TWM615840U - Tiered locking mechanism - Google Patents

Abstract

A tiered locking mechanism secures a component card to a printed circuit board and includes a base, a top slider structure, and a biasing element. The base includes a first-tier side wall and a coupling structure configured to engage the PCB. The top slider structure includes a second-tier side wall along with protrusions having a beveled edge. The top slider structure is slidable between locked and unlocked positions. The unlocked position includes the protrusions being displaced away from a component card engagement side relative to the locked position. A bottom one of the protrusions and the first-tier side wall form a first receiving slot in the locked position. A top one of the plurality of protrusions and the second-tier wall form a second receiving slot. The biasing element is configured to urge the top slider structure toward the locked position and to compress as the top slider structure moves away from the component card engagement side.

Description

Layered locking mechanism

The present disclosure generally relates to a layered locking mechanism. More specifically, the present disclosure relates to a layered locking mechanism for connectors of different heights for fixing a component card to the main printed circuit board ("PCB") of a computing device.

A component card such as an M.2 card is configured to be coupled to the main printed circuit board, and is often installed, released, replaced, and/or decoupled from the main printed circuit board for many reasons such as maintenance. For example, the component card of the M.2 card is generally docked to the main printed circuit board by a single-height connector. The existing mechanisms for fixing the component card to the main printed circuit board require the user to engage and/or disengage one or more coupling mechanisms to fix the component card to the main printed circuit board. Users may often need to add or replace component cards on the main printed circuit board. There is a need for a more general locking mechanism for computing devices, which will provide the fixing of different component cards in different configurations, such as M.2 cards.

According to an embodiment, a layered locking mechanism is configured to secure a component card to a printed circuit board (PCB). The layered locking mechanism includes a base, a top slide structure, and a biasing element. The base includes a first-layer side wall and a coupling structure. The first-layer side wall is on the component clamping side of the layered locking mechanism, and the coupling structure is configured to clamp the printed circuit board. The top slider structure is coupled to the base and disposed on the base. The top slider structure includes a second layer of sidewalls and a plurality of protrusions. The second layer of sidewalls are on the component clamping side, and each of the plurality of protrusions has an inclined edge. The top slide structure is slidable between the locked position and the unlocked position. The unlocking position includes a plurality of protrusions being moved away from the locking position of the component from the locking position. One of the bottoms of the plurality of protrusions and the side wall of the first layer form a first receiving groove in the locked position. One of the tops of the plurality of protrusions and the side wall of the second layer form a second receiving groove. The biasing element is disposed between the base and the top slide structure, and the biasing element is configured to advance the top slide structure toward the locked position, and compress when the top slide structure is moved from the component clamping side to the unlocked position.

In another feature of the embodiment, the locking mechanism includes a rib portion of the top surface of the top slider structure, opposite to the plurality of protrusions. The rib portion is configured to assist the top slider structure to move from the locked position to the unlocked position. In some embodiments, the coupling structure includes at least one fixing element configured to be disposed through a hole formed in the printed circuit board. In some embodiments, the coupling structure includes a threaded hole, and the at least one fixing element is a screw coupled to the threaded hole. In some embodiments, the coupling structure is configured to create pressure in the mating hole.

In another feature of the embodiment, the biasing element is a coil spring. In some embodiments, the top slider structure includes a spring guide with a spring disposed around the spring guide. In some embodiments, the base includes a biasing element receiving portion with a spring and a spring guide disposed therein. In some embodiments, the spring is coupled to the base and the top slider structure. In some embodiments, the hole is formed in an end of the base opposite to the engaging side of the component. In some embodiments, the hole is configured to allow at least a portion of the spring guide to pass through.

In another feature of the embodiment, the component card is an M.2 card with a notch. When coupled to the short connector of the printed circuit board, the notch is configured to be received in the first receiving slot, and when coupled to The high connector of the printed circuit board is received in the second receiving groove. In some embodiments, the notch is substantially semicircular. In some embodiments, the notch engages with the inclined edge of one of the tops of the plurality of protrusions before being seated in the second receiving groove. The top slider structure is configured to start to be removed from the component engagement side, and then move toward the component engagement side to the locked position. In some embodiments, before being positioned in the first receiving groove, the notch engages with the inclined edge of one of the bottoms of the plurality of protrusions. The top slider structure is configured to start to be removed from the component engagement side, and then move toward the component engagement side to the locked position.

