CN214481199U

CN214481199U - Headset module and headset

Info

Publication number: CN214481199U
Application number: CN202120748233.5U
Authority: CN
Inventors: 陈思; 高飞
Original assignee: Dongguan Luxshare Precision Industry Co Ltd
Current assignee: Dongguan Luxshare Precision Industry Co Ltd
Priority date: 2021-04-13
Filing date: 2021-04-13
Publication date: 2021-10-22
Anticipated expiration: 2031-04-13
Also published as: TWM617940U

Abstract

The utility model discloses a headset module and a headset, which belong to the technical field of electronic equipment, wherein the headset module comprises an earmuff component, and the middle part of the earmuff component is provided with a first through hole; a shell in the shape of a ring and connected to the earmuff assembly; the supporting framework comprises a supporting part connected to the shell and a framework part connected to the supporting part, and the framework part is provided with a mounting groove; the loudspeaker is fixedly arranged on the supporting part; the communication microphone is arranged in the mounting groove and located on the sound emitting side of the loudspeaker, and the communication microphone can collect voice signals transmitted through bone conduction through the first through hole. The utility model provides a headphone module and headphone can reduce the processing degree of difficulty to ambient noise to and improve the treatment effeciency to ambient noise.

Description

Headset module and headset

Technical Field

The utility model relates to an electronic equipment technical field especially relates to a headphone module and headphone.

Background

The headset has a strong noise reduction function, so that the headset is widely applied, and along with the improvement of science and technology, the noise reduction requirement on the voice input signal of the headset is higher and higher.

In the prior art, the noise of the headset during conversation is processed through the environment noise reduction technology of the environment noise reduction module, and the main purpose of the environment noise reduction technology is to reduce the environment noise of a user during conversation, so that the conversation is clearer. The principle of the environment noise reduction technology is that a voice microphone close to the mouth of a user and a reference microphone installed on a shell of the headset are arranged, the voice microphone collects large voice and environmental noise of near-end sound, the reference microphone collects small voice and environmental noise of far-end sound, and the differential amplification circuit of the environment noise reduction module processes signals collected by the voice microphone and the reference microphone.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a headphone module and headphone has reduced the processing degree of difficulty to ambient noise, has improved the treatment effeciency to ambient noise.

As the conception, the utility model adopts the technical proposal that:

a headphone module, comprising:

an earmuff assembly having a first through-hole in a middle portion thereof;

a shell in the shape of a ring and connected to the earmuff assembly;

the supporting framework comprises a supporting part connected to the shell and a framework part connected to the supporting part, and the framework part is provided with a mounting groove;

the loudspeaker is fixedly arranged on the supporting part;

and the communication microphone is arranged in the mounting groove and is positioned at the sound emitting side of the loudspeaker.

Optionally, still include the protective sheath, the protective sheath install in the mounting groove, the conversation microphone install in the protective sheath, just the second through-hole has been seted up respectively to the protective sheath in the both sides of presetting the direction, it does to preset the direction the thickness direction of ear muff subassembly.

Optionally, the sound receiving side of the communication microphone faces the first through hole, and the protective sleeve is made of silica gel or rubber.

Optionally, the skeleton portion has a circular outer contour, and the mounting groove is located in a central portion of the skeleton portion.

Optionally, a central portion of the skeleton portion protrudes toward the first through hole with respect to an end portion of the skeleton portion, and the mounting groove is located in the first through hole.

Optionally, the housing includes a first housing ring portion and a second housing ring portion, the second housing ring portion connects an inner peripheral edge of the first housing ring portion and extends toward a sound emission side of the speaker, the support portion includes a first support ring portion and a second support ring portion, the second support ring portion connects an inner peripheral edge of the first support ring portion and extends toward a sound emission side of the speaker (4), and the second support ring portion is fixed in the second housing ring portion.

Optionally, the inner side wall of the second casing ring portion is provided with a clamping groove, the outer side wall of the second support ring portion is provided with a clamping block, and the clamping block is clamped in the clamping groove.

Optionally, the speaker further comprises a rear housing, the rear housing is connected to the supporting portion, and the rear housing and the speaker form a rear cavity.

Optionally, the mobile phone further comprises a circuit board assembly, the circuit board assembly is fixedly arranged on the supporting portion, the circuit board assembly is electrically connected with the loudspeaker and the communication microphone respectively, the circuit board assembly comprises a radio communication module, and the radio communication module receives signals of the communication microphone and generates voice communication signals correspondingly.

