TWM615754U - Car lamp module with directly-packaged flexible chips - Google Patents

Car lamp module with directly-packaged flexible chips Download PDF

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TWM615754U
TWM615754U TW109215059U TW109215059U TWM615754U TW M615754 U TWM615754 U TW M615754U TW 109215059 U TW109215059 U TW 109215059U TW 109215059 U TW109215059 U TW 109215059U TW M615754 U TWM615754 U TW M615754U
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light
substrate
flexible
emitting element
car
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TW109215059U
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Chinese (zh)
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李勁樑
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歐普特光電科技股份有限公司
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Publication of TWM615754U publication Critical patent/TWM615754U/en

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Abstract

本創作係提供一種可撓式晶片直接封裝之車燈模組,其包含:一基板,其係呈可撓性之軟性設置;複數發光元件,其係透過晶片直接封裝(Chip On Board, COB)製程以封裝並陣列設置於該基板之一端面;藉此,本創作透過基板呈可撓性的軟性設置,藉可因應車燈之形狀及態樣進行設置,並可將光源均勻分布於車燈,藉以提升車燈設計之自由度,並可增進於照明時之光線均勻度及飽和度;此外,配合於基板設置螢光層,藉以令光線可藉由螢光層而均勻出光,並可兼具其良好之散熱效果者。This creation is to provide a flexible chip directly packaged car lamp module, which includes: a substrate, which is flexible and flexible; plural light-emitting elements, which are directly packaged through the chip (Chip On Board, COB) The manufacturing process is packaged and arranged in an array on one end surface of the substrate; by this, the creation is flexible and flexible through the substrate, which can be set according to the shape and pattern of the car light, and the light source can be evenly distributed in the car light , In order to enhance the freedom of car lamp design, and improve the uniformity and saturation of light during lighting; in addition, a fluorescent layer is provided on the substrate so that the light can be uniformly emitted through the fluorescent layer, and it can be combined Those with good heat dissipation effect.

Description

可撓式晶片直接封裝之車燈模組Car lamp module directly encapsulated by flexible chip

本創作係一種可撓式晶片直接封裝之車燈模組,尤指一種發光元件透過晶片直接封裝(Chip On Board, COB)製程以封裝並陣列設置於基板,藉可因應車燈之形狀及態樣,使提升車燈光線之均勻度及飽和度者。This creation is a car light module directly packaged by a flexible chip, especially a light-emitting element that is packaged through the chip on board (COB) process and arranged in an array on the substrate, which can adapt to the shape and state of the car light. In this way, to improve the uniformity and saturation of the car light.

按,現有之LED車燈,主要係因應其照明配置,而將LED光源模組集中黏著於有限面積之基板上,而為因應LED光源之散熱需求,故基板通常係採用散熱特性優異之金屬板,諸如:鋁質基板或銅質基板等,而因金屬板不具有可撓曲之特性,因此當應用於車燈時,難以依據車燈之設計及空間配置而有效配置,導致車燈所設計之光區具有弧面或曲面時,基板無法予以適配組裝,導致基板上所設置之LED光源無法依照原設計之光區投射光線,且亦不利於LED光源之光線分布配置,使車燈所投射之光線無法均勻飽和,其將影響車燈投射之光形及美感,亦將大幅影響車燈之設計自由度,使車燈之發展受限。According to the existing LED car lights, the LED light source modules are mainly adhered to a substrate with a limited area in response to their lighting configuration. In response to the heat dissipation requirements of the LED light source, the substrate usually uses a metal plate with excellent heat dissipation characteristics. , Such as: aluminum substrate or copper substrate, etc., and because the metal plate does not have the characteristic of flexibility, it is difficult to configure effectively according to the design and space configuration of the car lamp when it is used in the car lamp, resulting in the design of the car lamp When the light zone has a curved or curved surface, the substrate cannot be adapted and assembled, so that the LED light source set on the substrate cannot project light according to the original design of the light zone, and it is also not conducive to the light distribution of the LED light source, which makes the car light The projected light cannot be uniformly saturated, which will affect the light shape and beauty of the car lamp, and will also greatly affect the design freedom of the car lamp, which limits the development of the car lamp.

