TWM616006U - Sensing apparatus and keycap - Google Patents
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本創作係關於一種感測裝置及一種鍵帽。具體而言,本創作係關於一種與鍵帽結合的感測裝置,以及一種與感測裝置結合的鍵帽。This creation is about a sensing device and a key cap. Specifically, this creation is about a sensing device combined with a keycap, and a keycap combined with the sensing device.
於資通訊領域,以生物特徵(例如:指紋)進行使用者的身分認證,為電子產品所廣泛採用之認證方式。以指紋辨識為例,傳統的指紋感測裝置,為獨立於電子產品的外接裝置;即便是內建的指紋感測裝置,仍為電子產品內僅具單一功能(例如:指紋辨識)的獨立元件,需佔用電子產品額外的內部空間。如何將可擷取使用者的生物特徵之感測裝置,與電子產品的現有元件進行整合,以減少所需占用之電子產品的內部空間,並具有一體成形的簡潔外觀,為資通訊產業所欲解決之課題。In the field of information and communications, the use of biometrics (such as fingerprints) for user identity authentication is a widely used authentication method for electronic products. Take fingerprint recognition as an example. The traditional fingerprint sensing device is an external device independent of the electronic product; even the built-in fingerprint sensing device is an independent component with only a single function (such as fingerprint recognition) in the electronic product , Need to take up additional internal space for electronic products. How to integrate the sensor device that can capture the user's biological characteristics with the existing components of the electronic product to reduce the internal space of the electronic product that needs to be occupied, and to have an integrated and concise appearance, which is desired by the information and communications industry Problem solved.
本創作之一目的在於提供一種與鍵帽結合的感測裝置,提供電子裝置之鍵入以及生物特徵(例如:指紋)感測等功能,並具有一體成形的簡潔外觀。One purpose of this creation is to provide a sensing device combined with a keycap, providing electronic device input and biometric (for example: fingerprint) sensing functions, and having an integrated and concise appearance.
本創作之另一目的在於提供一種與感測裝置結合的鍵帽,提供電子裝置之鍵入以及生物特徵(例如:指紋)感測等功能,並具有一體成形的簡潔外觀。Another purpose of the present creation is to provide a keycap combined with a sensing device, which provides functions such as electronic device typing and biometric (eg fingerprint) sensing, and has a compact and integrated appearance.
本創作之一實施態樣涉及一種感測裝置。感測裝置包含感測單元及基座單元。感測單元包含感測單元第一表面,感測單元第一表面具有結合區域以及非結合區域,結合區域與非結合區域相互錯開且形狀相互對應。基座單元包含基座單元第一表面,基座單元第一表面具有接觸區域以及非接觸區域,接觸區域與非接觸區域相互錯開且形狀相互對應。感測單元以結合區域與基座單元的接觸區域相結合;感測單元與基座單元的側邊切齊。One implementation aspect of this creation involves a sensing device. The sensing device includes a sensing unit and a base unit. The sensing unit includes a first surface of the sensing unit, and the first surface of the sensing unit has a binding area and a non-binding area. The binding area and the non-binding area are staggered and the shapes correspond to each other. The base unit includes a first surface of the base unit. The first surface of the base unit has a contact area and a non-contact area. The contact area and the non-contact area are mutually staggered and have corresponding shapes. The sensing unit is combined with the contact area of the base unit by a coupling area; the sensing unit is aligned with the side edge of the base unit.
本創作之一另實施態樣涉及一種鍵帽。鍵帽包含感測單元及基座單元。感測單元包含感測單元第一表面,感測單元第一表面具有結合區域以及非結合區域,結合區域與非結合區域相互錯開且形狀相互對應。基座單元包含基座單元第一表面,基座單元第一表面具有接觸區域以及非接觸區域,接觸區域與非接觸區域相互錯開且形狀相互對應。感測單元以結合區域與基座單元的接觸區域相結合;感測單元與基座單元的側邊切齊。Another implementation aspect of this creation involves a keycap. The keycap includes a sensing unit and a base unit. The sensing unit includes a first surface of the sensing unit, and the first surface of the sensing unit has a binding area and a non-binding area. The binding area and the non-binding area are staggered and the shapes correspond to each other. The base unit includes a first surface of the base unit. The first surface of the base unit has a contact area and a non-contact area. The contact area and the non-contact area are mutually staggered and have corresponding shapes. The sensing unit is combined with the contact area of the base unit by a coupling area; the sensing unit is aligned with the side edge of the base unit.