Optionally, still include first sealed gum cover and second sealed gum cover, first sealed gum cover is located the ear muff subassembly reaches between the casing, the sealed gum cover of second is located the casing with between the supporting part.

A headset comprises a headset body and two headset modules, wherein one headset module is connected with one end of the headset body, and the other headset module is connected with the other end of the headset body.

The utility model discloses following beneficial effect has at least:

the utility model provides a headphone module and headphone, the sound-emitting side of speaker has skeleton portion, and skeleton portion has the mounting groove, makes the conversation microphone can install in the mounting groove, and then makes the conversation microphone can be closer to user's ear, because the sound that the user sent can produce the vibration through the solid in its head, the vibration can produce the air conduction fluctuation in the cavity (for example the passageway between the ears) in the head, the fluctuation can be transmitted to the duct and can propagate in the air conduction mode through the duct, makes the conversation microphone can pick up the user's speech signal that comes from the vocal cord sound production and transmit to the skull ear inside through the duct, because the ear inside is a comparatively confined space, and the earmuff subassembly has better passive noise reduction effect, makes the environmental noise that the conversation microphone received disturb very little or even can not receive the interference of environmental noise, therefore, the voice collected by the call microphone is purer, the processing difficulty of the environmental noise is reduced, and the processing efficiency of the environmental noise is improved. The headset module and the headset of the utility model can obtain a voice signal which is purer than the existing headset only by arranging the conversation microphone; or the utility model discloses a headphone module and headphone only need set up the module of making an uproar falls in conversation microphone and environment just can obtain for current headphone the more pure speech signal of earphone of making an uproar falls.

Drawings

Fig. 1 is a schematic structural diagram of a headphone module according to an embodiment of the present invention;

fig. 2 is a schematic view of an exploded structure of a headphone module according to an embodiment of the present invention;

fig. 3 is a schematic view of an exploded structure of a headphone module according to an embodiment of the present invention;

fig. 4 is a front view of a headphone module according to an embodiment of the present invention;

fig. 5 is a cross-sectional view a-a of fig. 4 in accordance with the present invention;

fig. 6 is a schematic structural view of a protective sheath provided by an embodiment of the present invention.

In the figure:

1. an earmuff assembly; 11. a first through hole; 12. a housing; 13. a dust cover; 14. a containing groove; 2. a housing; 21. a first housing ring portion; 22. a second housing ring portion; 221. a clamping groove; 3. a support framework; 31. a support portion; 311. a first support ring portion; 312. a second support ring portion; 3121. a clamping block; 32. a skeleton portion; 321. mounting grooves; 4. a speaker; 5. a call microphone; 6. a protective sleeve; 61. a second through hole; 7. a rear housing; 8. and a third sealing rubber sleeve.

Detailed Description

In order to make the technical problem solved by the present invention, the technical solution adopted by the present invention and the technical effect achieved by the present invention clearer, the technical solution of the present invention will be further explained by combining the drawings and by means of the specific implementation manner. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements related to the present invention are shown in the drawings.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

This embodiment provides a headphone module, has reduced the processing degree of difficulty to ambient noise, has improved the treatment effeciency to ambient noise, and can have better speech noise reduction effect for the user can have better experience.

As shown in fig. 1 to 6, the headphone module includes an earmuff assembly 1, a housing 2, a supporting frame 3, a speaker 4 and a communication microphone 5.

Wherein, as shown in fig. 2, the middle part of the earmuff component 1 has a first through hole 11, and the first through hole 11 is used for matching with the ear of the user to buckle on the ear of the user, thereby realizing passive noise reduction. Casing 2 is cyclic annular and is connected in the edge of earmuff subassembly 1, specifically, casing 2 can be connected through the mode of joint with earmuff subassembly 1, has first buckle if the edge of casing 2, has the second buckle on the earmuff subassembly 1, and first buckle can be with the mutual joint of second buckle to realize casing 2 and earmuff subassembly 1's being connected.

The support frame 3 is used for supporting and fixing the speaker 4 and the call microphone 5. Specifically, as shown in fig. 3, the support frame 3 includes a support portion 31 fixedly connected to the housing 2 and a frame portion 32 fixedly connected to the support portion 31. The speaker 4 is fixed on the support 31, and the speaker 4 is located on one side of the skeleton portion 32.

