TWM619932U - Improved endoscope - Google Patents

Abstract

An improved endoscope includes: an image sensor and a circuit adapter board. The image sensor has a guiding surface, and the guiding surface is provided with a plurality of first guiding elements; the circuit transfer board has a front surface and a back surface, the front surface and the guiding surface face each other, and the front surface is provided with a plurality of second guiding elements, Each first connecting member is respectively connected to each second connecting member between the connecting surface and the front surface to electrically connect the image sensor and the circuit transfer board. In this way, it is possible to achieve the effect of not only maintaining the smallest volume, but also allowing the connection between the circuit transfer board and the image sensor to have better conductivity and structural stability.

Description

Modified endoscope

The new type is related to endoscopes, and particularly refers to an improved endoscope that can maintain a minimum volume and has better conductivity and structural stability.

Regarding the endoscopic inspection device, it is used to go deep into the human body for medical examination, such as the commonly known gastroscope and colonoscope. The endoscope inspection device includes: external medical instruments, cables and endoscope main bodies (hereinafter referred to as endoscopes) used to penetrate into the human body, and the cables are bridged between the medical instruments and the endoscopes.

Since the endoscope and the cable must go deep into the human body, the smaller the size, the better. The existing endoscope has a circuit adapter board connected to the image sensor upright for this purpose, as described in detail later.

The image sensor has a conducting surface, and the circuit transfer board has a first surface and a second surface opposite to each other. The guiding surface is provided with a plurality of first solder balls and a plurality of second solder balls, the first surface is provided with a plurality of first guiding pieces, and the second surface is provided with a plurality of second guiding pieces. The circuit transfer board is vertically connected to the image sensor, so that the first surface and the second surface are perpendicular to the guiding surface. At this time, the first guide strips on the first surface are welded by the first solder balls on the guide surface, and the second guide strips on the second surface are welded by the first solder balls on the guide surface. Two solder balls are welded. In this way, the circuit transfer board is electrically connected to the image sensor.

Although the existing endoscope connects the circuit adapter board to the image sensor upright, the circuit adapter board can be adjacent to the guide surface of the image sensor with its short side, while the long side of the circuit adapter board is Yes Parallel to the axis of the cable, and the length of the short side is less than or equal to the corresponding length or width of the image sensor, so the length and width of the circuit adapter board will not exceed the image sensor to maintain the endoscope In the smallest volume.

However, the existing endoscope's connection method of vertically connecting the circuit adapter board to the image sensor has the problems of poor conductivity and poor structural stability: each first solder ball can only be connected to each other by its periphery. The first solder ball faces each other, and each second solder ball can only face each second solder ball with its periphery. As a result, each first solder ball and each second solder ball can only be welded to each other with its periphery. The soldering area of the peripheral edge of each first and each second guiding piece of the solder ball is much smaller than the soldering area of the top surface of the solder ball. Therefore, the problem of poor conductivity and poor structural stability between the image sensor of the existing endoscope and the circuit adapter board has been criticized for a long time.

The purpose of the present invention is to provide an improved endoscope, which can maintain a minimum volume, but also allows the connection between the circuit adapter board and the image sensor to have better conductivity and structural stability.

In order to achieve the above object, the present invention provides an improved endoscope, which includes: an image sensor having a guiding surface, the guiding surface is provided with a plurality of first guiding elements; and a circuit adapter board having A front surface and a back surface opposite to each other, the front surface and the guiding surface face each other, the front surface is provided with a plurality of second guiding members, and each of the first guiding members is respectively connected between the guiding surface and the front surface The image sensor and the circuit transfer board are electrically connected to each of the second conductive members.

Compared with the prior art, the present invention has the following effects: it can maintain the smallest volume, and can make the connection between the circuit transfer board and the image sensor have better conductivity and structural stability.

