TWM619459U - Active stylus - Google Patents

Abstract

An active stylus including a housing, a pen core, a first circuit board, and a touch sensing module is provided. The pen core, the first circuit board, and the touch sensing module are disposed in the housing respectively. The touch sensing module includes a touch sensing element and a second circuit board. The touch sensing element is disposed on and electrically connected to the second circuit board, and the touch sensing module is abutted to a lateral surface of the first circuit board. The second circuit board is vertical to the first circuit board. The pen core is abutted to the touch sensing element.

Description

Active stylus

This new creation is about an active stylus.

With the advancement and development of science and technology, there are many electronic devices on the market that use touch panels or touch pads as operating interfaces. Users usually use their fingers to operate on the touch panel, but they use their fingers to operate on the touch panel. When sliding on the touch panel, because the finger contact area is wide, it is easy to cause too much friction, which is not suitable for large amount or fast input. At the same time, accidental touch may occur. Therefore, a stylus has come out.

Existing stylus can be divided into active and passive. Among them, the active stylus sends signals from the signal transmitting circuit in the pen, and the corresponding touch panel (or touch pad) determines the signal after receiving the signal. The coordinates of the contacted position and the contact pressure.

Generally speaking, the existing active stylus uses a pen core to press against a pressure-sensitive element to generate a capacitance value change or a resistance value change, thereby generating a touch pressure signal, and the touch pressure signal is removed from the pressure by a wire. The sensing element is transmitted to the main circuit board of the active stylus, and the processor on the main circuit board processes, distinguishes or transmits the signal.

However, as the technology of pressure-sensitive components increases, the information they need to transmit has also doubled. Therefore, the above-mentioned wires cannot meet the signal transmission requirements of new-type pressure-sensitive components. At the same time, the wire needs to occupy a certain space inside the active stylus, and its bridging state between the circuit boards also makes assembly and soldering difficult or easy to damage during operation. Therefore, how to improve the pressure-sensitive components and the main The electrical connection between circuit boards to overcome the above-mentioned problems has become a subject for those skilled in the art to think about.

The present invention provides an active stylus, which provides a large amount of information transmission through the electrical connection structure between the circuit boards, and has the strength of the connection structure.

The active stylus created by the present invention includes a casing and a pen core arranged in the casing, a first circuit board and a pressure-sensitive module. The pressure-sensitive module includes a pressure-sensitive element and a second circuit board, and the pressure-sensitive element is configured and electrically connected to the second circuit board. The second circuit board is electrically connected to the first circuit board and abuts against the side surface of the first circuit board, wherein the second circuit board is perpendicular to the first circuit board. The pen core abuts against the pressure sensitive element.

In an embodiment of the present invention, the above-mentioned first circuit board has an upper surface and a lower surface opposite to each other. The above-mentioned side surface is adjacent to between the upper surface and the lower surface. The second circuit board has a front surface and a rear surface opposite to each other, the rear surface abuts on the side surface, and the pressure sensitive element is arranged on the front surface.

In an embodiment of the present invention, the above-mentioned active stylus further includes a plurality of first pads and a plurality of second pads, the first pads are respectively disposed on the upper surface and the lower surface, and the second pads Set on the back surface. The first circuit board and the second circuit board are electrically connected to each other only by welding the second pads with the first pads, respectively.

In an embodiment of the present invention, the electrical signal pins of the first pad include serial data output (SDO), serial data input/output (SDA), input/output power supply (VDD_IO), and Connection (NC), interrupt signal 1 (INT1), interrupt signal 2 (INT2), power supply (VDD), input/output ground (GND_IO), ground (GND), chip selection (CSB), clock (SCL/SCLK) ), and the electrical signal pin of the second pad corresponds to the first pad.

In an embodiment of the present invention, the above-mentioned first pads are spaced apart from the side surface.

In an embodiment of the present invention, part of the above-mentioned first pads are arranged in a row (R1) on the upper surface, and the other part is arranged in a row (R2) on the lower surface. The second pads are arranged in rows (R3) and rows (R4) on the back surface. The first pads located in the row (R1) are respectively soldered to the second pads located in the row (R3), and the first pads located in the row (R2) are respectively soldered to the second pads located in the row (R4).