According to another embodiment, a component board includes a printed circuit board and at least one layered locking mechanism configured to fix a component card to the printed circuit board. The at least one layered locking mechanism includes a base, a top slide, and a biasing element. The base includes a first-layer side wall and a coupling structure. The first-layer side wall is on the component clamping side of the at least one layered locking mechanism, and the coupling structure is configured to clamp the printed circuit board. The top slider structure is coupled to the base and disposed on the base. The top slider structure includes a second layer of sidewalls and a plurality of protrusions. The second layer of sidewalls are on the component clamping side, and each of the plurality of protrusions has an inclined edge. The top slide structure is slidable between the locked position and the unlocked position. The unlocking position includes a plurality of protrusions being moved away from the locking position of the component from the locking position. One of the bottoms of the plurality of protrusions and the side wall of the first layer form a first receiving groove in the locked position. One of the tops of the plurality of protrusions and the side wall of the second layer form a second receiving groove. The biasing element is arranged between the base and the top slide structure. The biasing element is configured to advance the top slider structure toward the locked position, and compress when the top slider structure is displaced from the component engagement side to the unlocked position.

The above new content is not intended to represent every embodiment or every feature of this disclosure. Rather, the aforementioned new content only provides examples of some of the novel features and features set forth herein. The above features and advantages and other features and advantages of the present disclosure will be apparent from the following detailed description of representative embodiments and modes when combined with the accompanying drawings and the scope of the attached patent application.

Various embodiments are described with reference to the drawings, and similar reference signs are used to designate similar or equivalent elements throughout the drawings. The drawings are not drawn to scale, and the drawings are provided only to illustrate the present invention. It should be understood that many specific details, relationships, and methods have been elaborated to provide a comprehensive understanding. However, a person with ordinary knowledge in the field will easily think that various embodiments can be practiced without one or more specific details or in other methods. In other cases, well-known structures or operations are shown in detail to avoid obscuring certain features of various embodiments. The various embodiments are not limited to the order in which the actions or events are shown, for example, some actions may occur in a different order and/or simultaneously with other actions or events. In addition, not all actions or events shown are required to implement the method according to the present invention.

The disclosed elements and limitations, for example, in the abstract, new content, and implementation paragraphs, but not explicitly stated in the scope of the patent application, should not be incorporated into the scope of the patent application individually or collectively by implication, inference or other means . For the purpose of this embodiment, unless explicitly stated otherwise, the singular includes the plural and vice versa. The noun "including" means "including but not limited to." In addition, similar words such as "about (about, almost, substantially, approximately)" and similar words can mean "在(at)", "近于(near, nearly at)", "在3% Within 5% (within 3-5% of)", "within acceptable manufacturing tolerances" or any logical combination thereof.

Regarding this disclosure, the term "computing device" or "computer device" refers to any device that is powered by electricity or battery, which has hardware, software, and/or firmware components, and software and/or firmware components can be Configure to operate the components on the device. The term "coupled" means to connect, whether directly or indirectly through intermediary components, and is not necessarily limited to physical connections. The connection can make the object permanently connected or releasably connected. The noun "substantially" is defined as substantially conforming to a specific size, shape, or other words that are substantially modified so that the component does not need to be precise. For example, the meaning of a substantial cylinder is an object that is similar to a cylinder, but may have one or more deviations from the actual cylinder.

The present technology relates to a component board having a printed circuit board and at least one layered locking mechanism, and the layered locking mechanism is configured to fix the module card to the printed circuit board. The technology also relates to a layered locking mechanism for fixing the component card to the printed circuit board. Although the installation heights of the component cards are different, this technology provides a universal layered locking mechanism for computing devices, and provides that different modules can be fixed at different heights under the same layered locking mechanism.

In some embodiments, the layered locking mechanism includes a base, a top slide, and a biasing element. The base may include a first layer of side walls and a coupling structure. The first layer of side walls is on the component clamping side of the layered locking mechanism, and the coupling structure is configured to clamp the printed circuit board. The top slider structure can be coupled to the base and disposed on the base. The top slider structure may include a second-layer side wall and a protrusion. The second-layer side wall is on the component clamping side, and the protrusion has an inclined edge. The top slide structure is slidable between the locked position and the unlocked position. The unlocking position includes a plurality of protrusions being moved away from the locking position of the component from the locking position. One of the bottom of the protrusion and the first layer side wall may form a first receiving groove in the locked position. One of the tops of the protrusions and the second layer of sidewalls may form the second receiving groove. The biasing element is disposed between the base and the top slide structure, and the biasing element is configured to advance the top slide structure toward the locked position, and compress when the top slide structure is moved from the component clamping side to the unlocked position.

