TWM619790U - Storage shock absorber of semiconductor automated material handling system - Google Patents

Abstract

This model relates to a storage damping device of a semiconductor automated logistics transmission system, which is combined with a day car carrier. The main structure includes at least one lower plate on the overhead crane carrier, and two bends formed on both sides of the lower plate The load-bearing part, a limit groove for accommodating the positioning rod, a plurality of damping elements arranged on the load-bearing part, an upper plate arranged on the damping element, a plurality of positioning pins arranged on the upper plate, plural forms Positioning holes on the lower plate, a plurality of positioning parts arranged on the joint part and corresponding to the positioning holes, and a plurality of pressing parts passing through the positioning holes and the positioning parts corresponding to their positions. With the above structure, the damping element can be quickly combined to provide a shock absorption effect without affecting the original OHB system, and the design of the limit groove hardly affects the overall size, and the positioning parts and the pressing parts can be directly corrected without calibration. Positioning greatly improves the convenience and positioning accuracy of OHB upgrades.

Description

Storage shock absorber of semiconductor automatic logistics transmission system

This model is to provide a storage damping device of a semiconductor automated logistics transmission system, especially a storage damping device of a semiconductor automated logistics transmission system that has the advantages of convenient and fast assembly and improvement, intuitive and precise positioning, and good damping effect.震装置。 Seismic device.

Press, when semiconductor-related components (such as semiconductor wafers) are moved or stored between different locations, they are all placed in a special storage box to avoid contamination by impurities. Transport (OHT) transportation, when it is not needed, it will be temporarily stored in the track buffer (Over Head Buffer, OHB) for the next retrieval. Among them, OHT is an overhead transportation system, which can effectively use the three-dimensional space of the factory building, maximize the space utilization rate of the clean room without occupying the personnel aisle, and make the logistics transportation in the clean room more effective through simulation analysis. Higher production utilization rate. OHB is a wafer box rack used in conjunction with OHT.

In general OHT systems, the positioning pin (KC pin) used to combine the wafer box is directly connected to the OHB structure. Therefore, all vibrations from the OHT include the vibration from the ceiling, the shaking of the suspension bracket during orbiting, and And the collisions during placement of the wafer boat box will be transmitted to the wafers inside the wafer boat box through OHB, and improper shaking of the wafer boat box will cause the wafer position to shift, collide or even damage, or produce dust particles spreading in the material The surface affects the material yield. These situations are quite unwilling to see for high-cost semiconductor wafers.

In addition, there are usually multiple sets of OHB in the factory, and the OHB settings must be precisely aligned with the OHT in four directions including three axes and rotation angles. The alignment is not easy. The existing OHB vibration reduction methods are mostly through simple additions. The spring will increase the overall volume, and if you want to improve the OHB, you need to remove the existing goods above one by one, and then re-calibrate them one by one after completion, which is very inconvenient.

Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the applicants of this new model and related manufacturers engaged in this industry urgently want to study and improve.

Therefore, in view of the above-mentioned deficiencies, the applicant of the present model has collected relevant information, evaluated and considered by multiple parties, and has accumulated years of experience in this industry, through continuous trials and modifications, to design this kind of assembly improvement that is convenient and fast , Intuitive precision positioning, and good shock absorption effect, and other advantages of the new patent of the storage shock absorption device of the semiconductor automated logistics transmission system.

The main purpose of the new model is to use the positioning parts and positioning holes corresponding to the position of the upper plate to prevent the upper plate of the existing OHB from repositioning and correcting actions after the lower plate is installed, which can be combined with the damping element to reduce The impact of OHT on semiconductor storage.

In order to achieve the above-mentioned purpose, the storage damping device of the present invention is combined with a day car carrier, the crane carrier has two positioning rods and two joint parts formed on each positioning rod, and the storage damping device It mainly includes: at least a lower plate, two load-bearing parts, a limit groove, a plurality of damping elements, an upper plate, a plurality of positioning pins, a plurality of positioning holes, a plurality of positioning parts, and a plurality of pressing parts. Set on the crane carrier, the load-bearing part is respectively formed by bending on both sides of the lower plate, the limiting groove is formed between the lower plate and the load-bearing part for accommodating the positioning rod, and the damping element is arranged On the carrying part, the upper plate is arranged on the damping elements for carrying semiconductor storage, the positioning pin is arranged on the upper plate for positioning the semiconductor storage, and the positioning hole is formed on the lower plate And the positions respectively correspond to the positioning pins. The positioning part is arranged on the joint part and corresponds to each positioning hole, and clamps the positioning rod together with the lower plate, and the pressing part penetrates the setting hole and the positioning part corresponding to its position. To fix the lower plate and the positioning rod.