In an embodiment of the present invention, the aforementioned row (R1), row (R2), row (R3), and row (R4) are parallel to each other.

In an embodiment of the present invention, each of the above-mentioned second pads partially overlaps the side surface.

In an embodiment of the present invention, the pressure direction of the aforementioned pressure-sensitive element is orthogonal to the front surface, the back surface and the side surface.

In an embodiment of the present invention, the aforementioned pen core, pressure-sensitive element, and the side surfaces of the second circuit board are aligned with each other.

Based on the above, the active stylus is formed by electrically connecting the second circuit board of the pressure-sensitive module to the first circuit board, and structurally making the second circuit board abut against the side surface of the first circuit board. In a mutually perpendicular state, the pressure-sensitive element is disposed on the second circuit board and faces away from the first circuit board, and the pen core abuts on the pressure-sensitive element. In this way, the active stylus sequentially forms the pen core, the pressure-sensitive element, the contact relationship between the second circuit board and the first circuit board. In addition to the smooth formation of the board-to-board electrical connection, two The first and second circuit boards that are vertically buttted can also improve their structural strength, especially for pressure-sensitive components. When the pen core is in contact with the pressure-sensitive component, the second circuit board has the first circuit board behind it. The support of the circuit board prevents the overall structure from being deformed or even damaged due to the above-mentioned pressing action.

FIG. 1 is an exploded view of an active stylus according to an embodiment of the invention. FIG. 2 is a schematic diagram of assembling the pressure-sensitive module and the first circuit board of FIG. 1. Please refer to FIGS. 1 and 2 at the same time. In this embodiment, the active stylus 100 includes a housing 110 and a refill 120 disposed in the housing 110, a pressure-sensitive module 130, a control module 140, and a battery 150. The housing 110 includes a front housing 114, an upper housing 112, a lower housing 111, and a pen holder 113. One end of the control module 140 is electrically connected to the battery 150, and the pressure-sensitive module 130 is electrically connected to the other end of the control module 140. The pen core 120 , The pressure-sensitive module 130 and the control module 140 are clamped and fixed by the upper shell 112 and the lower shell 111 and then sleeved with the penholder 113, and the front housing 114 is locked to the penholder 113, and the front end of the pen core 120 The front shell 114 is extended and can be moved along the axial direction to complete the general structural assembly of the active stylus 100.

Furthermore, the control module 140 includes a first circuit board 141 and a processor 142 disposed thereon, a switch element 143, and other electronic components (not shown). The first circuit board 141 has an upper surface S1 and a lower surface S2. It is adjacent to the side surface S3, and the side surface S3 is adjacent to the upper surface S1 and the lower surface S2. The pressure-sensitive module 130 includes a pressure-sensitive element 131 and a second circuit board 132. The second circuit board 132 has a front surface S5 and a back surface S4 opposite to each other. The pressure-sensitive element 131 is disposed and electrically connected to the second circuit board 132. The front surface S5 of the pressure-sensitive module 130 and the rear surface S4 of the pressure-sensitive module 130 abut against the side surface S3 of the first circuit board 141 and complete the electrical connection relationship with the first circuit board 141.

FIG. 3 shows the pressure-sensitive module of FIG. 2 from another perspective. Please refer to FIGS. 1 to 3 at the same time. In this embodiment, because the back surface S4 of the second circuit board 132 abuts the side surface S3 of the first circuit board 141, the first circuit board 141 and the second circuit board 132 is perpendicular to each other (orthogonal). At the same time, the pressure-sensitive element 131 located on the front surface S5 is substantially facing away from the first circuit board 141, and the pen core 120 is facing the pressing protrusion 131a of the pressure-sensitive element 131. A state where the pen core 120, the pressure sensitive element 131, and the side surface S3 of the first circuit board 141 are aligned with each other is formed inside. In other words, the orthographic projections of the pen core 120 and the pressing protrusion 131a of the pressure-sensitive element 131 on the side surface S3 overlap each other, and the pressure direction of the pen core 120 against the pressure-sensitive element 131 (equivalent to the pressure-sensitive element 131 The pressing direction of the element 131) is orthogonal to the front surface S5, the rear surface S4 of the second circuit board 132, and the side surface S3 of the first circuit board 141.