本創作係提供一種感測裝置,其係可以鍵盤鍵帽、滑鼠按鍵、鍵盤或其他電子裝置殼體之形式實施。圖1為根據本創作一實施例所繪示的鍵帽10之爆炸示意圖;圖2為根據本創作一實施例所繪示的鍵帽10之立體示意圖。在本實施例中,作為感測裝置之鍵帽10包含感測單元200及基座單元300,如圖1及圖2所示。This creation provides a sensing device, which can be implemented in the form of a keyboard keycap, mouse button, keyboard or other electronic device housing. FIG. 1 is an exploded schematic diagram of a
值得注意的是,於各種實施例中,感測裝置可為電子裝置之具有感測功能的一功能性元件,同時具有電子裝置之其他功能。於一較佳實施例,電子裝置為筆記型電腦、桌上型電腦、行動裝置…或其他具有感測功能的電子裝置。於一較佳實施例,感測功能為生物特徵(例如:指紋)感測及辨識功能,感測裝置為具有生物特徵(例如:指紋)感測及辨識功能的電子裝置之一功能性元件,例如:筆記型電腦之指紋感測器;感測裝置同時具有電子裝置之其他功能,例如:筆記型電腦之鍵入功能。It is worth noting that, in various embodiments, the sensing device can be a functional element of the electronic device that has a sensing function, and also has other functions of the electronic device. In a preferred embodiment, the electronic device is a notebook computer, a desktop computer, a mobile device... or other electronic devices with a sensing function. In a preferred embodiment, the sensing function is a biometric (e.g., fingerprint) sensing and recognition function, and the sensing device is a functional element of an electronic device with a biometric (e.g., fingerprint) sensing and recognizing function, For example: the fingerprint sensor of the notebook computer; the sensor device also has other functions of the electronic device, such as the typing function of the notebook computer.
值得注意的是,於一較佳實施例,鍵帽10為電子裝置之具有鍵入功能的一功能性元件,同時具有電子裝置之其他功能,例如:感測功能。於一較佳實施例,電子裝置為筆記型電腦、桌上型電腦、行動裝置…或其他具有鍵入功能的電子裝置。於一較佳實施例,鍵帽10為電子裝置(例如:筆記型電腦)的鍵入裝置(例如:鍵盤)的其中一個鍵帽;鍵帽10同時具有電子裝置之其他功能,例如:筆記型電腦之感測功能。It is worth noting that, in a preferred embodiment, the
進一步而言,感測單元200包含感測單元第一表面S21,感測單元第一表面S21具有結合區域A1以及非結合區域A2,結合區域A1與非結合區域A2相互錯開且形狀相互對應,如圖1所示。具體而言,將感測單元第一表面S21所涵蓋區域,扣除非結合區域A2,所剩餘的區域即為結合區域A1;換言之,結合區域A1的形狀以及非結合區域A2的形狀共同形成感測單元第一表面S21的形狀。值得注意的是,圖1所示為結合區域A1以及所對應的非結合區域A2的較佳形狀,於其他實施例中,亦可依設計需求呈現不同的形狀。Furthermore, the
基座單元300包含基座單元第一表面S31,基座單元第一表面S31具有接觸區域B1以及非接觸區域B2,接觸區域B1與非接觸區域B2相互錯開且形狀相互對應,如圖1所示。具體而言,將基座單元第一表面S31所涵蓋區域,扣除非接觸區域B2,所剩餘的區域即為接觸區域B1;換言之,接觸區域B1的形狀以及非接觸區域B2的形狀共同形成基座單元第一表面S31的形狀。值得注意的是,圖1所示為接觸區域B1以及所對應的非接觸區域B2的較佳形狀,於其他實施例中,亦可依設計需求呈現不同的形狀。The
感測單元200以結合區域A1與基座單元300的接觸區域B1相結合,如圖1所示。感測單元200與基座單元300的側邊切齊;具體而言,結合後之感測單元200與基座單元300,其外觀看起來為單一物件,如圖2所示。The
圖3為根據本創作一實施例所繪示的第一垂直投影範圍P1及第二垂直投影範圍P2之立體示意圖。如圖3所示,感測單元200於平行於感測單元第一表面S21之虛擬投影面E1具有第一垂直投影範圍P1,基座單元300於虛擬投影面E1具有第二垂直投影範圍P2;具體而言,虛擬投影面E1分別與感測單元第一表面S21及基座單元第一表面S31相互平行。於虛擬投影面E1,第一垂直投影範圍P1及第二垂直投影範圍P2相互疊合;換言之,感測單元200的感測單元第一表面S21及基座單元300的基座單元第一表面S31具有相同的形狀以及相同的大小。3 is a three-dimensional schematic diagram of the first vertical projection range P1 and the second vertical projection range P2 drawn according to an embodiment of the present creation. As shown in FIG. 3, the