When assembling the lower plate and the upper plate of the present invention, the design corresponding to the position of the positioning pin and the positioning hole, and the design corresponding to the position of the positioning element and the positioning hole are used, and they are arranged on the joint, so that the lower plate can reuse the damping After the components are combined with the upper plate, the positioning action is completed synchronously, which reduces the difficulty of assembly and avoids re-calibration and positioning. Besides, the limit groove of the lower plate can limit the position of the positioning rod, and its concave design can be used. The volume of the lower plate itself hardly affects the spatial configuration of the crane carrier. Therefore, after the upper and lower panels are assembled, the effect of the damping element can be used to effectively cushion the vibration from the ceiling, the shaking of the suspension bracket during track operation, and the collision of semiconductor storage during placement. The effect of shock absorption to ensure the storage quality of semiconductors.

With the above-mentioned technology, a breakthrough can be made to solve the problems of OHB vibration, difficulty in OHB improvement, and repositioning and correction existing in the conventional OHT system, so as to achieve the practical advancement of the above-mentioned advantages.

100: Storage shock absorber

1, 1a, 1b, 1c: lower plate

11: Bearing Department

12, 12a: Limit groove

13, 13c: positioning hole

2: Damping element

21: The first buffer space

3, 3a, 3c: upper plate

31, 31c: positioning pin

4, 4a, 4b: positioning parts

41: Protruding part

42: Clamping part

43a: Flexible joint

44a, 44b: Pad body

45b: shock-absorbing element

451b: Insertion part

452b: Isolation Department

453b: second buffer space

5, 5a, 5c: urgent parts

51, 51c: Screw

52, 52c: Nut

6, 6c: Crane carrier

61, 61a, 61b, 61c: positioning rod

611: groove

612, 612a, 612b, 612c: joint

613c: open end

62: Cantilever

7: Semiconductor memory

71: unmanned guided vehicle

The first figure is a perspective view of a preferred embodiment of the new model.

The second figure is a cross-sectional view taken along the line A-A of the first figure of the preferred embodiment of the new invention.

The third figure is an exploded view of the hidden crane carrier of the preferred embodiment of the new model.

The fourth figure is the assembly diagram (1) of the preferred embodiment of the new type.

The fifth figure is the assembly diagram (2) of the preferred embodiment of the new type.

The sixth figure is a schematic diagram (1) of the shock absorption of the preferred embodiment of the new type.

The seventh figure is a schematic diagram (2) of the shock absorption of the preferred embodiment of the new type.

The eighth figure is a three-dimensional view of another preferred embodiment of the present invention.

Figure 9 is a cross-sectional view taken along line B-B of Figure 8 of another preferred embodiment of the present invention.

The tenth figure is a cross-sectional view of another preferred embodiment of the present invention.

Figure eleven is an exploded view of another preferred embodiment of the present invention.

In order to achieve the above-mentioned purpose and effect, the technical means and structure adopted by the present invention are drawn to illustrate the characteristics and functions of the preferred embodiment of the present invention in detail as follows, so as to fully understand.

Please refer to the first to third figures, which are the three-dimensional view of the preferred embodiment of the new model to the exploded view of the hidden crane carrier. From the figures, it can be clearly seen that the storage damping device 100 of the present model is related to one day. The vehicle carrier 6 is combined, and the crane carrier 6 has two positioning rods 61 and two coupling parts 612 respectively formed on the positioning rods 61, and the storage damping device 100 mainly includes:

At least the lower plate 1 is attached to the positioning rods 61;

The two load-bearing parts 11 are respectively formed by bending on both sides of the lower plate 1;

A limiting groove 12 is formed between the lower plate 1 and the supporting portions 11, and is used for accommodating the positioning rod 61;

A plurality of damping elements 2 are arranged on the load-bearing part 11;

