TWM618164U - Improved structure of memory module - Google Patents

Abstract

This creation discloses an improved structure of a memory module, which includes: a printed circuit board; a plurality of memory units, the memory units are arranged on the printed circuit board; and a connection interface is arranged on the printed circuit board , And used to connect to a host system of an electronic device; wherein the printed circuit board is provided with a pad area electrically connected to the memory cells and the connection interface, the pad area has a plurality of pads, and the At least two of the solder pads are electrically connected to each other.

Description

Improved structure of memory module

This creation is related to the technical field of a memory module, and especially refers to an improved structure of a memory module that is conducive to modification.

Click, among memory modules, dynamic random access memory modules can be roughly divided into unbuffered dual in-line memory modules (UDIMMs) and small form factor dual-line memory based on their functions. Module (Small Outline Dual In-line Memory Module, SODIMM), Registered Dual In-line Memory Module (RDIMM), Full Buffered Dual Memory Module (Full Buffered Dual) In-line Memory Module (FBDIMM) and Load Reduced Dual In-line Memory Module (LRDIMM)...etc.

Among them, because UDIMM and SODIMM are mainly used in desktop computers and notebook computers, and RDIMM, FBDIMM and LRDIMM are mainly used in workstations and servers, and RDIMM, FBDIMM or LRDIMM has more temporary storage than UDIMM or SODIMM. Registers, buffers or isolation memory buffers (Isolation Memory Buffer, IMB), so there are differences in structure and function; as the market develops, sometimes there will be overproduction of RDIMM, FBDIMM or LRDIMM The problem arises, so manufacturers or distributors try to convert RDIMMs, FBDIMMs or LRDIMMs into UDIMMs or SODIMMs, but they are removing their registers, buffers, or isolation memory buffers. IMB), the memory unit and the connection interface provided on the printed circuit board cannot achieve the effect of electrical connection. Therefore, the memory unit must be removed and assembled in another form to electrically connect the memory unit and the connection interface. The printed circuit board can be converted into UDIMM or SODIMM from RDIMM, FBDIMM or LRDIMM.

However, if the modification is carried out according to the above method, the producer not only needs to spend a huge amount of work time for disassembly and assembly, but also the printed circuit boards between the two cannot be shared, which will undoubtedly cause an increase in cost and a waste of resources.

Therefore, in view of the above, the creator of this creation has painstakingly researched, thought about and designed an improved structure of the memory module for many years, in order to improve the lack of conventional technology, and then enhance the implementation and utilization in the industry.

The main purpose of this creation is to provide an improved structure of the memory module. The printed circuit board is provided with a memory unit, a connection interface and a pad area, and the pad area is electrically connected to the memory unit and the connection interface. The solder pad area has solder pads that are electrically connected. As a result, even when the register, buffer, or isolation memory buffer (Isolation Memory Buffer, IMB) is not set in the printed circuit The board can still electrically connect the memory cells with the connection interface through the electrically connected solder pads.

Therefore, in order to achieve the above objective, the present invention provides an improved structure of a memory module, which includes: a printed circuit board; a plurality of memory units, the memory units are arranged on the printed circuit board; and a connection interface, A host system that is arranged on the printed circuit board and is used to connect to an electronic device; wherein the printed circuit board is provided with a pad area electrically connected to the memory cells and the connection interface, and the pad area has a plurality of Soldering pads, and at least two of the soldering pads are electrically connected in a group.

Following the improved structure of the memory module described above, the pad area is a pad area where a register can be set.

Following the improved structure of the memory module described above, the pad area is a pad area where a buffer can be arranged.

Following the improved structure of the memory module described above, the pad area is a pad area where an isolation memory buffer (Isolation Memory Buffer, IMB) can be arranged.

Following the improved structure of the memory module described above, the solder pads include at least one set of address signal pins, and the set of address signal pins are electrically connected to each other.

Following the improved structure of the memory module described above, the solder pads are electrically connected by a wire in a bridging manner.

Following the improved structure of the memory module described above, the bonding pad area is further combined with a conductive element, so that the bonding pads are electrically connected through the conductive element.

Following the improved structure of the memory module described above, the conductive element includes a substrate with a conductive circuit layer arranged on the bottom surface of the substrate, and a plurality of corresponding solder pads corresponding to the solder pads are provided on the bottom surface of the substrate.

Following the improved structure of the memory module described above, the surface of the substrate is further coated with an ink layer.

To sum up, this case is not only innovative in terms of spatial form, but also can improve the above-mentioned multiple functions compared with conventional items. It should fully meet the new and progressive statutory new patent requirements. An application is filed in accordance with the law, and you are requested to approve it. This new type patent application is to encourage creation, and it is easy to feel the virtue.

The following describes the implementation of this creation based on Figures 1 to 4. This description is not intended to limit the implementation of this creation, but is a kind of embodiment of the creation, and in the drawings and embodiments, the same or similar drawing symbols in all drawings refer to the same, substantially the same, or Parts and components with the same function. The drawing is a simplified form, and in all the embodiments, the drawing is not drawn according to precise dimensions.