圖4為根據本創作一實施例所繪示的第三垂直投影範圍P3及第四垂直投影範圍P4之立體示意圖。如圖4所示,非結合區域A2於平行於感測單元第一表面S21之虛擬投影面E1具有第三垂直投影範圍P3,非接觸區域B2於虛擬投影面E1具有第四垂直投影範圍P4;具體而言,虛擬投影面E1分別與非結合區域A2及非接觸區域B2相互平行。於虛擬投影面E1,第三垂直投影範圍P3及第四垂直投影範圍P4相互疊合;換言之,感測單元200的非結合區域A2及基座單元300的非接觸區域B2具有相同的形狀以及相同的大小。FIG. 4 is a three-dimensional schematic diagram of the third vertical projection range P3 and the fourth vertical projection range P4 drawn according to an embodiment of the present creation. As shown in FIG. 4, the non-combined area A2 has a third vertical projection range P3 on the virtual projection surface E1 parallel to the first surface S21 of the sensing unit, and the non-contact area B2 has a fourth vertical projection range P4 on the virtual projection surface E1; Specifically, the virtual projection surface E1 is parallel to the non-joining area A2 and the non-contact area B2, respectively. On the virtual projection surface E1, the third vertical projection range P3 and the fourth vertical projection range P4 overlap each other; in other words, the non-combined area A2 of the
圖5為根據本創作另一實施例所繪示的鍵帽10之爆炸示意圖;圖6A及6B為根據本創作另一實施例所繪示的鍵帽10之剖面示意圖。圖5~圖6與圖1~圖4的差異在於,圖5~圖6所示實施例的鍵帽10進一步包含覆蓋層100,覆蓋層100分別覆蓋至少部分的感測單元200以及基座單元300。詳細而言,鍵帽10的感測單元200進一步包含感測單元第二表面S22以及感測單元側表面S23,感測單元第二表面S22相對於感測單元第一表面S21,感測單元第二表面S22及感測單元第一表面S21以感測單元側表面S23相連接,如圖5所示。鍵帽10的基座單元300進一步包含基座單元第二表面S32以及基座單元側表面S33,基座單元第二表面S32相對於基座單元第一表面S31,基座單元第二表面S32及基座單元第一表面S31以基座單元側表面S33相連接,如圖5所示。覆蓋層100分布於感測單元第二表面S22、感測單元側表面S23、以及基座單元側表面S33,如圖5~圖6所示。覆蓋層100之較佳厚度範圍為0.01~0.05mm;亦即,圖6A及圖6B所示的覆蓋層厚度dc的較佳範圍為0.01~0.05mm。於一較佳實施例,覆蓋層100之較佳厚度為0.03mm;亦即,圖6A及圖6B所示的覆蓋層厚度dc較佳為0.03mm。5 is an exploded schematic diagram of the
詳細而言,覆蓋層100分布於感測單元第二表面S22具有一第一覆蓋層厚度dc1,覆蓋層100分布於感測單元側表面S23與基座單元側表面S33具有一第二覆蓋層厚度dc2。值得注意的是,於圖6A及圖6B所示實施例,包覆於感測單元第二表面S22的覆蓋層100,與包覆於感測單元側表面S23及基座單元側表面S33的覆蓋層100,具有相同之覆蓋層厚度dc;亦即,第一覆蓋層厚度dc1等於第二覆蓋層厚度dc2,二者皆為覆蓋層厚度dc。於其他實施例(圖未示),亦可依設計需求,使包覆於感測單元第二表面S22的覆蓋層100,與包覆於感測單元側表面S23及基座單元側表面S33的覆蓋層100,具有不同之覆蓋層厚度;亦即,第一覆蓋層厚度dc1不等於第二覆蓋層厚度dc2。In detail, the
圖7為根據本創作另一實施例所繪示的鍵帽10之爆炸示意圖。圖7與圖1~圖6的差異在於,圖7所示實施例的鍵帽10進一步包含電路板500。詳細而言,鍵帽10的感測單元200進一步包含感測容置空間210以及容置於感測容置空間210之複數個電性連接點220。於平行感測單元第一表面S21之虛擬投影面E1,電性連接點220具有第五垂直投影範圍P5,電路板500具有第六垂直投影範圍P6;具體而言,虛擬投影面E1分別與感測單元第一表面S21及基座單元第一表面S31相互平行。於虛擬投影面E1,電性連接點220之垂直投影範圍(亦即,第五垂直投影範圍P5)落於電路板之垂直投影範圍(亦即,第六垂直投影範圍P6)內。於一較佳實施例,電路板500為可彎摺之軟性電路板。FIG. 7 is an exploded schematic diagram of the
詳細而言,鍵帽10的感測單元200進一步包含對應於非結合區域A2之電性連接點分布區域C2;感測容置空間210貫穿感測單元第一表面S21,以於感測單元第一表面S21形成非結合區域A2,並與電性連接點分布區域C2相鄰接,如圖7所示。In detail, the
詳細而言,鍵帽10的基座單元300進一步包含相對於基座單元第一表面S31之基座單元第二表面S32;基座單元300具有基座容置空間310;基座容置空間310貫穿基座單元第一表面S31以及基座單元第二表面S32,並於基座單元第一表面S31形成非接觸區域B2,如圖7所示。In detail, the
圖8為根據本創作一實施例所繪示的鍵帽10之立體示意圖。圖8與圖7的差異在於,圖8的電路板500穿過基座單元300的基座容置空間310以與感測單元200相接觸。詳細而言,圖8的電路板500進一步包含電路板第一表面S51,電路板第一表面S51具有電連接區域S511以及非電連接區域S512。於平行感測單元第一表面S21之虛擬投影面E1,電性連接點220具有第五垂直投影範圍P5,電連接區域S511具有第七垂直投影範圍P7;具體而言,虛擬投影面E1分別與感測單元第一表面S21及電路板第一表面S51相互平行。於虛擬投影面E1,電性連接點220之垂直投影範圍(亦即,第五垂直投影範圍P5)落於電連接區域S511之垂直投影範圍(亦即,第七垂直投影範圍P7)內。FIG. 8 is a three-dimensional schematic diagram of the
詳細而言,圖8的基座單元300具有基座容置空間310,電路板500的電路板第一表面S51的電連接區域S511穿過基座容置空間310以與感測單元第一表面S21相接觸,使電性連接點220電性連接於電連接區域S511。In detail, the
於一較佳實施例,電性連接點220以一內圈c1以及一外圈c2的方式分布於電性連接點分布區域C2,如圖7及圖8所示。於其他實施例,電性連接點220亦可依設計需求,做不同的分布。In a preferred embodiment, the electrical connection points 220 are distributed in the electrical connection point distribution area C2 in a manner of an inner ring c1 and an outer ring c2, as shown in FIGS. 7 and 8. In other embodiments, the electrical connection points 220 can also be distributed differently according to design requirements.
