TWM619932U - Improved endoscope - Google Patents
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- TWM619932U TWM619932U TW110206749U TW110206749U TWM619932U TW M619932 U TWM619932 U TW M619932U TW 110206749 U TW110206749 U TW 110206749U TW 110206749 U TW110206749 U TW 110206749U TW M619932 U TWM619932 U TW M619932U
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Abstract
一種改良型內視鏡,包括:一影像感測器以及一電路轉接板。影像感測器具有一導接面,導接面設有複數第一導接件;電路轉接板具有一正面和一背面,正面與導接面彼此面對面,正面設有複數第二導接件,各第一導接件在導接面與正面之間分別連接於各第二導接件而電性連通影像感測器和電路轉接板。藉此,可達成既能維持在最小體積,又能讓電路轉接板與影像感測器之間的連接具有較佳的導電性以及結構穩固性的效果。 An improved endoscope includes: an image sensor and a circuit adapter board. The image sensor has a guiding surface, and the guiding surface is provided with a plurality of first guiding elements; the circuit transfer board has a front surface and a back surface, the front surface and the guiding surface face each other, and the front surface is provided with a plurality of second guiding elements, Each first connecting member is respectively connected to each second connecting member between the connecting surface and the front surface to electrically connect the image sensor and the circuit transfer board. In this way, it is possible to achieve the effect of not only maintaining the smallest volume, but also allowing the connection between the circuit transfer board and the image sensor to have better conductivity and structural stability.
Description
本新型與內視鏡有關,特別是指一種既能維持最小體積又能具有較佳導電性和結構穩固性的改良型內視鏡。 The new type is related to endoscopes, and particularly refers to an improved endoscope that can maintain a minimum volume and has better conductivity and structural stability.
關於內視鏡檢視裝置,用於深入人體內部進行醫療檢查,例如俗稱的胃鏡和大腸鏡等。內視鏡檢視裝置包括:設置於外部的醫療儀器以及用以深入人體內部的纜線和內視鏡主體(下稱內視鏡),纜線橋接於醫療儀器與內視鏡之間。 Regarding the endoscopic inspection device, it is used to go deep into the human body for medical examination, such as the commonly known gastroscope and colonoscope. The endoscope inspection device includes: external medical instruments, cables and endoscope main bodies (hereinafter referred to as endoscopes) used to penetrate into the human body, and the cables are bridged between the medical instruments and the endoscopes.
內視鏡和纜線由於須深入人體內部,因此體積愈小愈好,現有內視鏡即為此而將電路轉接板直立連接於影像感測器,詳如後述。 Since the endoscope and the cable must go deep into the human body, the smaller the size, the better. The existing endoscope has a circuit adapter board connected to the image sensor upright for this purpose, as described in detail later.
影像感測器具有一導接面,電路轉接板具有彼此相對的一第一面和一第二面。導接面設有多數第一錫球和多數第二錫球,第一面設有多數第一導接片,第二面設有多數第二導接片。電路轉接板直立連接於影像感測器,使第一面和第二面皆與導接面垂直。此時,第一面上的各第一導接片係被導接面上的各第一錫球所焊接,至於第二面上的各第二導接片則被導接面上的各第二錫球所焊接。如此以使電路轉接板電性連通於影像感測器。 The image sensor has a conducting surface, and the circuit transfer board has a first surface and a second surface opposite to each other. The guiding surface is provided with a plurality of first solder balls and a plurality of second solder balls, the first surface is provided with a plurality of first guiding pieces, and the second surface is provided with a plurality of second guiding pieces. The circuit transfer board is vertically connected to the image sensor, so that the first surface and the second surface are perpendicular to the guiding surface. At this time, the first guide strips on the first surface are welded by the first solder balls on the guide surface, and the second guide strips on the second surface are welded by the first solder balls on the guide surface. Two solder balls are welded. In this way, the circuit transfer board is electrically connected to the image sensor.
現有內視鏡雖然藉由將電路轉接板直立連接於影像感測器,使電路轉接板能以其短邊對應鄰接於影像感測器的導接面,電路轉接板的長邊則是 與纜線的軸心平行,且所述短邊的長度小於或等於影像感測器的對應長度或寬度,所以電路轉接板的長寬皆不會超出影像感測器而使內視鏡維持在最小體積。 Although the existing endoscope connects the circuit adapter board to the image sensor upright, the circuit adapter board can be adjacent to the guide surface of the image sensor with its short side, while the long side of the circuit adapter board is Yes Parallel to the axis of the cable, and the length of the short side is less than or equal to the corresponding length or width of the image sensor, so the length and width of the circuit adapter board will not exceed the image sensor to maintain the endoscope In the smallest volume.