Turning now to Figures 1A and 1B, right isometric and top views of exemplary layered locking mechanisms 110, 120 are depicted. The layered locking mechanism 110 uses a short connector 117 to secure the low-position component card 113 to the computing device Used printed circuit board 130. The layered locking mechanism 120 uses the high connector 127 to fix the high-position component card 123 to the printed circuit board 130. The main difference between the layered locking mechanisms 110 and 120 is that the mounting heights of the component cards 113 and 123 fixed by the locking mechanisms 110 and 120 are different. In addition, the locations where the component cards 113 and 123 are respectively fixed to the layered locking mechanisms 110 and 120 are also different. In addition, the layered locking mechanisms 110, 120 are interchangeable, and can be used in both low-position and high-position component card configurations, because these two layered locking mechanisms both include a unique combination of components to accommodate Different component card installation heights.

The layered locking mechanisms 110 and 120 can have applications for fixing different types of component cards to the motherboard of the computing device, such as M.2 solid state drives or other internally installed computer expansion cards for computing devices. Other types of component cards can also be considered.

With reference to Figure 1C, a left isometric view of the layered locking mechanisms 110, 120, the high connector 127 for the high-position component card, and the low connector 117 for the low-position component card are depicted, except for the previously shown in Figure 1A The respective component cards 113 and 123 in the figure and figure 1B are not depicted in figure 1C. The component card (not shown) is supported at one end by one of the layered locking mechanisms 110, 120, and is supported at the opposite end by providing corresponding low or high connectors 117, 127 connected to the printed circuit board 130. When installed, the component cards 113, 123 depicted in FIGS. 1A and 1B are suspended at different heights above the printed circuit board 130.

Turning to Figure 2, an exploded right isometric view of an exemplary layered locking mechanism 210, 220 is depicted. The layered locking mechanism 210, 220 is secured to a partially depicted printed circuit board 230 for a computing device. Each layered locking mechanism 210, 220 includes a respective top slider structure 212, 222, the top slider structure 212, 222 can be moved between a locked position and an unlocked position to allow the component card to be fixed to the printed circuit board 230 The connector or the connector from the printed circuit board 230 is removed. The layered locking mechanisms 210, 220 are placed on the top surface 231 of the printed circuit board through the holes 234, 236 of the printed circuit board 230, respectively. The layered locking mechanisms 210, 220 are fixed to the printed circuit board 230 using respective fastening mechanisms 215, 225, such as extending partially through the respective holes 234, 236 to the bases of the respective layered locking mechanisms 210, 220. Screw or anchoring mechanism. For example, where the fastening mechanisms 215, 225 are screws, the screws extend through the respective holes 234, 236, and are engaged with the threaded portions (not shown) of the layered locking mechanisms 210, 220, wherein the fastening mechanisms 215, 225 and The printed circuit board is tightened to separate the heads of the screws from the respective layered locking mechanisms 210, 220.

Turning to FIGS. 3A to 3C, the right front isometric view, side view, and front view of the exemplary hierarchical locking mechanism 300 are respectively depicted, similar to those depicted in FIGS. 1A to 1C and 2. The layered locking mechanism 300 accommodates a low-position component snap-to-low connector fixation or a high-position component snap-to-high connector fixation of a printed circuit board (not shown) of a computing device. The layered locking mechanism 300 includes a base 310 and a top slider structure 350 coupled to the base 310 and disposed on the base 310. The top slider structure 350 can slide along the base 310, for example, through coupling to the slot 315 or a track provided on the base 310. The base 310 includes a first layer side wall 325 on the component engagement side 320 of the layered locking mechanism 300. In some embodiments, the base 310 includes a coupling structure 330 that extends downwardly from the bottom surface 317 (Figure 3B) of the base 310 to connect the layered locking mechanism 300 with the printed circuit board (not shown). The top surface of the printed circuit board (not shown) is snapped, and the layered locking mechanism 300 is fixed to the top surface of the printed circuit board (not shown).