圖9為根據本創作一實施例所繪示的鍵帽10之剖面示意圖。具體而言,圖9為對應於圖8的鍵帽10之立體示意圖的剖面示意圖。如圖9所示,於一較佳實施例,當感測單元第二表面S22受到壓力Fp,傳送生物特徵訊號以及開關機訊號至電路板500。於一較佳實施例,生物特徵訊號為指紋辨識訊號。具體而言,當使用者以手指按壓感測單元200,感測單元第二表面S22受到壓力Fp,感測單元200藉由電性連接點220與電路板500的電連接區域S511進行電性連接,並傳送生物特徵訊號(例如:指紋辨識訊號)以及開關機訊號至電路板500。於一較佳實施例,電路板500進一步將生物特徵訊號(例如:指紋辨識訊號)以及開關機訊號傳送至電子裝置之處理單元(圖未示),進行使用者的生物特徵(例如:指紋)辨識以及電子裝置的開關機。FIG. 9 is a schematic cross-sectional view of the
於一較佳實施例,藉此生物特徵(例如:指紋)辨識功能與開關機功能之結合,可以對使用者進行身分驗證,確認是由哪個使用者曾經對電子裝置(圖未示)進行開關機。於一較佳實施例,可進一步預先設定電子裝置的開關機之權限,避免不具權限的使用者對電子裝置進行開關機;或是避免不具權限的使用者冒用其他人的身分(例如:盜用管理者的帳號密碼),對不具權限的電子裝置進行開關機。In a preferred embodiment, by combining the biometrics (for example: fingerprint) recognition function with the switch function, the user's identity can be verified to confirm which user has switched on the electronic device (not shown) machine. In a preferred embodiment, the authority for turning on and off the electronic device can be further pre-set to prevent unauthorized users from turning on and off the electronic device; or to prevent unauthorized users from fraudulently using the identity of other people (for example, embezzling Administrator’s account password), turn on and off the electronic device without authority.
如圖9所示,於另一較佳實施例,當感測單元第二表面S22受到壓力Fp,傳送生物特徵訊號(例如:指紋辨識訊號)以及鍵入訊號至電路板500。詳細而言,當使用者以手指按壓感測單元200,感測單元第二表面S22受到壓力Fp,感測單元200藉由電性連接點220與電路板500的電連接區域S511進行電性連接,並傳送生物特徵訊號(例如:指紋辨識訊號)以及鍵入訊號至電路板500。於一較佳實施例,電路板500進一步將生物特徵(例如:指紋)辨識訊號)以及鍵入訊號傳送至電子裝置之處理單元(圖未示),進行使用者的生物特徵(例如:指紋)辨識以及電子裝置的鍵入。As shown in FIG. 9, in another preferred embodiment, when the second surface S22 of the sensing unit receives a pressure Fp, a biometric signal (for example, a fingerprint recognition signal) and a key-in signal are sent to the
於一較佳實施例,藉此生物特徵(例如:指紋)辨識功能與鍵入功能之結合,可以對使用者進行身分驗證,確認是由哪個使用者曾經對電子裝置(圖未示)進行鍵入;具體而言,當使用者開啟文字編輯器進行文字編輯,不須藉由額外的驗證方式(例如:數位簽章),即可得知這段文字是由哪個使用者鍵入。於一較佳實施例,可進一步預設鍵入的權限,避免不具權限的使用者對電子裝置進行鍵入;或是避免不具權限的使用者冒用其他人的身分(例如:盜用其他人的帳號密碼),對不具權限的電子裝置進行鍵入;或是避免不具權限的使用者,冒用其他人的身分,對已開啟編輯功能的文件內容進行竄改。In a preferred embodiment, by combining the biometrics (for example: fingerprint) recognition function and the keying function, the user can be authenticated to confirm which user has keyed the electronic device (not shown); Specifically, when the user opens the text editor for text editing, no additional verification method (such as digital signature) is required to know which user typed the text. In a preferred embodiment, the authority for typing can be further preset to prevent users without authority from typing on the electronic device; or users without authority can pretend to use other people's identity (for example, stealing other people's account passwords) ), to type in an electronic device that has no authority; or to prevent an unauthorized user from using the identity of another person to tamper with the content of the document that has the editing function turned on.
