TWM617940U - Headphone module and headphone - Google Patents

Abstract

A headphone module and a headphone. The headphone module includes an earmuff assembly, the middle of the earmuff assembly has a first through hole; a shell, the shell is ring-shaped and connected to The earmuff assembly; a support frame, including a support part connected to the housing and a frame part connected to the support part, the frame part has a mounting groove; the speaker is fixed on the support part; A call microphone is installed in the installation slot, and the call microphone is located on the sound side of the speaker, and the call microphone can collect voice signals transmitted through bone conduction through the first through hole.

Description

Headphone module and headphone

This creation relates to the technical field of electronic equipment, such as a headphone module and a headphone.

Headphones have a strong noise reduction function and have been widely used. With the advancement of technology, the noise reduction requirements for the voice input signals of the headphones are becoming higher and higher.

In related technologies, the headset uses the environmental noise reduction technology of the environmental noise reduction module to process the noise during the call. The main purpose of the environmental noise reduction technology is to reduce the user's environmental noise during the call and make the call clearer. The principle of environmental noise reduction technology is to set up a voice microphone close to the user’s mouth and a reference microphone installed on the headset shell. The voice microphone collects loud voices and environmental noise at the near end, and collects far-end sounds through the reference microphone. Small voice and environmental noise, and then the signals collected by the voice microphone and the reference microphone are processed through the differential amplifier circuit of the environmental noise reduction module. Because the voice microphone and the reference microphone both collect environmental noise, the sound collected by the two is mixed. , The processing is more difficult and the processing efficiency is low.

This creation provides a headphone module and a headphone, which reduces the difficulty of processing environmental noise and improves the processing efficiency of environmental noise.

An embodiment provides a headphone module, including: An earmuff assembly, the middle of the earmuff assembly has a first through hole; A housing, the housing is ring-shaped and connected to the earmuff assembly; The supporting frame includes a supporting part connected to the housing and a skeleton part connected to the supporting part, and the skeleton part is provided with a mounting groove; The loudspeaker is fixed on the supporting part; The call microphone is installed in the installation slot, and the call microphone is located on the sound emitting side of the speaker.

Optionally, it further includes a protective cover, the protective cover is installed in the installation groove, the call microphone is installed in the protective cover, and the protective cover is provided with a second Two through holes, the preset direction is the thickness direction of the earmuff assembly.

Optionally, the sound receiving side of the call microphone faces the first through hole, and the material of the protective cover is silicone or rubber.

Optionally, the outline of the skeleton part is circular, and the installation groove is located in the central part of the skeleton part.

Optionally, the central part of the frame part protrudes toward the first through hole relative to the end of the frame part, and the mounting groove is located in the first through hole.

Optionally, the housing includes a first housing ring portion and a second housing ring portion, and the second housing ring portion is connected to the inner periphery of the first housing ring portion and faces the output of the speaker. Extending on the sound side, the support portion includes a first support ring portion and a second support ring portion, the second support ring portion is connected to the inner periphery of the first support ring portion and extends toward the sound emitting side of the speaker, The second supporting ring portion is fixed in the second housing ring portion.

Optionally, the inner side wall of the second housing ring portion is provided with an engaging groove, the outer side wall of the second support ring portion is provided with an engaging block, and the engaging block is engaged with the engaging groove middle.

Optionally, it further includes a rear case, the rear case is connected to the support part, and the rear case and the speaker form a rear cavity.

Optionally, it further includes a circuit board assembly, the circuit board assembly is fixed on the support portion, and the circuit board assembly is electrically connected to the speaker and the call microphone, respectively, and the circuit board assembly includes A radio call module, the radio call module is configured to receive the signal from the call microphone and correspondingly generate a voice call signal.

Optionally, it further includes a first sealant sleeve and a second sealant sleeve, the first sealant sleeve is arranged between the earmuff assembly and the housing, and the second sealant sleeve is arranged on the Between the housing and the support part.

An embodiment provides a headphone including a headband assembly and two headphone modules as described above, one of the two headphone modules and the headphone module The first end of the headband component is connected, and the other of the two headphone modules is connected to the second end of the headband component.

In the description of this creation, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated position or positional relationship is based on the position or positional relationship shown in the diagram, which is only for the convenience of describing the creation and simplified description, and does not indicate or imply that the pointed device or element must have a specific position or a specific position. Construction and operation, therefore cannot be understood as a limitation of this creation. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance.