In this way, the first circuit board 141 can serve as a structural support for the second circuit board 132, so that the second circuit board 132 will not be deformed or even damaged during the pressure-sensitive component 131 being pressed.

4 and 5 illustrate the corresponding connection states of the first circuit board and the pressure-sensitive module from different perspectives. Please refer to FIGS. 3 to 5 at the same time. In this embodiment, the active stylus 100 further includes a plurality of first pads B1 to B7 and a plurality of second pads A1 to A7, and the first pads B1 to B7 They are respectively disposed on the upper surface S1 and the lower surface S2 of the first circuit board 141. The second pads A1-A7 are all disposed on the rear surface S4 of the second circuit board 132. As shown in FIGS. 2 to 5, the first circuit board 141 and the second circuit board 132 of this embodiment are electrically connected to each other by only soldering the second pads A1 to A7 with the first pads B1 to B7, respectively.

As shown in Figures 4 and 5, among the first pads B1 to B7, some of the first pads B1 to B3 are located on the upper surface S1 and are arranged along the row R1, while the other part of the first pads B4 to B7 are on the bottom. The surface S2 is arranged in a row R2. The second pads A1 to A7 are all arranged in two rows (row R3 and row R4) on the rear surface S4 of the second circuit board 132, and the first pads B1 to B3 in row R1 are respectively soldered to row R3. The second pads A1 to A3 of the row R2 are respectively soldered to the second pads A4 to A7 of the row R4 to the second pads A4 to A7. The rows R1, R2, R3, and R4 are Parallel to each other.

At the same time, the pressure-sensitive element 131 of this embodiment is a digital output pressure-sensitive element formed of a capacitive MEMS structure, so multiple transmission terminals are required to facilitate the transmission of a large amount of information. Accordingly, the electrical signal pins of the first pads B1 to B7 in this embodiment include serial data output (SDO), serial data input/output (SDA), input/output power supply (VDD_IO), and idle connection. (NC), interrupt signal 1 (INT1), interrupt signal 2 (INT2), power supply (VDD), input/output ground (GND_IO), ground (GND), chip selection (CSB), clock (SCL/SCLK) Among seven of them, the electrical signal pins of the second pads A1 to A7 will correspond to the electrical signal pins of the first pads B1 to B7.

Please refer to FIG. 4 again, in order to allow the first circuit board 141 and the second circuit 132 that are perpendicular to each other to be electrically connected smoothly, therefore, in this embodiment, the first pads B1 to B7 are spaced apart from the side surface S3. D1, and each of the second pads A1 to A7 is partially overlapped on the side surface S3, and then the first pads B1 to B7 and the second pads A1 to A7 can be connected to each other in a one-to-one correspondence through the welding material 170 ( Fig. 4 is partially enlarged and takes the first pad B3 and the second pad A3 as an example. The rest of the first pads B1, B2, B4~B7, and the second pads A1, A2, A4~A7 are also the same, so we will not repeat them) . At the same time, the first pads B1 to B7 of the same group or the second pads A1 to A7 of the same group are also prevented from being short-circuited.

In summary, in the above-mentioned embodiment of the present invention, the active stylus electrically connects the second circuit board of the pressure-sensitive module to the first circuit board, and structurally makes the second circuit board Abutting on the side of the first circuit board to form a state of being perpendicular to each other, wherein the pressure-sensitive element is disposed on the second circuit board and facing away from the first circuit board, and the pen core is abutted on the pressure-sensitive element, so that the pen The side surfaces of the core, the pressure sensitive element and the first circuit board are aligned with each other, so that the structural strength can be effectively improved. When the pen core is in contact with the pressure-sensitive element, the second circuit board is supported by the first circuit board, so that the overall structure will not be deformed or even damaged due to the aforementioned pressing action.