The top slider structure 350 also includes a second layer side wall 365 on the component engagement side 320 of the layered locking mechanism 300. The top slider structure 350 further includes a plurality of protrusions, such as an exemplary lower protrusion 370 and an upper protrusion 380, each of the lower exemplary lower protrusion 370 and the upper protrusion 380 has a respective inclined edge, such as inclined edges 375, 385 . The top slide structure 350 is slidable between the locked position (toward the component engaging side 320 or the front of the layered locking mechanism) and the unlocked position, wherein in the unlocked position, the top slide structure 350 engages with the component The side 320 (in the direction relative to the locked position) slides away from the base 310. In some embodiments, the lower and upper protrusions 370, 380 of the top slider structure 350 are completely removed from the unlocked position in the locked position depicted by the layered locking mechanism 300 in FIGS. 3A and 3B. The component card engaging side 320 is moved away.

When the top slider structure 350 is in the locked position, as the top slider structure 350 is completely displaced toward the component engagement side 320 of the layered locking mechanism 300, the lower protrusion 370 and the first layer side wall 325 form a first Receiving slot 328. The upper protrusion 380 and the second layer side wall 365 form a second receiving groove 368, and the second receiving groove 368 is disposed on the first receiving groove 328.

In some embodiments, the top slide structure 350 may also include a tactile portion 390 that allows or assists the technician to slide the top slide structure 350 from the locked position to the unlocked position. For example, the rib structure may be formed on the top surface 395 of the top slider structure 350. The rib structure may be located on the opposite side of the component clamping side 320, for example, opposite to the lower protrusion 370 or the upper protrusion 380.

Referring to Figure 3D, an exploded rear isometric view of the exemplary layered locking mechanism 300 depicted in Figures 3A to 3C is depicted. The layered locking mechanism 300 has a base 310, a top slider structure 350, and a biasing element 352 located in an opening in the base 310. The top slider structure 350 is slidably disposed on the base 310 and has a plurality of protrusions 370 and 380 extending therefrom. The plurality of protrusions 370, 380 are layered, and are depicted as an extension of the top slider structure 350 protruding from the front side (for example, the component engagement side). The top slider structure 350 and the plurality of protrusions 370 and 380 may include inclined edges 375 and 385. In some embodiments, only the plurality of protrusions 370, 380 include beveled edges.

The lower protrusion 370 and the first layer side wall 325 form a first receiving groove 328 for engaging the notch of the module card (not shown) with the short connector (not shown), as shown in Figs. 1A to 1C and 4 Fig. 5A and Fig. 5B discussed in more detail. The upper protrusion 380 and the second layer sidewall 365 form a second receiving groove 368 disposed on the first receiving groove 328. The second receiving slot 368 is also used to couple the notch of the component card (not shown) to the high connector (not shown), as shown in FIGS. 1A to 1C, 4, and 5A and 5B. Discussed in more detail. The base 310 may have a coupling structure 330 configured to fix the layered locking mechanism 300 to a main board (not shown). This part will be discussed in more detail with respect to FIG. 4, FIG. 5A, and FIG. 5B.

The top slider structure 350 can be converted between a locked position and an unlocked position. The biasing element 352, which is at least partially disposed in the opening in the base 310, pushes the stratified locking mechanism 300 to the locked position without a reaction force greater than the propulsive force of the biasing element. In the unlocked position after the reaction force is applied to the biasing element 352, the plurality of protrusions 370 and 380 are displaced toward the back wall 313 of the base 310 with respect to the locked position.

In some embodiments, the layered locking mechanism 300 may have a tactile portion 390 formed on the top slider structure 350, and the tactile portion 390 may be disposed relative to one or more of the plurality of protrusions 370, 380. The haptic portion 390 may assist in transitioning the layered locking mechanism 300 from the locked position to the unlocked position. For example, the tactile portion 390 may be operatively engaged by force (for example, applied by a technician's finger) to guide the top slider structure 350 while simultaneously compressing the biasing element 352 located in the base 310 to The layered locking mechanism 300 is switched between the locked position and the unlocked position.