1: Image sensor

11: Sensing surface

12: Guiding surface

121: The first guide

2: Circuit transfer board

21: positive

212: second guide

22: back

223: third guide

23: Peripheral

3: cable

31: Connection line

4: Capacitive element

5: Welding

6: Covering body

Figure 1 is a three-dimensional schematic diagram of the new endoscope when viewed from the rear.

FIG. 2 is a schematic diagram of the three-dimensional assembly of the new model according to FIG. 1.

Figure 3 is a schematic cross-sectional view of the new endoscope after being assembled.

The detailed description and technical content of the present invention are described below in conjunction with the drawings. However, the drawings are only for reference and explanation, and are not intended to limit the present invention.

As shown in Figures 1 to 3, the present invention provides an improved endoscope (hereinafter referred to as endoscope), including: an image sensor 1, a circuit adapter board 2 and a cable 3, preferably also Including a capacitive element 4 and a plurality of soldering objects 5.

The image sensor 1 (Image Sensor) can be various devices capable of sensing images, such as: Charge Coupled Device (CCD) or Complementary Metal-Oxide Semiconductor (CMOS), etc. The present invention is not limited to this. In this embodiment, a complementary metal oxide semiconductor (CMOS) is taken as an example for description. The image sensor 1 has a sensing surface 11 and a guiding surface 12 opposite to each other. The sensing surface 11 is used for sensing images, and the guiding surface 12 is used for guiding and is provided with a plurality of (at least two) first guiding members 121. The number of the first connecting members 121 can be two or more than two. The present invention is not limited to this. As shown in FIG. 1, four first connecting members are provided on the connecting surface 12 121. The first conductive member 121 can be any member that can be structurally fixed and electrically connected at the same time. In this embodiment, a solder (such as a solder ball or a solder pad) is taken as an example for description.

The circuit adapter board 2 can be any circuit board that can be used for switching, which is not limited by the present invention. The circuit transfer board 2 has a front face 21, a back face 22 and a periphery (thickness side) 23. The front face 21 and the back face 22 are opposite to each other, and the periphery 23 is connected between the periphery of the front face 21 and the periphery of the back 22. Among them, the positive 21 is provided with four second guide members 212 corresponding to each of the aforementioned first guide members 121, and the back 22 is provided with a plurality of third guide members 223. The second conductive member 212 and the third conductive member 223 can be various conductive objects, preferably both solderability, such as copper sheets, and the third conductive member 223 can also be pluggable Performance, but the present model is not limited to this.

The circuit transfer board 2 and the image sensor 1 are arranged side by side with each other, so that the front face 21 and the guiding surface 12 face each other. Specifically, the front face 21 and the guiding face 12 are parallel to each other, and are now set on the front 21 Each second guide member 212 is corresponding to each first guide member 121 provided on the guide surface 12, and each first guide member 121 is respectively connected to each of the first guide members 121 between the front surface 21 and the guide surface 12 The second guide member 212. The aforementioned connection word in this paragraph refers to the simultaneous structural fixation and electrical connection. In this embodiment, each first conductive member 121 can be a solder (such as a solder ball or a solder pad). Etc.) and welded to each second guide member 212. In this way, the circuit transfer board 2 is electrically connected to the image sensor 1.

The cable 3 includes a plurality of connecting wires 31, and the number of the connecting wires 31 may be two or more than two. As shown in FIG. 1, it includes four connecting wires 31. Each connection wire 31 is correspondingly connected to each third conductive member 223 on the back surface 22 in various feasible ways, so that each connection wire 31 is electrically connected to each third conductive member 223. The aforementioned connection word in this paragraph can be plug-in connection or can be structurally fixed and electrically connected at the same time, etc. In this embodiment, it is shown in Figure 2 and Figure 3 by four welding objects 5 ( For example, solder balls or solder pads, etc.) and each connecting wire 31 is soldered to each third conductive member 223 correspondingly. In other embodiments not shown in the drawings, each connecting wire 31 can also be directly connected (for example, soldered) to a circuit (not shown in the figure) on the back side 22, and the aforementioned third conductive member 223 can be omitted.