In the description of this creation, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication between two components. For those with ordinary knowledge in the technical field, they can understand the specific meaning of the above terms in this creation under specific circumstances.

This embodiment provides a headphone module, which reduces the difficulty of processing environmental noise, improves the processing efficiency of environmental noise, and can have a better voice noise reduction effect, so that users can have a better experience .

As shown in FIGS. 1 to 6, the headphone module includes an earmuff assembly 1, a housing 2, a supporting frame 3, a speaker 4 and a call microphone 5.

Wherein, as shown in FIG. 2, the middle part of the earmuff assembly 1 has a first through hole 11, and the first through hole 11 is configured to cooperate with the user's ear so as to be buckled on the user's ear, thereby realizing passive noise reduction. The housing 2 has a ring shape and is connected to the edge of the earmuff assembly 1. Optionally, the housing 2 and the earmuff assembly 1 can be connected by a snap connection. For example, the edge of the housing 2 has a first buckle, and the earmuff The assembly 1 has a second buckle, and the first buckle and the second buckle can be connected to each other to realize the connection between the housing 2 and the earmuff assembly 1.

The support frame 3 is configured to support the fixed speaker 4 and the call microphone 5. As shown in FIG. 3, the supporting frame 3 includes a supporting part 31 fixedly connected to the housing 2 and a skeleton part 32 fixedly connected to the supporting part 31. The speaker 4 is fixed on the supporting portion 31, and the speaker 4 is located on one side of the frame portion 32.

In addition, the skeleton portion 32 has a mounting groove 321, the call microphone 5 is installed in the mounting groove 321, and the call microphone 5 is located on the sound side of the speaker 4, so that the call microphone 5 can be close to the ear and skull of the user. The sound receiving side of the call microphone 5 faces the first through hole 11, and the call microphone 5 can collect voice signals transmitted through bone vibration conduction and ear canal gas fluctuation conduction through the first through hole 11. That is, when the user is talking, Sound is produced by the vocal cords, and vibrates through solids such as bones or tissues inside the human head. The vibrations are transmitted to the inside of the ear canal, causing the air in the ear canal to fluctuate. This fluctuation is concentrated to the call microphone 5, which in turn makes the call microphone 5Can collect and transmit the voice signal inside the ear canal in a centralized way. In some embodiments, the environmental noise reduction module can be used to reduce the noise of the voice signal in the call microphone 5. Since the call microphone 5 is close to the earmuff assembly 1, the call microphone 5 can collect less environmental noise or even no noise. The environmental noise will be collected, which can reduce the working intensity of the environmental noise reduction module, improve the processing efficiency of the environmental noise reduction module, and reduce the situation that the processed sound becomes smaller or distorted. Since the voice signal collected by the call microphone 5 is less or not doped with environmental noise, it is also possible to perform noise reduction processing on the voice signal in the call microphone 5 without using the environmental noise reduction module, which reduces the headset model. The number of electronic components in the group further reduces the power consumption of the headset module, and also reduces the situation where the processed sound becomes smaller or distorted.

In the headphone module provided in this embodiment, the speaker 4 has a skeleton part 32 on the sound side, and the skeleton part 32 has a mounting slot 321, so that the call microphone 5 can be installed in the mounting slot 321, so that the call microphone 5 can be installed in the mounting slot 321. Closer to the user’s ears, since the sound made by the user can pass through the solids in the head to produce vibrations, the vibrations will produce air conduction fluctuations in the cavity in the head (such as the channel between the mouth and ears). It can be transmitted to the ear canal and can be transmitted through the ear canal by air conduction, so that the call microphone 5 can pick up the user's voice signal from the vocal cords through the ear canal and transmit it to the inside of the skull ear. Because the inside of the ear is a relatively closed space, In addition, the earmuff assembly 1 has a better passive noise reduction effect, so that the environmental noise interference of the call microphone 5 is small or even not interfered by the environmental noise, thereby making the sound collected by the call microphone 5 purer and reducing the environmental noise The difficulty of processing, improves the processing efficiency of environmental noise.