And, the frame part 32 has a mounting groove 321 thereon, the call microphone 5 is mounted in the mounting groove 321, and the call microphone 5 is located on the sound emitting side of the speaker 4, so that the call microphone 5 can be close to the ear and skull of the user. The sound reception side of the communication microphone 5 faces the first through hole 11, the communication microphone 5 can collect the voice signal transmitted by bone vibration conduction and ear canal gas fluctuation conduction through the first through hole 11, that is, when the user is in communication, sound is generated by a vocal cord, and vibration is generated by bones or tissues and other solids inside the head of the human body, the vibration is transmitted to the inside of the ear canal, so that the gas inside the ear canal fluctuates, the fluctuation is transmitted in a concentrated manner to cause the communication microphone 5, and then the communication microphone 5 can collect the voice signal transmitted to the inside of the ear canal in a concentrated manner. In some embodiments, the noise reduction processing may be performed on the voice signal in the call microphone 5 by using the environment noise reduction module, and since the call microphone 5 is close to the ear muff assembly 1, the call microphone 5 can collect less environment noise or even can not collect environment noise, so that the working strength of the environment noise reduction module can be reduced, the processing efficiency of the environment noise reduction module is improved, and the situation of the processed sound being reduced or distorted is also reduced. It can be understood that, since the speech signal collected by the microphone 5 is doped with little or no ambient noise, the speech signal in the microphone 5 may be subjected to noise reduction without using an ambient noise reduction module, so as to reduce the number of electronic components in the headphone module, further reduce the power consumption of the headphone module, and reduce the situation of the processed sound becoming small or distorted.

In the headphone module provided by this embodiment, the frame portion 32 is disposed on the sound-emitting side of the speaker 4, and the frame portion 32 has the mounting groove 321, so that the microphone 5 can be mounted in the mounting groove 321, and further the microphone 5 can be closer to the ear of the user, because the sound emitted by the user can generate vibration through the solid in the head, the vibration can generate air conduction fluctuation in the chamber (for example, the channel between the ears) in the head, the fluctuation can be transmitted to the ear canal and can be transmitted in an air conduction manner through the ear canal, so that the microphone 5 can pick up the voice signal of the user from the vocal cord sounding and transmitted to the inside of the skull bone through the ear canal, because the inside of the ear is a relatively closed space, and the earmuff assembly 1 has a relatively good passive noise reduction effect, so that the ambient noise interference on the microphone 5 is very small or even can not be interfered by the ambient noise, therefore, the voice collected by the call microphone 5 is purer, the processing difficulty of the environmental noise is reduced, and the processing efficiency of the environmental noise is improved.

In addition, for the noise reduction headset of the prior art, the environmental noise reduction module needs to correct the gain and the time delay of the near-end speech and the far-end speech before working, detect and recognize the speech signal and the environmental noise signal, and then suppress the environmental noise through the filter module. When the noise of the external environment is large or the external environment is overlapped with the frequency spectrum of the voice signal, the voice signal after noise reduction processing is eliminated due to the fact that the suppression parameter is too large, and then the passing sound is reduced or distorted; and if the suppression parameters are too small, the noise reduction effect is not obvious, and the situation of inaudibility is easily caused. In the headphone module provided by this embodiment, because there is no interference of external environment noise, or there is only interference of smaller external environment noise, the requirement of the environment noise reduction technology of the environment noise reduction module on the algorithm for separating and eliminating external environment noise is lower, and then the design cost of the headphone is concentrated on picking up the skull voice signal of the user and amplifying and restoring, and the technical difficulty is easier to break through. That is to say, the utility model discloses a headphone module and headphone only need set up the conversation microphone, through its isolated external environment noise's structural design and the design of the conversation microphone that corresponds to duct closed environment, just can obtain the speech signal for current headphone lower noise: or the utility model discloses a headphone module and headphone only need set up the module of making an uproar falls in conversation microphone and environment just can obtain the speech signal who falls the earphone lower noise for current headphone.

Further, as shown in fig. 2 or fig. 3, the headphone module further includes a protective cover 6. Wherein, the protection cover 6 is installed in the installation groove 321, and the communication microphone 5 is installed in the protection cover 6, that is, the communication microphone 5 is installed in the installation groove 321 through the protection cover 6. The protective cover 6 is provided to prevent the call microphone 5 from being damaged by collision with the inner wall of the mounting groove 321. In addition, as shown in fig. 6, the two sides of the protective cover 6 in the preset direction are respectively provided with a second through hole 61, so that the microphone 5 can collect voice signals through the second through hole 61, and the microphone 5 can be electrically connected to other electronic structures. The predetermined direction is a thickness direction of the ear muff assembly 1, that is, an up-down direction in fig. 5. Optionally, the protective casing 6 in this embodiment is in interference fit with the inner wall of the mounting groove 321 to reduce the probability of the protective casing 6 separating from the mounting groove 321.