有鑑於此,本創作人特地針對基板及光源之配置加以研究及改良,期以一較佳創作改善上述問題,並在經過長期研發及不斷測試後,始有本創作之問世。In view of this, the creator specially researched and improved the configuration of the substrate and the light source, hoping to improve the above problems with a better creation, and after long-term research and development and continuous testing, the original creation came out.

爰是,本創作之目的係為解決前述問題,為達致以上目的,吾等創作人提供一種可撓式晶片直接封裝之車燈模組,其包含:一基板,其係呈可撓性之軟性設置;以及複數發光元件,其係透過晶片直接封裝(Chip On Board, COB)製程以封裝並陣列設置於該基板之一端面者。The purpose of this creation is to solve the aforementioned problems. In order to achieve the above goals, our creators provide a car light module directly packaged with a flexible chip, which includes: a substrate, which is flexible Flexible arrangement; and a plurality of light-emitting elements, which are packaged and arrayed on one end surface of the substrate through a chip on board (COB) process.

據上所述之可撓式晶片直接封裝之車燈模組,其中,該基板於設置所述發光元件之一端面處,更對應覆設有一螢光層,且該螢光層係覆於所述發光元件者。According to the above-mentioned flexible chip directly encapsulated car lamp module, wherein the substrate is provided with a fluorescent layer corresponding to one end surface of the light emitting element, and the fluorescent layer is covered on the The light-emitting element.

據上所述之可撓式晶片直接封裝之車燈模組,其中,所述發光元件為發光二極體(Light-emitting diode, LED)。According to the above-mentioned vehicle lamp module directly packaged by a flexible chip, the light-emitting element is a light-emitting diode (LED).

據上所述之可撓式晶片直接封裝之車燈模組,其中,該基板係呈幾何形狀或非幾何圖形設置者。According to the above-mentioned flexible chip directly encapsulated car lamp module, wherein, the substrate is arranged in a geometric shape or a non-geometric shape.

據上所述之可撓式晶片直接封裝之車燈模組,其中,該基板一端更設有二電極,所述電極係耦接於該基板及所述發光元件者。According to the above-mentioned vehicle lamp module directly packaged by a flexible chip, two electrodes are further provided at one end of the substrate, and the electrodes are coupled to the substrate and the light-emitting element.

據上所述之可撓式晶片直接封裝之車燈模組,更包含一燈座,該燈座設有一燈罩,且該基板係對應設置於該燈座,並令所述發光元件朝向於該燈罩處者。According to the above-mentioned car lamp module directly encapsulated by the flexible chip, it further includes a lamp holder, the lamp holder is provided with a lampshade, and the substrate is correspondingly disposed on the lamp holder, and the light emitting element is directed toward the lamp holder. Those in the lampshade.

是由上述說明及設置,顯見本創作主要具有下列數項優點及功效,茲逐一詳述如下:Based on the above description and settings, it is obvious that this creation mainly has the following advantages and functions, which are detailed as follows:

1.本創作藉由基板呈可撓性之軟性設置,並配合發光元件透過晶片直接封裝(Chip On Board, COB)製程以封裝並陣列設置於基板,藉使基板可因應車燈之設計及光區設計而設置於車燈內,故無論車燈之燈座為平面、曲面或弧面,該基板皆可因應配置,並使發光元件可符合車燈之光線投射之設計,且令光線可均勻投射,使增進照明時之均勻度及飽和度;且藉其封裝配置,藉可令本創作可予模組化,藉可利於裝設、運輸,並可降低零組件之庫存成本者。1. In this creation, the substrate is flexible and flexible, and the light-emitting element is packaged and arranged on the substrate in an array through the chip on board (COB) process, so that the substrate can be adapted to the design and light of the car lights. The area design is set in the car lamp, so no matter the lamp holder of the car lamp is flat, curved or curved, the substrate can be configured accordingly, and the light-emitting element can conform to the design of the light projection of the car lamp, and the light can be uniform Projection can improve the uniformity and saturation of lighting; and by its packaging configuration, the creation can be modularized, which can facilitate installation and transportation, and can reduce the inventory cost of components.