Moreover, in the case of related technology headphone noise reduction, because the environmental noise reduction module needs to correct the gain and time delay of the near-end voice and the far-end voice before working, and detect and recognize the voice signal and the environmental noise signal , And then suppress the environmental noise through the filter module. When the external environment noise is relatively large or coincides with the frequency spectrum of the voice signal, the suppression parameter will be too large and the voice signal after the noise reduction process will be eliminated, which will cause the passing sound to become smaller or distorted. If the suppression parameter is too small, the noise reduction effect will not be obvious. It is easier to cause inaudibility. However, in the headphone module provided in this embodiment, because there is no interference from external environmental noise, or only small external environmental noise interference, the environmental noise reduction technology of the environmental noise reduction module separates and eliminates external noise. The algorithmic requirements for environmental noise are lower, and the design cost of the headset can be concentrated on picking up the user's skull voice signal and amplifying and restoring it. Technical difficulties are easier to break through. In other words, the headset module and headset of the present creation only need to be equipped with the call microphone 5. Through its structural design to isolate the noise of the external environment and the design of the call microphone 5 corresponding to the closed environment of the ear canal, Obtain a voice signal with lower noise compared to existing headsets: or the headset module and headset created by this invention only need to set the call microphone 5 and the environmental noise reduction module to obtain a relatively low noise signal. Voice signals with lower noise than existing headset noise reduction headphones.

In an embodiment, as shown in FIG. 2 or FIG. 3, the headset module further includes a protective cover 6. The protective cover 6 is installed in the installation slot 321, and the call microphone 5 is installed in the protective cover 6, that is, the call microphone 5 is installed in the installation slot 321 through the protective cover 6. The arrangement of the protective cover 6 can prevent the call microphone 5 from being damaged due to collision with the inner wall of the installation groove 321. In addition, as shown in FIG. 6, the protective cover 6 is provided with second through holes 61 on both sides in the preset direction, so that the call microphone 5 can collect voice signals through the second through holes 61, and it is also convenient for the call microphone 5 to communicate with others. Electrical connection of electronic structure. The preset direction is the thickness direction of the earmuff assembly 1, that is, the up-down direction in FIG. 5. Optionally, the protective sleeve 6 in this embodiment is an interference fit with the inner wall of the installation groove 321 to reduce the probability of the protective sleeve 6 being separated from the installation groove 321.

Optionally, the material of the protective cover 6 in this embodiment is silicon rubber, rubber or plastic, so that the protective cover 6 can be relatively soft, and thus can play a shock-proof effect.

Optionally, as shown in FIG. 2 or FIG. 3, the outline of the skeleton part 32 is circular, and the installation groove 321 is located in the central part of the skeleton part 32, which is convenient for the call microphone 5 to be evenly collected by the first through hole 11 or ear The sound signal transmitted by the cover assembly 1 can also reduce the degree of interference of the call microphone 5 to the sound emitted by the speaker 4. For example, the cross section of the first through hole 11 is circular, and the cross section of the installation groove 321 is also circular, and the axis of the first through hole 11 is collinear with the axis of the installation groove 321.

In an embodiment, the skeleton portion 32 is a net structure formed by a plurality of strips, that is, the skeleton portion 32 has a plurality of hollow holes, so that the sound emitted by the speaker 4 can be transmitted through the hollow holes. Illustratively, as shown in FIG. 3, the skeleton portion 32 in this embodiment is in the shape of a Eight Diagrams matrix.

In this embodiment, the sound receiving side of the call microphone 5 faces the first through hole 11 so that the call microphone 5 can effectively collect the sound in the first through hole 11.

5, the center of the frame portion 32 protrudes toward the first through hole 11 relative to the end of the frame portion 32, and the mounting groove 321 is located in the first through hole 11 to reduce the communication microphone 5 and the user's ear canal or The distance between the skull bones is convenient for picking up the voice signal transmitted by the ear canal or skull.

In this embodiment, the earmuff assembly 1 is in direct contact with the user's skull, so that the user's ear canal forms a relatively closed environment, so that the fluctuations of the voice signal inside the ear canal can be concentrated to the call microphone 5, so that the call microphone 5 can be more compact. Obtaining the voice signal accurately increases the way for the call microphone 5 to obtain the voice signal, and ensures the reliability of the call microphone 5 to obtain the voice signal. For example, as shown in FIG. 3, the earmuff assembly 1 includes a cover case 12 and a dust cover 13 sleeved on the cover case 12. The first through hole 11 is opened on the cover case 12, and the dust cover 13 covers the first through hole. 11.