Further, the material of the protective sheath 6 in this embodiment is silica gel, rubber or plastic, so that the protective sheath 6 can be softer, and can play a role in shock resistance.

Alternatively, as shown in fig. 2 or fig. 3, the skeleton portion 32 has a circular contour, and the mounting groove 321 is located in the central portion of the skeleton portion 32, so that the call microphone 5 can uniformly collect the sound signal transmitted by the first through hole 11 or the ear muff assembly 1, and the interference degree of the call microphone 5 on the sound emitted by the speaker 4 can be reduced. Illustratively, the cross section of the first through hole 11 is circular, and the cross section of the mounting groove 321 is also circular, and the axis of the first through hole 11 is collinear with the axis of the mounting groove 321.

Further, the skeleton portion 32 is a mesh structure formed of a plurality of bar structures, that is, the skeleton portion 32 has a plurality of hollowed holes so that the sound emitted from the speaker 4 can be transmitted through the hollowed holes. Illustratively, as shown in fig. 3, the skeleton portion 32 in the present embodiment has an eight-diagram matrix shape.

In this embodiment, the sound receiving side of the conversation microphone 5 faces the first through hole 11, so that the conversation microphone 5 can effectively collect sound in the first through hole 11.

Referring to fig. 5, the center of the skeleton portion 32 protrudes toward the first through hole 11 relative to the end of the skeleton portion 32, and the mounting groove 321 is located in the first through hole 11, so as to further reduce the distance between the call microphone 5 and the ear canal or skull of the user, and facilitate picking up the voice signal propagated by the ear canal or skull.

In this embodiment, earmuff component 1 and user's skull direct contact make user's duct form more confined environment for the fluctuation of the inside speech signal of duct can concentrate and spread to conversation microphone 5, makes conversation microphone 5 can acquire speech signal more accurately, has increased conversation microphone 5 and has acquireed the way of speech signal, has guaranteed conversation microphone 5 and has acquireed the reliability of speech signal. Illustratively, as shown in fig. 3, the earmuff assembly 1 includes a housing 12 and a dust cover 13 covering the housing 12, the first through hole 11 is opened on the housing 12, and the dust cover 13 covers the first through hole 11.

In some embodiments, the shell 2 includes a first shell ring portion 21 and a second shell ring portion 22, the second shell ring portion 22 connects the inner periphery of the first shell ring portion 21 and extends toward the sound-emitting side of the speaker 4, the first shell ring portion 21 and the second shell ring portion 22 have a stepped cross section, and the earmuff assembly 1 has a receiving groove 14 with a stepped cross section, the cross section contour of the receiving groove 14 corresponds to the cross section contour of the shell 2, so that the shell 2 is stably and compactly received in the receiving groove 14. The supporting portion 31 includes a first supporting ring portion 311 and a second supporting ring portion 312, the second supporting ring portion 312 connects the inner periphery of the first supporting ring portion 311 and extends toward the sound emitting side of the speaker 4, the first supporting ring portion 311 and the second supporting ring portion 312 have a stepped cross section, and the cross section contour of the housing 2 corresponds to the cross section contour of the supporting portion 31, so that the supporting portion 31 is stably and compactly accommodated in the housing 2. Wherein the second support ring portion 312 is fixed in the second housing ring portion 22. In some embodiments, the inner sidewall of the second housing ring 22 is provided with a snap groove 221, the outer sidewall of the second support ring 312 is provided with a snap block 3121, and the snap block 3121 is snapped into the snap groove 221. In some embodiments, the engaging grooves 221 and the engaging blocks 3121 are respectively provided in a plurality and annularly spaced.

Optionally, referring to fig. 3 or fig. 5, the headphone module further includes a rear housing 7. Wherein the rear shell 7 is fixedly connected to the support part 31, and the rear shell 7 and the loudspeaker 4 form a rear cavity.

Further, as shown in fig. 3, a third sealant sleeve 8 is provided between the rear case 7 and the support portion 31, and the third sealant sleeve 8 is used for sealing a gap between the rear case 7 and the support portion 31, so that the rear cavity can be a sealed cavity.

Similarly, a first sealing rubber sleeve is arranged between the shell 12 and the shell 2 of the earmuff assembly 1, so that the first sealing rubber sleeve can seal a gap between the shell 12 and the shell 2, and further the possibility of environmental noise entering the headphone module is reduced; a second sealing rubber sleeve is arranged between the shell 2 and the supporting part 31, so that a gap between the shell 2 and the supporting part 31 can be sealed by the third sealing rubber sleeve, and the probability of environmental noise entering the headphone module is further reduced.