Furthermore, the pressure-sensitive element is a digital output pressure-sensitive element formed by a capacitive micro-electromechanical structure, so multiple transmission terminals are required to facilitate the transmission of a large amount of information. Therefore, by arranging a plurality of first pads on the upper and lower surfaces of the first circuit board, the plurality of second pads on the rear surface of the second circuit board are soldered compared to the pair of first pads. That is to say, in the process of board-to-board vertical butting in this case, the above-mentioned pads are also welded to each other to complete and meet the electrical connection requirements.

100: Active stylus 110: shell 111: lower shell 112: upper shell 113: Penholder 114: front shell 120: Refill 130: Pressure Sensing Module 131: Pressure Sensitive Components 131a: Anti-pressure convex part 132: second circuit board 140: control module 141: The first circuit board 142: processor 143: Switching element 150: battery 170: Welding material A1, A2, A3, A4, A5, A6, A7: second pad B1, B2, B3, B4, B5, B6, B7: the first pad D1: Spacing R1, R2, R3, R4: column S1: upper surface S2: bottom surface S3: side S4: Rear surface S5: Front surface

FIG. 1 is an exploded view of an active stylus according to an embodiment of the invention. FIG. 2 is a schematic diagram of assembling the pressure-sensitive module and the first circuit board of FIG. 1. FIG. 3 shows the pressure-sensitive module of FIG. 2 from another perspective. 4 and 5 illustrate the corresponding connection states of the first circuit board and the pressure-sensitive module from different perspectives.

100: Active stylus

110: shell

111: lower shell

112: upper shell

113: Penholder

114: front shell

120: Refill

130: Pressure Sensing Module

140: control module

141: The first circuit board

142: processor

143: Switching element

150: battery

Claims (10)

An active stylus, including: A shell A pen core is set in the shell; A first circuit board arranged in the housing; and A pressure-sensitive module is disposed in the housing. The pressure-sensitive module includes a pressure-sensitive element and a second circuit board. The pressure-sensitive element is configured and electrically connected to the second circuit board. The second circuit board is electrically connected to the second circuit board. The first circuit board is sexually connected and abuts against a side surface of the first circuit board, wherein the second circuit board is perpendicular to the first circuit board, and the pen core abuts against the pressure sensitive element. The active stylus according to claim 1, wherein the first circuit board has an upper surface and a lower surface opposite to each other, the side surface is adjacent to the upper surface and the lower surface, and the second circuit board has A front surface and a rear surface opposite to each other, the rear surface abuts on the side surface, and the pressure sensitive element is disposed on the front surface. The active stylus according to claim 2, further comprising a plurality of first pads and a plurality of second pads, the first pads are respectively disposed on the upper surface and the lower surface, and the second pads The pads are arranged on the rear surface, wherein the first circuit board and the second circuit board are electrically connected to each other only by soldering the second pads with the first pads, respectively. The active stylus according to claim 3, wherein the electrical signal pins of the first pads include serial data output (SDO), serial data input/output (SDA), and input/output power supply ( VDD_IO), open connection (NC), interrupt signal 1 (INT1), interrupt signal 2 (INT2), power supply (VDD), input/output ground (GND_IO), ground (GND), chip selection (CSB), clock (SCL/SCLK) of the seven types, and the electrical signal pins of the second pads correspond to the first pads. The active stylus according to claim 3, wherein each of the first pads is spaced apart from the side surface. The active stylus according to claim 3, wherein parts of the first pads are arranged in a row (R1) on the upper surface, and another part of the first pads are arranged in a row (R1) on the lower surface ( R2), the second pads are arranged in a row (R3) and a row (R4) on the rear surface, and the first pads located in the row (R1) are respectively soldered to the row (R3). For the second pads, the first pads in the row (R2) are respectively soldered to the second pads in the row (R4). The active stylus according to claim 6, wherein the column (R1), the column (R2), the column (R3), and the column (R4) are parallel to each other. The active stylus according to claim 3, wherein each of the second pads partially overlaps the side surface. The active stylus according to claim 3, wherein the pressing direction of the pressure-sensitive element is orthogonal to the front surface, the rear surface and the side surface. The active stylus according to claim 1, wherein the pen core, the pressure-sensitive element, and the side surface are aligned with each other.

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