The inclined edge 375 of the lower protrusion 370 of the top slider structure 350 can also be configured to be fastened to the short connector immediately before the low position component card (not shown) (see element 117 in FIGS. 1A to 1C). ). When abutting the inclined edge 375, the layered locking mechanism 300 is switched to the unlocked position. The inclined edge 385 of the upper protrusion 380 of the top slider structure 350 can also be configured to be fastened to the high connector immediately before the high-position component card (not shown) (see element 127 in FIGS. 1A to 1C). ). When abutting the inclined edge 385, the layered locking mechanism 300 is switched to the unlocked position. Whether the module card is fixed to the low connector or the high connector, abutting the inclined edge 375 or 385 will cause the module card to slide off the inclined edge 375 or 385. The contact of the component card with the inclined edge 375 or 385 of the lower protrusion 370 or the upper protrusion 380 causes the top slider structure 350 to exert a force on the biasing element 352. This force will then compress the biasing element 352, and thus transform the layered locking mechanism 300 from the locked position to the unlocked position. The inclined edges 375, 385 may include inclined portions or beveled portions, along the respective protrusions 370, 380, and located at the respective protrusions 370, 380 thereof.

The biasing element 352 located in the opening of the base 310 is configured to advance the top slide structure 350 toward the locked position. For example, the spring receiving opening 314 may be provided in the base 310 to receive the biasing element 352. The compression of the biasing element 352 converts the layered locking mechanism 300 to the unlocked position by the sliding of the top slider structure 350.

In some embodiments, the biasing element guide 354 extending from the top slider structure 350 is provided in the base 310 and configured to receive the biasing element 352. The biasing element 352 may include a spring, such as a coil spring coupled to the top slider structure 350. The biasing element guide 354 may be a protrusion extending relative to one of the plurality of protrusions, such as the lower protrusion 370, and configured to receive the biasing element 352. In some embodiments, the biasing element guide 354 may be a cylindrical structure surrounded by the biasing element 352, for example, a spring may be provided. The biasing element guide 354 may allow the spring 352 to compress and expand smoothly, and minimize the compression or deflection of the spring 352 that is inconsistent with the direction in which the locking mechanism 300 switches between the locked position and the unlocked position. The back wall 313 of the base 310 may include a rear hole 318 to allow the biasing element guide 354 to extend through when the top slider structure 350 is switched to the unlocked position.

The top slider structure 350 may include a sheet structure 356 on the corresponding side of the top slider structure 350. The sheet structure 356 may be received by the slot 315 in the base 310 to allow the top slide structure 350 to switch between the locked position and the unlocked position. The sheet structure 356 can slide from one end corresponding to the locked position to the opposite end corresponding to the unlocked position. The sheet structure 356 is configured to guide the top slider structure along the base 310. The sheet structure 356 can slide in the corresponding grooves 315 on both sides of the base 310 or along rails (not shown) on both sides of the base 310.

Turning to Figure 4, before moving the low-position component card 113 in the direction A to fix the component card 113 in the first receiving slot 328 of the layered locking mechanism 110, the exemplary printed circuit board in Figure 1A The cross section of a part of 130 is depicted. The layered locking mechanism 110 is unique in that it has a layered protrusion for receiving component cards of different heights mounted on the printed circuit board 130 and a top slide structure 350 with receiving grooves. For example, the upper protrusion 380 forms a part of the second receiving groove 368 to fix the high-position component card (not shown), and further includes a lower protrusion 370 forming the first receiving groove 328, together with the base 310 to hold The low-position component card 113 is fixed to the printed circuit board 130.

The low-position component card 113 includes a notch 160. After being coupled to a short connector (not shown) of the printed circuit board, when the low-position component card 113 moves in the direction A, the notch 160 is configured to be received in the first receiving slot 328 . In some embodiments, the notch 160 is substantially semicircular. Before being positioned in the first receiving groove 328, the notch 160 may be engaged with the inclined edge 375 of the lower protrusion 370. When the notch 160 of the low-position component card 113 abuts the inclined edge 375, the top slider structure 350 starts to move from the notch 160 to the left side of FIG. 4 to the unlocked position, and the biasing element 352 follows the biasing element guide 354 compression. Then, when the low-position component card 113 is continuously forced to slide downward along the inclined edge 375 in the direction A, the notch 160 clears the lower protrusion 370 and enters the first receiving groove 328. At this time, the top slider structure 350 is pushed by the biasing element 352 toward the low-position component card 113 to the locked position, and the low-position component card is fixed by the layered locking mechanism 110.