It can be understood that the headset module provided in this embodiment further includes a circuit board assembly, the circuit board assembly is fixedly disposed on the supporting portion 31, and the circuit board assembly is electrically connected to the speaker 4 and the microphone 5 respectively. In some embodiments, the circuit board assembly includes a radio call module electrically connected to the call microphone 5 to receive a signal of the call microphone 5 and correspondingly generate a voice call signal, but does not include an environmental noise reduction module. Due to the design of the headset module of this embodiment, the microphone 5 can receive the voice signal with low noise through the ear canal of the user, so that it is not necessary to provide a second microphone for noise reduction and an environmental noise reduction module. In some embodiments, the circuit board assembly may also include an ambient noise reduction module, a switch module, and the like, where the ambient noise reduction module enables the headset module of this embodiment to generate a voice signal with lower noise than the conventional headset.

The embodiment also provides a headset, which comprises a head band assembly and two headset modules as described above. Wherein, a headphone module is connected with one end of the head band component, and the other headphone module is connected with the other end of the head band component. In some embodiments, the headband assembly is removably connected with the headset module.

In this embodiment, the call microphone 5 is installed on the sound emitting side of the speaker 4, and the call microphone connecting rod of the conventional headset can be eliminated, so that the whole structure of the headset is more compact and indirect, a large amount of material cost can be saved, and the headset is convenient to lighten.

The above embodiments have been described only the basic principles and features of the present invention, and the present invention is not limited by the above embodiments, and is not departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A headphone module, comprising:

an earmuff assembly (1), wherein the middle part of the earmuff assembly (1) is provided with a first through hole (11);

a shell (2), said shell (2) being annular and connected to said earmuff assembly (1);

a support frame (3) which comprises a support part (31) connected to the shell (2) and a frame part (32) connected to the support part (31), wherein the frame part (32) is provided with a mounting groove (321);

a loudspeaker (4) fixedly arranged on the supporting part (31);

and the conversation microphone (5) is arranged in the mounting groove (321), and the conversation microphone (5) is positioned on the sound emitting side of the loudspeaker (4).

2. The headphone module as claimed in claim 1, further comprising a protective sleeve (6), wherein the protective sleeve (6) is installed in the installation groove (321), the microphone (5) is installed in the protective sleeve (6), and the protective sleeve (6) has second through holes (61) respectively opened on two sides in a predetermined direction, the predetermined direction being a thickness direction of the earmuff assembly (1).

3. The headphone module as claimed in claim 1, wherein the sound reception side of the conversation microphone (5) faces the first through hole (11).

4. The headphone module according to claim 1, wherein the skeleton portion (32) has a circular outer contour, and the mounting groove (321) is located in a central portion of the skeleton portion (32).

5. The headphone module according to claim 4, wherein a central portion of the skeleton portion (32) protrudes toward the first through hole (11) with respect to an end of the skeleton portion (32), and the mounting groove (321) is located in the first through hole (11).

6. A headphone module according to claim 4, characterized in that the housing (2) comprises a first housing ring section (21) and a second housing ring section (22), the second housing ring section (22) connecting the inner circumference of the first housing ring section (21) and extending towards the sound emitting side of the loudspeaker (4), the support section (31) comprising a first support ring section (311) and a second support ring section (312), the second support ring section (312) connecting the inner circumference of the first support ring section (311) and extending towards the sound emitting side of the loudspeaker (4), the second support ring section (312) being fixed in the second housing ring section (22).

7. The headphone module as claimed in claim 6, characterized in that the inner side wall of the second housing ring part (22) is provided with a snap groove (221), the outer side wall of the second support ring part (312) is provided with a snap block (3121), the snap block (3121) snap in the snap groove (221).

8. A headphone set according to claim 1, characterized in that it further comprises a rear shell (7), the rear shell (7) being connected to the support (31), and the rear shell (7) forming a rear cavity with the loudspeaker (4).

9. The headset module of claim 1, further comprising a circuit board assembly, wherein the circuit board assembly is fixedly disposed on the support portion (31), and the circuit board assembly is electrically connected to the speaker (4) and the call microphone (5), respectively, and the circuit board assembly comprises a sound receiving and call module, and the sound receiving and call module receives a signal from the call microphone (5) and generates a voice call signal correspondingly.

10. A headphone comprising a headband assembly and two headphone modules according to any one of claims 1-9, one of the headphone modules being connected to one end of the headband assembly and the other of the headphone modules being connected to the other end of the headband assembly.