In some embodiments, the housing 2 includes a first housing ring portion 21 and a second housing ring portion 22, and the second housing ring portion 22 is connected to the inner periphery of the first housing ring portion 21 and faces the output of the speaker 4. The sound side extends, the first shell ring portion 21 and the second shell ring portion 22 have a stepped cross section, and the earmuff assembly 1 has a stepped accommodating groove 14 (refer to FIG. 5), and the accommodating groove 14 The cross-sectional profile of corresponds to the cross-sectional profile of the housing 2 so that the housing 2 is stably and compactly accommodated in the accommodating groove 14. The support portion 31 includes a first support ring portion 311 and a second support ring portion 312. The second support ring portion 312 is connected to the inner periphery of the first support ring portion 311 and extends toward the sound emitting side of the speaker 4. The first support ring portion 311 It has a stepped cross section with the second support ring portion 312, and the cross-sectional profile of the housing 2 corresponds to the cross-sectional profile of the support portion 31, so that the support portion 31 is stably and compactly accommodated in the housing 2. Wherein, the second supporting ring portion 312 is fixed in the second housing ring portion 22. In some embodiments, the inner side wall of the second housing ring portion 22 is provided with an engaging groove 221, and the outer side wall of the second support ring portion 312 is provided with an engaging block 3121, and the engaging block 3121 is engaged with the engaging groove 221 middle. In some embodiments, there are a plurality of engaging grooves 221 and engaging blocks 3121 respectively and are arranged at intervals in a ring shape.

Optionally, please refer to FIG. 3 or FIG. 5, the headphone module further includes a rear shell 7. Wherein, the rear case 7 is fixedly connected to the support portion 31, and the rear case 7 and the speaker 4 form a rear cavity 9.

In one embodiment, as shown in FIG. 3, there is a third sealant sleeve 8 between the rear shell 7 and the support portion 31, and the third sealant sleeve 8 is configured to seal the gap between the rear shell 7 and the support portion 31, So that the back cavity 9 can be a sealed cavity.

Similarly, there is a first sealing rubber sleeve between the casing 12 and the casing 2 of the earmuff assembly 1, so that the first sealing rubber sleeve can seal the gap between the casing 12 and the casing 2, thereby reducing the entry of environmental noise. Probability in the headset module; there is a second sealing rubber sleeve between the housing 2 and the support portion 31, so that the second sealing rubber sleeve can seal the gap between the housing 2 and the support portion 31 to reduce the environment The probability of noise entering the headset module.

The headphone module provided in this embodiment further includes a circuit board assembly, the circuit board assembly is fixed on the support portion 31, and the circuit board assembly is electrically connected to the speaker 4 and the call microphone 5, respectively. In some embodiments, the circuit board assembly includes a radio call module but does not include an environmental noise reduction module, and the radio call module is electrically connected to the call microphone 5 to receive signals from the call microphone 5 and correspondingly generate voice call signals. Due to the design of the headset module of this embodiment, the call microphone 5 can receive low-noise voice signals through the user's ear canal, so there is no need to install a second microphone for noise reduction and an environmental noise reduction module. In some embodiments, the circuit board component may also include an environmental noise reduction module, a switch module, etc. The environmental noise reduction module can make the headphone module of this embodiment produce noise reduction compared to the existing headphone module. Headphones have lower noise voice signals.

This embodiment also provides a headset, which includes a headband component and two headset modules as described above. Among them, one headphone module is connected to the first end of the headband assembly, and the other headphone module is connected to the second end of the headband assembly. In some embodiments, the headband assembly and the headset module are detachably connected.

In this embodiment, the call microphone 5 is installed on the sound-emitting side of the speaker 4, which can eliminate the call microphone connecting rod of the traditional headset, so that the overall structure of the headset is more compact and indirect, which can save a lot of material costs. Facilitate the lightweight of the headset.

In the headset module and headset provided by this creation, the speaker 4 has a skeleton part 32 on the sound side, and the skeleton part 32 has an installation groove 321, so that the call microphone 5 can be installed in the installation groove 321, thereby making The call microphone 5 can be closer to the user’s ears. Since the user’s sound can pass through the solids in the head to produce vibrations, the vibrations will cause air conduction fluctuations in the cavity in the head (such as the passage between the mouth and ear). The fluctuation can be transmitted to the ear canal and can be transmitted through the ear canal by air conduction, so that the call microphone 5 can pick up the user’s voice signal from the vocal cords and transmit it to the skull ear through the ear canal. A closed space, and the earmuff assembly 1 has a good passive noise reduction effect, so that the environmental noise interference of the call microphone 5 is small or even not interfered by the environmental noise, so that the sound collected by the call microphone 5 is purer and reduces The difficulty of processing environmental noise is improved, and the processing efficiency of environmental noise is improved. The headset module and headset of this creation only need to be equipped with the call microphone 5 to obtain a purer voice signal compared with the existing headset; or the headset module and headset of this creation The headset only needs to be equipped with the call microphone 5 and the environmental noise reduction module to obtain a purer voice signal compared with the existing headset noise reduction headset.