Turning to Figure 5A, just before moving the high-position component card 123 in the direction B to fix it in the locked position in the second receiving groove 368 of the layered locking mechanism 120, through the exemplary printing in Figure 1A A cross-section of a part of the circuit board 130 is depicted. The layered locking mechanism 120 is unique to the top slider structure 350 having an upper protrusion 380 and a lower protrusion 370. The upper protrusion 380 forms part of the second receiving groove 368 to fix the high-position component card 123. The lower protrusion 370 can The same layered locking mechanism 120 is allowed to be used in other applications to fix low-position component cards, as discussed above for FIG. 4.

The high position component card 123 includes a notch 162, and when coupled to a high connector (not shown) of the printed circuit board 130, the notch 162 is configured to be received in the second receiving groove 368. In some embodiments, the notch 162 is substantially semicircular. Before being positioned in the second receiving groove 368, the notch 162 may be engaged with the inclined edge 385 of the upper protrusion 380. During the continuous movement in the direction B, when the notch 162 of the high-position component card 123 abuts the inclined edge 385, the top slider structure 350 starts to move from the notch 162 toward the left side of FIG. 5A to the unlocked position, and the biasing element 352 Compress along the biasing element guide 354. Then, in the high position, the component card 123 is continuously forced downward and along the inclined edge 385 along the direction B, and the notch 162 passes over the upper protrusion 380 and enters the second receiving groove 368. At this time, the top slider structure 350 is then pushed by the biasing element 352 toward the high position assembly card 123 to the locked position.

Figure 5B depicts a cross-section through a portion of the exemplary printed circuit board 130 in Figure 1A just before the high-position component card 123 is removed, with the layered locking mechanism 120 in the unlocked position. The high-position component card 123 is depicted as being at least partially positioned within the second receiving slot 368. The top slider structure 350 has been effectively displaced to the fully unlocked position by the external force applied to the top slider structure 350 (for example, the force applied by the technician), wherein the upper protrusion 380 is no longer provided in the notch 162 of the positioning high position component card 123 Above. This allows the high-position component card 123 to be lifted in the direction C or to rotate around a coupled high connector (not shown) to allow the printed circuit board and the high-position component card 123 to be removed. If the low-position component card 113 is fixed by the layered locking mechanism 120, a similar process can be completed.

The biasing element 352 is depicted in the compressed position, and the biasing element guide 354 extends through the rear hole 318 of the back wall 313. Then, due to the unique nature of the layered locking mechanism 120, to accommodate the component cards of different mounting heights on the printed circuit board, a new component card including a high-position component card or a low-position component card can be installed. The installation of the new component card may occur before the external force causing the compression of the biasing element 352 is removed. Once the external force is removed, the top slider structure 350 including the lower and upper protrusions 370, 380 is pushed by the biasing element 352 to return to the locked position.

Referring back to FIG. 4 and FIGS. 5A and 5B, the depicted cross-section also includes the coupling structure 330. In some embodiments, the coupling structure 330 may encapsulate the full length (not shown) of the base 310 of the layered locking mechanism 110, 120, and the coupling structure 330 is depicted as extending downward from the base 310 . It can be considered that the coupling structure 330 does not significantly extend from the bottom surface 317 of the base 310 (as seen in FIG. 5A). In the described embodiment, the coupling structure 330 and the base 310 are formed in a unibody structure, although other configurations may also be considered. The coupling structure 330 may have a fixing element 415 configured as discussed in FIG. 2 above to be disposed through a hole formed in the printed circuit board 130. The fixing element 415 and the hole 416 may have corresponding perimeters, wherein the hole 416 is slightly larger to allow a substantially corresponding fit between the two parts. For example, the coupling structure 330 of the layered locking mechanism 300 may include a threaded hole, and at least one fixing element 415 may be coupled to the threaded hole by a screw. In some embodiments, the fixing element 415 and the hole 416 may have an interference fit, where the conditions of mating or contact between the two parts require pressure to force the parts together, or to make the parts fit together.

4, 5A, and 5B, it can be considered that the bottom surface 317 of the base may be configured to abut the top surface 132 of the printed circuit board 130 and engage the printed circuit board in some embodiments The top surface 132 of the 130 and the coupling structure 330 are disposed through holes formed in the printed circuit board 130 (visible in the elements 236 and 234 in Figure 2). By fixing the layered locking mechanisms 110, 120 to the printed circuit board 130, the coupling structure 330 allows component cards (eg, low-position component card 113, high-position component card 123) to be received or fixed by the layered locking mechanisms 110, 120 .