圖10為根據本創作一實施例所繪示的第一凹角w1~第八凹角w8之立體示意圖。具體而言,基座單元300的基座單元第一表面S31之非接觸區域B2具有第一凹角w1、第二凹角w2、第三凹角w3、以及第四凹角w4;感測單元200的感測單元第一表面S21之非結合區域A2具有第五凹角w5、第六凹角w6、第七凹角w7、以及第八凹角w8。第一凹角w1、第二凹角w2、第三凹角w3、以及第四凹角w4的形狀分別與第五凹角w5、第六凹角w6、第七凹角w7、以及第八凹角w8的形狀相互對應;亦即,第一凹角w1的形狀對應於第五凹角w5的形狀、第二凹角w2形狀對應於第六凹角w6的形狀、第三凹角w3的形狀對應於第七凹角w7的形狀、第四凹角w4的形狀對應於第八凹角w8的形狀。FIG. 10 is a three-dimensional schematic diagram of the first concave corner w1 to the eighth concave corner w8 drawn according to an embodiment of the present creation. Specifically, the non-contact area B2 of the base unit first surface S31 of the
於一較佳實施例,非接觸區域B2的第一凹角w1、第二凹角w2、第三凹角w3、以及第四凹角w4為分別向非接觸區域B2的中心凹陷的直角,非結合區域A2的第五凹角w5、第六凹角w6、第七凹角w7、以及第八凹角w8為分別向非結合區域A2的中心凹陷的直角,如圖10所示。於其他實施例,各個凹角(第一凹角w1~第八凹角w8)亦可依設計需求呈現例如鈍角或銳角等其他的角度。In a preferred embodiment, the first reentrant angle w1, the second reentrant angle w2, the third reentrant angle w3, and the fourth reentrant angle w4 of the non-contact area B2 are right angles recessed toward the center of the non-contact area B2. The fifth recessed corner w5, the sixth recessed corner w6, the seventh recessed corner w7, and the eighth recessed corner w8 are right angles respectively recessed toward the center of the non-bonding area A2, as shown in FIG. 10. In other embodiments, each of the concave angles (the first concave angle w1 to the eighth concave angle w8) can also present other angles such as obtuse angles or acute angles according to design requirements.
圖11為根據本創作一實施例所繪示的基座單元300之立體示意圖。詳細而言,基座單元300進一步包含第一連接件321、第二連接件322、第三連接件323以及第四連接件324;基座單元300進一步包含相對於基座單元第一表面S31之基座單元第二表面S32,基座單元第二表面S32具有第一邊L1以及對應於第一邊L1的第二邊L2。換言之,第一邊L1以及第二邊L2分別位於基座單元第二表面S32相對應之兩側。FIG. 11 is a three-dimensional schematic diagram of the
如圖11所示,第一連接件321及第二連接件322沿第一方向D1相對設置於基座單元第二表面S32之第一邊L1;第三連接件323及第四連接件324沿第一方向D1相對設置於基座單元第二表面S32之第二邊L2。換言之,第一方向D1為由第一連接件321指向第二連接件322的方向,第一方向D1亦為由第三連接件323指向第四連接件324的方向。如圖11所示,第一連接件321及第二連接件322相距第一距離d1;第三連接件323及第四連接件324相距第二距離d2;第一距離d1較第二距離d2為長。As shown in FIG. 11, the first connecting
如圖11所示,基座單元第二表面S32具有連接區域G1以及非連接區域G2,連接區域G1與非連接區域G2相互錯開且形狀相互對應。具體而言,將基座單元第二表面S32所涵蓋區域,扣除連接區域G1,所剩餘的區域即為非連接區域G2;換言之,連接區域G1的形狀以及非連接區域G2的形狀共同形成基座單元第二表面S32的形狀。As shown in FIG. 11, the second surface S32 of the base unit has a connection area G1 and a non-connection area G2, and the connection area G1 and the non-connection area G2 are offset from each other and have shapes corresponding to each other. Specifically, the area covered by the second surface S32 of the base unit is subtracted from the connection area G1, and the remaining area is the non-connection area G2; in other words, the shape of the connection area G1 and the shape of the non-connection area G2 together form the base The shape of the second surface S32 of the unit.