An upper plate 3 is arranged on the damping elements 2 for carrying semiconductor storage, and the height of the damping element 2 is greater than the depth of the carrying portion 11, so that the upper plate 3 and the lower plate There is a first buffer space 21 between 1;

A plurality of positioning pins 31 are arranged on the upper plate 3 for positioning the semiconductor storage Device

A plurality of positioning holes 13 are formed on the lower plate 1 and their positions correspond to the positioning pins 31;

A plurality of positioning members 4 are arranged on the coupling portion 612 and corresponding to the positioning holes 13, and clamp the positioning rod 61 together with the lower plate 1, and the positioning member 4 has a portion embedded in the coupling portion 612 The inner protrusion 41, and a clamping portion 42 formed integrally from the side of the protrusion 41 and arranged outside the coupling portion 612; and

The plurality of pressing members 5 respectively pass through the positioning holes 13 and the positioning members 4 corresponding to their positions to fix the lower plate 1 and the positioning rod 61.

Through the above description, we can understand the structure of this technology, and according to the corresponding cooperation of this structure, it has the advantages of convenient and fast assembly and improvement, intuitive and precise positioning, and good shock absorption effect. The detailed explanation will be The following instructions.

Please also refer to the first to seventh diagrams, which are the three-dimensional view of the preferred embodiment of the new model to the damping diagram (2). When the above-mentioned components are assembled, the first to fourth diagrams can be used. It can be clearly seen that the overhead crane carrier 6 is an Over Head Buffer (OHB), so it has four cantilever beams 62 and two positioning rods 61, which are generally extruded aluminum, and each positioning rod 61 has A joining part 612. In this embodiment, the joining part 612 is the opening part of the groove 611 on the aluminum extrusion; the upper plate 3 can be a flat plate originally arranged on the positioning rod 61 to facilitate the user to install the lower part The plate 1, or a structure that is configured as a whole set with the storage damping device 100, to facilitate the setting of new users. The positioning pin 31 on the upper plate 3 is a post for positioning and combining with the semiconductor storage 7 (see the seventh figure) Shaped structure (KC pin), only directly locked on the upper plate 3, not connected with the lower plate 1 or the positioning rod 61; the lower plate 1 is an integrally formed convex plate with a protruding part adjacent to it The upper plate 3 also has a plurality of positioning holes 13, and both ends are defined as bearing portions 11 for arranging the damping element 2, and the upper plate 3 is arranged on the damping element 2 to be combined with the lower plate 1 for positioning; The piece 4 is a convex block structure, and the pressing piece 5 is a combination of a screw 51 and a nut 52. In this embodiment, the number of positioning pins 31, positioning holes 13, positioning parts 4, and pressing parts 5 are all three, and they are respectively arranged on two positioning rods 61. The number of lower plate 1 is one, so the corresponding limit The number of grooves 12 and upper plate 3 is also one.

As shown in the third and fourth figures, when the present invention is assembled, if the upper plate 3 is a plane plate originally arranged on the positioning rod 61, first remove the upper plate 3, and then install the lower plate 1 , Otherwise, install the lower plate 1 directly. When installing, first place the nut 52 of the positioning member 4 and the pressing member 5 on the positioning rod 61 In the groove 611 of the positioning member 4, the protruding portion 41 of the positioning member 4 is located at the joining portion 612, and the clamping portion 42 is located in the groove 611, and then the lower plate 1 is placed on the positioning rod 61. The design of the limit groove 12 allows the two positioning rods 61 to naturally complete the left and right limit, so only the position of the positioning hole 13 is determined, and the screw 51 of the pressing member 5 is passed through the setting hole 13, the positioning member 4 and the joint at the same time. 612 is fine. After the installation of the three sets of the pressing member 5 is completed, the clamping part 42 and the lower plate 1 are clamped and fixed to the positioning rod 61 due to the locking action of the pressing member 5. The locking action also causes the lower plate 1 and the positioning rod 61 will not produce relative displacement.