然而,現有內視鏡將電路轉接板直立連接於影像感測器的連接方式,卻有導電性不佳以及結構穩固性不佳的問題:各第一錫球皆僅能以其周緣與各第一導接片面對,各第二錫球亦皆僅能以其周緣與各第二導接片面對,導致各第一錫球和各第二錫球皆僅能以其周緣焊接於各第一導接片和各第二導接片,且錫球的周緣的焊接面積遠小於錫球的頂面的焊接面積。因此,現有內視鏡的影像感測器與電路轉接板之間具有導電性不佳以及結構穩固性不佳的問題,早為人所詬病已久。 However, the existing endoscope's connection method of vertically connecting the circuit adapter board to the image sensor has the problems of poor conductivity and poor structural stability: each first solder ball can only be connected to each other by its periphery. The first solder ball faces each other, and each second solder ball can only face each second solder ball with its periphery. As a result, each first solder ball and each second solder ball can only be welded to each other with its periphery. The soldering area of the peripheral edge of each first and each second guiding piece of the solder ball is much smaller than the soldering area of the top surface of the solder ball. Therefore, the problem of poor conductivity and poor structural stability between the image sensor of the existing endoscope and the circuit adapter board has been criticized for a long time.
本新型的目的在於提供一種改良型內視鏡,既能維持在最小體積,又能讓電路轉接板與影像感測器之間的連接具有較佳的導電性以及結構穩固性。 The purpose of the present invention is to provide an improved endoscope, which can maintain a minimum volume, but also allows the connection between the circuit adapter board and the image sensor to have better conductivity and structural stability.
為了達成上述目的,本新型提供一種改良型內視鏡,包括:一影像感測器,具有一導接面,該導接面設有複數第一導接件;以及一電路轉接板,具有彼此相對的一正面和一背面,該正面與該導接面彼此面對面,該正面設有複數第二導接件,且各該第一導接件在該導接面與該正面之間分別連接於各該第二導接件而電性連通該影像感測器和該電路轉接板。 In order to achieve the above object, the present invention provides an improved endoscope, which includes: an image sensor having a guiding surface, the guiding surface is provided with a plurality of first guiding elements; and a circuit adapter board having A front surface and a back surface opposite to each other, the front surface and the guiding surface face each other, the front surface is provided with a plurality of second guiding members, and each of the first guiding members is respectively connected between the guiding surface and the front surface The image sensor and the circuit transfer board are electrically connected to each of the second conductive members.
相較於先前技術,本新型具有以下功效:既能維持在最小體積,又能讓電路轉接板與影像感測器之間的連接具有較佳的導電性以及結構穩固性。 Compared with the prior art, the present invention has the following effects: it can maintain the smallest volume, and can make the connection between the circuit transfer board and the image sensor have better conductivity and structural stability.
1:影像感測器 1: Image sensor
11:感測面 11: Sensing surface
12:導接面 12: Guiding surface
121:第一導接件 121: The first guide
2:電路轉接板 2: Circuit transfer board
21:正面 21: positive
212:第二導接件 212: second guide
22:背面 22: back
223:第三導接件 223: third guide
23:周邊 23: Peripheral
3:纜線 3: cable
31:連接線 31: Connection line
4:電容元件 4: Capacitive element
5:焊接物 5: Welding
6:包覆體 6: Covering body
圖1 為本新型內視鏡於後視時的立體示意圖。 Figure 1 is a three-dimensional schematic diagram of the new endoscope when viewed from the rear.
圖2 為本新型依據圖1的立體組合示意圖。 FIG. 2 is a schematic diagram of the three-dimensional assembly of the new model according to FIG. 1.
圖3 為本新型內視鏡於組合後的剖視示意圖。 Figure 3 is a schematic cross-sectional view of the new endoscope after being assembled.
有關本新型的詳細說明和技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,非用以限制本新型。 The detailed description and technical content of the present invention are described below in conjunction with the drawings. However, the drawings are only for reference and explanation, and are not intended to limit the present invention.