如圖11所示,連接區域G1具有第一凸角m1、第二凸角m2、第三凸角m3、及第四凸角m4。具體而言,第一凸角m1及第二凸角m2位於連接區域G1靠近第一邊L1的一側,第三凸角m3及及第四凸角m4位於連接區域G1靠近第二邊L2的一側;第一方向D1為由第一凸角m1指向第二凸角m2的方向,第一方向D1亦為由第三凸角m3指向第四凸角m4的方向。As shown in FIG. 11, the connection area G1 has a first lobe m1, a second lobe m2, a third lobe m3, and a fourth lobe m4. Specifically, the first lobe m1 and the second lobe m2 are located on the side of the connecting region G1 close to the first side L1, and the third lobe m3 and the fourth lobe m4 are located on the side of the connecting region G1 close to the second side L2. One side; the first direction D1 is the direction from the first lobe m1 to the second lobe m2, and the first direction D1 is also the direction from the third lobe m3 to the fourth lobe m4.
詳細而言,於靠近基座單元第二表面S32之第一邊L1的一側,第一連接件321及第二連接件322分別位於遠離第一凸角m1以及第二凸角m2的一側;亦即,第一連接件321不位於第一凸角m1,第二連接件322不位於第二凸角m2。詳細而言,於靠近該第二邊的一側,第三連接件323及第四連接件324分別位於第三凸角m3以及第四凸角m4。In detail, on the side close to the first side L1 of the second surface S32 of the base unit, the first connecting
圖12A~12C為根據本創作一實施例所繪示的感測單元200之立體示意圖。如圖12A~12C所示,感測單元200的感測單元第一表面S21之結合區域A1具有粗糙面R。具體而言,感測單元200與基座單元300進行結合前,可使用例如雷射打點(如圖12A所示)、機械研磨(如圖12B及12C所示)、或化學蝕刻(圖未示)…等方式,將感測單元200欲與基座單元300結合的區域(亦即,結合區域A1)進行表面粗糙化,使結合區域A1成為粗糙面R。12A to 12C are three-dimensional schematic diagrams of the
圖13為根據本創作另一實施例所繪示的鍵帽10之立體示意圖。具體而言,圖13的鍵帽10為圖11的基座單元300與圖12A~12C的感測單元200相互結合後,再將覆蓋層100塗佈於感測單元200以及基座單元300的表面。於一較佳實施例,覆蓋層100為彩色漆;感測單元200以及基座單元300結合後,依設計需求將所需彩色漆噴塗於感測單元200的感測單元第二表面S22、感測單元側表面S23,以及基座單元300的基座單元側表面S33,使鍵帽10的外觀展現客製化的顏色。於另一實施例,覆蓋層100為保護漆;感測單元200以及基座單元300結合後,將保護漆噴塗於感測單元200的感測單元第二表面S22、感測單元側表面S23,以及基座單元300的基座單元側表面S33,藉由保護漆,可使鍵帽10具有耐磨、抗刮之功能,以進一步延長鍵帽10之使用年限。FIG. 13 is a three-dimensional schematic diagram of a
於又一實施例,覆蓋層100為彩色漆與保護漆的疊加,例如先以彩色漆噴塗於鍵帽10之外觀表面(例如感測單元第二表面S22、感測單元側表面S23、與基座單元側表面S33),再以保護漆噴再次塗於鍵帽10之外觀表面,作為鍵帽10之外觀表面以及先前所噴塗之彩色漆的保護。具體而言,覆蓋層100的製作過程需經過三道程序:首先將鍵帽10欲進行噴塗的外觀表面(例如感測單元第二表面S22、感測單元側表面S23、與基座單元側表面S33)之表面結構進行破壞,使漆料可以更佳地附著於鍵帽10之外觀表面;再依設計需求噴塗指定顏色之彩色漆噴於外觀表面,使鍵帽10展現指定顏色;最後再將保護漆噴塗於外觀表面,使鍵帽10具備耐磨、抗刮之功能。In another embodiment, the
藉由圖11及圖13的基座單元300所包含的各連接件(圖11及圖13以第一連接件321、第二連接件322、第三連接件323以及第四連接件324為例),鍵帽10可依設計需求固定於電子裝置(圖未示)上。例如將鍵帽10固定於筆記型電腦,作為筆記型電腦的鍵盤中的其中一個按鍵;或是將感測裝置10固定於桌上型電腦,作為桌上型電腦的鍵盤中的其中一個按鍵。With reference to the connecting members included in the
值得注意的是,圖11或圖13的各連接件的配置方式僅為鍵帽10連接至電子裝置(圖未示)的其中一個實施例。於其他的實施例中,各連接件的形狀以及所放置位置亦可依設計需求做不同的調整。It is worth noting that the configuration of the connecting members in FIG. 11 or FIG. 13 is only one embodiment of the
感測單元200與基座單元300的結合,包含模內射出以及分件黏合兩種方式。關於模內射出,請詳圖14A~14B及所對應段落之說明;關於分件黏合,請詳圖15~16及所對應段落之說明。The combination of the
圖14A~14B為根據本創作一實施例所繪示的注膠模具600之剖面示意圖;圖14A為注膠前,圖14A為注膠後。於圖14A~14B所示實施例,感測單元200與基座單元300為以模內射出方式結合為一體。具體而言,注膠模具600包含第一模座610以及第二模座620,第一模座610進一步包含注膠口615。詳細而言,以模內射出方式結合感測單元200與基座單元300的方法如下:先將感測單元200放置於第二模座620,如圖14A所示;再將塑料粒子溶化後,從注膠口615注入注膠模具600中以進一步形成基座單元300及基座單元300所包含的各連接件(圖14B以第一連接件321、第二連接件322、第三連接件323以及第四連接件324為例),如圖14B所示;塑料冷卻定形後,感測單200與基座單元300即可結合為一體;再將注膠模具600拆除(圖未示),以得到感測單元210。14A to 14B are schematic cross-sectional views of a
圖15為根據本創作一實施例所繪示的鍵帽10及黏著層400之立體示意圖;圖16為根據本創作另一實施例所繪示的鍵帽10及黏著層400’之立體示意圖。於圖15~16所示實施例,感測單元200與基座單元300為以分件黏合方式結合為一體;詳細而言,於圖15~16所示實施例,感測單元200與基座單元300間進一步夾設有黏著層400(或黏著層400’),感測單元200與基座單元300為以黏著層400(或黏著層400’)進行黏合。FIG. 15 is a three-dimensional schematic diagram of the
圖15及圖16的差異在於,圖15的黏著層400為以圈形方式夾設於感測單元200與基座單元300間;圖16的黏著層400’為以鋸齒狀方式夾設於感測單元200與基座單元300間。與圖15相較,圖16的黏著層400’的分布範圍更大,膠合面積更大,故具有更好的黏合能力。The difference between FIGS. 15 and 16 is that the