This creation requires the priority of the Chinese patent application whose application date is April 13, 2021 and the application number is 202120748233.5. The entire content of this application is incorporated into this creation by reference.

1: Earmuff components 11: The first through hole 12: Cover 13: Dust cover 14: accommodating slot 2: shell 21: The first shell ring 22: second housing ring 221: Snap Slot 3: Support skeleton 31: Support 311: first support ring 312: second support ring 3121: snap block 32: Skeleton 321: installation slot 4: speaker 5: Call microphone 6: Protective sleeve 61: second through hole 7: back shell 8: The third sealant sleeve 9: back cavity

[Figure 1] is a schematic diagram of the structure of the headset module provided by this creative embodiment. [Fig. 2] is a schematic diagram 1 of an exploded structure of the headset module provided by this creative embodiment. [Figure 3] is the second schematic diagram of an exploded structure of the headset module provided by this creative embodiment. [Figure 4] is the front view of the headset module provided by this creative embodiment. [Figure 5] is the A-A cross-sectional view shown in Figure 4 of this creation. [Figure 6] is a schematic diagram of the structure of the protective cover provided by this creative embodiment.

11: The first through hole

12: Cover

13: Dust cover

14: accommodating slot

21: The first shell ring

22: second housing ring

311: first support ring

312: second support ring

32: Skeleton

4: speaker

5: Call microphone

6: Protective sleeve

7: back shell

9: back cavity

Claims (10)

A headphone module, the characteristics of which include: An earmuff assembly (1), the middle of the earmuff assembly (1) has a first through hole (11); A housing (2), the housing (2) is ring-shaped and connected to the earmuff assembly (1); The supporting frame (3) includes a supporting part (31) connected to the housing (2) and a skeleton part (32) connected to the supporting part (31), the skeleton part (32) is provided with a mounting groove (321) ； The loudspeaker (4) is fixed on the supporting part (31); The call microphone (5) is installed in the installation slot (321), and the call microphone (5) is located on the sound side of the speaker (4). The headphone module according to claim 1, which further includes a protective cover (6), the protective cover (6) is installed in the installation slot (321), and the call microphone (5) is installed in the protective cover (6). Inside the sleeve (6), and the protective sleeve (6) is respectively provided with second through holes (61) on both sides in a preset direction, and the preset direction is the thickness direction of the earmuff assembly (1). The headset module according to claim 1, wherein the sound receiving side of the call microphone (5) faces the first through hole (11). The headphone module according to claim 1, wherein the outline of the skeleton part (32) is circular, and the installation groove (321) is located in the central part of the skeleton part (32). The headphone module according to claim 4, wherein the central portion of the frame portion (32) protrudes toward the first through hole (11) with respect to the end portion of the frame portion (32), and the The mounting groove (321) is located in the first through hole (11). The headphone module according to claim 4, wherein the housing (2) includes a first housing ring portion (21) and a second housing ring portion (22), the second housing ring portion (22) Connecting the inner peripheral edge of the first shell ring portion (21) and extending toward the sound emitting side of the speaker (4), the support portion (31) includes a first support ring portion (311) and a second support ring Portion (312), the second support ring portion (312) is connected to the inner periphery of the first support ring portion (311) and extends toward the sound emitting side of the speaker (4), and the second support ring portion (312) is fixed In the second housing ring (22). The headphone module according to claim 6, wherein the inner side wall of the second housing ring portion (22) is provided with an engaging groove (221), and the outer side wall of the second supporting ring portion (312) A locking block (3121) is provided, and the locking block (3121) is locked in the locking groove (221). The headphone module according to claim 1, which further comprises a rear shell (7), the rear shell (7) is connected to the supporting portion (31), and the rear shell (7) and the speaker ( 4) Form the back cavity (9). The headphone module according to claim 1, which further includes a circuit board assembly, the circuit board assembly is fixed on the supporting portion (31), and the circuit board assembly, the speaker (4) and the The call microphones (5) are electrically connected, and the circuit board assembly includes a radio call module. The radio call module is configured to receive signals from the call microphone (5) and correspondingly generate voice call signals. A headset, which is characterized by comprising a headband assembly and two headset modules as described in any one of claims 1 to 9, one of the two headset modules is the headset The headphone module is connected to the first end of the headband component, and the other of the two headphone modules is connected to the second end of the headband component.

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