2.本創作藉由設置螢光層,使發光元件所產生之光線可由螢光層完整收光後予以均勻出光,使更進一步提升光線之均勻度及飽和度,並可藉其顏色之配置,使提升車燈整體之視覺效果;此外,透過螢光層之配置,亦可兼具良好之散熱效果,以維所述發光元件之發光效率者。2. By setting the fluorescent layer in this creation, the light generated by the light-emitting element can be completely collected by the fluorescent layer and then be uniformly emitted, so that the uniformity and saturation of the light can be further improved, and the color configuration can be used. It can improve the overall visual effect of the car lamp; in addition, through the arrangement of the fluorescent layer, it can also have a good heat dissipation effect, so as to maintain the luminous efficiency of the light-emitting element.

本創作係一種可撓式晶片直接封裝之車燈模組,其實施手段、特點及其功效,茲舉數種較佳可行實施例並配合圖式於下文進行詳細說明,俾供 鈞上深入瞭解並認同本創作。This creation is a car lamp module directly encapsulated by a flexible chip. Its implementation means, characteristics and effects are listed below with several preferred and feasible embodiments and detailed descriptions in conjunction with the drawings, for a thorough understanding. And agree with this creation.

首先,請參閱第1圖至第3圖所示,本創作係一種可撓式晶片直接封裝之車燈模組,其包含:First of all, please refer to Figures 1 to 3. This creation is a car light module directly packaged by a flexible chip, which includes:

一基板1,其係呈可撓性之軟性設置,且該基板1係可依設計需求而呈幾何形狀或非幾何圖形設置者;以及A substrate 1, which is arranged in a flexible and flexible manner, and the substrate 1 can be arranged in a geometric shape or a non-geometric shape according to design requirements; and

複數發光元件11,較佳者,所述發光元件11為發光二極體(Light-emitting diode, LED),並係透過晶片直接封裝(Chip On Board, COB)製程以封裝並陣列設置於該基板1之一端面者,藉使發光元件11及基板1可予模組化,使利於成組裝配、銷售及運輸,並可提升於組裝時之便利性,並且能夠予以降低庫存之成本者。A plurality of light-emitting elements 11, preferably, the light-emitting element 11 is a light-emitting diode (LED), which is packaged and arrayed on the substrate through a chip on board (COB) process If the light-emitting element 11 and the substrate 1 can be modularized, it is convenient for group assembly, sales and transportation, and can improve the convenience during assembly, and can reduce the cost of inventory.

藉由前述配置,令基板1得以依據安裝需求,而可配置於各式構形之表面,如:平面、弧面或曲面,使增進基板1與所配置燈具之適配性,且發光元件11亦可依據光區配置需求而規則或不規則陣列於基板1,配合基板1之軟性設置,使發光元件11所發之光線可符合燈具之光區配置,藉以於燈具之發光區域係呈曲面或弧面配置時,由於基板1具有可撓性,故於對應之處亦可予彎曲,且彎曲部分亦具有事先配置之發光元件11,藉使燈具整體之發光之光區不因曲面配置而有不均之情事,是以,本創作之設置,係可提升光線照射時之均勻度及飽和度,以提升燈具光形之美感;藉由前述者,故本創作係可應用於一車燈2,如第4圖所示者,其係更包含一燈座21,該燈座21設有一燈罩22,且該基板1係對應設置於該燈座21,並令所述發光元件11朝向於該燈罩22處者,藉如前述,基板1係可因應燈座21之形狀配置而予以對應設置,並具有提升光線均勻度及飽和度之效果,藉以令本創作可適用於各形式之車燈2,故本創作確實具有廣泛之適用性者。Through the aforementioned configuration, the substrate 1 can be configured on various surfaces according to installation requirements, such as a flat surface, a curved surface, or a curved surface, so as to improve the compatibility of the substrate 1 with the configured lamps, and the light-emitting element 11 It can also be arranged in a regular or irregular array on the substrate 1 according to the requirements of the light area configuration, and cooperate with the soft setting of the substrate 1, so that the light emitted by the light-emitting element 11 can conform to the light area configuration of the lamp, so that the light-emitting area of the lamp is curved or When the curved surface is configured, since the substrate 1 is flexible, it can be bent at the corresponding place, and the curved part also has the light-emitting element 11 configured in advance, so that the light area of the whole luminaire is not affected by the curved surface configuration. Because of the unevenness, the setting of this creation can improve the uniformity and saturation of the light when irradiated, so as to enhance the beauty of the light shape of the lamp; based on the foregoing, the creation system can be applied to a car lamp 2 As shown in Figure 4, it further includes a lamp holder 21, the lamp holder 21 is provided with a lamp shade 22, and the substrate 1 is correspondingly disposed on the lamp holder 21, and the light-emitting element 11 faces the For the lampshade 22, as mentioned above, the substrate 1 can be arranged corresponding to the shape and configuration of the lamp holder 21, and has the effect of improving the uniformity and saturation of light, so that this creation can be applied to various forms of car lamps 2 , So this creation does have a wide range of applicability.