10:鍵帽10: keycap
100:覆蓋層100: cover layer
dc:覆蓋層厚度dc: cover layer thickness
dc1:第一覆蓋層厚度dc1: the thickness of the first covering layer
dc2:第二覆蓋層厚度dc2: the thickness of the second covering layer
200:感測單元200: sensing unit
210:感測容置空間210: Sensing accommodating space
220:電性連接點220: electrical connection point
c1:內圈c1: inner circle
c2:外圈c2: outer ring
S21:感測單元第一表面S21: The first surface of the sensing unit
S22:感測單元第二表面S22: The second surface of the sensing unit
S23:感測單元側表面S23: Side surface of sensing unit
A1:結合區域A1: Bonding area
A2:非結合區域A2: Non-binding area
w5:第五凹角w5: fifth concave corner
w6:第六凹角w6: sixth concave corner
w7:第七凹角w7: seventh concave corner
w8:第八凹角w8: eighth concave corner
C2:電性連接點分布區域C2: Distribution area of electrical connection points
R:粗糙面R: rough surface
300:基座單元300: base unit
310:基座容置空間310: Base accommodating space
321:第一連接件321: The first connector
322:第二連接件322: second connector
323:第三連接件323: The third connector
324:第四連接件324: The fourth connector
S31:基座單元第一表面S31: The first surface of the base unit
S32:基座單元第二表面S32: The second surface of the base unit
S33:基座單元側表面S33: Side surface of base unit
B1:接觸區域B1: contact area
B2:非接觸區域B2: Non-contact area
w1:第一凹角w1: first concave corner
w2:第二凹角w2: second concave corner
w3:第三凹角w3: third concave corner
w4:第四凹角w4: fourth concave corner
G1:連接區域G1: Connection area
G2:非連接區域G2: Disconnected area
m1:第一凸角m1: the first convex angle
m2:第二凸角m2: second convex angle
m3:第三凸角m3: third lobe
m4 第四凸角m4 fourth lobe
400、400’:黏著層400, 400’: Adhesive layer
500:電路板500: circuit board
S51:電路板第一表面S51: The first surface of the circuit board
S511:電連接區域S511: Electrical connection area
S512:非電連接區域S512: Non-electrically connected area
E1:虛擬投影面E1: Virtual projection surface
P1:第一垂直投影範圍P1: The first vertical projection range
P2:第二垂直投影範圍P2: The second vertical projection range
P3:第三垂直投影範圍P3: The third vertical projection range
P4:第四垂直投影範圍P4: The fourth vertical projection range
P5:第五垂直投影範圍P5: Fifth vertical projection range
P6:第六垂直投影範圍P6: The sixth vertical projection range
D1:第一方向D1: First direction
D2:第二方向D2: second direction
D3:第三方向D3: Third party
L1:第一邊L1: First side
L2:第二邊L2: second side
d1:第一距離d1: first distance
d2:第二距離d2: second distance
Fp:壓力Fp: pressure
600:注膠模具600: plastic injection mold
610:第一模座610: The first mold base
620:第二模座620: second mold base
615:注膠口615: Injection port
本創作所附圖式說明如下: 圖1為根據本創作一實施例所繪示的鍵帽之爆炸示意圖; 圖2為根據本創作一實施例所繪示的鍵帽之立體示意圖; 圖3為根據本創作一實施例所繪示的第一垂直投影範圍及第二垂直投影範圍之立體示意圖; 圖4為根據本創作一實施例所繪示的第三垂直投影範圍及第四垂直投影範圍之立體示意圖; 圖5為根據本創作另一實施例所繪示的鍵帽之爆炸示意圖; 圖6A及6B為根據本創作另一實施例所繪示的鍵帽之剖面示意圖; 圖7為根據本創作另一實施例所繪示的鍵帽之爆炸示意圖; 圖8為根據本創作另一實施例所繪示的鍵帽之立體示意圖; 圖9為根據本創作一實施例所繪示的鍵帽之剖面示意圖; 圖10為根據本創作一實施例所繪示的第一凹角~第八凹角之立體示意圖; 圖11為根據本創作一實施例所繪示的基座單元之立體示意圖; 圖12A~12C為根據本創作一實施例所繪示的感測單元之立體示意圖; 圖13為根據本創作另一實施例所繪示的鍵帽之立體示意圖; 圖14A~14B為根據本創作一實施例所繪示的注膠模具之剖面示意圖; 圖15為根據本創作一實施例所繪示的鍵帽及黏著層之立體示意圖;以及 圖16為根據本創作另一實施例所繪示的鍵帽及黏著層之立體示意圖。 