Thereby, since the circuit transfer board 2 and the image sensor 1 are arranged side by side with each other, the front 21 of the circuit transfer board 2 and the conducting surface 12 of the image sensor 1 face each other, so that each second conducting connection The member 212 can also be connected to each first guide member 121 face-to-face (for example, soldering). In the case of a solder ball, the front surface (top surface) of the solder ball is welded to the second guide member 212, which can be kept to a minimum. The volume can also have better conductivity and structural stability.

In order to suppress high frequency, noise or suppress their combination, the present invention can also bridge the capacitive element 4 between the two third conductive members 223 spaced and adjacent to each other. Preferably, the capacitive element 4 is bridged. The two welded objects 5 spaced and adjacent to each other are welded at the same time, so that the simultaneous welding is utilized for both labor-saving effects.

In order to prevent the periphery (contour) of the circuit transfer board 2 that has been arranged side by side with the image sensor 1 from protruding from the periphery (contour) of the image sensor 1, the area of the circuit transfer board 2 (maximum area, For example, the area of the sensing surface 11 must be less than or equal to the area of the image sensor 1 (the largest area, such as the area of the front 21 or the back 22).

In order to improve the integrity and protect the covered components, as shown in FIG. 3, the endoscope of the present invention may further include a covering body 6, which covers the image sensor 1, the circuit switch The connecting plate 2, the connecting wire 31, and the capacitive element 4.

To sum up, the new improved endoscope can indeed achieve the intended purpose of use and solve the deficiencies of the known technology. It fully meets the requirements of a new patent application. The application is filed in accordance with the Patent Law. Please check in detail and give you permission. The patent in this case protects the rights of the creator of the new type.

The above are only the preferred and feasible embodiments of the present model, and the scope of the patent of the present model is not limited because of this. Any equivalent structural changes made by using the description of the present model and the contents of the drawings shall be included in the present model. Within the scope of the rights, he shall be Chen Ming.

1: Image sensor

11: Sensing surface

12: Guiding surface

121: The first guide

2: Circuit transfer board

21: positive

212: second guide

22: back

223: third guide

23: Peripheral

3: cable

31: Connection line

4: Capacitive element

Claims (11)

An improved endoscope, comprising: an image sensor with a guiding surface provided with a plurality of first guiding elements; and a circuit adapter board having a front surface and a back surface opposite to each other , The front surface and the guide surface face each other, the front surface is provided with a plurality of second guide members, and each of the first guide members is respectively connected to each of the second guide members between the guide surface and the front surface The image sensor is electrically connected to the circuit adapter board. The improved endoscope according to claim 1, wherein the guiding surface and the front surface are parallel to each other. The improved endoscope according to claim 1, wherein the image sensor and the circuit adapter board are arranged side by side with each other. The improved endoscope according to claim 1, wherein the circuit adapter board further has a periphery connected between the periphery of the front surface and the periphery of the back surface. The improved endoscope according to claim 1, wherein the image sensor further has a sensing surface, and the sensing surface and the guiding surface are opposite to each other. The improved endoscope according to claim 1, further comprising a plurality of connecting wires, a plurality of third guide members are arranged on the back, and each of the connecting wires is connected to each of the third guide members correspondingly. The improved endoscope according to claim 6, wherein each of the connecting wires is correspondingly welded to each of the third guide members through a plurality of welding objects. The improved endoscope according to claim 7, further comprising a capacitive element, and the capacitive element is simultaneously welded between two welding objects spaced and adjacent to each other in a bridging manner. The improved endoscope according to claim 1, further comprising a capacitive element, a plurality of third conductive elements are arranged on the back surface, and the capacitive element is bridged between two adjacent third conductive elements that are spaced apart from each other. The improved endoscope according to claim 1, wherein any one of the first guide members is a welding object. The improved endoscope according to claim 1, wherein the area of the circuit adapter board is less than or equal to the area of the image sensor.

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