As described above, including the features shown in FIGS. 1 to 5B, it is mainly the content that the component card is inserted into the printed circuit board of the computing device and the component card is removed from the printed circuit board of the computing device. However, the described locking mechanism can be applied to the arrangement of other component cards of different heights above the surface of the printed circuit board. The layered locking mechanism used to connect the component card with the high connector and the low connector for the printed circuit board is presented in an exemplary and non-limiting manner, and may include different combinations of the components.

Although various embodiments of the present invention have been described above, it should be understood that they are presented in an exemplary and non-limiting manner. Various changes can be made according to the embodiments disclosed herein without departing from the spirit or scope of the present invention. Therefore, the breadth and scope of the present invention should not be limited by any of the above-mentioned embodiments. On the contrary, the scope of the present model should be defined according to the scope of the following patent applications and their equivalents.

Although the present invention has been shown and described with respect to one or more embodiments, a person with ordinary knowledge in the art will think of equivalents and modifications after reading and understanding the specification and the drawings. In addition, although the specific features of the present invention may have been disclosed with respect to only one of the several embodiments, for any given or specific application, this feature may be combined with one or more of the other embodiments if required and advantageous. Other feature combinations.

The terms used here are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used herein, the singular form "一 (a, an, the)" is also intended to include the plural form, unless the context clearly dictates otherwise. In addition, the nouns "including (including, includes)", "having, has, with" or their variations are intended to be used in the implementation and/or the scope of the patent application. Such nouns are intended to be similar nouns "including" The way is included.

Unless otherwise defined, all terms used here (including technical and scientific terms) have the same meaning commonly understood by those skilled in the art. In addition, for example, nouns defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technical field. Unless clearly defined here, they will not be interpreted as idealized or excessively formal meanings.

110, 120, 210, 220, 300: layered locking mechanism 113, 123: component card 117: Short connector 127: high connector 130, 230: printed circuit boards 132,231,395: top surface 160,162: gap 212, 222, 350: top slide structure 215, 225: Fastening mechanism 234,236,416: hole 310: Pedestal 313: Back Wall 314: Spring receiving opening 315: Groove 317: bottom surface 318: Back Hole 320: Component card clamping side 325: first layer sidewall 328: first receiving slot 330: Coupling structure 352: Bias element 354: Bias element guide 356: sheet structure 365: second layer sidewall 368: second receiving slot 370: lower protrusion 375, 385: sloping edges 380: Upper protrusion 390: Tactile part 415: fixed element A, B, C: direction

The present disclosure will be better understood from the description of the following embodiments with reference to the accompanying drawings. Figures 1A and 1B depict a right isometric view and a top view of an exemplary layered locking mechanism according to some embodiments of the present disclosure. The position component card is fixed to the high connector, and the low position component card is fixed to the low connector. Figure 1C depicts a left isometric view of the layered locking mechanism, high connector, and low connector of Figures 1A and 1B according to some embodiments of the present disclosure. Figure 2 depicts an exploded right isometric view of an exemplary layered locking mechanism secured to a printed circuit board according to some embodiments of the present disclosure. Figure 3A depicts a right front isometric view of an exemplary layered locking mechanism according to some embodiments of the present disclosure. The exemplary layered locking mechanism is used to fix the low-position component card to the short connector, and the high-position component card Fixed to the printed circuit board of the computing device. Figure 3B depicts a side view of the exemplary layered locking mechanism in Figure 3A according to some embodiments of the present disclosure. Figure 3C depicts a front view of the exemplary layered locking mechanism in Figure 3A according to some embodiments of the present disclosure. Figure 3D depicts an exploded isometric view of the exemplary layered locking mechanism in Figure 3A according to some embodiments of the present disclosure. Figure 4 depicts a cross-section through a portion of the exemplary printed circuit board in Figure 1A before the low-position component card is fixed by the first receiving slot of the layered locking mechanism according to some embodiments of the present disclosure . FIG. 5A depicts the exemplary printed circuit board in FIG. 1A before the high-position component card is fixed in the locked position in the second receiving groove of the layered locking mechanism according to some embodiments of the present disclosure. Part of the cross section. FIG. 5B depicts a portion of the exemplary printed circuit board in FIG. 1A in the locked position before the high-position component card is about to be removed according to some embodiments of the present disclosure. section. This disclosure is easy to make various modifications and alternative forms. Some representative embodiments have been shown by way of example in the drawings, and will be described in detail here. However, it should be understood that the present invention is not intended to be limited to the specific forms disclosed. Rather, this disclosure will cover all modifications, equivalents, and alternative forms that fall within the spirit and scope of the new model as defined by the scope of the patent application.

