: Limiting plate section

23A3: hollow area

3: Thermal glue

T1: thickness

T2: thickness

Claims (7)

A luminous storage device, including: A memory module, including a circuit board; and A light-emitting module, including A plurality of light-emitting elements are arranged on the circuit board and electrically connected to the circuit board, and the light-emitting elements emit light toward the same side, A light guide unit has a uniform light plate portion located on the light emitting side of the light emitting elements for diffusing light, a light output portion spaced apart from the uniform light plate portion, and a space between the light uniform plate portion and the light output portion Layer so that the light emitted by the light-emitting elements sequentially passes through the homogenizing plate portion, the space layer and the light-emitting portion to emit light, and A heat dissipation unit is connected to the memory module and holds the light guide unit, and has two side walls spaced opposite to each other and respectively covering the light uniforming plate portion and both sides of the space layer. According to claim 1, the light-emitting storage device, wherein the homogenizing plate portion has a first light-incident surface and a first light-emitting surface located on opposite sides, and the light-emitting portion has a light-emitting surface opposite to the first light-emitting surface. Parallel and spaced second light-incident surfaces, the thickness of the uniform light plate portion between the first light-incident surface and the first light-emitting surface is not less than 2mm, and the first light-emitting surface and the second light-incident surface jointly define the The thickness of the space layer, the thickness of the space layer is not less than 2mm. According to claim 1, the light-emitting storage device, wherein the homogenizing plate portion has a first light-incident surface and a first light-emitting surface located on opposite sides, and the light-emitting portion has a light-emitting surface opposite to the first light-emitting surface. Parallel and spaced second light-incident surfaces, the thickness of the uniform light plate portion between the first light-incident surface and the first light-emitting surface is not greater than 2cm, and the first light-emitting surface and the second light-incident surface jointly define the The thickness of the space layer, the thickness of the space layer is not more than 2cm. The light-emitting storage device according to claim 2 or 3, wherein the circuit board has a first board edge for plugging into an electrical connector and a second board edge opposite to the first board edge, The light-emitting elements emit light toward the second board edge side, the uniform light plate portion is provided at the second board edge, and the first light incident surface and the board surface of the circuit board are perpendicular to each other, and the light guide unit also has an integrated connection At the two connecting parts at both ends of the light emitting part, each of the connecting parts has a limiting groove for embedding the second plate edge and a clamping groove for accommodating the light homogenizing plate part. The light-emitting storage device according to claim 4, wherein the width of the light exit portion is smaller than the light homogenizing plate portion, and it also has an equal-width section close to the light homogenizing plate portion and forming the second light incident surface, and a second light incident surface. The wide section is away from the peak section with the width tapering in the direction of the homogenizing plate portion. The heat dissipation unit includes two heat conducting plates arranged adjacent to the two board surfaces of the circuit board, and each of the heat conducting plates has a contact with the memory module. The connecting plate portion is connected and fixed and a limiting plate portion bent and extended from the connecting plate portion adjacent to the second plate edge side. The connecting parts and the side walls are respectively formed by the heat conducting plates in the local areas where the connecting plate parts and the limiting plate parts are connected. According to claim 5, the light-emitting storage device, wherein the limit plate portions each form a hollow area at positions corresponding to the width sections. According to claim 2 or 3, the light-emitting storage device, wherein the heat dissipation unit further has a bottom wall connected to the side walls, and each of the side walls has a vertical wall portion vertically connected to the bottom wall and a self-standing wall A first horizontal wall section extending vertically and spaced apart from the bottom wall and a second horizontal wall section extending vertically from the vertical wall section and spaced apart from the first horizontal wall section, the first horizontal wall section of the side walls Extending oppositely and at a distance from each other to form a light channel and together with the bottom wall to form a first accommodating space for accommodating the circuit board. The two sides of the space layer together with the first horizontal wall portions form a second accommodating space for accommodating the uniform light plate portion. The walls are connected, and the light-emitting elements are arranged toward the light channel.

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