而就其電路配置而言,在一實施例中,該基板1一端更設有二電極12,所述電極12係耦接於該基板1及所述發光元件11,藉可簡易透過將電路配置於電極12即可驅動所述發光元件11發光,以提升線路裝配之便利性及增進車燈2之空間應用者。As for the circuit configuration, in one embodiment, the substrate 1 is further provided with two electrodes 12 at one end, and the electrodes 12 are coupled to the substrate 1 and the light-emitting element 11, so that the circuit can be easily configured by The electrode 12 can drive the light-emitting element 11 to emit light, so as to enhance the convenience of circuit assembly and enhance the space application of the vehicle lamp 2.

在另一實施例中,為令發光元件11所發之光線可被收光後均勻出光,故該基板1於設置所述發光元件11之一端面處,更對應覆設有一螢光層13,且該螢光層13係覆於所述發光元件11,藉此,如第2、3圖所示者,發光元件11之光線將由螢光層13收光後,可將光線均勻的散佈並出光,使更進一步提升光線之均勻度及飽和度,且螢光層13係可具有各式顏色之配置,藉可提升其視覺之美感,並於配置於車燈2時,如第4圖所示,亦可提升車燈2整體之視覺效果;此外,透過螢光層13之配置,由於其具有吸收熱量之特性,故可將發光元件11發光所產生之熱量予以吸收,因此,其兼具良好之散熱效果,藉以令發光元件11不因熱量累積而影響其發光效能,使維護發光元件11之發光效率者。In another embodiment, in order to allow the light emitted by the light-emitting element 11 to be collected and emitted uniformly, the substrate 1 is further covered with a fluorescent layer 13 at an end surface where the light-emitting element 11 is disposed. And the fluorescent layer 13 covers the light-emitting element 11, whereby, as shown in Figures 2 and 3, the light of the light-emitting element 11 will be collected by the fluorescent layer 13, and the light can be evenly distributed and emitted. , To further improve the uniformity and saturation of light, and the fluorescent layer 13 can have various color configurations, which can enhance its visual beauty, and when it is placed in the car light 2, as shown in Figure 4 , It can also improve the overall visual effect of the car lamp 2; in addition, the configuration of the fluorescent layer 13 has the characteristic of absorbing heat, so it can absorb the heat generated by the light-emitting element 11, so it has both good The heat dissipation effect prevents the light-emitting element 11 from affecting its luminous efficiency due to heat accumulation, so that the luminous efficiency of the light-emitting element 11 is maintained.

綜觀上述,本創作所揭露之技術手段不僅為前所未見,且確可達致預期之目的與功效,故兼具新穎性與進步性,誠屬專利法所稱之新型無誤,以其整體結構而言,確已符合專利法之法定要件,爰依法提出新型專利申請。In summary, the technical means disclosed in this creation is not only unprecedented, but also achieves the expected purpose and effect. Therefore, it is both novel and progressive. It is truly a new type in the patent law. In terms of structure, it has indeed met the statutory requirements of the Patent Law, and Yan has filed a new patent application in accordance with the law.