110, 120: Layered locking mechanism

113, 123: component card

117: Short connector

127: high connector

130: printed circuit board

Claims (10)

A layered locking mechanism configured to fix a component card to a printed circuit board (PCB), the layered locking mechanism comprising: A base, including a first layer of side wall and a coupling structure, the first layer of side wall is on a component clamping side of the layered locking mechanism, and the coupling structure is configured to clamp the printed circuit board; A top slider structure coupled to the base and disposed on the base. The top slider structure includes a second layer of side walls and a plurality of protrusions, and the second layer of side walls is on the component clamping side , Each of the plurality of protrusions has an inclined edge, the top sliding member structure is slidable between a locked position and an unlocked position, and the unlocked position includes the plurality of protrusions engaged with the assembly The side is moved away from the locking position, one of the bottoms of the plurality of protrusions and the first layer side wall form a first receiving groove in the locking position, one of the tops of the plurality of protrusions and the first receiving groove A second receiving groove is formed on the two-layer sidewall; and A biasing element is arranged between the base and the top slide structure, the biasing element is configured to push the top slide structure toward the locking position, and the top slide structure is engaged with the component from the side Compressed when moved to the unlocked position. For example, the layered locking mechanism of claim 1, further comprising a rib portion on a top surface of the top slide structure, relative to the plurality of protrusions, the rib portion is configured to assist the top slide structure from the locked position Move to the unlocked position. The layered locking mechanism of claim 1, wherein the coupling structure includes at least one fixing element configured to be disposed through a hole formed in the printed circuit board. Such as the layered locking mechanism of claim 3, wherein the coupling structure includes a threaded hole, and the at least one fixing element is a screw coupled to the threaded hole. Such as the layered locking mechanism of claim 3, wherein the coupling structure is configured to form a pressure matching the hole. Such as the layered locking mechanism of claim 1, wherein a hole is formed in an end of the base opposite to the engaging side of the component, and the hole is configured to allow at least a part of the spring guide to pass through. For example, the layered locking mechanism of claim 1, wherein the component card is an M.2 card with a notch, and when coupled to a short connector of the printed circuit board, the notch is configured to be received in the first In the receiving groove, and when coupled to a high connector of the printed circuit board, is received in the second receiving groove. For example, the layered locking mechanism of claim 7, wherein before being positioned in the second receiving groove, the notch is engaged with the inclined edge of one of the tops of the plurality of protrusions, and the top slider structure is configured to It is initially moved away from the clamping side of the component, and then moved to the locked position toward the clamping side of the component. For example, the layered locking mechanism of claim 7, wherein before being positioned in the first receiving groove, the notch is engaged with the inclined edge of one of the bottoms of the plurality of protrusions, and the top slider structure is configured to It is first moved away from the component engagement side, and then moved to the locked position toward the component engagement side. A component board, including: A printed circuit board; and At least one layered locking mechanism configured to fix a component card to the printed circuit board, the at least one layered locking mechanism comprising: A base, including a first layer of sidewall and a coupling structure, the first layer of sidewall is on a component clamping side of the at least one layered locking mechanism, and the coupling structure is configured to clamp the printed circuit board; A top slider structure coupled to the base and disposed on the base. The top slider structure includes a second layer of side walls and a plurality of protrusions, and the second layer of side walls is on the component clamping side , Each of the plurality of protrusions has an inclined edge, the top sliding member structure is slidable between a locked position and an unlocked position, and the unlocked position includes the plurality of protrusions engaged with the assembly The side is moved away from the locked position, one of the bottoms of the plurality of protrusions and the first layer side wall form a first receiving groove in the locked position, one of the tops of the plurality of protrusions, and the A second receiving groove is formed on the sidewall of the second layer; and A biasing element is arranged between the base and the top slide structure, the biasing element is configured to push the top slide structure toward the locking position, and the top slide structure is engaged with the component from the side Compressed when moved to the unlocked position.

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