如圖1至圖3所示,本新型提供一種改良型內視鏡(以下簡稱內視鏡),包括:一影像感測器1、一電路轉接板2以及一纜線3,較佳還包括一電容元件4和複數焊接物5。
As shown in Figures 1 to 3, the present invention provides an improved endoscope (hereinafter referred to as endoscope), including: an
影像感測器1(Image Sensor)可為各式能夠感測影像的器件,例如可為:感光耦合元件(CCD,Charge Coupled Device)或互補性氧化金屬半導體(CMOS,Complementary Metal-Oxide Semiconductor)等,本新型對此並未限定,於本實施例中則以互補性氧化金屬半導體(CMOS)為例進行說明。影像感測器1具有彼此相對的一感測面11和一導接面12。感測面11用以感測影像,導接面12則用於導接且設有複數(至少兩個)第一導接件121。第一導接件121的數量可為兩個,也可為兩個以上,本新型對此並未限制,如圖1所示則是在導接面12上設有四個第一導接件121。第一導接件121可為任何可同時結構性固接以及電性連接的構件,於本實施例中則以焊接物(例如:錫球或焊墊等)為例進行說明。
The image sensor 1 (Image Sensor) can be various devices capable of sensing images, such as: Charge Coupled Device (CCD) or Complementary Metal-Oxide Semiconductor (CMOS), etc. The present invention is not limited to this. In this embodiment, a complementary metal oxide semiconductor (CMOS) is taken as an example for description. The
電路轉接板2可為任何能夠用於轉接的電路板,本新型對此並未限定。電路轉接板2具有一正面21、一背面22和一周邊(厚度邊)23,正面21與背面22彼此相對,周邊23則圍繞連接於正面21的周緣與背面22的周緣之間。其中,正面
21設有對應於前述各第一導接件121的四個第二導接件212,背面22則設有複數第三導接件223。第二導接件212和第三導接件223可為各式能夠導電的物件,較佳則是兼具可焊性,例如銅片等,而且第三導接件223還可兼具可插拔性,但本新型對此皆未限定。
The
電路轉接板2與影像感測器1彼此並排配置,以使正面21與導接面12彼此面對面,具體而言則是讓正面21與導接面12彼此平行,此時設於正面21上的各第二導接件212係與設於導接面12上的各第一導接件121分別對應,各第一導接件121則在正面21與導接面12之間分別連接於各第二導接件212。本段前述的連接二字係指可同時結構性固接以及電性連接而言,於本實施例中則是藉由各第一導接件121可為焊接物(例如:錫球或焊墊等)而焊接於各第二導接件212。如此以使電路轉接板2電性連通於影像感測器1。
The
纜線3包含複數連接線31,連接線31的數量可為兩條,也可為兩條以上,如圖1所示則是包含四條連接線31。各連接線31以各式可行的方式對應連接於背面22上的各第三導接件223,使各連接線31電性連通各第三導接件223。本段前述的連接二字可為插接或是可同時結構性固接以及電性連接,等方式,於本實施例中則是如圖2和圖3所示藉由四個焊接物5(例如:錫球或焊墊等)而將各連接線31對應焊接於各第三導接件223。在圖式未繪示的其它實施例中,各連接線31亦可直接連接(例如焊接)於背面22上的電路(圖中未示),亦即可省略前述第三導接件223。
The
藉此,由於電路轉接板2已與影像感測器1彼此並排配置,使電路轉接板2的正面21得以與影像感測器1的導接面12彼此面對面,因此各第二導接件212也就能與各第一導接件121彼此面對面連接(例如焊接),以錫球而言則是錫球正面(頂面)對第二導接件212焊接,進而既能維持在最小體積,又能具有較佳的導電性和結構穩固性的效果。
Thereby, since the
為能抑制高頻、噪音或抑制其組合,本新型還可將電容元件4橋接於彼此間隔相鄰的二第三導接件223之間,較佳而言則是將電容元件4以橋接方式被彼此間隔相鄰的二焊接物5同時焊接,以利用同時焊接而兼具省工效果。
In order to suppress high frequency, noise or suppress their combination, the present invention can also bridge the
為使已與影像感測器1彼此並排配置的電路轉接板2的周緣(輪廓),不致於突出於影像感測器1的周緣(輪廓),電路轉接板2的面積(最大面積,例如感測面11的面積)係須小於或等於影像感測器1的面積(最大面積,例如正面21或背面22的面積)。
In order to prevent the periphery (contour) of the
為提升完整性並兼具保護所包覆元件的效果,如圖3所示,本新型內視鏡還可包括一包覆體6,包覆體6包覆住影像感測器1、電路轉接板2、連接線31以及電容元件4。
In order to improve the integrity and protect the covered components, as shown in FIG. 3, the endoscope of the present invention may further include a
綜上所述,本新型改良型內視鏡,確可達到預期的使用目的,並解決習知技術的缺失,完全符合新型專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障新型創作人之權利。 To sum up, the new improved endoscope can indeed achieve the intended purpose of use and solve the deficiencies of the known technology. It fully meets the requirements of a new patent application. The application is filed in accordance with the Patent Law. Please check in detail and give you permission. The patent in this case protects the rights of the creator of the new type.
以上所述者,僅為本新型之較佳可行實施例而已,非因此即侷限本新型之專利範圍,舉凡運用本新型說明書及圖式內容所為之等效結構變化,均理同包含於本新型之權利範圍內,合予陳明。 The above are only the preferred and feasible embodiments of the present model, and the scope of the patent of the present model is not limited because of this. Any equivalent structural changes made by using the description of the present model and the contents of the drawings shall be included in the present model. Within the scope of the rights, he shall be Chen Ming.
1:影像感測器 1: Image sensor
11:感測面 11: Sensing surface
12:導接面 12: Guiding surface
121:第一導接件 121: The first guide
2:電路轉接板 2: Circuit transfer board
21:正面 21: positive
212:第二導接件 212: second guide
22:背面 22: back
223:第三導接件 223: third guide
23:周邊 23: Peripheral
3:纜線 3: cable
31:連接線 31: Connection line
4:電容元件 4: Capacitive element
Claims (11)
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TW110206749U TWM619932U (en) | 2021-06-10 | 2021-06-10 | Improved endoscope |
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TW110206749U TWM619932U (en) | 2021-06-10 | 2021-06-10 | Improved endoscope |
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