The description of the drawings in this creation is as follows: Fig. 1 is an exploded schematic diagram of a keycap according to an embodiment of the present creation; Figure 2 is a three-dimensional schematic diagram of a keycap drawn according to an embodiment of the present creation; 3 is a three-dimensional schematic diagram of a first vertical projection range and a second vertical projection range drawn according to an embodiment of the present creation; 4 is a three-dimensional schematic diagram of a third vertical projection range and a fourth vertical projection range drawn according to an embodiment of the present creation; Fig. 5 is an exploded schematic diagram of a keycap according to another embodiment of the present creation; 6A and 6B are schematic cross-sectional views of a keycap according to another embodiment of the invention; Fig. 7 is an exploded schematic diagram of a keycap according to another embodiment of the present creation; Figure 8 is a three-dimensional schematic diagram of a keycap drawn according to another embodiment of the present invention; Fig. 9 is a schematic cross-sectional view of a keycap according to an embodiment of the present creation; FIG. 10 is a three-dimensional schematic diagram of the first to eighth concave corners drawn according to an embodiment of the present creation; Figure 11 is a three-dimensional schematic diagram of a base unit drawn according to an embodiment of the present creation; 12A to 12C are three-dimensional schematic diagrams of a sensing unit drawn according to an embodiment of the present creation; Figure 13 is a three-dimensional schematic diagram of a keycap drawn according to another embodiment of the present invention; 14A to 14B are schematic cross-sectional views of a glue injection mold according to an embodiment of the present creation; FIG. 15 is a three-dimensional schematic diagram of the keycap and the adhesive layer according to an embodiment of the present creation; and FIG. 16 is a three-dimensional schematic diagram of a keycap and an adhesive layer according to another embodiment of the present creation.
10:鍵帽 10: keycap
200:感測單元 200: sensing unit
210:感測容置空間 210: Sensing accommodating space
220:電性連接點 220: electrical connection point
c1:內圈 c1: inner circle
c2:外圈 c2: outer ring
S21:感測單元第一表面 S21: The first surface of the sensing unit
A1:結合區域 A1: Bonding area
A2:非結合區域 A2: Non-binding area
C2:電性連接點分布區域 C2: Distribution area of electrical connection points
300:基座單元 300: base unit
310:基座容置空間 310: Base accommodating space
S31:基座單元第一表面 S31: The first surface of the base unit
B1:接觸區域 B1: contact area
B2:非接觸區域 B2: Non-contact area
D1:第一方向 D1: First direction
D2:第二方向 D2: second direction
D3:第三方向 D3: Third party
Claims (38)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110204589U TWM616006U (en) | 2021-04-23 | 2021-04-23 | Sensing apparatus and keycap |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110204589U TWM616006U (en) | 2021-04-23 | 2021-04-23 | Sensing apparatus and keycap |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM616006U true TWM616006U (en) | 2021-08-21 |
Family
ID=78285403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110204589U TWM616006U (en) | 2021-04-23 | 2021-04-23 | Sensing apparatus and keycap |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM616006U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI801850B (en) * | 2021-04-23 | 2023-05-11 | 凱爾威科技有限公司 | Sensing apparatus and keycap |
-
2021
- 2021-04-23 TW TW110204589U patent/TWM616006U/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI801850B (en) * | 2021-04-23 | 2023-05-11 | 凱爾威科技有限公司 | Sensing apparatus and keycap |
| US11880443B2 (en) | 2021-04-23 | 2024-01-23 | Carewe Technology Corp. | Sensing apparatus and keycap |
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