As shown in the fifth to seventh figures, the damping element 2 is arranged on the bearing portion 11 of the lower plate 1, and then the upper plate 3 is arranged on the damping element 2. In this embodiment, the two bearing portions 11 are Two damping elements 2 are respectively provided. On the whole, the damping elements 2 are placed on the four corners of the lower plate 1, and the upper plate 3 is not directly in contact with the lower plate 1, so the upper plate 3 is The stress, such as the placement of the semiconductor storage 7 by the Overhead Hoist Transport (OHT), must be transmitted to the lower plate 1 through the damping element 2. On the contrary, it comes from the overhead crane carrier. The vibration of 6 must also be transmitted to the upper plate 3 or the semiconductor storage 7 through the damping element 2, and because the height of the damping element 2 is greater than the depth of the carrying portion 11, so that the upper plate 3 and the lower plate 1 There is a first buffer space 21 therebetween, which can also provide the upper plate 3 with a certain degree of buffering effect. And because the combined positions of the damping element 2 and the upper plate 3 and the lower plate 1 are set correspondingly in advance, after the assembly is completed, each set of positioning pins 31, positioning holes 13, pressing parts 5, and positioning parts 4 are all located In the same straight line, the positioning of the positioning rod 61, the lower plate 1 and the upper plate 3 can be naturally completed during the above assembly action, so that the position of the new positioning pin 31 and the position of the old positioning pin 31 can be The front and back, left and right, up and down, and angle directions are exactly the same, and it has a fast and accurate positioning function. Furthermore, after the upper plate 3 and the lower plate 1 are assembled, they are generally in the shape of an undercut. The recessed design at the limit groove 12 makes the positioning rod 61 still very close to the upper plate 3. The volume of the lower plate 1 itself hardly affects the spatial configuration of the original crane carrier 6.

Please also refer to the eighth and ninth figures, which are an exploded view of another preferred embodiment of the new model and a cross-sectional view taken along line BB of the eighth figure. It can be clearly seen from the figure that this embodiment is similar to the above The embodiment is similar, but the positioning member 4a has a flexible joint part 43a embedded in the joint part 612a, and a cushion body part 44a provided on one side of the flexible joint part 43a, wherein the flexible joint part 43a The part 43a is made of polyetheretherketone (PEEK) or polyoxymethylene (Polyoxymeth ylene, POM) and other engineering plastic materials. During assembly, the flexible joint 43a can be directly inserted into the joint 612a, so the setting method is more convenient, and when the pressing member 5a is provided, due to the material characteristics of the flexible joint 43a, it will be squeezed and deformed by the pressing member 5a, and at the same time, the pressing member is internally combined in the joint 612a. 5a. The feature of externally engaging the positioning rod 61a also has the risk of preventing the lower plate 1a and the positioning rod 61a from slipping and causing inaccurate positioning. In addition, the number of the lower plate 1a in this embodiment is two, so the number of the corresponding limiting groove 12a and the upper plate 3a is also two.

Please also refer to the tenth figure, which is a cross-sectional view of another preferred embodiment of the new model. It can be clearly seen from the figure that this embodiment is similar to the above-mentioned embodiment, except that the positioning member 4b includes a A shock-absorbing element 45b arranged between the lower plate 1b and the positioning rod 61b, and a cushion portion 44b arranged on one side of the shock-absorbing element 45b, and the shock-absorbing element 45b has a shock-absorbing element 45b inserted into the coupling portion 612b The insertion portion 451b, and an isolation portion 452b formed on one side of the insertion portion 451b and located between the lower plate 1b and the positioning rod 61b, and the isolation portion 452b is between the lower plate 1b and the positioning rod 61b There is a second buffer space 453b. The shock-absorbing element 45b is one of Thermoplastic Elastomer (TPE) or thermoplastic elastic sponge. It has the characteristics of high ductility and low resilience. It not only provides good shock-absorbing effect, but also uses inserting The portion 451b directly corresponds to the joint portion 612b, and also has the advantage of convenient assembly. The isolation portion 452b has a certain thickness before the force is applied, so that a second buffer space 453b can be formed between the lower plate 1b and the positioning rod 61b. Improve cushioning effect.

Please also refer to the eleventh figure, which is an exploded view of another preferred embodiment of the new model. It can be clearly seen from the figure that this embodiment is similar to the above-mentioned embodiment, and only the crane carrier 6c The upper two positioning rods 61c are C-shaped steel, so they have an open end 613c. The joint 612c on each positioning rod 61c is a perforation on the C-shaped steel. The joint 612c is located on the side of the positioning rod 61c away from the mouth end 613c. It also corresponds to the position of the positioning hole 13c on the lower plate 1c, and the coupling portion 612c of this embodiment is a hole for directly locking the positioning pin 31c of the upper plate 3c before modification. In this way, when assembling the lower plate 1c, only the screw 51c of the pressing member 5c from above the lower plate 1c through the connecting portion 612c of the setting rod 61c, and the opening end 613c under the positioning rod 61c is covered. The nut 52c is provided for locking, so that after the lower plate 1c is fixed to the positioning rod 61c, the position of the joint portion 612c and the original positioning pin 31c can be accurately corresponded without correction.