First, please refer to Figure 1. The present invention provides an improved structure 10 of a memory module, which includes: a printed circuit board 11; a plurality of memory units 12, the memory units 12 are arranged in the printed circuit The circuit board 11; and a connection interface 13 provided on the printed circuit board 11 and used to connect to a host system of an electronic device (not shown); wherein the printed circuit board 11 is provided with a memory unit 12 The bonding pad area 14 is electrically connected to the connection interface 13. The bonding pad area 14 has a plurality of bonding pads 141, and at least two of the bonding pads 141 are electrically connected to each other.

Wherein, the connection interface 13 can be a golden finger. When the improved structure 10 of the memory module provided by the present invention is inserted into the slot of the host system of the electronic device, it can be connected with the host system.

In one embodiment, the pad area 14 is a pad area where a register can be provided, and the pads 141 of the pad area 14 may include at least one set of address signal pins , The set of address signal pins are electrically connected to each other. Therefore, if the output of dual-line memory modules (RDIMMs), fully-buffered dual-line memory modules (FBDIMMs) or low-load dual-line memory modules (LRDIMMs) with registers is excessive, manufacturers can The register, buffer, or isolation memory buffer (Isolation Memory Buffer, IMB) is removed, and the solder pad exposed in the solder pad area is electrically connected. This saves production Refitting a dual-row memory module with a register costs many modification processes and work time, and there is no need to design a printed circuit board separately and discard the printed circuit board of the dual-row memory module with a register , So this creation can achieve the same effect as unbuffered dual-line memory module (UDIMM).

In one embodiment, as shown in FIG. 2, the solder pads 141 can be electrically connected by a wire 15 in a bridging manner; in another embodiment, as shown in FIG. 3, they are connected to the solder The pad area 14 is combined with a conductive element 16 so that the solder pads 141 are electrically connected through the conductive element 16. Moreover, as shown in FIG. 4, the conductive element 16 includes a substrate 161 on which a conductive circuit layer is arranged. And the bottom surface of the substrate 161 is provided with a plurality of corresponding solder pads 162 corresponding to the solder pads. In addition, in one embodiment, the surface of the substrate 161 is further coated with an ink layer 163 to protect the exposed surface of the substrate 161.

Therefore, this creation does provide an improved structure of the memory module. The printed circuit board is provided with a memory unit, a connection interface and a pad area, and the pad area is electrically connected to the memory unit and the connection interface, and the soldering The pad area has solder pads for electrical connection. As a result, even if the register, buffer, or isolation memory buffer (Isolation Memory Buffer, IMB) is not installed on the printed circuit board, it is still The memory cells can be electrically connected to the connection interface through electrically connected solder pads.

However, the above are only the preferred embodiments of this creation, and should not be used to limit the scope of implementation of this creation, that is, all simple equivalent changes and modifications made according to the scope of patent application and creation description of this creation are all It is still within the scope of this creation patent.

10: Improved structure of memory module 11: Printed circuit board 12: Memory unit 13: Connection interface 14: Pad area 141: Pad 15: Wire 16: conductive element 161: Substrate 162: Corresponding pad 163: Ink layer

Figure 1 is a schematic plan view of the improved structure of the created memory module. Figure 2 is a partial enlarged schematic view of Figure 1. Figure 3 is another schematic plan view of the improved structure of the created memory module. Figure 4 is a schematic cross-sectional view of the conductive element in Figure 3.

10: Improved structure of memory module

11: Printed circuit board

12: Memory unit

13: Connection interface

14: Pad area

141: Pad

Claims (9)

An improved structure of a memory module, which includes: A printed circuit board; A plurality of memory units, the memory units are arranged on the printed circuit board; and A connection interface, arranged on the printed circuit board, and used to connect to the host system of an electronic device; Wherein, the printed circuit board is provided with a solder pad area electrically connected to the memory cells and the connection interface, the solder pad area has a plurality of solder pads, and at least two of the solder pads are electrically connected to each other. The improved structure of the memory module according to claim 1, wherein the pad area is a pad area where a register can be provided. The improved structure of the memory module according to claim 1, wherein the pad area is a pad area where a buffer can be provided. The improved structure of the memory module according to claim 1, wherein the pad area is a pad area where an isolated memory buffer can be provided. The improved structure of the memory module according to claim 1, wherein the solder pads include at least one set of address signal pins, and the set of address signal pins are electrically connected to each other. The improved structure of the memory module according to any one of claims 1 to 5, wherein the solder pads are electrically connected by a wire in a bridging manner. The improved structure of the memory module according to any one of claims 1 to 5, wherein the bonding pad area is further combined with a conductive element, so that the bonding pads are electrically connected through the conductive element. The improved structure of the memory module according to claim 7, wherein the conductive element includes a substrate provided with a conductive circuit layer, and the bottom surface of the substrate is provided with a plurality of corresponding solder pads corresponding to the solder pads . The improved structure of the memory module according to claim 8, wherein the surface of the substrate is further coated with an ink layer.

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