惟以上所述者,僅為本創作之較佳實施例,當不能以此作為限定本創作之實施範圍,即大凡依本創作申請專利範圍及說明書內容所作之等效變化與修飾,皆應仍屬於本創作專利涵蓋之範圍內。However, the above are only preferred embodiments of this creation, and should not be used to limit the scope of implementation of this creation, that is, all equivalent changes and modifications made in accordance with the scope of the patent application for this creation and the contents of the specification should still be used. It belongs to the scope of this creation patent.

1:基板 11:發光元件 12:電極 13:螢光層 2:車燈 21:燈座 22:燈罩1: substrate 11: Light-emitting element 12: Electrode 13: Fluorescent layer 2: car lights 21: Lamp holder 22: lampshade

第1圖係本創作未設置螢光層之前視示意圖。 第2圖係本創作設置螢光層之前視示意圖。 第3圖係本創作設置螢光層之剖視示意圖。 第4圖係本創作應用於車燈之使用狀態示意圖。 Figure 1 is a schematic diagram of this creation before the phosphor layer is set. Figure 2 is a schematic diagram of this creation before setting the phosphor layer. Figure 3 is a schematic cross-sectional view of the fluorescent layer set up in this creation. Figure 4 is a schematic diagram of the usage status of this creation applied to car lights.

1:基板 1: substrate

11:發光元件 11: Light-emitting element

12:電極 12: Electrode

Claims (6)

一種可撓式晶片直接封裝之車燈模組,其包含: 一基板,其係呈可撓性之軟性設置;以及 複數發光元件,其係透過晶片直接封裝(Chip On Board, COB)製程以封裝並陣列設置於該基板之一端面者。 A vehicle lamp module directly encapsulated by a flexible chip, which includes: A substrate, which is arranged in a flexible and flexible manner; and The plural light-emitting elements are packaged and arrayed on one end surface of the substrate through a chip on board (COB) process. 如請求項1所述之可撓式晶片直接封裝之車燈模組,其中,該基板於設置所述發光元件之一端面處,更對應覆設有一螢光層,且該螢光層係覆於所述發光元件者。The automotive lamp module directly packaged with a flexible chip as described in claim 1, wherein the substrate is provided with a fluorescent layer corresponding to an end surface where the light-emitting element is provided, and the fluorescent layer is coated In the light-emitting element. 如請求項1所述之可撓式晶片直接封裝之車燈模組,其中,所述發光元件為發光二極體(Light-emitting diode, LED)。The vehicle lamp module directly packaged with a flexible chip according to claim 1, wherein the light-emitting element is a light-emitting diode (LED). 如請求項1所述之可撓式晶片直接封裝之車燈模組,其中,該基板係呈幾何形狀或非幾何圖形設置者。The vehicle lamp module directly packaged with a flexible chip as described in claim 1, wherein the substrate is a geometric shape or a non-geometric configuration. 如請求項1所述之可撓式晶片直接封裝之車燈模組,其中,該基板一端更設有二電極,所述電極係耦接於該基板及所述發光元件者。The automotive lamp module directly packaged with a flexible chip according to claim 1, wherein two electrodes are further provided at one end of the substrate, and the electrodes are coupled to the substrate and the light-emitting element. 如請求項1至請求項5中任一項所述之可撓式晶片直接封裝之車燈模組,更包含一燈座,該燈座設有一燈罩,且該基板係對應設置於該燈座,並令所述發光元件朝向於該燈罩處者。The vehicle lamp module directly packaged by the flexible chip as described in any one of claim 1 to claim 5, further comprising a lamp holder, the lamp holder is provided with a lamp shade, and the substrate is correspondingly disposed on the lamp holder , And make the light-emitting element face the lampshade.
TW109215059U 2020-11-16 2020-11-16 Car lamp module with directly-packaged flexible chips TWM615754U (en)

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