However, the above descriptions are only the preferred embodiments of the present model, which does not limit the scope of the patent of the present model. Therefore, all simple modifications and equivalent results made by using the description of the present model and the schematic content are given. Structural changes should be included in the scope of the patent of this new model in the same way, and should be stated.

In summary, the storage damping device of the semiconductor automated logistics transmission system of the present invention can indeed achieve its efficacy and purpose when used. Therefore, the present invention is a new model with excellent practicability and is in compliance with the application of a new patent. As for the essential requirements, Yan submits an application in accordance with the law, and I hope that the review committee will grant this model as soon as possible to protect the applicant’s hard work. If the review committee of the Bureau has any doubts, please feel free to write instructions.

1: Lower plate

11: Bearing Department

12: Limit groove

13: positioning hole

2: Damping element

21: The first buffer space

3: Upper plate

31: positioning pin

4: Positioning parts

41: Protruding part

42: Clamping part

5: Urgent parts

61: positioning rod

612: joint

Claims (9)

A storage damping device of a semiconductor automatic logistics transmission system, the storage damping device is combined with a day car carrier, the crane carrier has two positioning rods, and two joint parts formed on each positioning rod, and The storage damping device mainly includes: At least the lower plate is attached to the positioning rods; The two load-bearing parts are respectively formed by bending on both sides of the lower plate; A limiting groove is formed between the lower plate and the load-bearing parts, and is used for accommodating the positioning rod; A plurality of damping elements are arranged on the load-bearing part; An upper plate is arranged on the damping elements for carrying the semiconductor memory; A plurality of positioning pins are arranged on the upper plate for positioning the semiconductor memory; A plurality of positioning holes are formed on the lower plate and the positions are respectively corresponding to the positioning pins; A plurality of positioning pieces are arranged on the joint portion and are positioned corresponding to the positioning holes, and clamp the positioning rod together with the lower plate; and The plurality of pressing parts are respectively penetrated through the positioning holes and the positioning parts corresponding to their positions to fix the lower plate and the positioning rod. As described in the first item of the scope of patent application, the storage shock absorber of the semiconductor automatic logistics transmission system, wherein the height of the damping element is greater than the depth of the bearing part, so that there is a gap between the upper plate and the lower plate The first buffer space. As described in the first item of the scope of patent application, the storage damping device of the semiconductor automatic logistics transmission system, wherein the positioning member has a protruding part embedded in the joint part, and an integrally formed side of the protruding part A clamping part arranged on the outside of the joint part. As described in the first item of the scope of patent application, the storage damping device of the semiconductor automated logistics transmission system, wherein the positioning member has a flexible joint part embedded in the joint part, and a flexible joint part arranged on one side of the flexible joint part The cushion body. As described in the first item of the scope of patent application, the storage damping device of the semiconductor automated logistics transmission system, wherein the positioning member has a shock-absorbing element arranged between the lower plate and the positioning rod, and a shock-absorbing element arranged on the shock-absorbing element Pad body on one side. As described in item 5 of the scope of patent application, the storage shock-absorbing device of the semiconductor automated logistics transmission system, wherein the shock-absorbing element has an insertion part inserted into the coupling part, and an insertion part formed on one side of the insertion part and located at the The isolation part between the lower plate and the positioning rod. As described in the sixth item of the scope of patent application, the storage shock absorption device of the semiconductor automated logistics transmission system, wherein the isolation part makes the distance between the lower plate and the positioning rod a second buffer space. As described in item 1 of the scope of patent application, the storage damping device of the semiconductor automated logistics transmission system, wherein the storage damping device is an undercut type. According to the first item of the scope of patent application, the storage damping device of the semiconductor automated logistics transmission system, wherein the positioning rod has an open end, and the coupling part is located on a side of the positioning rod away from the open end.

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